JP2020047869A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2020047869A
JP2020047869A JP2018176871A JP2018176871A JP2020047869A JP 2020047869 A JP2020047869 A JP 2020047869A JP 2018176871 A JP2018176871 A JP 2018176871A JP 2018176871 A JP2018176871 A JP 2018176871A JP 2020047869 A JP2020047869 A JP 2020047869A
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light emitting
light
emitting device
reflection
reflecting
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JP7066963B2 (en
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拓也 長本
Takuya Nagamoto
拓也 長本
紘一 甘利
Koichi Amari
紘一 甘利
友士 榊原
Yuji Sakakibara
友士 榊原
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Abstract

To provide a light-emitting device whose light distribution is controlled by the structure of the light-emitting device itself.SOLUTION: A light-emitting device 1 includes a light-emitting element 50 having a light-emitting surface 10, a reflecting member 30 provided on the first end side of the first end 10a and the second end 10b separated in the first direction on the light emitting surface. The reflecting member includes a lower surface 31 on the light emitting surface side, an upper surface 32 having an inner end 32a at a position closer to the second end than the inner end 31a of the lower surface, and an inner surface 33 between the inner edge of the upper surface and the inner edge of the lower surface, which includes a surface inclined with respect to the light emitting surface, or a curved surface.SELECTED DRAWING: Figure 1

Description

本開示は、発光装置に関する。   The present disclosure relates to a light emitting device.

光源として例えばＬＥＤ（Light Emitting Diode）を含む発光装置を使った照明機器において、発光装置から出た光の配光を制御する場合には、発光装置とは別に設けたレンズ（２次レンズ）やリフレクタなどが用いられている。   In a lighting device using a light emitting device including, for example, an LED (Light Emitting Diode) as a light source, when controlling the light distribution of light emitted from the light emitting device, a lens (secondary lens) provided separately from the light emitting device, Reflectors and the like are used.

特開２０１８−１１０３９号公報JP 2018-11039 A

本開示は、発光装置自体の構造で配光制御された発光装置を提供する。   The present disclosure provides a light emitting device whose light distribution is controlled by the structure of the light emitting device itself.

本開示の一態様によれば、発光装置は、発光面を有する発光素子と、前記発光面上において第１方向に離間した第１端部と第２端部のうちの前記第１端部側に配置された反射部材と、を備えている。前記反射部材は、前記発光面側の下面と、前記下面の内端よりも前記第２端部に近い位置に内端を有する上面と、前記上面の内端と前記下面の内端の間の内側面であって、前記発光面に対して傾斜した面、または曲面を有する内側面と、を有する。   According to one aspect of the present disclosure, a light emitting device includes a light emitting element having a light emitting surface, and a first end side of a first end and a second end separated from each other in a first direction on the light emitting surface. And a reflection member disposed at the same position. The reflection member has a lower surface on the light emitting surface side, an upper surface having an inner end at a position closer to the second end than an inner end of the lower surface, and a lower surface between the inner end of the upper surface and the inner end of the lower surface. An inner surface having a surface inclined with respect to the light emitting surface or an inner surface having a curved surface.

本開示によれば、発光装置自体の構造で配光制御された発光装置を提供することができる。   According to the present disclosure, it is possible to provide a light emitting device whose light distribution is controlled by the structure of the light emitting device itself.

本開示の第１実施形態の発光装置の模式斜視図である。1 is a schematic perspective view of a light emitting device according to a first embodiment of the present disclosure. 本開示の第１実施形態の発光装置の模式断面図である。1 is a schematic cross-sectional view of a light emitting device according to a first embodiment of the present disclosure. 第１実施形態の変形例の発光装置の模式断面図である。It is a schematic cross section of a light emitting device of a modification of the first embodiment. 本開示の第２実施形態の発光装置の模式断面図である。It is a schematic cross section of a light emitting device of a second embodiment of the present disclosure. 本開示の第３実施形態の発光装置の模式断面図である。It is a schematic cross section of a light emitting device of a third embodiment of the present disclosure.

