JP2008277073A - Light emitting diode - Google Patents

Light emitting diode Download PDF

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JP2008277073A
JP2008277073A JP2007118154A JP2007118154A JP2008277073A JP 2008277073 A JP2008277073 A JP 2008277073A JP 2007118154 A JP2007118154 A JP 2007118154A JP 2007118154 A JP2007118154 A JP 2007118154A JP 2008277073 A JP2008277073 A JP 2008277073A
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light
emitting diode
light emitting
light guide
guide plate
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Kosuke Tsuchiya
康介 土屋
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that cost is increased when a light guide path is formed on a light guide plate side. <P>SOLUTION: In this edge light type light emitting diode 6 having an emission surface 6a oppositely to a light reception surface 5a formed on a side surface of a light guide plate 5 formed of a transparent resin member, the light emitting diode 6 is sealed by a translucent sealing resin 10 by mounting an LED chip 8 on a board 9. The translucent sealing resin 10 is surrounded by reflectors 11 formed of a white resin improved in diffusion reflectivity of the resin surface by mixing titanium oxide in the resin, and a light guide path 12 is formed with a reflecting member 13 inclined from a part of the reflector 11 to the emitting surface 6a of the light emitting diode 6 to set the thickness of the emission surface 6a of the light emitting diode 6 nearly equal to that of the light reception surface 5a of the light guide plate 5. A light diffusing agent 15 is included in the translucent sealing resin 10. Light can be efficiently used, a high-output LED can be used with respect to a thin light guide plate, and the number of used LEDs can be reduced, whereby cost can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、液晶ディスプレイにバックライトとして用いるのに適したエッジライトタイプの発光ダイオードに関する。   The present invention relates to an edge light type light emitting diode suitable for use as a backlight in a liquid crystal display.

従来、パーソナルコンピュータ、薄型テレビ、カーナビゲーションなどの表示画面に、液晶表示装置用のバックライト装置として、光源を導光板のエッジ部に配置するエッジライト型バックライト装置が使用さられている。上記エッジライト型バックライト装置は、透明なアクリル樹脂板などの射出成形品で作られた導光板のエッジ部の受光面にＬＥＤなどの光源を配置する方式であり、薄型のバックライト装置を実現することができる。（例えば、特許文献１参照）   2. Description of the Related Art Conventionally, an edge light type backlight device in which a light source is arranged at an edge portion of a light guide plate is used as a backlight device for a liquid crystal display device on a display screen of a personal computer, a thin television, a car navigation system, and the like. The above-mentioned edge light type backlight device is a system in which a light source such as an LED is arranged on the light receiving surface of the edge portion of a light guide plate made of an injection molded product such as a transparent acrylic resin plate, realizing a thin backlight device. can do. (For example, see Patent Document 1)

特開２００３−１２１８４０号（第３〜４頁、図２）JP 2003-121840 (pages 3 to 4, FIG. 2)

上記した特許文献１に開示されている液晶表示装置は、図１５に示される。図１５において、液晶表示装置２１は、バックライト部２２と液晶表示部２３とを備え、ケース２４の底面からバックライト部２２、液晶表示部２３の順に積層されている。   The liquid crystal display device disclosed in Patent Document 1 is shown in FIG. In FIG. 15, the liquid crystal display device 21 includes a backlight unit 22 and a liquid crystal display unit 23, and the backlight unit 22 and the liquid crystal display unit 23 are stacked in this order from the bottom surface of the case 24.

