JP6069014B2 - Slit nozzle and substrate processing apparatus - Google Patents

Description

  In the present invention, the surface of a glass substrate for liquid crystal, a semiconductor substrate, a flexible substrate for film liquid crystal, a substrate for photomask, a substrate for color filter, a substrate for solar cell, a substrate for organic EL, etc. (hereinafter simply referred to as “substrate”). The present invention relates to a technique for applying a treatment liquid to the substrate.

  The substrate manufacturing process includes a coating process in which a processing liquid such as a photoresist is applied to the surface of the substrate. In the coating process, a coating apparatus (so-called slit coater) that discharges the processing liquid from the slit nozzle onto the surface of the substrate may be used.

  Specifically, for example, the slit nozzle has a slit-like discharge port extending along its longitudinal direction (width direction), and discharges the processing liquid from this discharge port. In the coating apparatus, the slit nozzle is moved relative to the substrate along a direction orthogonal to the longitudinal direction of the discharge port while discharging the processing liquid from the discharge port toward the substrate. As a result, the treatment liquid is applied to a rectangular region in the surface of the substrate (see, for example, Patent Document 1).

JP 2006-261326 A

  By the way, the coating film formed on the surface of the substrate by applying the treatment liquid has a tendency that the film thickness in the vicinity of the edge is locally thick due to the action of surface tension or the like. For this reason, there is a high possibility that a chip with sufficiently secured product quality is not obtained from the area near the edge of the coating film, and such an area is often eventually discarded. That is, an area obtained by adding a region where the film thickness near the edge of the coating film is difficult to stabilize to the blank area from the edge of the substrate to the edge of the coating film is often discarded. Naturally, the larger the area to be discarded, the greater the waste and the lower the production efficiency.

  On the other hand, depending on the characteristics (viscosity, wettability, etc.) of processing liquids, some of them are relatively easy to spread on the substrate, while others are relatively difficult to spread. Even when an easy-to-use treatment liquid is applied, the dimensions are often sufficiently smaller than the width of the substrate so that the coating film does not protrude from the edge of the substrate. Therefore, when a treatment liquid that is relatively difficult to spread is applied using this slit nozzle, the blank area from the edge of the substrate to the edge of the coating film becomes large, and consequently the area to be discarded becomes large. . In addition, some processing liquids tend to shrink on the substrate. Even when this type of processing liquid is applied, the blank area from the edge of the substrate to the edge of the coating film is large. As a result, the area to be discarded becomes large.

  In order to keep the area to be discarded in correspondence with various processing conditions, for example, a plurality of slit nozzles having different discharge port width dimensions are prepared, and the one that matches the processing conditions is prepared. A slit nozzle may be selected and used. In this case, for example, when the processing conditions are changed, the blank area can be suppressed to a small value (and thus the area to be discarded can be suppressed to a small value) by changing the slit nozzle to be used. However, according to this measure, in order to flexibly cope with various processing conditions, it is necessary to prepare many slit nozzles, which is not realistic.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a technique capable of flexibly changing the discharge width of the processing liquid in the slit nozzle.

The first aspect is a slit nozzle having a slit-like discharge port at its lower part, and a liquid feed path is formed inside, and a lower end of the liquid feed path opens to the outside, whereby the length of the discharge port A nozzle body portion having an opening edge along the direction, a pair of side plates disposed on both sides of the longitudinal end surfaces of the nozzle body portion, an end surface of the nozzle body portion, and the side plate, An adjustment thin plate sandwiched between the inner thin plate and the adjustment thin plate, the inner thin plate being in contact with the end surface of the nozzle body, and penetrating from the outer surface in contact with the side plate. A liquid feeding space communicating with the liquid feeding path at the opening end on the inner side surface and having an opening end on the outer side surface opened to the side plate; and a processing liquid in the liquid feeding space Under the outer surface Comprising a leakage structure to leak from the edge, wherein the liquid feed space, is closed relative to the lower end surface of the adjustment sheet.

  According to a second aspect, in the slit nozzle according to the first aspect, the liquid supply path is a diffusion path section that diffuses the processing liquid in the longitudinal direction of the nozzle body section, and the processing from the diffusion path section to the discharge port. A flow path portion for guiding the liquid, and the liquid feeding space communicates with the flow path portion.

  According to a third aspect, in the slit nozzle according to the first or second aspect, the adjustment thin plate is detachably fixed to the nozzle main body and the side plate.

A fourth aspect is the slit nozzle according to any one of the first to third aspects, wherein the adjustment thin plate extends vertically from the inner side surface to the outer side surface of the adjustment thin plate. A long through groove, and the through groove forms the liquid feeding space.

According to a fifth aspect, in the slit nozzle according to any one of the first to third aspects, the adjustment thin plate is formed on the outer side surface and has a long groove extending vertically and a bottom surface of the groove. To the inner side surface, and the groove and the through hole form the liquid feeding space.

According to a sixth aspect, in the slit nozzle according to any one of the first to fifth aspects, the lower end surface of the adjustment thin plate is not flush with the lower end of the nozzle body.

According to a seventh aspect, in the substrate processing apparatus, the slit nozzle according to any one of the first to sixth aspects, a holding unit that holds the substrate horizontally below the slit nozzle, and the slit nozzle, A drive unit that relatively moves the substrate held in the direction perpendicular to the longitudinal direction of the discharge port, and a supply unit that supplies a processing liquid to the slit nozzle.

According to the first to seventh aspects, the adjustment thin plate leaks out the liquid supply space communicating with the liquid supply path of the nozzle main body and the processing liquid in the liquid supply space from the lower end edge of the outer surface of the adjustment thin plate. And a structure. According to this configuration, the discharge end position of the slit nozzle can be set to the position of the outer surface of the adjustment thin plate. That is, the discharge end position of the slit nozzle can be shifted outward from the position of the end face of the nozzle body by the thickness of the adjustment thin plate. Therefore, the discharge width of the processing liquid in the slit nozzle can be flexibly changed simply by changing the thickness of the adjustment thin plate.

  In particular, according to the second aspect, the liquid feeding space communicates with the flow path portion that guides the processing liquid from the diffusion path portion to the discharge port. According to this configuration, a part of the processing liquid in the liquid feeding path can be smoothly flowed into the liquid feeding space.

  In particular, according to the third aspect, the adjustment thin plate is detachably provided. According to this configuration, the adjustment thin plate can be easily replaced. As a result, the discharge width of the processing liquid in the slit nozzle can be easily changed.