以下、図面を参照し、実施形態について説明する。なお、各図面中、同じ要素には同じ符号を付している。   Hereinafter, embodiments will be described with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals.

図１は、第１実施形態の発光装置１の模式斜視図である。図１において、基板１１の上面に対して平行な方向であって相互に直交する２方向をＸ方向およびＹ方向とし、これらＸ方向およびＹ方向の双方に対して直交する方向をＺ方向とする。
図２は、第１実施形態の発光装置１の模式断面図である。図２は、図１におけるＸ方向に沿った断面を表す。 FIG. 1 is a schematic perspective view of the light emitting device 1 according to the first embodiment. In FIG. 1, two directions parallel to the upper surface of the substrate 11 and orthogonal to each other are defined as an X direction and a Y direction, and a direction orthogonal to both the X direction and the Y direction is defined as a Z direction. .
FIG. 2 is a schematic sectional view of the light emitting device 1 according to the first embodiment. FIG. 2 shows a cross section along the X direction in FIG.

発光装置１は、基板１１と、発光素子５０と、反射部材３０と、透光部材１５とを有する。   The light emitting device 1 includes a substrate 11, a light emitting element 50, a reflecting member 30, and a light transmitting member 15.

発光素子５０は、基板１１上に配置されたチップ２０と、チップ２０上に配置された蛍光体層１３とを有する。   The light emitting element 50 has a chip 20 arranged on the substrate 11 and a phosphor layer 13 arranged on the chip 20.

チップ２０は、発光層を含む半導体積層部と、電極を有する。１つまたは複数のチップ２０が基板１１上に配置されている。図１に示す例では、２つのチップ２０が基板１１上に配置されている。基板１１上には樹脂部材１２も設けられている。樹脂部材１２は、チップ２０の周囲に配置され、チップ２０の側面を直接的に又は間接的に覆っている。   The chip 20 has a semiconductor laminated portion including a light emitting layer and electrodes. One or a plurality of chips 20 are arranged on the substrate 11. In the example shown in FIG. 1, two chips 20 are arranged on the substrate 11. A resin member 12 is also provided on the substrate 11. The resin member 12 is arranged around the chip 20 and directly or indirectly covers the side surface of the chip 20.

蛍光体層１３は、チップ２０の上面上および樹脂部材１２の上面上に配置されている。蛍光体層１３の上面が発光素子５０の発光面１０となる。または、発光素子５０は蛍光体を含まない透光層を含んでいてもよい。あるいは、発光素子５０は、チップ２０の上に別の部材を含まなくてもよく、その場合チップ２０の上面が発光素子５０の上面となる。   The phosphor layer 13 is arranged on the upper surface of the chip 20 and on the upper surface of the resin member 12. The upper surface of the phosphor layer 13 becomes the light emitting surface 10 of the light emitting element 50. Alternatively, the light emitting element 50 may include a light transmitting layer containing no phosphor. Alternatively, the light emitting element 50 does not need to include another member on the chip 20, in which case the upper surface of the chip 20 becomes the upper surface of the light emitting element 50.

蛍光体層１３は、母材と、母材に分散された蛍光体とを有する。蛍光体層１３の母材の材料として、例えば、シリコーン樹脂、エポキシ樹脂、ガラスなどを用いることができる。蛍光体は、チップ２０が発する光によって励起され、チップ２０が発する光の波長とは異なる波長の光を発する。   The phosphor layer 13 has a base material and a phosphor dispersed in the base material. As a material of the base material of the phosphor layer 13, for example, a silicone resin, an epoxy resin, glass, or the like can be used. The phosphor is excited by light emitted from the chip 20, and emits light having a wavelength different from the wavelength of the light emitted from the chip 20.