上記したバックライト部２２は、透明なアクリル樹脂板などで作られた導光板２５と発光ダイオード２６とで構成され、上部に液晶表示部２３が載置される導光板２５の本体部２５ａと発光ダイオード２６からの出射光を受光する受光部２５ｄとで一体形成されている。前記本体部２５ａの上面と前記液晶表示部２３との間には光拡散部材２７が配設されている。一方の受光部２５ｂは、本体部２５ａから上方に向けて４５度以下の角度に傾斜させた傾斜面２５ｃが形成され、底面の端部から前記傾斜面２５ｃの端部にかけて垂直に切り立った受光面２５ｄを形成している。前記傾斜面２５ｃには、Ａｇ蒸着シートなどの高反射率を有する反射膜２８が設けられている。発光ダイオード２６のＬＥＤチップからの出射光は厚みのある導光板２５の受光面２５ｄに漏れなく入射される。入射光は前記傾斜面２５ｃに形成された反射膜２８で一旦反射される。反射された光はさらに導光板２５の端部まで拡散され、光拡散部材２７を透過して均一な光となって、液晶表示部２３の下面を均一に照明する。   The backlight unit 22 includes a light guide plate 25 made of a transparent acrylic resin plate and the like, and a light emitting diode 26. The backlight unit 22 emits light from the main body 25a of the light guide plate 25 on which the liquid crystal display unit 23 is placed. The light receiving portion 25d that receives the light emitted from the diode 26 is integrally formed. A light diffusing member 27 is disposed between the upper surface of the main body 25 a and the liquid crystal display unit 23. One light receiving portion 25b is formed with an inclined surface 25c inclined upward at an angle of 45 degrees or less upward from the main body portion 25a, and the light receiving surface standing vertically from the end portion of the bottom surface to the end portion of the inclined surface 25c. 25d is formed. The inclined surface 25c is provided with a reflective film 28 having a high reflectance such as an Ag vapor deposition sheet. Light emitted from the LED chip of the light emitting diode 26 is incident on the light receiving surface 25d of the light guide plate 25 having a thickness without leakage. Incident light is once reflected by the reflective film 28 formed on the inclined surface 25c. The reflected light is further diffused to the end portion of the light guide plate 25, passes through the light diffusion member 27, becomes uniform light, and uniformly illuminates the lower surface of the liquid crystal display unit 23.

解決しようとする問題点としては、上記したように、導光板側の受光部に発光ダイオードの出射面にあわせた導光部を設けたが、一般的に、導光板は板材カットの既製品が多く、導光板に導光部を設けることは高価になる。等の問題が発生した。   The problem to be solved is that, as described above, the light receiving part on the light guide plate side is provided with a light guide part corresponding to the emission surface of the light emitting diode. In many cases, it is expensive to provide a light guide portion on a light guide plate. Etc. occurred.

本発明は、上述の欠点を解消するもので、その目的は、発光ダイオードの出射面の厚さを薄型導光板の受光面の厚さと略等しくなるように、発光ダイオード側に導光路を形成することにより、発光ダイオードの出射光を効率よく使用することができる発光ダイオードを提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its purpose is to form a light guide on the light emitting diode side so that the thickness of the light emitting surface of the light emitting diode is substantially equal to the thickness of the light receiving surface of the thin light guide plate. Thus, the present invention provides a light emitting diode that can efficiently use the light emitted from the light emitting diode.

上記目的を達成するために、本発明における発光ダイオードは、透明の樹脂部材よりなり、平面が略矩形形状をした導光板の側面に形成された受光面に対向して出射面を有するエッジライトタイプの発光ダイオードで、前記発光ダイオードはＬＥＤチップを基板に実装し透光性封止樹脂で封止され、該透光性封止樹脂は反射手段を有するリフレクターで囲まれた発光ダイオードにおいて、前記発光ダイオードの出射面の厚さを前記導光板の受光面の厚さと略等しくなるように発光ダイオード側に導光路を形成したことを特徴とするものである。   In order to achieve the above object, the light-emitting diode according to the present invention is an edge light type having a light-emitting surface made of a transparent resin member and opposed to a light-receiving surface formed on a side surface of a light guide plate having a substantially rectangular plane. In the light emitting diode, the LED chip is mounted on a substrate and sealed with a light-transmitting sealing resin, and the light-transmitting sealing resin is surrounded by a reflector having a reflecting means. The light guide path is formed on the light emitting diode side so that the thickness of the light emitting surface of the diode is substantially equal to the thickness of the light receiving surface of the light guide plate.

また、前記発光ダイオード側に形成された導光路は、前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する反射部材を配設したことを特徴とするものである。   Further, the light guide path formed on the light emitting diode side is characterized in that a reflecting member that is inclined from a part of the reflector to an emission surface of the light emitting diode is disposed.

また、前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する反射部材の内面に、銀またはアルミニウムの蒸着により形成した金属反射膜を形成したことを特徴とするものである。   Further, a metal reflecting film formed by vapor deposition of silver or aluminum is formed on the inner surface of the reflecting member inclined from a part of the reflector to the emitting surface of the light emitting diode.