In particular, according to the first aspect, the liquid feeding space is closed with respect to the lower end surface of the adjustment thin plate. According to this configuration, the processing liquid in the liquid feeding space oozes out to the boundary portion where the outer surface of the adjustment thin plate and the side plate are in contact with each other and leaks from the lower end edge of the outer surface. According to this configuration, the discharge end position of the slit nozzle can be accurately shifted by the thickness of the adjustment thin plate with a simple configuration.

In particular, according to the fourth aspect, the long through groove provided penetrating from the inner side surface to the outer side surface of the adjustment thin plate forms a liquid feeding space. According to this configuration, the amount of the treatment liquid leaking from the lower end edge can be adjusted by adjusting at least one of the dimension of the through groove and the formation position of the through groove.

In particular, according to the fifth aspect, the long groove formed on the outer side surface of the adjustment thin plate and the through hole penetrating from the bottom surface of the groove to the inner side surface form a liquid feeding space. According to this configuration, the amount of the processing liquid leaking from the lower end edge can be adjusted by adjusting at least one of the dimension of the groove, the position where the groove is formed, the dimension of the through hole, and the position where the through hole is formed. it can.

In particular, according to the sixth aspect, the lower end surface of the adjustment thin plate is not flush with the lower end of the nozzle body. According to this configuration, the film thickness of the edge portion of the coating film (that is, the coating film portion formed by applying the treatment liquid from the vicinity of the discharge end position of the slit nozzle) can be adjusted.

It is the perspective view which showed the outline of the substrate processing apparatus which concerns on this invention. It is the schematic side view which showed the structure of the slit nozzle. It is the schematic perspective view which showed the structure of the nozzle main-body part of a slit nozzle. It is the schematic sectional drawing which showed a part of slit nozzle provided with the adjustment thin plate which concerns on a 1st form. It is the schematic plan view which looked at the adjustment thin plate which concerns on a 1st form from the outer surface side. It is the schematic sectional drawing which showed a part of slit nozzle provided with the adjustment thin plate which concerns on a 2nd form. It is the schematic plan view which looked at the adjustment thin plate which concerns on a 2nd form from the side of an outer surface. It is the schematic sectional drawing which showed a part of slit nozzle provided with the adjustment thin plate which concerns on a 3rd form. It is the schematic plan view which looked at the adjustment thin plate which concerns on a 3rd form from the outer surface side. It is the schematic sectional drawing which showed a part of slit nozzle provided with the adjustment thin plate which concerns on a 4th form. It is the schematic plan view which looked at the adjustment thin plate which concerns on a 4th form from the outer surface side. It is the schematic sectional drawing which showed a part of slit nozzle provided with the adjustment thin plate which concerns on a 5th form. It is the schematic plan view which looked at the adjustment thin plate which concerns on a 5th form from the outer surface side. It is a figure for demonstrating the discharge end position of a slit nozzle. It is the schematic side view which showed the structure of the slit nozzle which concerns on a modification. It is the schematic side view which showed the structure of the slit nozzle which concerns on a modification. It is explanatory drawing which showed typically a mode that the slit nozzle scans a board | substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiment is an example embodying the present invention, and is not an example of limiting the technical scope of the present invention. In the drawings, the size and number of each part may be exaggerated or simplified for easy understanding.

<1. Overall Configuration of Substrate Processing Apparatus 1>
The overall configuration of the substrate processing apparatus 1 will be described with reference to FIG. FIG. 1 is a perspective view schematically showing the substrate processing apparatus 1. In FIG. 1 and the following drawings, the X direction, the Y direction, and the Z direction are defined for convenience of illustration and description. The X direction is the moving direction of the slit nozzle 42. The Y direction is the longitudinal direction of the slit nozzle 42. The Z direction is the vertical direction.

  The substrate processing apparatus 1 is an apparatus for applying a processing liquid (here, a resist liquid) to a rectangular glass substrate constituting a screen panel of a liquid crystal display device, and includes a main body unit 10 and a control unit 20. The main body unit 10 includes a stage 30, a bridging unit 40, and a driving unit 50.

  The stage 30 is a holding table on which the substrate 2 is placed. The stage is composed of a rectangular parallelepiped stone or the like, and its upper surface and side surfaces are processed flat. The upper surface of the stage 30 is a horizontal plane and serves as a holding surface 31 for the substrate 2. A large number of vacuum suction ports (not shown) are formed on the holding surface 31. When processing the substrate 2 in the substrate processing apparatus 1, the substrate 2 is held horizontally by the vacuum suction port adsorbing the substrate 2.

  A plurality of lift pins 32 are provided on the holding surface 31. The lift pin 32 is configured to be movable up and down. When the substrate 2 is placed on the stage 30 or when the substrate 2 is removed from the stage 30, the lift pins 32 are raised to hold the substrate. Further, a pair of traveling rails 33 are fixed to both ends of the holding surface 31 across the region where the substrate 2 is held. The traveling rail 33 constitutes a linear guide that supports the bridging portion 40 and guides the movement of the bridging portion 40 in the X direction.

  An opening 34 is provided on the −X direction side of the holding surface 31. Inside the main body 10 below the opening 34, a preliminary application mechanism for normalizing the state of the slit nozzle 42, a standby pod for preventing the slit nozzle 42 from drying, and the like are provided.

  The bridging portion 40 is horizontally stretched above the stage 30. The bridging portion 40 has a nozzle support portion 41 that uses carbon fiber reinforced resin or the like as an aggregate, a slit nozzle 42 attached to the nozzle support portion 41, and an elevating mechanism 43 that supports both ends of the nozzle support portion 41. ing.

  The slit nozzle 42 has a slit-like discharge port 711 in the lower portion thereof, and scans the surface of the substrate 2 while discharging the resist solution from the discharge port 711 to apply the resist solution to a predetermined region on the surface of the substrate 2. Apply. Specifically, the slit nozzle 42 includes a long nozzle body 71, a pair of side plates 72 disposed on both sides of the longitudinal direction (Y direction) of the nozzle body 71, and a nozzle body And an adjustment thin plate 73 sandwiched between the end face of 71 and each side plate 72. The detailed configuration of the slit nozzle 42 will be described later.

  The lifting mechanism 43 supports the slit nozzle 42 via the nozzle support portion 41. The elevating mechanism 43 includes an AC servo motor 431 and a ball screw (not shown), and moves the slit nozzle 42 in a translational manner based on a control signal from the control unit 20. The lifting mechanism 43 adjusts the posture of the slit nozzle 42 in the YZ plane.

