JP6049121B2 - 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 - Google Patents
機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 Download PDFInfo
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- JP6049121B2 JP6049121B2 JP2012002034A JP2012002034A JP6049121B2 JP 6049121 B2 JP6049121 B2 JP 6049121B2 JP 2012002034 A JP2012002034 A JP 2012002034A JP 2012002034 A JP2012002034 A JP 2012002034A JP 6049121 B2 JP6049121 B2 JP 6049121B2
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- 238000004519 manufacturing process Methods 0.000 title description 17
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- 229910052751 metal Inorganic materials 0.000 claims description 104
- 239000000956 alloy Substances 0.000 claims description 99
- 229910045601 alloy Inorganic materials 0.000 claims description 95
- 239000002245 particle Substances 0.000 claims description 94
- 229910000765 intermetallic Inorganic materials 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000007769 metal material Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000002923 metal particle Substances 0.000 claims 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 description 100
- 239000002612 dispersion medium Substances 0.000 description 36
- 239000002114 nanocomposite Substances 0.000 description 29
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- 150000002736 metal compounds Chemical class 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 14
- 239000002041 carbon nanotube Substances 0.000 description 12
- 229910021393 carbon nanotube Inorganic materials 0.000 description 12
- 238000005477 sputtering target Methods 0.000 description 12
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- 239000011521 glass Substances 0.000 description 4
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- 230000000704 physical effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001246 colloidal dispersion Methods 0.000 description 2
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- 239000002609 medium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Electrodes Of Semiconductors (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012002034A JP6049121B2 (ja) | 2012-01-10 | 2012-01-10 | 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012002034A JP6049121B2 (ja) | 2012-01-10 | 2012-01-10 | 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013143216A JP2013143216A (ja) | 2013-07-22 |
| JP2013143216A5 JP2013143216A5 (de) | 2014-12-18 |
| JP6049121B2 true JP6049121B2 (ja) | 2016-12-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012002034A Active JP6049121B2 (ja) | 2012-01-10 | 2012-01-10 | 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6049121B2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11011473B2 (en) | 2018-12-17 | 2021-05-18 | Samsung Electronics Co., Ltd. | Semiconductor package |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5885351B2 (ja) * | 2013-10-09 | 2016-03-15 | 有限会社 ナプラ | 接合部及び電気配線 |
| JP6038270B1 (ja) * | 2015-12-22 | 2016-12-07 | 有限会社 ナプラ | 電子装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001290266A1 (en) * | 2000-10-25 | 2002-05-06 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
| JP4255847B2 (ja) * | 2004-01-27 | 2009-04-15 | 田中貴金属工業株式会社 | 金属ペーストを用いた半導体ウェハーへのバンプの形成方法 |
| JP2007173131A (ja) * | 2005-12-26 | 2007-07-05 | Hitachi Ltd | 微粒子分散液、およびそれを用いた導電パターン形成装置 |
| JP5212462B2 (ja) * | 2008-03-07 | 2013-06-19 | 富士通株式会社 | 導電材料、導電ペースト、回路基板、及び半導体装置 |
| JP2010161331A (ja) * | 2008-12-12 | 2010-07-22 | Hitachi Ltd | 電極，電極ペースト及びそれを用いた電子部品 |
| JP4563506B1 (ja) * | 2010-01-13 | 2010-10-13 | 有限会社ナプラ | 電極材料 |
| JP2011021255A (ja) * | 2009-07-16 | 2011-02-03 | Applied Nanoparticle Laboratory Corp | ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品 |
| JP5660426B2 (ja) * | 2010-03-17 | 2015-01-28 | 独立行政法人情報通信研究機構 | 無線通信システム |
| JP5750259B2 (ja) * | 2010-11-30 | 2015-07-15 | ハリマ化成株式会社 | 導電性金属ペースト |
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- 2012-01-10 JP JP2012002034A patent/JP6049121B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11011473B2 (en) | 2018-12-17 | 2021-05-18 | Samsung Electronics Co., Ltd. | Semiconductor package |
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| Publication number | Publication date |
|---|---|
| JP2013143216A (ja) | 2013-07-22 |
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