また、前記透光性封止樹脂に光拡散剤を含有させたことを特徴とするものである。   The translucent sealing resin contains a light diffusing agent.

また、前記発光ダイオード側に形成された導光路は、前記リフレクターの内壁の一部を傾斜させた傾斜部をリフレクターと一体成形したことを特徴とするものである。   Further, the light guide path formed on the light emitting diode side is characterized in that an inclined portion obtained by inclining a part of the inner wall of the reflector is integrally formed with the reflector.

また、前記発光ダイオード側に形成された導光路は、前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する傾斜部と、該傾斜部から折れ曲り前記導光板の受光面に垂直になる直線部で反射部材を構成することを特徴とするものである。   Further, the light guide path formed on the light emitting diode side includes an inclined portion that is inclined from a part of the reflector to an emission surface of the light emitting diode, and a linear portion that is bent from the inclined portion and is perpendicular to the light receiving surface of the light guide plate. The reflective member is constituted by the above.

また、前記発光ダイオード側に形成された導光路は、前記リフレクターの内壁の一部から発光ダイオードの出射面にかけて傾斜する傾斜部と、該傾斜部から折れ曲り前記導光板の受光面に垂直になる直線部とをリフレクターと一体成形したことを特徴とするものである。   The light guide path formed on the light emitting diode side is inclined from a part of the inner wall of the reflector to the emission surface of the light emitting diode, and is bent from the inclined portion to be perpendicular to the light receiving surface of the light guide plate. The straight part and the reflector are integrally formed.

本発明の発光ダイオードは、薄型導光板の側面の受光面に略等しくなるように、発光ダイオード側の出射面にかけて傾斜する反射部を設けて導光路を形成することにより、ＬＥＤチップからの出射光は漏れることなく効率良く使用される。薄型導光板に対して高出力の発光ダイオードを使用できる。また、光を効率良く使用できるので使用するＬＥＤチップの個数を減らすことも可能である。   The light emitting diode of the present invention is configured to provide a light guide path by providing a reflecting portion that is inclined toward the light emitting diode side of the light emitting surface so as to be substantially equal to the light receiving surface of the side surface of the thin light guide plate, thereby emitting light from the LED chip. Is used efficiently without leaking. A high-power light emitting diode can be used for a thin light guide plate. In addition, since the light can be used efficiently, the number of LED chips to be used can be reduced.

本発明の発光ダイオードについて、図面に基づいて説明する。   The light emitting diode of the present invention will be described with reference to the drawings.

図１〜図３は、本発明の実施例１に係わり、図１は、液晶表示装置の断面図、図２は、本発明の発光ダイオードの断面図、図３は、図２の斜視図である。図1〜図３において、液晶表示装置１は、バックライト部２と液晶表示部３とを備え、ケース４の底面からバックライト部２、液晶表示部３の順に積層されている。上記したバックライト部２は、透明なアクリル樹脂板などよりなり射出成形などで作られた導光板５と発光ダイオード６とで構成される。上部に液晶表示部３が載置される導光板５は、発光ダイオード６からの出射光を受光する受光部５aと底面には図示しない微細なプリズム模様、凹凸模様などが転写された反射面が形成され、多様な光を効率良く導光板５の上面に載置して光拡散部材７を照射する。光拡散部材７を透過したバラツキのない均一な光は液晶表示部３を明るく照射する。   1 to 3 relate to a first embodiment of the present invention, FIG. 1 is a sectional view of a liquid crystal display device, FIG. 2 is a sectional view of a light emitting diode of the present invention, and FIG. 3 is a perspective view of FIG. is there. 1 to 3, the liquid crystal display device 1 includes a backlight unit 2 and a liquid crystal display unit 3, and the backlight unit 2 and the liquid crystal display unit 3 are stacked in this order from the bottom surface of the case 4. The above-described backlight unit 2 includes a light guide plate 5 and a light emitting diode 6 made of a transparent acrylic resin plate or the like and made by injection molding or the like. The light guide plate 5 on which the liquid crystal display unit 3 is placed has a light receiving unit 5a that receives the light emitted from the light emitting diode 6 and a reflective surface to which a fine prism pattern, concavo-convex pattern (not shown) is transferred on the bottom surface. A variety of light is efficiently placed on the upper surface of the light guide plate 5 to irradiate the light diffusing member 7. Uniform light that does not vary through the light diffusing member 7 illuminates the liquid crystal display unit 3 brightly.