  The drive unit 50 moves the slit nozzle 42 relative to the substrate 2 held on the stage 30 in a direction (X direction) orthogonal to the longitudinal direction (Y direction) of the discharge port 711. Specifically, the drive unit 50 includes, for example, a pair of stators 51 along both sides of the stage 30 and a pair of movers 52 attached to both ends of the bridging unit 40. In the drive unit 50, the stator 51 and the mover 52 constitute a pair of AC coreless linear motors, and the bridging unit 40 is moved in the X direction. The drive unit 50 is attached with a linear encoder 53 having a scale unit and a detector. The linear encoder 53 detects the position of the mover 52 and transmits the detection result to the control unit 20.

  The control unit 20 includes a calculation unit 21 that processes various data according to a program, and a storage unit 22 that stores the program and various data. In addition, an operation unit 23 that receives an instruction input from an operator and a display unit 24 that displays various data are provided on the front surface of the control unit 20.

  The controller 20 is electrically connected to the main body 10 by a cable (not shown). The control unit 20 controls the operations of the stator 51 and the mover 52 based on the input signal from the operation unit 23 and the detection result from the linear encoder 53. Thereby, operation | movement of the bridge | crosslinking part 40 on the stage 30 is controlled. Further, the control unit 20 controls the operation of the elevating mechanism 43 and the discharge operation of the resist solution from the slit nozzle 42 based on an input signal from the operation unit 23 and signals from various sensors (not shown).

<2. Configuration of slit nozzle 42>
The configuration of the slit nozzle 42 will be described with reference to FIGS. FIG. 2 is a schematic side view showing the configuration of the slit nozzle 42. FIG. 3 is a schematic perspective view showing the configuration of the nozzle body 71 of the slit nozzle 42.

  As described above, the slit nozzle 42 includes a long nozzle main body 71, a pair of side plates 72 disposed on both sides of both end surfaces 713 and 714 in the longitudinal direction of the nozzle main body 71, and the nozzle main body 71. An adjustment thin plate 73 sandwiched between the end surfaces 713 and 714 and the side plates 72 is provided.

<Nozzle body 71>
A liquid feed path 712 that is an internal flow path is formed inside the nozzle body 71. The lower end of the liquid feeding path 712 is open to the outside. This opening is a linear opening extending over the entire length of the nozzle body 71 along the Y-axis direction of the nozzle body 71, and this opening defines an opening edge along the longitudinal direction of the discharge port 711. Has been. The resist solution supplied to the liquid supply path 712 is discharged toward the substrate 2 from the discharge port 711. That is, the nozzle main body 71 defines the flow of the resist solution on the front surface (−X side) and the back surface (+ X side) of the liquid supply path 712.

  Specifically, the liquid supply path 712 includes, for example, a diffusion path portion (manifold) 7121 for diffusing the processing liquid in the longitudinal direction of the nozzle main body 71 and a flow path section for guiding the processing liquid from the manifold 7121 to the discharge port 711 ( Land) 7122. The manifold 7121 is formed as a groove deeper in the + X direction than the land 7122. In addition, the manifold 7121 is connected to a resist solution supply source 70 that supplies a resist solution 9 that is a processing solution, through solution feeding holes 720 and 730 to be described later. The resist solution 9 supplied to the manifold 7121 from the resist solution supply source 70 is diffused in the longitudinal direction (Y-axis direction) of the nozzle body 71 in the manifold 7121, and then guided to the discharge port 711 through the land 7122. Then, the ink is discharged from the discharge port 711 toward the substrate 2. According to this configuration, the discharge amount of the resist liquid 9 from the discharge port 711 can be made uniform along the Y axis.

<Side plate 72>
The side plate 72 is attached to the end surfaces 713 and 714 of the nozzle body 71 in the Y direction with the adjustment thin plate 73 interposed therebetween. That is, the nozzle main body 71, the adjustment thin plate 73, and the side plate 72 are in contact with the end surfaces 713 and 714 of the nozzle main body 71 with one main surface (inner side surface) 731 of the adjustment thin plate 73. In a state where one main surface (contact surface) 721 of the side plate 72 is in contact with the other main surface (outer surface) 732 of the thin plate 73 (see FIG. 4 etc.), the fastening member 74 (specifically, For example, screws that reach the nozzle body 71 from the side plate 72 via the adjustment thin plate 73 are fastened to each other and fixed together. As a result, the opening end in the Y direction of the liquid supply path 712 formed inside the nozzle body 71 is blocked.

  In this embodiment, it is assumed that the nozzle body 71, the side plate 72, and the adjustment thin plate 73 are arranged so that their lower ends are flush with each other and are fixed integrally. However, as will be described later, the lower ends of the members 71, 72, and 73 are not necessarily flush with each other.

  The side plate 72 is formed with a first liquid supply hole 720 that penetrates from the contact surface 721 to the opposite surface. The first liquid feeding hole 720 is provided at a position overlapping the manifold 7121 of the nozzle body 71 as viewed from the Y direction. In addition, a resist solution supply source 70 that supplies a resist solution 9 that is a processing solution is connected to the first liquid supply hole 720. The adjustment thin plate 73 also has a second liquid supply hole 730 penetrating from the inner surface 731 to the outer surface 732 at a position overlapping the first liquid supply hole 720 when viewed from the Y direction. Is supplied to the manifold 7121 through the first liquid supply hole 720 and the second liquid supply hole 730. The resist solution 9 supplied to the manifold 7121 is discharged toward the substrate 2 from the discharge port 711 as described above.

<Adjustment thin plate 73>
The adjustment thin plate 73 is a thin plate-like member and is disposed between the nozzle body 71 and the side plate 72. Specifically, as described above, the adjustment thin plate 73 has the inner surface 731 in contact with the end surfaces 713 and 714 of the nozzle body 71 and the outer surface 732 in contact with the contact surface 721 of the side plate 72. In this state, it is fixed to the nozzle main body 71 and the side plate 72 by being fastened by the fastening member 74. That is, the adjustment thin plate 73 is detachably fixed to the nozzle main body 71 and the side plate 72 by the fastening member 74.