チップ２０の半導体積層部は、例えば、ＩｎｘＡｌｙＧａ１−ｘ−ｙＮ（０≦ｘ、０≦ｙ、Ｘ＋Ｙ≦１）を含み、青色系の光を発光することができる。青色系の光を発光するチップ２０に対して、例えば黄色系の発光をする蛍光体を含む蛍光体層１３を組み合わせることができる。または、青色系の光を発光するチップ２０に対して、緑色系の発光をする蛍光体および赤色系の発光をする蛍光体を含む蛍光体層１３を組み合わせることができる。 Semiconductor lamination portion of the chip 20, for example, an In x Al y Ga include 1-x-y N (0 ≦ x, 0 ≦ y, X + Y ≦ 1) , and can emit blue light. The phosphor layer 13 including, for example, a phosphor that emits yellow light can be combined with the chip 20 that emits blue light. Alternatively, a phosphor layer 13 including a phosphor that emits green light and a phosphor that emits red light can be combined with the chip 20 that emits blue light.

樹脂部材１２は、チップ２０が発する光および蛍光体が発する光に対して反射性または遮光性を有する。樹脂部材１２は、例えば、母材と、母材に分散された反射材または遮光材とを有する。母材は、蛍光体層１３の母材と同じものを用いることができる。反射材は、例えば、酸化チタン、酸化亜鉛、酸化ケイ素、酸化ジルコニウム、酸化アルミニウム、窒化アルミニウムなどが挙げられる。   The resin member 12 has a property of reflecting or blocking light emitted from the chip 20 and light emitted from the phosphor. The resin member 12 has, for example, a base material and a reflective material or a light shielding material dispersed in the base material. The same base material as the base material of the phosphor layer 13 can be used. Examples of the reflecting material include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, and aluminum nitride.

発光素子５０の発光面１０（蛍光体層１３の上面）上に、反射部材３０と透光部材１５が配置されている。   On the light emitting surface 10 (the upper surface of the phosphor layer 13) of the light emitting element 50, the reflecting member 30 and the light transmitting member 15 are arranged.

発光面１０は、例えば、Ｘ方向に沿った短辺と、Ｙ方向に沿った長辺とを有する矩形状に形成されている。発光面１０は、Ｘ方向に離間した第１端部１０ａと第２端部１０ｂとを有する。   The light emitting surface 10 is formed in, for example, a rectangular shape having a short side along the X direction and a long side along the Y direction. The light emitting surface 10 has a first end 10a and a second end 10b separated in the X direction.

反射部材３０は、発光面１０上において第１端部１０ａ側に配置されている。反射部材３０は、下面３１と、上面３２と、内側面３３と、外側面３４とを有する。   The reflection member 30 is disposed on the light emitting surface 10 on the first end 10a side. The reflecting member 30 has a lower surface 31, an upper surface 32, an inner surface 33, and an outer surface.

下面３１は、反射部材３０の高さ方向（Ｚ方向）において、上面３２よりも発光面１０側に位置する。上面３２の内端３２ａは、下面３１の内端３１ａよりも、発光面１０の第２端部１０ｂに近い位置にある。上面３２および下面３１は、発光面１０に対して平行に、第１端部１０ａから第２端部１０ｂに向かって広がっている。上面３２は、下面３１よりも、第２端部１０ｂに近い位置にまで広がっている。   The lower surface 31 is located closer to the light emitting surface 10 than the upper surface 32 in the height direction (Z direction) of the reflecting member 30. The inner end 32 a of the upper surface 32 is located closer to the second end 10 b of the light emitting surface 10 than the inner end 31 a of the lower surface 31. The upper surface 32 and the lower surface 31 extend from the first end 10a toward the second end 10b in parallel with the light emitting surface 10. The upper surface 32 extends to a position closer to the second end 10b than the lower surface 31.