前記発光ダイオード６は、ＬＥＤチップ８をガラスエポキシ樹脂よりなる絶縁基板９に実装され、透光性封止樹脂１０で封止されている。該透光性封止樹脂１０は、樹脂中に酸化チタンなどを混ぜて樹脂表面の拡散反射率を向上させた白色樹脂よりなるリフレクター１１で囲まれている。前記発光ダイオード６の出射面６aの厚さを前記導光板５の受光面５aの厚さと略等しくなるように発光ダイオード６側に導光路１２を形成する。そのため、リフレクター１１の一部から発光ダイオード６の出射面６aにかけて傾斜する反射部材１３を配設する。該反射部材１３の内面には反射手段として、例えば、銀またはアルミニウムの蒸着により形成した金属反射膜１４を施す。前記透光性封止樹脂１０に光拡散剤１５を含有させて光の散乱率を向上させる。   In the light emitting diode 6, the LED chip 8 is mounted on an insulating substrate 9 made of glass epoxy resin and sealed with a translucent sealing resin 10. The translucent sealing resin 10 is surrounded by a reflector 11 made of a white resin in which titanium oxide or the like is mixed in the resin to improve the diffuse reflectance of the resin surface. The light guide path 12 is formed on the light emitting diode 6 side so that the thickness of the light emitting surface 6 a of the light emitting diode 6 is substantially equal to the thickness of the light receiving surface 5 a of the light guide plate 5. Therefore, a reflecting member 13 that is inclined from a part of the reflector 11 to the emission surface 6a of the light emitting diode 6 is disposed. For example, a metallic reflective film 14 formed by vapor deposition of silver or aluminum is applied to the inner surface of the reflective member 13 as reflective means. The light transmissive sealing resin 10 contains a light diffusing agent 15 to improve the light scattering rate.

上記した構成の発光ダイオードの作用・効果について説明する。先ず、発光ダイオード６に実装されたＬＥＤチップ８からの出射光の内、直進する光は導光路１２を通り出射面６ａから前記導光板５の受光面５ａから入射する。前記リフレクター１１の内面や前記傾斜する反射部材１３の内面に施された金属反射膜１４で反射された光は導光路１２に導かれて出射面６ａに集中する。前述したように、前記発光ダイオード６の出射面６ａの厚さを前記導光板５の側面に形成された受光面５ａの厚さと略等しくなるように発光ダイオード６側に導光路１２の先端部が形成されている。そのため、ＬＥＤチップ８の出射光は漏れることがなく導光板５の受光面５ａに導光される。更に、前記透光性封止樹脂１０に光拡散剤１５を含有させているので光の散乱率が一層向上されるものである。   The operation and effect of the light emitting diode configured as described above will be described. First, of the light emitted from the LED chip 8 mounted on the light emitting diode 6, light traveling straight through the light guide path 12 enters the light receiving surface 5 a of the light guide plate 5 from the light emitting surface 6 a. The light reflected by the metal reflection film 14 applied to the inner surface of the reflector 11 and the inner surface of the inclined reflecting member 13 is guided to the light guide 12 and concentrated on the exit surface 6a. As described above, the tip of the light guide 12 is formed on the light emitting diode 6 side so that the thickness of the light emitting surface 6a of the light emitting diode 6 is substantially equal to the thickness of the light receiving surface 5a formed on the side surface of the light guide plate 5. Is formed. Therefore, the emitted light of the LED chip 8 is guided to the light receiving surface 5a of the light guide plate 5 without leaking. Furthermore, since the light diffusing agent 15 is contained in the translucent sealing resin 10, the light scattering rate is further improved.