  The adjustment thin plate 73 is provided so as to penetrate from the inner side surface 731 to the outer side surface 732, communicates with the liquid feeding path 712 (preferably, the land 7122) at the opening end on the inner side surface 731 side, and opens on the outer side surface 732 side. Includes a liquid feeding space V opened to the side plate 72 and a leakage structure L for leaking the resist solution 9 in the liquid feeding space V from the lower end edge 7320 of the outer surface 732. In the present invention, the adjustment thin plate 73 can constitute the liquid feeding space V and the leakage structure L in various forms. Below, the adjustment thin plate 73 of various forms is demonstrated.

<I. First Form of Adjustment Thin Plate 73>
First, the 1st form of the adjustment thin plate 73 is demonstrated, referring FIG. 4, FIG. 4 and 5, a slit nozzle 42 (hereinafter, referred to as “adjustment thin plate 73 a” when distinguished from the adjustment thin plate 73 of another form) is described. In order to distinguish from the slit nozzle 42 provided with the adjustment thin plate 73 of another form, it is indicated as “slit nozzle 42a”). FIG. 4 is a cross-sectional view in which the vicinity of the adjustment thin plate 73a in the slit nozzle 42a is cut by a plane including the liquid feeding path 712. FIG. 5 is a view of the slit nozzle 42a as viewed from the arrow K in FIG. That is, FIG. 5 is a schematic plan view of the adjustment thin plate 73 a disposed in the nozzle body 71 as viewed from the outer surface 732 side. 4 and 5 and FIG. 6 to FIG. 13 referred later, only the vicinity of the adjustment thin plate 73 provided on one end surface 713 of the nozzle main body 71 is shown, but the other end surface 714 is shown. The vicinity of the adjustment thin plate 73 provided in the same configuration is also the same.

  The adjustment thin plate 73 a includes a through groove 81 that penetrates from the inner surface 731 to the outer surface 732. The through groove 81 communicates with the liquid feeding path 712 (preferably, the land 7122) at the opening end on the inner side surface 731 side. Further, the through groove 81 opens to the contact surface 721 of the side plate 72 at the opening end on the outer surface 732 side. That is, the opening end of the through groove 81 on the outer surface 732 side is closed by the side plate 72. However, in the slit nozzle 42a provided with the adjustment thin plate 73a, the side plate 72 and the adjustment thin plate 73a are arranged so that the opening end on the outer surface 732 side of the through groove 81 is not completely sealed by the contact surface 721. The fastening force of the fastening member 74 is adjusted so that the contact face 721 and the outer face 732 are integrally fixed with a very small gap maintained.

  More specifically, the through-groove 81 has, for example, a long and thin outer shape extending in the vertical direction (Z direction) when viewed from the Y direction, and the upper end thereof is the same as or higher than the upper end of the land 7122. While being arranged at a low position, the lower end thereof is arranged at a position higher than the lower end surface 733 of the adjustment thin plate 73. That is, the lower end of the through groove 81 is closed without opening to the lower end surface 733. The through groove 81 is formed at a position overlapping the land 7122 in the X direction, and the width (dimension in the X direction) is the same as or smaller than the width (dimension in the X direction) of the land 7122. It is said.

  In the adjustment thin plate 73a according to the first embodiment, the through groove 81 forms the liquid feeding space V. However, the liquid feeding space V is closed with respect to the lower end surface 733 of the adjustment thin plate 73a. In the slit nozzle 42a provided with the adjustment thin plate 73a, a part of the resist solution 9 in the liquid supply path 712 flows into the liquid supply space V from the land 7122 and is sent to the outer surface 732 side. A part of the resist solution 9 sent to the outer surface 732 oozes out to the boundary portion between the outer surface 732 and the contact surface 721 of the side plate 72 and leaks out (bleeds out) from the lower end edge 7320 of the outer surface 732. ) In other words, the adjustment thin plate 73 a is formed with a leakage structure L that leaks the resist solution 9 in the liquid feeding space V from the lower end edge 7320 of the outer surface 732.

  The amount of the resist solution 9 that leaks from the lower end edge 7320 includes, for example, the dimensions of the through grooves 81 (specifically, the dimensions in the Z direction and the dimensions in the X direction), the positions where the through grooves 81 are formed, and the flatness of the outer surface 732. It can be adjusted by changing at least one of the fastening force of the fastening member 74. For example, the leakage amount can be increased by increasing the area of the through-groove 81 as viewed from the Y direction. Further, the closer the lower end position of the through groove 81 is to the lower end edge 7320, the greater the amount of leakage. Further, by increasing the flatness of the outer surface 732 of the adjustment thin plate 73, the amount of leakage can be increased. Further, the leakage amount can be increased by reducing the fastening force of the fastening member 74.

<Ii. Second Form of Adjustment Thin Plate 73>
Next, the 2nd form of the adjustment thin plate 73 is demonstrated, referring FIG. 6, FIG. 6 and 7, a slit nozzle 42 (hereinafter, referred to as “adjustment thin plate 73 b” when distinguished from an adjustment thin plate 73 of another form) is described. In order to distinguish from the slit nozzle 42 provided with the adjustment thin plate 73 of another form, it is shown as “slit nozzle 42b”). FIG. 6 is a cross-sectional view in which the vicinity of the adjustment thin plate 73 b in the slit nozzle 42 b is cut by a plane including the liquid feeding path 712. FIG. 7 is a view of the slit nozzle 42b as viewed from the arrow K in FIG. That is, FIG. 7 is a schematic plan view of the adjustment thin plate 73b disposed in the nozzle body 71 as viewed from the outer surface 732 side.

  The adjustment thin plate 73 b includes a groove 82 that is recessed in the outer surface 732, and a through hole 83 that penetrates from the bottom surface of the groove 82 to the inner surface 731. The through hole 83 communicates with the liquid feeding path 712 (preferably, the land 7122) at the opening end on the inner surface 731 side. Further, the through hole 83 communicates with the inside of the groove 82 at the opening end on the bottom surface side of the groove 82. On the other hand, the groove 82 opens with respect to the contact surface 721 of the side plate 72 at the opening end on the outer surface 732 side. That is, the opening end of the groove 82 is closed by the side plate 72. However, in the slit nozzle 42b provided with the adjustment thin plate 73b, the side plate 72 and the adjustment thin plate 73b are connected to the contact surface 721 so that the opening end of the groove 82 is not completely sealed by the contact surface 721. The fastening force of the fastening member 74 is adjusted so as to be integrally fixed with a very small gap between the outer side surface 732 and the outer side surface 732.