上面３２の内端３２ａと下面３１の内端３１ａとの間に内側面３３が配置されている。内側面３３は、発光面１０に対して傾斜した面、または曲面を有する。図１および図２に示す例では、内側面３３は、第１反射面３３ａと第２反射面３３ｂとを有する。第１反射面３３ａは、発光面１０に対して垂直な面である。第２反射面３３ｂは、例えば曲面である。または、第２反射面３３ｂは、発光面１０に対して傾斜した傾斜面であってよい。第１反射面３３ａは上面３２に連続し、第２反射面３３ｂは第１反射面３３ａと下面３１に連続している。   An inner side surface 33 is arranged between an inner end 32 a of the upper surface 32 and an inner end 31 a of the lower surface 31. The inner side surface 33 has a surface inclined with respect to the light emitting surface 10 or a curved surface. In the example shown in FIGS. 1 and 2, the inner side surface 33 has a first reflection surface 33a and a second reflection surface 33b. The first reflecting surface 33a is a surface perpendicular to the light emitting surface 10. The second reflection surface 33b is, for example, a curved surface. Alternatively, the second reflection surface 33b may be an inclined surface inclined with respect to the light emitting surface 10. The first reflection surface 33a is continuous with the upper surface 32, and the second reflection surface 33b is continuous with the first reflection surface 33a and the lower surface 31.

図１および図２には、第２反射面３３ｂとして、例えば凹面状の曲面を示す。または、曲面は凸面状であってもよい。また、内側面３３は、傾斜面を有していてもよい。または、内側面３３は、傾斜面と曲面の両方を有していてもよい。   1 and 2 show, for example, a concave curved surface as the second reflection surface 33b. Alternatively, the curved surface may be convex. Further, the inner side surface 33 may have an inclined surface. Alternatively, the inner side surface 33 may have both an inclined surface and a curved surface.

内側面３３の第２反射面３３ｂは、発光素子５０の発光面１０の第１端部１０ａから庇状に突き出て発光面１０の上に重なり、発光面１０に対向している。   The second reflection surface 33b of the inner side surface 33 projects from the first end 10a of the light emitting surface 10 of the light emitting element 50 in an eaves shape, overlaps the light emitting surface 10, and faces the light emitting surface 10.

反射部材３０の外側面３４は、発光装置１のＹ方向に沿った側面の一部を構成し、発光装置１の外部に露出している。反射部材３０のＸ方向に沿った側面３６は、発光装置１のＸ方向に沿った側面の一部を構成し、発光装置１の外部に露出している。   The outer side surface 34 of the reflection member 30 forms a part of a side surface of the light emitting device 1 along the Y direction, and is exposed to the outside of the light emitting device 1. The side surface 36 of the reflecting member 30 along the X direction constitutes a part of the side surface of the light emitting device 1 along the X direction, and is exposed to the outside of the light emitting device 1.

反射部材３０の上面３２、下面３１、内側面３３、および外側面３４は、矩形状の発光面１０の長辺方向（Ｙ方向）に連続して延びている。   The upper surface 32, the lower surface 31, the inner side surface 33, and the outer side surface 34 of the reflecting member 30 extend continuously in the long side direction (Y direction) of the rectangular light emitting surface 10.

反射部材３０は、チップ２０が発する光および蛍光体が発する光に対して反射性を有する。反射部材３０は、例えば、母材と、母材に分散された反射材とを有する。母材は、樹脂部材１２と同じものを用いることができる。すなわち、反射部材３０は、反射材を含む樹脂部材である。反射材は、例えば、酸化チタン、酸化亜鉛、酸化ケイ素、酸化ジルコニウム、酸化アルミニウム、窒化アルミニウムなどである。または、反射部材３０は、金属部材であってもよい。   The reflecting member 30 has reflectivity for light emitted from the chip 20 and light emitted from the phosphor. The reflection member 30 has, for example, a base material and a reflection material dispersed in the base material. The same base material as the resin member 12 can be used. That is, the reflection member 30 is a resin member including a reflection material. The reflecting material is, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride, or the like. Alternatively, the reflection member 30 may be a metal member.