図４〜図６は、本発明の実施例２に係わり、図４は、本発明の発光ダイオードと導光板の関係を示す断面図、図５は、図４の発光ダイオードの断面図、図６は、図５の斜視図である。図４〜図６において、上記した実施例１では、導光路をリフレクターと傾斜部材で構成したが、実施例２では、リフレクターのみで一体成形したものである。即ち、前記発光ダイオード６側に形成された導光路１２は、前記リフレクター１１の内壁の一部を傾斜させて傾斜部１１ａをリフレクター１１と一体成形する。リフレクター１１及び傾斜部１１ａの内面には反射手段として、例えば、銀またはアルミニウムの蒸着により形成した図示しない金属反射膜を施す。   4 to 6 relate to the second embodiment of the present invention, FIG. 4 is a cross-sectional view showing the relationship between the light-emitting diode of the present invention and the light guide plate, FIG. 5 is a cross-sectional view of the light-emitting diode of FIG. FIG. 6 is a perspective view of FIG. 5. 4 to 6, in the above-described first embodiment, the light guide path is configured by the reflector and the inclined member. However, in the second embodiment, the light guide is integrally formed only by the reflector. That is, the light guide 12 formed on the light emitting diode 6 side inclines a part of the inner wall of the reflector 11 and integrally forms the inclined portion 11 a with the reflector 11. For example, a metal reflecting film (not shown) formed by vapor deposition of silver or aluminum is applied to the inner surfaces of the reflector 11 and the inclined portion 11a as reflecting means.

上記した構成の発光ダイオードの作用・効果については、実施例１の反射部材をリフレクターと一体成形した分、部材コスト、組立てコストが低下する。その他の作用・効果は上記した実施例１と同様であるので説明は省略する。   Regarding the operation and effect of the light emitting diode having the above-described configuration, the member cost and the assembly cost are reduced because the reflecting member of Example 1 is integrally formed with the reflector. Since other operations and effects are the same as those of the first embodiment, description thereof will be omitted.

図７及び図８は、上記した実施例１及び実施例２において、ケース４の底面に当接するリフレクター１１の一面を取除くことにより、前記発光ダイオード６の出射面６ａの厚さと前記導光板５の側面に形成された受光面５ａの厚さを確実に等しくすることができる。従って、ＬＥＤチップ８の出射光は漏れることがなく導光板５の受光面５ａに導光されるのでＬＥＤチップ８からの出射光は確実に導光板５の受光面５aに導光される。   7 and FIG. 8 show the thickness of the exit surface 6a of the light emitting diode 6 and the light guide plate 5 by removing one surface of the reflector 11 that contacts the bottom surface of the case 4 in the first and second embodiments. The thickness of the light receiving surface 5a formed on the side surface of each can be made equal. Accordingly, the light emitted from the LED chip 8 is guided to the light receiving surface 5a of the light guide plate 5 without leaking, so that the light emitted from the LED chip 8 is reliably guided to the light receiving surface 5a of the light guide plate 5.

図９は、本発明の実施例３に係わる発光ダイオードと導光板の関係を示す断面図である。図９において、発光ダイオード６に形成された導光路１２は、導光路１２を構成する反射部材１３を傾斜部１３ａと、該傾斜部１３ａから折れ曲り前記導光板５の受光面５ａに垂直になる直線部１３ｂで構成するものである。図９と図１〜図３、図１０と図４〜図６、図１１と図７、図１２と図８がそれぞれ対応する。構成、作用・効果は同様であるので、説明は省略する。   FIG. 9 is a cross-sectional view showing the relationship between the light emitting diode and the light guide plate according to Example 3 of the present invention. In FIG. 9, the light guide path 12 formed in the light emitting diode 6 bends the reflecting member 13 constituting the light guide path 12 from the inclined portion 13 a and the inclined portion 13 a and is perpendicular to the light receiving surface 5 a of the light guide plate 5. The straight portion 13b is used. 9 and FIGS. 1 to 3, FIG. 10 and FIGS. 4 to 6, FIGS. 11 and 7, and FIGS. 12 and 8 correspond to each other. Since the configuration, operation, and effect are the same, description thereof is omitted.

図１３及び図１４はＬＥＤチップを複数個実装したもので、図１３は、発光ダイオードの斜視図、図１４は、図１３のX−X線断面図である。所望により複数個のＬＥＤチップを搭載した発光ダイオードを使用することにより、光源であるＬＥＤよりも薄い導光板に光を効率良く導くことができ充分な明るさを得ることができる。   13 and 14 show a plurality of LED chips mounted thereon. FIG. 13 is a perspective view of the light emitting diode, and FIG. 14 is a cross-sectional view taken along the line XX of FIG. If desired, by using a light emitting diode having a plurality of LED chips mounted thereon, light can be efficiently guided to a light guide plate thinner than the light source LED, and sufficient brightness can be obtained.