  More specifically, for example, the groove 82 has a long and narrow outer shape extending in the vertical direction (Z direction) when viewed from the Y direction, and the upper end thereof is the same as or lower than the upper end of the land 7122. It is arranged at a position and its lower end is arranged at a position higher than the lower end surface 733. That is, the lower end of the groove 82 is in a closed state without opening in the lower end surface 733. The groove 82 is formed at a position overlapping the land 7122 in the X direction, and the width (dimension in the X direction) is the same as or smaller than the width (dimension in the X direction) of the land 7122. Is done. On the other hand, more specifically, the through-hole 83 has, for example, a substantially circular outer shape when viewed from the Y direction, and opens at, for example, the upper end of the bottom of the groove 82 at one opening end and extends along the horizontal direction. And open to the land 7122 at the other opening end.

  In the adjustment thin plate 73b according to the second embodiment, the groove 82 and the through hole 83 form the liquid feeding space V. However, the liquid feeding space V is closed with respect to the lower end surface 733 of the adjustment thin plate 73a. In the slit nozzle 42b provided with the adjustment thin plate 73b, a part of the resist solution 9 in the liquid feeding path 712 flows into the liquid feeding space V from the land 7122 and is sent to the outer surface 732 side. A part of the resist solution 9 sent to the outer surface 732 oozes out to the boundary portion between the outer surface 732 and the contact surface 721 of the side plate 72 and leaks from the lower end edge 7320 of the outer surface 732. ing. In other words, the adjustment thin plate 73 b is formed with a leakage structure L that leaks the resist solution 9 in the liquid feeding space V from the lower end edge 7320 of the outer surface 732.

  The amount of the resist solution 9 leaking from the lower end edge 7320 is, for example, the dimension of the groove 82, the position where the groove 82 is formed, the dimension of the through hole 83, the position where the through hole 83 is formed, the flatness of the outer surface 732, Adjustment can be made by changing at least one of the fastening forces. For example, the amount of leakage can be increased by increasing the area of the groove 82 viewed from the Y direction. Further, the closer the lower end position of the groove 82 is to the lower end edge 7320, the greater the amount of leakage can be. Further, the leakage amount can be increased by increasing the area of the through hole 83 as viewed from the Y direction. Further, by increasing the flatness of the outer surface 732 of the adjustment thin plate 73, the amount of leakage can be increased. Further, the leakage amount can be increased by reducing the fastening force of the fastening member 74.

<Iii. Third Embodiment of Adjustment Thin Plate 73>
Next, the 3rd form of the adjustment thin plate 73 is demonstrated, referring FIG. 8, FIG. 8 and 9, the slit nozzle 42 (hereinafter, referred to as “adjustment thin plate 73 c” when distinguished from the adjustment thin plate 73 of other forms) is referred to as the adjustment thin plate 73 according to the third embodiment. In order to distinguish from the slit nozzle 42 having the adjustment thin plate 73 of another form, “slit nozzle 42c” is shown). FIG. 8 is a cross-sectional view of the slit nozzle 42c in the vicinity of the adjustment thin plate 73c cut along a plane including the liquid feeding path 712. FIG. 9 is a view of the slit nozzle 42c as viewed from the arrow K in FIG. That is, FIG. 9 is a schematic plan view of the adjustment thin plate 73c disposed in the nozzle main body 71 as viewed from the outer surface 732 side.

  The adjustment thin plate 73 c includes a through groove 84 that penetrates from the inner surface 731 to the outer surface 732. The through groove 84 communicates with the liquid feeding path 712 (preferably, the land 7122) at the opening end on the inner surface 731 side. Further, the through groove 84 opens to the contact surface 721 of the side plate 72 at the opening end on the outer surface 732 side. That is, the open end of the through groove 84 on the outer surface 732 side is closed by the side plate 72.

  More specifically, the through groove 84 has a long and narrow outer shape extending in the vertical direction (Z direction) when viewed from the Y direction, for example, and the upper end thereof is the same as or higher than the upper end of the land 7122. While being arranged at a low position, the lower end thereof opens to the lower end surface 733 to form an opening 840. That is, as viewed from the Z direction, the edge of the opening 840 reaches the lower end edge 7320 of the outer side surface 732 and also reaches the lower end edge of the inner side surface 731. The through groove 84 is formed at a position overlapping the land 7122 in the X direction, and the width (dimension in the X direction) is the same as or smaller than the width (dimension in the X direction) of the land 7122. It is said.

  In the adjustment thin plate 73c according to the third embodiment, the through groove 84 forms the liquid feeding space V. However, the liquid feeding space V is open to the lower end surface 733 of the adjustment thin plate 73c. In the slit nozzle 42c provided with the adjustment thin plate 73c, the resist solution 9 in the liquid feeding path 712 flows into the liquid feeding space V from the land 7122 and is sent to the outer surface 732 side, and leaks from the opening 840. That is, the adjustment thin plate 73 c is formed with a leakage structure L that allows the resist solution 9 in the liquid feeding space V to leak from the lower end edge 7320 of the outer surface 732.

  The amount of the resist solution 9 that leaks from the lower end edge 7320 can be adjusted, for example, by changing the dimension of the through groove 84. For example, the leakage amount can be increased by increasing the area of the through groove 84 as viewed from the Y direction.

<Iv. Fourth Embodiment of Adjustment Thin Plate 73>
Next, the 4th form of the adjustment thin plate 73 is demonstrated, referring FIG. 10, FIG. 10 and 11, a slit nozzle 42 (hereinafter, referred to as “adjustment thin plate 73 d” when distinguished from an adjustment thin plate 73 of another form) is provided according to the fourth embodiment. In order to distinguish from the slit nozzle 42 provided with the adjustment thin plate 73 of another form, it is shown as “slit nozzle 42d”). FIG. 10 is a cross-sectional view in which the vicinity of the adjustment thin plate 73d in the slit nozzle 42d is cut by a plane including the liquid feeding path 712. FIG. 11 is a view of the slit nozzle 42d as viewed from the arrow K in FIG. That is, FIG. 11 is a schematic plan view of the adjustment thin plate 73 disposed in the nozzle body 71 as viewed from the outer surface 732 side.

  The adjustment thin plate 73 d includes a groove 85 formed in the outer surface 732 and a through hole 86 that penetrates from the bottom surface of the groove 85 to the inner surface 731. The through hole 86 communicates with the liquid feeding path 712 (preferably, the land 7122) at the opening end on the inner surface 731 side. Further, the through hole 86 communicates with the inside of the groove 85 at the opening end on the bottom surface side of the groove 85. On the other hand, the groove 85 opens to the contact surface 721 of the side plate 72 at the opening end on the outer surface 732 side. That is, the opening end of the groove 85 on the outer surface 732 side is closed by the side plate 72.

