JP6104624B2 - 半導体デバイスの製造方法および半導体デバイス - Google Patents

半導体デバイスの製造方法および半導体デバイス Download PDF

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Publication number
JP6104624B2
JP6104624B2 JP2013021328A JP2013021328A JP6104624B2 JP 6104624 B2 JP6104624 B2 JP 6104624B2 JP 2013021328 A JP2013021328 A JP 2013021328A JP 2013021328 A JP2013021328 A JP 2013021328A JP 6104624 B2 JP6104624 B2 JP 6104624B2
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Japan
Prior art keywords
translucent
light receiving
optical
semiconductor
bonding
Prior art date
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Active
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JP2013021328A
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English (en)
Japanese (ja)
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JP2014154629A (ja
JP2014154629A5 (https=
Inventor
勝久 長谷川
勝久 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Pioneer Micro Technology Corp
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Pioneer Corp
Pioneer Micro Technology Corp
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Priority to JP2013021328A priority Critical patent/JP6104624B2/ja
Publication of JP2014154629A publication Critical patent/JP2014154629A/ja
Publication of JP2014154629A5 publication Critical patent/JP2014154629A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
JP2013021328A 2013-02-06 2013-02-06 半導体デバイスの製造方法および半導体デバイス Active JP6104624B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013021328A JP6104624B2 (ja) 2013-02-06 2013-02-06 半導体デバイスの製造方法および半導体デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013021328A JP6104624B2 (ja) 2013-02-06 2013-02-06 半導体デバイスの製造方法および半導体デバイス

Publications (3)

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JP2014154629A JP2014154629A (ja) 2014-08-25
JP2014154629A5 JP2014154629A5 (https=) 2016-06-02
JP6104624B2 true JP6104624B2 (ja) 2017-03-29

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JP2013021328A Active JP6104624B2 (ja) 2013-02-06 2013-02-06 半導体デバイスの製造方法および半導体デバイス

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JP (1) JP6104624B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190081028A1 (en) * 2016-05-30 2019-03-14 Mitsumi Electric Co., Ltd. Optical module, module, and methods for manufacturing optical module and module
CN107482089A (zh) * 2017-08-08 2017-12-15 湘能华磊光电股份有限公司 一种高亮度led芯片及其制备方法
JP7410782B2 (ja) * 2020-04-03 2024-01-10 京セラ株式会社 電磁波検出装置および検出モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198470A (ja) * 2000-12-05 2002-07-12 Greatek Electronics Inc Ｉｃパッケージング構造
JP4720629B2 (ja) * 2006-06-07 2011-07-13 株式会社デンソー 回転センサ装置
JP2009049290A (ja) * 2007-08-22 2009-03-05 Fujifilm Corp 撮像装置及びその製造方法
JP5017472B1 (ja) * 2011-03-16 2012-09-05 株式会社東芝 電子機器

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JP2014154629A (ja) 2014-08-25

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