以上説明したように、発光ダイオード側に導光路を形成して、導光路の先端部の出射面と、導光板の側面の受光面との厚みを略等しくすることにより、ＬＥＤチップの出射光は漏れることがなく導光板の受光面に導光されるのでＬＥＤチップの出射光は効率良く導光板に入射される。導光板内に拡散された光は、導光板の上面に配置された光拡散材を透過して均一な光となって液晶表示部を明るく照明するものである。導光路を発光ダイオード側に形成するので、薄型の導光板に対して高出力のＬＥＤを使用できる。また、光を効率良く使用することができるので、使用するＬＥＤの個数を減らすことができる。など安価な発光ダイオードを提供することが可能である。   As described above, a light guide path is formed on the light emitting diode side, and the light emitted from the LED chip can be obtained by making the exit surface of the tip of the light guide path substantially equal in thickness to the light receiving surface of the side surface of the light guide plate. Since the light is guided to the light receiving surface of the light guide plate without leaking, the light emitted from the LED chip is efficiently incident on the light guide plate. The light diffused in the light guide plate is transmitted through a light diffusing material disposed on the upper surface of the light guide plate to become uniform light, and brightly illuminates the liquid crystal display unit. Since the light guide is formed on the light emitting diode side, a high-power LED can be used for a thin light guide plate. In addition, since the light can be used efficiently, the number of LEDs used can be reduced. It is possible to provide an inexpensive light emitting diode.

本発明の実施例１に係わる液晶表示装置の断面図である。It is sectional drawing of the liquid crystal display device concerning Example 1 of this invention. 図１の発光ダイオードの断面図である。It is sectional drawing of the light emitting diode of FIG. 図２の斜視図である。FIG. 3 is a perspective view of FIG. 2. 本発明の実施例２に係わる発光ダイオードと導光板の関係を示す断面図である。It is sectional drawing which shows the relationship between the light emitting diode concerning Example 2 of this invention, and a light-guide plate. 図４の発光ダイオードの断面図である。It is sectional drawing of the light emitting diode of FIG. 図５の斜視図である。FIG. 6 is a perspective view of FIG. 5. 実施例１に対応する発光ダイオードと導光板の関係を示す断面図である。FIG. 3 is a cross-sectional view illustrating a relationship between a light-emitting diode and a light guide plate corresponding to Example 1. 実施例２に対応する発光ダイオードと導光板の関係を示す断面図である。It is sectional drawing which shows the relationship between the light emitting diode corresponding to Example 2, and a light-guide plate. 本発明の実施例３に係わる発光ダイオードと導光板の関係を示す断面図である。It is sectional drawing which shows the relationship between the light emitting diode concerning Example 3 of this invention, and a light-guide plate. 図４に対応する発光ダイオードと導光板の関係を示す断面図である。FIG. 5 is a cross-sectional view showing a relationship between a light emitting diode and a light guide plate corresponding to FIG. 4. 図７に対応する発光ダイオードと導光板の関係を示す断面図である。It is sectional drawing which shows the relationship between the light emitting diode corresponding to FIG. 7, and a light-guide plate. 図８に対応する発光ダイオードと導光板の関係を示す断面図である。It is sectional drawing which shows the relationship between the light emitting diode corresponding to FIG. 8, and a light-guide plate. 複数個のＬＥＤチップを実装した本発明の発光ダイオードの斜視図である。It is a perspective view of the light emitting diode of this invention which mounted several LED chip. 図１３のX−X線断面図である。It is XX sectional drawing of FIG. 従来の液晶表示装置の断面図である。It is sectional drawing of the conventional liquid crystal display device.