  More specifically, for example, the groove 85 has a long and narrow outer shape extending in the vertical direction (Z direction) when viewed from the Y direction, and the upper end thereof is the same as or lower than the upper end of the land 7122. In addition to being disposed at a position, the lower end thereof opens to the lower end surface 733 to form an opening 850. That is, as viewed from the Z direction, the edge of the opening 850 reaches the lower end edge 7320 of the outer surface 732. The groove 85 is formed at a position overlapping the land 7122 in the X direction, and the width (dimension in the X direction) is the same as or smaller than the width (dimension in the X direction) of the land 7122. Is done. On the other hand, more specifically, the through-hole 86 has, for example, a substantially circular outer shape when viewed from the Y direction, and opens at, for example, the upper end of the bottom of the groove 85 at one opening end and extends along the horizontal direction. And open to the land 7122 at the other opening end.

  In the adjustment thin plate 73d according to the fourth embodiment, the groove 85 and the through hole 86 form the liquid feeding space V. However, the liquid feeding space V is open to the lower end surface 733 of the adjustment thin plate 73d. In the slit nozzle 42d provided with the adjustment thin plate 73d, the resist solution 9 in the liquid supply path 712 flows into the liquid supply space V from the land 7122 and is sent to the outer surface 732 side, and leaks from the opening 850. In other words, the adjustment thin plate 73 d is formed with a leakage structure L that leaks the resist solution 9 in the liquid feeding space V from the lower end edge 7320 of the outer surface 732.

  The amount of the resist solution 9 that leaks from the lower end edge 7320 can be adjusted, for example, by changing at least one of the dimension of the groove 85 and the dimension of the through hole 86. For example, the leakage amount can be increased by increasing the area of the groove 85 viewed from the Y direction. Further, the leakage amount can be increased by increasing the area of the through-hole 86 as viewed from the Y direction.

<V. Fifth Form of Adjustment Thin Plate 73>
Next, a fifth embodiment of the adjustment thin plate 73 will be described with reference to FIGS. 12 and 13, a slit nozzle 42 (hereinafter, referred to as “adjustment thin plate 73 e” when distinguished from an adjustment thin plate 73 of another form) is provided according to the fifth embodiment. In order to distinguish from the slit nozzle 42 having the adjustment thin plate 73 of another form, “slit nozzle 42e” is shown). FIG. 12 is a cross-sectional view in which the vicinity of the adjustment thin plate 73 e in the slit nozzle 42 e is cut by a plane including the liquid feeding path 712. FIG. 13 is a view of the slit nozzle 42e as viewed from the arrow K in FIG. That is, FIG. 13 is a schematic plan view of the adjustment thin plate 73e disposed in the nozzle main body 71 as viewed from the outer surface 732 side.

  The adjustment thin plate 73 e includes a through groove 87 that penetrates from the inner surface 731 to the outer surface 732. The through groove 87 communicates with the liquid feeding path 712 at the opening end on the inner surface 731 side. Further, the through groove 87 opens with respect to the contact surface 721 of the side plate 72 at the opening end on the outer surface 732 side. That is, the opening end on the outer surface 732 side of the through groove 87 is closed by the side plate 72.

  More specifically, the through groove 87 has the same shape as the liquid feeding path 712 when viewed from the Y direction. That is, the through-groove 87 has the same outer shape and the same dimensions as the liquid feeding path 712 when viewed from the Y direction, and is formed at a position overlapping the liquid feeding path 712, and the lower end thereof is the lower end surface. An opening 870 is formed in the opening 733. That is, as viewed from the Z direction, the edge of the opening 870 reaches the lower end edge 7320 of the outer side surface 732 and also reaches the lower end edge of the inner side surface 731.

  In the adjustment thin plate 73e according to the fifth embodiment, the through groove 87 forms the liquid feeding space V. However, the liquid feeding space V is open to the lower end surface 733 of the adjustment thin plate 73e. In the slit nozzle 42e provided with the adjustment thin plate 73e, the resist solution 9 in the liquid supply path 712 flows into the liquid supply space V and is sent to the outer surface 732 side, and leaks from the opening 870. That is, the adjustment thin plate 73 e is formed with a leakage structure L that allows the resist solution 9 in the liquid feeding space V to leak from the lower end edge 7320 of the outer surface 732.

<3. Adjustment of discharge width>
As described above, the adjustment thin plate 73 includes the liquid supply space V and the leakage structure L, and a part of the resist solution 9 supplied to the liquid supply path 712 of the slit nozzle 42 is outside the adjustment thin plate 73. It leaks out from the lower edge 7320 of 732. Here, as shown in FIG. 2, in a state where the slit nozzle 42 discharges the resist solution 9 toward the substrate 2, the lower end of the slit nozzle 42 and the substrate 2 are in a very close state. A state is formed in which the lower end of the slit nozzle 42 and the surface of the substrate 2 are connected via the resist solution 9 discharged from the slit nozzle 42. At this time, if the state in which the resist solution 9 leaks from the lower end edge 7320 is formed, the position (discharge end position) E in the Y direction in the discharge width of the slit nozzle 42 is the end surface 713 of the nozzle main body 71. , 714 to the position of the outer surface 732 of the adjustment thin plate 73.

  That is, if the adjustment thin plate 73 is not provided between the nozzle main body 71 and the side plate 72 (upper stage in FIG. 14), the discharge end position E of the slit nozzle is set on the end surfaces 713 and 714 of the nozzle main body 71. When the adjustment thin plate 73 provided with the liquid feeding space V and the leakage structure L is sandwiched between the nozzle body 71 and the side plate 72, the discharge end position E of the slit nozzle 42 is The adjustment thin plate 73 is shifted outward by the thickness d (lower stage in FIGS. 2 and 14). Therefore, the discharge width in the Y direction of the slit nozzle 42 can be arbitrarily adjusted by adjusting the thickness d of the adjustment thin plate 73.

  In the resist solution coating film 90 formed on the upper surface of the substrate 2, as shown in FIG. 14, the film thickness in the vicinity of the edge tends to increase due to the action of surface tension or the like. Therefore, the region M3 including the blank region M2 from the edge of the substrate 2 to the edge of the coating film 90 and the region M1 in the vicinity of the edge of the coating film 90 where the film thickness is difficult to stabilize is cut out and discarded. May be. As a matter of course, the larger the area M3 to be discarded, the more waste and the lower the production efficiency.