透光部材１５は、反射部材３０の内側面３３に隣接して発光面１０上に配置されている。透光部材１５は、反射部材３０の第２反射面３３ｂと、発光素子５０の発光面１０との間に配置されている。透光部材１５の側面は、発光装置１の側面の一部を構成し、発光装置１の外部に露出している。透光部材１５の上面および反射部材３０の上面３２は連続した平坦面を形成し、これら透光部材１５の上面および反射部材３０の上面３２は発光装置１の上面を構成する。   The light transmitting member 15 is disposed on the light emitting surface 10 adjacent to the inner side surface 33 of the reflecting member 30. The light transmitting member 15 is arranged between the second reflecting surface 33 b of the reflecting member 30 and the light emitting surface 10 of the light emitting element 50. The side surface of the light transmitting member 15 forms a part of the side surface of the light emitting device 1 and is exposed to the outside of the light emitting device 1. The upper surface of the light transmitting member 15 and the upper surface 32 of the reflecting member 30 form a continuous flat surface, and the upper surface of the light transmitting member 15 and the upper surface 32 of the reflecting member 30 constitute the upper surface of the light emitting device 1.

透光部材１５は、反射部材３０を補強している。これにより、反射部材３０の形状変化による配光の変化を防ぐことができる。反射部材３０の内側面３３は、第１反射面３３ａと第２反射面３３ｂとの間に角部３３ｃを有する。その角部３３ｃが透光部材１５に食い込むことで、透光部材１５と反射部材３０との密着性を高めることができる。   The light transmitting member 15 reinforces the reflecting member 30. Thereby, it is possible to prevent a change in light distribution due to a change in the shape of the reflection member 30. The inner surface 33 of the reflecting member 30 has a corner 33c between the first reflecting surface 33a and the second reflecting surface 33b. Since the corners 33c bite into the light transmitting member 15, the adhesion between the light transmitting member 15 and the reflecting member 30 can be enhanced.

透光部材１５は、チップ２０が発する光および蛍光体が発する光に対して透過性を有する。透光部材１５は、例えば樹脂部材またはガラス部材である。透光部材１５は、後述する遮光対象エリアに光を広げる可能性がある散乱材を含まないことが望ましい。   The light transmitting member 15 has transparency to light emitted from the chip 20 and light emitted from the phosphor. The light transmitting member 15 is, for example, a resin member or a glass member. It is desirable that the translucent member 15 does not include a scattering material that may spread light to a light-shielding target area described later.

発光素子５０の発光面１０から出射された光は透光部材１５に入射する。透光部材１５に入射した光のうち反射部材３０の第２反射面３３ｂに向かった光は、第２反射面３３ｂで反射する。この第２反射面３３ｂでの光の反射により、発光面１０から上方に出射された光の方向を第２端部１０ｂ側の照明対象エリア１００に向かう方向（発光面１０に対して傾斜した斜め方向および発光面１０に平行な方向を含む方向）に変換することができる。   Light emitted from the light emitting surface 10 of the light emitting element 50 enters the light transmitting member 15. Of the light incident on the light transmitting member 15, the light traveling toward the second reflecting surface 33 b of the reflecting member 30 is reflected by the second reflecting surface 33 b. Due to the reflection of the light from the second reflecting surface 33b, the direction of the light emitted upward from the light emitting surface 10 is directed toward the illumination target area 100 on the second end 10b side (oblique with respect to the light emitting surface 10). Direction and a direction including a direction parallel to the light emitting surface 10).

発光面１０における反射部材３０が配置された第１端部１０ａ側のエリアは遮光対象エリア２００であり、反射部材３０は遮光対象エリア２００に向かう光を遮る。例えば、住宅地などに対して遮光しつつ、道路を照明する街路灯などの照明機器に、本実施形態の発光装置１を用いることができる。   The area on the first end 10a side of the light emitting surface 10 where the reflection member 30 is arranged is a light shielding target area 200, and the reflection member 30 blocks light traveling toward the light shielding target area 200. For example, the light-emitting device 1 of the present embodiment can be used for a lighting device such as a street lamp that illuminates a road while shielding a residential area or the like from light.

