JP2013143216A5 - - Google Patents

Download PDF

Info

Publication number
JP2013143216A5
JP2013143216A5 JP2012002034A JP2012002034A JP2013143216A5 JP 2013143216 A5 JP2013143216 A5 JP 2013143216A5 JP 2012002034 A JP2012002034 A JP 2012002034A JP 2012002034 A JP2012002034 A JP 2012002034A JP 2013143216 A5 JP2013143216 A5 JP 2013143216A5
Authority
JP
Japan
Prior art keywords
metal
alloy particles
bonding region
electronic device
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012002034A
Other languages
English (en)
Japanese (ja)
Other versions
JP6049121B2 (ja
JP2013143216A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012002034A priority Critical patent/JP6049121B2/ja
Priority claimed from JP2012002034A external-priority patent/JP6049121B2/ja
Publication of JP2013143216A publication Critical patent/JP2013143216A/ja
Publication of JP2013143216A5 publication Critical patent/JP2013143216A5/ja
Application granted granted Critical
Publication of JP6049121B2 publication Critical patent/JP6049121B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012002034A 2012-01-10 2012-01-10 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法 Active JP6049121B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012002034A JP6049121B2 (ja) 2012-01-10 2012-01-10 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012002034A JP6049121B2 (ja) 2012-01-10 2012-01-10 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2013143216A JP2013143216A (ja) 2013-07-22
JP2013143216A5 true JP2013143216A5 (de) 2014-12-18
JP6049121B2 JP6049121B2 (ja) 2016-12-21

Family

ID=49039691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012002034A Active JP6049121B2 (ja) 2012-01-10 2012-01-10 機能性材料、電子デバイス、電磁波吸収／遮蔽デバイス及びそれらの製造方法

Country Status (1)

Country Link
JP (1) JP6049121B2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885351B2 (ja) * 2013-10-09 2016-03-15 有限会社 ナプラ 接合部及び電気配線
JP6038270B1 (ja) * 2015-12-22 2016-12-07 有限会社 ナプラ 電子装置
KR102662146B1 (ko) 2018-12-17 2024-05-03 삼성전자주식회사 반도체 패키지

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001290266A1 (en) * 2000-10-25 2002-05-06 Harima Chemicals, Inc. Electroconductive metal paste and method for production thereof
JP4255847B2 (ja) * 2004-01-27 2009-04-15 田中貴金属工業株式会社 金属ペーストを用いた半導体ウェハーへのバンプの形成方法
JP2007173131A (ja) * 2005-12-26 2007-07-05 Hitachi Ltd 微粒子分散液、およびそれを用いた導電パターン形成装置
CN101965617B (zh) * 2008-03-07 2013-03-06 富士通株式会社 导电材料、导电膏、电路板以及半导体器件
JP2010161331A (ja) * 2008-12-12 2010-07-22 Hitachi Ltd 電極，電極ペースト及びそれを用いた電子部品
JP4563506B1 (ja) * 2010-01-13 2010-10-13 有限会社ナプラ 電極材料
JP2011021255A (ja) * 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
JP5660426B2 (ja) * 2010-03-17 2015-01-28 独立行政法人情報通信研究機構 無線通信システム
JP5750259B2 (ja) * 2010-11-30 2015-07-15 ハリマ化成株式会社 導電性金属ペースト

Similar Documents

Publication Publication Date Title
JP2013115177A5 (de)
JP2015226935A5 (de)
JP2011516606A5 (de)
JP2013528829A5 (de)
JP2011509921A5 (de)
JP2015164123A5 (de)
WO2012164078A3 (de) Verfahren zum herstellen eines formkörpers sowie vorrichtung
JP2011014556A5 (de)
EP3181333A3 (de) Verfahren zur herstellung eines dreidimensional geformten objekts
WO2013066669A3 (en) Structures incorporating silicon nanoparticle inks, densified silicon materials from nanoparticle silicon deposits and corresponding methods
MY152943A (en) Method for producing a silicon ingot
JP2014507971A5 (de)
JP2015512266A5 (de)
JP2013051033A5 (de)
JP2011029609A5 (ja) 半導体装置の作製方法
JP2013143216A5 (de)
WO2015102732A3 (en) Amorphous alloy containing feedstock for powder injection molding
JP2014011456A5 (de)
JP2016044978A5 (de)
JP2013511602A5 (de)
JP2015522683A5 (de)
JP2012248845A5 (de)
JP2011516635A5 (de)
JP2016507379A5 (de)
JP2012030220A5 (ja) 極小径粒の作製方法および正極活物質の作製方法