  The peak position of the film thickness in the vicinity of the edge of the coating film 90 is often defined by the discharge end position E. In the substrate processing apparatus 1, the discharge end position E is set by providing the adjustment thin plate 73. The adjustment thin plate 73 can be brought closer to the edge of the substrate 2 by the thickness d. As a result, the margin area M2 can be reduced, and the area M3 to be discarded can be reduced. Specifically, for example, by selecting and disposing the adjustment thin plate 73 whose thickness d matches the width of the margin area M2 (or slightly smaller than the width of the margin area M2), it becomes a discard target. The region M3 can be kept small.

<4. Effect>
According to the above embodiment, the adjustment thin plate 73 communicates the liquid supply space V communicating with the liquid supply passage 712 of the nozzle body 71 and the lower end edge of the outer surface 732 of the adjustment thin plate 73 with the processing liquid in the liquid supply space V. And a leakage structure L that leaks from 7320. According to this configuration, as described above, the discharge end position E of the slit nozzle 42 can be set to the position of the outer surface 732 of the adjustment thin plate 73. That is, the discharge end position E of the slit nozzle 42 can be shifted outward from the position of the end surfaces 713 and 714 of the nozzle body 71 by the thickness d of the adjustment thin plate 73. Therefore, the discharge width of the treatment liquid in the slit nozzle 42 can be flexibly changed only by changing the thickness d of the adjustment thin plate 73 while using the same nozzle main body 71.

  Further, according to the above embodiment, the liquid feeding space V communicates with the land 7122 that is a flow path portion that guides the processing liquid from the manifold 7121 that is the diffusion path portion to the discharge port 711. According to this configuration, a part of the processing liquid in the liquid feeding path 712 can be smoothly flowed into the liquid feeding space V.

  Moreover, according to said embodiment, the adjustment thin plate 73 is provided so that attachment or detachment is possible. According to this configuration, the adjustment thin plate 73 can be easily replaced. As a result, the discharge width of the processing liquid in the slit nozzle 42 can be easily changed.

  In particular, according to the adjustment thin plates 73a and 73b according to the first and second embodiments, the liquid feeding space V is closed with respect to the lower end surface 733 of the adjustment thin plates 73a and 73b. According to this configuration, the processing liquid in the liquid feeding space V oozes out from the lower edge 7320 through the boundary portion where the outer surface 732 of the adjustment thin plates 73a and 73b and the contact surface 721 of the side plate 72 are in contact with each other. It will leak out. According to this configuration, the discharge end position E of the slit nozzles 42a and 42b can be accurately shifted in the Y direction by the thickness d of the adjustment thin plates 73a and 73b with a simple configuration.

  In particular, in the adjustment thin plate 73a according to the first embodiment, the long through groove 81 provided so as to penetrate from the inner side surface 731 to the outer side surface 732 forms the liquid feeding space V. According to this configuration, the amount of the processing liquid leaking from the lower edge 7320 can be adjusted by adjusting at least one of the dimension of the through groove 81 and the formation position of the through groove 81.

  In particular, in the adjustment thin plate 73b according to the second embodiment, the long groove 82 formed in the outer surface 732 and the through hole 83 penetrating from the bottom surface of the groove 82 to the inner surface 731 form the liquid feeding space V. To do. According to this configuration, by adjusting at least one of the dimension of the groove 82, the position where the groove 82 is formed, the dimension of the through hole 83, and the position where the through hole 83 is formed, the amount of the processing liquid leaking from the lower end edge 7320 Can be adjusted.

  On the other hand, according to the adjustment thin plates 73c, 73d, and 73e according to the third to fifth embodiments, the liquid feeding space V has the openings 840, 850, and 870 that are opened in the lower end surface 733 of the adjustment thin plates 73c, 73d, and 73e. And the edges of the openings 840, 850, 870 reach the lower edge 7320. According to this configuration, since the processing liquid in the liquid feeding space V leaks from the lower end edge 7320 through the openings 840, 850, 870, the thickness d of the adjustment thin plates 73c, 73d, 73e is relatively large. In addition, the discharge end position E can be sufficiently shifted by the thickness d.

  In particular, in the adjustment thin plate 73c according to the third embodiment, a long through groove 84 provided penetrating from the inner side surface 731 to the outer side surface 732 forms the liquid feeding space V, and the lower end of the through groove 84 is opened. A portion 840 is formed. According to this configuration, the amount of the processing liquid leaking from the lower end edge 7320 can be adjusted by adjusting at least one of the dimension of the through groove 84 and the formation position of the through groove 84.

  In particular, in the adjustment thin plate 73d according to the fourth embodiment, a long groove 85 formed on the outer surface 732 and a through hole 86 penetrating from the bottom surface of the groove 85 to the inner surface 731 form a liquid feeding space V. The lower end of the groove 85 forms the opening 850. According to this configuration, by adjusting at least one of the dimension of the groove 85, the position where the groove 85 is formed, the dimension of the through hole 86, and the position where the through hole 86 is formed, the amount of the processing liquid leaking from the lower end edge 7320 Can be adjusted.

  Particularly, in the adjustment thin plate 73e according to the fifth embodiment, the adjustment thin plate 73e is provided so as to penetrate from the inner side surface 731 to the outer side surface 732, and has the same shape as the liquid feeding path 712 when viewed along the longitudinal direction of the nozzle main body 71. The formed through groove 87 forms the liquid feeding space V, and the lower end of the through groove 87 forms the opening 870. According to this configuration, since a sufficient amount of processing liquid leaks from the lower end of the adjustment thin plate 73e, even when the thickness d of the adjustment thin plate 73e is particularly large, the discharge end position E is sufficiently set by the thickness d. Can be shifted.

<5. Other embodiments>
As mentioned above, although embodiment of this invention was described, this invention is not limited to said example. For example, in the above-described embodiment, the lower end surface 733 of the adjustment thin plate 73 is arranged so as to be flush with the lower end of the nozzle body 71, but the lower end surface 733 of the adjustment thin plate 73 is the nozzle body. It may not be flush with the lower end of the portion 71. For example, as illustrated in FIG. 15, the lower end surface 733 of the adjustment thin plate 73 may be disposed above the lower end of the nozzle body 71 and the lower end of the side plate 72. For example, as illustrated in FIG. 16, the lower end surface 733 of the adjustment thin plate 73 may be disposed below the lower end of the nozzle main body 71 and the lower end of the side plate 72. By adjusting the height position of the lower end surface 733 with respect to the lower end of the nozzle body 71 (that is, the formation position of the discharge port 711), the film thickness of the edge portion in the Y direction of the coating film 90 formed on the substrate 2 ( That is, the film thickness of the coating film portion formed by applying the treatment liquid from the vicinity of the discharge end position E of the slit nozzle 42 can be adjusted.