実施形態によれば、発光装置１自体で配光制御されている。そのため、発光装置１とは別に備えられる２次レンズやリフレクタを小型化すること、それらの部品数を削減することが可能になる。また、用途によっては、２次レンズやリフレクタを不要にすることも可能である。したがって、そのような発光装置１を搭載した照明機器の小型化、構成の簡略化、部品数の削減が可能になる。   According to the embodiment, the light distribution is controlled by the light emitting device 1 itself. Therefore, it is possible to reduce the size of the secondary lens and the reflector provided separately from the light emitting device 1 and to reduce the number of components thereof. Further, depending on the application, it is possible to eliminate the need for a secondary lens or a reflector. Therefore, it is possible to reduce the size, simplify the configuration, and reduce the number of components of the lighting device equipped with such a light emitting device 1.

傾斜面または曲面の内側面３３は、発光面１０に対して垂直な面のみからなる内側面に比べて、反射部材３０の高さを抑えつつ、反射面の面積を広く確保することができる。   The inner surface 33 of the inclined surface or the curved surface can secure a larger area of the reflecting surface while suppressing the height of the reflecting member 30 as compared with the inner surface composed of only the surface perpendicular to the light emitting surface 10.

チップ２０の側面は、反射性または遮光性を有する樹脂部材１２で直接的に又は間接的に覆われ、発光装置１の側面を構成していない。チップ２０の側面は、発光装置１の外部に露出していない。樹脂部材１２の側面は、発光装置１の側面の一部を構成する。蛍光体層１３の側面も発光装置１の側面の一部を構成してもよい。蛍光体層１３の厚さがチップ２０の厚さに比べて薄い場合は、蛍光体層１３の側面から出射される光は、実質的に発光装置１の配光に与える影響は小さい。   The side surface of the chip 20 is directly or indirectly covered with the resin member 12 having a reflective or light-shielding property, and does not constitute the side surface of the light emitting device 1. The side surface of the chip 20 is not exposed outside the light emitting device 1. The side surface of the resin member 12 forms a part of the side surface of the light emitting device 1. The side surface of the phosphor layer 13 may also constitute a part of the side surface of the light emitting device 1. When the thickness of the phosphor layer 13 is smaller than the thickness of the chip 20, the light emitted from the side surface of the phosphor layer 13 substantially has little effect on the light distribution of the light emitting device 1.

反射部材３０の下面３１は、図２に示すように、半導体積層部を含むチップ２０の上面に重ならない位置に配置することができる。尚、反射部材３０の下面３１は、チップ２０の上面に重なる位置に配置されていてもよい。反射部材３０がチップ２０の上面と重なる場合は、例えば、チップ２０の上面の面積の５％〜２０％とすることができる。   As shown in FIG. 2, the lower surface 31 of the reflection member 30 can be arranged at a position that does not overlap the upper surface of the chip 20 including the semiconductor laminated portion. The lower surface 31 of the reflection member 30 may be arranged at a position overlapping the upper surface of the chip 20. When the reflection member 30 overlaps the upper surface of the chip 20, for example, it can be set to 5% to 20% of the area of the upper surface of the chip 20.

反射部材３０と、チップ２０の周囲の樹脂部材１２とは別体であり、反射部材３０の下面３１と樹脂部材１２との間には蛍光体層１３が配置されている。反射部材３０を樹脂部材１２と別体とすることで、反射部材３０を形成する難易度を低くできる。   The reflecting member 30 and the resin member 12 around the chip 20 are separate bodies, and the phosphor layer 13 is disposed between the lower surface 31 of the reflecting member 30 and the resin member 12. By forming the reflecting member 30 separately from the resin member 12, the difficulty of forming the reflecting member 30 can be reduced.