符号の説明Explanation of symbols

１ 液晶表示装置
２ バックライト部
３ 液晶表示部
４ ケース
５ 導光板
５ａ 受光面
６ 発光ダイオード
６ａ 出射面
７ 光拡散材
８ ＬＥＤチップ
９ 絶縁基板
１０ 透光性封止樹脂
１１ リフレクター
１１ａ リフレクターの傾斜部
１１ｂ リフレクターの直線部
１２ 導光路
１３ 反射部材
１３ａ 反射部材の傾斜部
１３ｂ 反射部材の直線部
１４ 金属反射膜
１５ 光拡散剤 DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 2 Backlight part 3 Liquid crystal display part 4 Case 5 Light guide plate 5a Light-receiving surface 6 Light emitting diode 6a Output surface 7 Light diffusing material 8 LED chip 9 Insulating substrate 10 Translucent sealing resin 11 Reflector 11a Inclined part of reflector 11b Linear part of reflector 12 Light guide 13 Reflective member 13a Inclined part of reflective member 13b Linear part of reflective member 14 Metal reflective film 15 Light diffusing agent

Claims (7)

透明の樹脂部材よりなり、平面が略矩形形状をした導光板の側面に形成された受光面に対向して出射面を有するエッジライトタイプの発光ダイオードで、前記発光ダイオードはＬＥＤチップを基板に実装し透光性封止樹脂で封止され、該透光性封止樹脂は反射手段を有するリフレクターで囲まれた発光ダイオードにおいて、前記発光ダイオードの出射面の厚さを前記導光板の受光面の厚さと略等しくなるように発光ダイオード側に導光路を形成したことを特徴とする発光ダイオード。   An edge light type light emitting diode made of a transparent resin member and having a light emitting surface facing the light receiving surface formed on the side surface of the light guide plate having a substantially rectangular shape. The light emitting diode has an LED chip mounted on the substrate. The light-emitting diode is sealed with a light-transmitting sealing resin, and the light-transmitting sealing resin is surrounded by a reflector having a reflecting means. 1. A light emitting diode characterized in that a light guide is formed on the light emitting diode side so as to be substantially equal to the thickness. 前記発光ダイオード側に形成された導光路は、前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する反射部材で形成したことを特徴とする請求項１記載の発光ダイオード。   The light-emitting diode according to claim 1, wherein the light guide path formed on the light-emitting diode side is formed of a reflecting member that is inclined from a part of the reflector to an emission surface of the light-emitting diode. 前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する反射部材の内面に、銀またはアルミニウムの蒸着により形成した金属反射膜を施したことを特徴とする請求項2記載の発光ダイオード。   3. The light emitting diode according to claim 2, wherein a metal reflective film formed by vapor deposition of silver or aluminum is applied to an inner surface of the reflecting member that is inclined from a part of the reflector to an emission surface of the light emitting diode. 前記透光性封止樹脂に光拡散剤を含有させたことを特徴とする請求項１〜３のいずれか1項記載の発光ダイオード。   The light-emitting diode according to claim 1, wherein the light-transmitting sealing resin contains a light diffusing agent. 前記発光ダイオード側に形成された導光路は、前記リフレクターの内壁の一部を傾斜させた傾斜部をリフレクターと一体成形したことを特徴とする請求項1記載の発光ダイオード。   2. The light-emitting diode according to claim 1, wherein the light guide path formed on the light-emitting diode side is integrally formed with the reflector in an inclined portion in which a part of the inner wall of the reflector is inclined. 前記発光ダイオード側に形成された導光路は、前記リフレクターの一部から発光ダイオードの出射面にかけて傾斜する傾斜部と、該傾斜部から折れ曲り前記導光板の受光面に垂直になる直線部で反射部材を構成することを特徴とする請求項１〜３のいずれか1項記載の発光ダイオード。   The light guide formed on the light emitting diode side is reflected by an inclined part inclined from a part of the reflector to an emission surface of the light emitting diode, and a linear part bent from the inclined part and perpendicular to the light receiving surface of the light guide plate. The light emitting diode according to any one of claims 1 to 3, wherein the light emitting diode constitutes a member. 前記発光ダイオード側に形成された導光路は、前記リフレクターの内壁の一部から発光ダイオードの出射面にかけて傾斜する傾斜部と、該傾斜部から折れ曲り前記導光板の受光面に垂直になる直線部とをリフレクターと一体成形したことを特徴とする請求項5記載の発光ダイオード。
The light guide path formed on the light emitting diode side is an inclined portion that is inclined from a part of the inner wall of the reflector to an emission surface of the light emitting diode, and a linear portion that is bent from the inclined portion and is perpendicular to the light receiving surface of the light guide plate. 6. The light-emitting diode according to claim 5, wherein: is integrally formed with the reflector.
JP2007118154A 2007-04-27 2007-04-27 Light emitting diode Pending JP2008277073A (en)

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