  For example, when the lower end surface 733 of the adjustment thin plate 73 is disposed above the lower end of the nozzle main body 71, the end surfaces 713 and 714 of the nozzle main body 71, the lower end surface 733 of the adjustment thin plate 73, and the side plate 72 A recess 701 surrounded by the contact surface 721 is formed. Therefore, since the resist solution 9 is taken in the recess 701 at the discharge end position E of the slit nozzle 42 at the timing when the discharge of the resist solution 9 from the slit nozzle 42 is started, the resist solution 9 applied to the substrate 2 is removed. The amount is relatively small. As a result, the film thickness of the end portion on the application start side (region A1 in FIG. 17) in the edge portion in the Y direction of the coating film 90 can be reduced. Therefore, by arranging the lower end surface 733 of the adjustment thin plate 73 above the lower end of the nozzle main body 71 when the film thickness of the coating film 90 in the region A1 is easily increased locally, the film Thickness uniformity can be improved.

  Further, for example, when the lower end surface 733 of the adjustment thin plate 73 is disposed below the lower end of the nozzle main body 71, the lower end portion of the adjustment thin plate 73 protrudes below the lower end of the nozzle main body 71. A convex portion 702 is formed. When the coating process is completed and the slit nozzle 42 is raised, the resist solution 9 that has been connected between the slit nozzle 42 and the substrate 2 is cut from both ends in the Y direction, and a convex portion 702 is formed. As a result, the timing at which the resist solution 9 begins to run out can be delayed. As a result, it is possible to increase the film thickness of the end portion (region A2 in FIG. 17) on the coating end side of the edge portion in the Y direction of the coating film 90. Therefore, by arranging the lower end surface 733 of the adjustment thin plate 73 below the lower end of the nozzle main body 71 in the case where the film thickness of the coating film 90 in the region A2 is likely to be locally thin, The uniformity of the film thickness can be improved.

  In addition, the substrate processing apparatus 1 is configured to supply the processing liquid to the manifold 7121 from both end surfaces 713 and 714 in the Y direction of the nozzle main body 71, but only from one end surface of the nozzle main body 71, The configuration may be such that the processing liquid is supplied to the manifold 7121. In this case, as a matter of course, the liquid feeding holes 720 and 730 are not formed in the side plate 72 and the adjustment thin plate 73 disposed on the other end face. Further, the processing liquid may be supplied to the manifold 7121 from the upper side of the nozzle main body 71. In this case, as a matter of course, the first liquid feeding hole 720 is not formed in any of the two side plates 72, and the second liquid feeding hole 730 is not formed in any of the two adjustment thin plates 73.

  Further, for example, the substrate processing apparatus 1 is configured to scan the slit nozzle 42 with respect to the stationary substrate 2, but may be configured to move the substrate 2 with respect to the fixed slit nozzle 42. . That is, any configuration may be used as long as the slit nozzle 42 is scanned relative to the substrate.

  The substrate to be processed is not limited to a glass substrate for liquid crystal, and may be a semiconductor substrate, a photomask, or the like. Further, the processing solution to be applied is not limited to the resist solution, but may be another processing solution such as a developing solution.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate 10 Main part 20 Control part 30 Stage 40 Bridging part 42, 42a, 42b, 42c, 42d, 42e Slit nozzle 50 Drive part 71 Nozzle main part 711 Discharge port 712 Liquid feed path 7121 Manifold 7122 Land 72 Side Plate 73, 73a, 73b, 73c, 73d, 73e Adjustment thin plate 731 Inner side surface 732 Outer side surface 7320 Lower end edge 733 Lower end surface V Liquid feed space L Leakage structure

Claims (7)

In a slit nozzle having a slit-like outlet at its lower part,
A liquid feed path is formed inside, and a lower end of the liquid feed path is open to the outside, whereby an opening edge along the longitudinal direction of the discharge port is defined; and
A pair of side plates disposed on the sides of the longitudinal end surfaces of the nozzle body,
An adjustment thin plate sandwiched between the end surface of the nozzle body and the side plate;
With
The adjusting thin plate is
From the inner surface that is in contact with the end surface of the nozzle body part, through the outer surface that is in contact with the side plate, and communicates with the liquid feed path at the opening end on the inner surface side, A liquid-feeding space in which the opening end on the outer surface side is open to the side plate; and
A leakage structure for leaking the processing liquid in the liquid feeding space from the lower edge of the outer surface;
Equipped with a,
A slit nozzle in which the liquid feeding space is closed with respect to a lower end surface of the adjustment thin plate . The slit nozzle according to claim 1,
The liquid delivery path is
A diffusion path part for diffusing the treatment liquid in the longitudinal direction of the nozzle body part;
A flow path section for guiding the processing liquid from the diffusion path section to the discharge port;
With
The liquid feeding space communicates with the flow path portion.
Slit nozzle. The slit nozzle according to claim 1 or 2,
The adjustment thin plate is detachably fixed to the nozzle body and the side plate.
Slit nozzle. In the slit nozzle according to any one of claims 1 to 3 ,
The adjusting thin plate is
A long through groove extending vertically from the inner side surface of the adjustment thin plate to the outer side surface;
With
The through groove forms the liquid feeding space;
Slit nozzle. In the slit nozzle according to any one of claims 1 to 3 ,
The adjusting thin plate is
A long groove extending in the vertical direction formed on the outer surface;
A through hole penetrating from the bottom surface of the groove to the inner surface;
With
The groove and the through hole form the liquid feeding space.
Slit nozzle. In the slit nozzle according to any one of claims 1 to 5 ,
The lower end surface of the adjustment thin plate is not flush with the lower end of the nozzle body,
Slit nozzle. A slit nozzle according to any one of claims 1 to 6 ,
A holding portion for horizontally holding the substrate below the slit nozzle;
A drive unit that moves the slit nozzle relative to the substrate held by the holding unit in a direction perpendicular to the longitudinal direction of the discharge port;
A supply unit for supplying a treatment liquid to the slit nozzle;
A substrate processing apparatus comprising:

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