または、図３に示すように、反射部材３０を樹脂部材１２と一体に形成してもよい。この場合、蛍光体層１３における遮光対象エリア２００側の側面が反射部材３０によって覆われ、遮光対象エリア２００への蛍光体層１３の側面からの漏れ光を防ぐことができる。   Alternatively, as shown in FIG. 3, the reflecting member 30 may be formed integrally with the resin member 12. In this case, the side surface of the phosphor layer 13 on the side of the light shielding target area 200 is covered with the reflection member 30, and light leakage from the side surface of the phosphor layer 13 to the light shielding target area 200 can be prevented.

図４は、本開示の第２実施形態の発光装置２の模式断面図である。   FIG. 4 is a schematic cross-sectional view of the light emitting device 2 according to the second embodiment of the present disclosure.

発光面１０の広さや、望む配光に応じて、複数の反射部材３０を配置することができる。図４に示す発光装置２は、例えばＸ方向に沿って並んだ２つのチップ２０を有する。発光装置２の発光面１０は、第１実施形態の発光装置１の発光面１０よりもＸ方向の幅が広がっている。   A plurality of reflecting members 30 can be arranged according to the size of the light emitting surface 10 and the desired light distribution. The light emitting device 2 shown in FIG. 4 has, for example, two chips 20 arranged along the X direction. The light emitting surface 10 of the light emitting device 2 is wider in the X direction than the light emitting surface 10 of the light emitting device 1 of the first embodiment.

そして、発光装置２の発光面１０上には、２つの反射部材３０がＸ方向に互いに離間して配置されている。１つの反射部材３０は、第１実施形態と同様、発光面１０の第１端部１０ａ側に配置されている。もう１つの反射部材３０は、第１端部１０ａと第２端部１０ｂとの間に配置されている。   Then, on the light emitting surface 10 of the light emitting device 2, two reflecting members 30 are arranged apart from each other in the X direction. One reflecting member 30 is disposed on the first end 10a side of the light emitting surface 10 as in the first embodiment. Another reflecting member 30 is disposed between the first end 10a and the second end 10b.

第１端部１０ａと第２端部１０ｂとの間に設けられた反射部材３０の下面３１も、チップ２０の上面に重なっていないため、発光装置２の光束の低下を防ぐことができる。   Since the lower surface 31 of the reflection member 30 provided between the first end 10a and the second end 10b does not overlap with the upper surface of the chip 20, it is possible to prevent the light flux of the light emitting device 2 from lowering.

図５は、本開示の第３実施形態の発光装置３の模式断面図である。   FIG. 5 is a schematic cross-sectional view of a light emitting device 3 according to the third embodiment of the present disclosure.

発光装置３の反射部材３０の外側面３５は、発光面１０に対して傾斜した傾斜面を有する。または、外側面３５は曲面を有していてもよい。   The outer surface 35 of the reflecting member 30 of the light emitting device 3 has an inclined surface that is inclined with respect to the light emitting surface 10. Alternatively, the outer surface 35 may have a curved surface.

複数の発光装置３がＸ方向に並べて配置され、それら複数の発光装置３の上方に、複数の発光装置３に共通に２次レンズが配置されている。この場合において、ある発光装置３の内側面３３で反射して第２端部１０ｂ側の側面から外部に出射した光を、その発光装置３の第２端部１０ｂ側の隣に配置された他の発光装置３の反射部材３０の外側面３５で反射させて、２次レンズに向かわせることができる。   A plurality of light emitting devices 3 are arranged in the X direction, and a secondary lens is arranged above the plurality of light emitting devices 3 in common with the plurality of light emitting devices 3. In this case, the light reflected by the inner side surface 33 of a certain light emitting device 3 and emitted to the outside from the side surface on the second end portion 10b side is separated from the light emitting device 3 by the light The light can be reflected by the outer surface 35 of the reflecting member 30 of the light emitting device 3 and directed to the secondary lens.

