JP6083253B2 - 発光装置の積層体 - Google Patents

発光装置の積層体 Download PDF

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Publication number
JP6083253B2
JP6083253B2 JP2013032080A JP2013032080A JP6083253B2 JP 6083253 B2 JP6083253 B2 JP 6083253B2 JP 2013032080 A JP2013032080 A JP 2013032080A JP 2013032080 A JP2013032080 A JP 2013032080A JP 6083253 B2 JP6083253 B2 JP 6083253B2
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JP
Japan
Prior art keywords
light emitting
light
emitting device
substrate
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013032080A
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English (en)
Japanese (ja)
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JP2014165190A (ja
JP2014165190A5 (enExample
Inventor
山田 元量
元量 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013032080A priority Critical patent/JP6083253B2/ja
Priority to US14/184,842 priority patent/US9388951B2/en
Publication of JP2014165190A publication Critical patent/JP2014165190A/ja
Publication of JP2014165190A5 publication Critical patent/JP2014165190A5/ja
Application granted granted Critical
Publication of JP6083253B2 publication Critical patent/JP6083253B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2013032080A 2013-02-21 2013-02-21 発光装置の積層体 Active JP6083253B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013032080A JP6083253B2 (ja) 2013-02-21 2013-02-21 発光装置の積層体
US14/184,842 US9388951B2 (en) 2013-02-21 2014-02-20 Stacked assembly of light emitting devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013032080A JP6083253B2 (ja) 2013-02-21 2013-02-21 発光装置の積層体

Publications (3)

Publication Number Publication Date
JP2014165190A JP2014165190A (ja) 2014-09-08
JP2014165190A5 JP2014165190A5 (enExample) 2016-04-07
JP6083253B2 true JP6083253B2 (ja) 2017-02-22

Family

ID=51350570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013032080A Active JP6083253B2 (ja) 2013-02-21 2013-02-21 発光装置の積層体

Country Status (2)

Country Link
US (1) US9388951B2 (enExample)
JP (1) JP6083253B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506042B2 (ja) * 2015-02-17 2019-04-24 三菱電機株式会社 光源モジュールおよび発光装置
JP6540098B2 (ja) * 2015-02-27 2019-07-10 日亜化学工業株式会社 発光装置
JP2016167034A (ja) * 2015-03-10 2016-09-15 株式会社東芝 表示装置、発光装置及びライトユニット
JP2016197669A (ja) * 2015-04-03 2016-11-24 大日本印刷株式会社 Led素子用のフレキシブル多層回路基板及びそれを用いたledドットマトリックス表示装置
JP2016197675A (ja) * 2015-04-06 2016-11-24 大日本印刷株式会社 Led素子用のフレキシブル多層回路基板
JP6617452B2 (ja) * 2015-07-07 2019-12-11 日亜化学工業株式会社 線状光源
JP6608758B2 (ja) * 2016-04-11 2019-11-20 株式会社Joled 有機el表示パネル、有機el表示装置、及びその製造方法
FR3102832B1 (fr) * 2019-11-06 2021-10-29 Valeo Vision Ensemble de sources lumineuses, dispositif d'éclairage automobile et procédé de fabrication
CN111998238A (zh) * 2020-08-26 2020-11-27 广东奥普特科技股份有限公司 一种可自动校正亮度的线性光源及校正方法
JP7505395B2 (ja) * 2020-12-21 2024-06-25 豊田合成株式会社 発光装置とその製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148629A (ja) * 1995-11-17 1997-06-06 Stanley Electric Co Ltd Ledドットマトリクス表示器
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
US6767112B2 (en) * 2002-05-29 2004-07-27 Jiahn-Chang Wu Projection lamp with led matrix panel
JP2006100052A (ja) 2004-09-29 2006-04-13 Moriyama Sangyo Kk 発光装置
JP4582786B2 (ja) * 2005-06-16 2010-11-17 ニチコン株式会社 光源装置
US20100072416A1 (en) * 2006-10-31 2010-03-25 Techno Polymer Co. Ltd Heat-dissipating resin composition, substrate for led mounting, reflector, and substrate for led mounting having reflector portion
DE102007041896A1 (de) * 2007-09-04 2009-03-05 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
WO2009083887A1 (en) * 2008-01-03 2009-07-09 Koninklijke Philips Electronics N.V. Display device and illumination device
JP4544316B2 (ja) * 2008-03-10 2010-09-15 セイコーエプソン株式会社 光源及び光源実装方法
JP5279309B2 (ja) * 2008-03-19 2013-09-04 トッパン・フォームズ株式会社 紫外線照射装置
JP5308773B2 (ja) * 2008-10-30 2013-10-09 スタンレー電気株式会社 半導体発光装置
DE102009015307A1 (de) * 2009-03-27 2010-09-30 Osram Opto Semiconductors Gmbh Anordnung optoelektronischer Bauelemente
EP2430652B1 (en) * 2009-05-12 2019-11-20 The Board of Trustees of the University of Illionis Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
JP2011228602A (ja) 2010-04-23 2011-11-10 Toray Ind Inc Led発光装置およびその製造方法
JP2012069834A (ja) * 2010-09-27 2012-04-05 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP5885922B2 (ja) 2010-12-28 2016-03-16 日亜化学工業株式会社 発光装置
US8927308B2 (en) * 2011-05-12 2015-01-06 Universal Display Corporation Method of forming bus line designs for large-area OLED lighting
KR102098590B1 (ko) * 2012-12-11 2020-04-09 삼성전자주식회사 발광모듈 및 이를 구비한 면 조명장치
JP6064584B2 (ja) * 2012-12-22 2017-01-25 日亜化学工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
JP2014165190A (ja) 2014-09-08
US9388951B2 (en) 2016-07-12
US20140231835A1 (en) 2014-08-21

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