以上、具体例を参照しつつ、本開示の実施形態について説明した。しかし、本開示は、これらの具体例に限定されるものではない。本開示の上述した実施形態を基にして、当業者が適宜設計変更して実施し得る全ての形態も、本開示の要旨を包含する限り、本開示の範囲に属する。他、本開示の思想の範疇において、当業者であれば、各種の変更例及び修正例に想到し得るものであり、それら変更例及び修正例についても本開示の範囲に属するものと了解される。   The embodiments of the present disclosure have been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. All modes that can be implemented by a person skilled in the art with appropriate design changes based on the above-described embodiments of the present disclosure also fall within the scope of the present disclosure as long as the gist of the present disclosure is included. In addition, in the scope of the concept of the present disclosure, those skilled in the art can conceive various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present disclosure. .

１〜３…発光装置、１０…発光面、１１…基板、１３…蛍光体層、１５…透光部材、２０…チップ、３０…反射部材、３１…下面、３２…上面、３３…内側面、３３ａ…第１反射面、３３ｂ…第２反射面、３４,３５…外側面、５０…発光素子   1-3 light-emitting device, 10 light-emitting surface, 11 substrate, 13 phosphor layer, 15 light-transmitting member, 20 chip, 30 reflective member, 31 lower surface, 32 upper surface, 33 inner surface, 33a: first reflecting surface, 33b: second reflecting surface, 34, 35: outer surface, 50: light emitting element

Claims (6)

発光面を有する発光素子と、
前記発光面上において第１方向に離間した第１端部と第２端部のうちの前記第１端部側に配置された反射部材と、
を備え、
前記反射部材は、
前記発光面側の下面と、
前記下面の内端よりも前記第２端部に近い位置に内端を有する上面と、
前記上面の内端と前記下面の内端の間の内側面であって、前記発光面に対して傾斜した面、または曲面を有する内側面と、
を有する発光装置。 A light emitting element having a light emitting surface,
A reflecting member disposed on the first end side of the first end and the second end separated from each other in a first direction on the light emitting surface;
With
The reflection member,
A lower surface on the light emitting surface side;
An upper surface having an inner end at a position closer to the second end than an inner end of the lower surface;
An inner surface between the inner end of the upper surface and the inner end of the lower surface, a surface inclined with respect to the light emitting surface, or an inner surface having a curved surface,
A light emitting device having: 前記反射部材の前記内側面は、前記第１方向に交差する第２方向に連続して延びている請求項１記載の発光装置。   The light emitting device according to claim 1, wherein the inner surface of the reflection member extends continuously in a second direction that intersects the first direction. 前記反射部材は、反射材を含む樹脂部材である請求項１または２に記載の発光装置。   The light emitting device according to claim 1, wherein the reflection member is a resin member including a reflection material. 前記反射部材の前記内側面に隣接して前記発光面上に設けられた透光部材をさらに備えた請求項１〜３のいずれか１つに記載の発光装置。   The light emitting device according to claim 1, further comprising a light transmitting member provided on the light emitting surface adjacent to the inner side surface of the reflection member. 前記発光素子は、蛍光体層を含み、
前記発光面は、前記蛍光体層の上面である請求項１〜４のいずれか１つに記載の発光装置。 The light emitting device includes a phosphor layer,
The light emitting device according to claim 1, wherein the light emitting surface is an upper surface of the phosphor layer. 前記発光素子は、半導体積層部を含み、
前記反射部材の前記下面は、前記半導体積層部の上面に重なっていない請求項１〜５のいずれか１つに記載の発光装置。 The light emitting element includes a semiconductor laminated portion,
The light emitting device according to claim 1, wherein the lower surface of the reflection member does not overlap an upper surface of the semiconductor stacked unit.
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