JP2013143216A5 - - Google Patents

Download PDF

Info

Publication number
JP2013143216A5
JP2013143216A5 JP2012002034A JP2012002034A JP2013143216A5 JP 2013143216 A5 JP2013143216 A5 JP 2013143216A5 JP 2012002034 A JP2012002034 A JP 2012002034A JP 2012002034 A JP2012002034 A JP 2012002034A JP 2013143216 A5 JP2013143216 A5 JP 2013143216A5
Authority
JP
Japan
Prior art keywords
metal
alloy particles
bonding region
electronic device
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012002034A
Other languages
Japanese (ja)
Other versions
JP6049121B2 (en
JP2013143216A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012002034A priority Critical patent/JP6049121B2/en
Priority claimed from JP2012002034A external-priority patent/JP6049121B2/en
Publication of JP2013143216A publication Critical patent/JP2013143216A/en
Publication of JP2013143216A5 publication Critical patent/JP2013143216A5/ja
Application granted granted Critical
Publication of JP6049121B2 publication Critical patent/JP6049121B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (4)

バルク状成形体でなる機能性材料であって、金属/合金粒子と、結合領域とを含んでおり、前記結合領域は、金属間化合物又は金属化合物を含むナノコンポジット構造を有し、200ｎｍ以下のサイズで前記金属/合金粒子の周りを埋めている機能性材料。   A functional material formed of a bulk-shaped molded body, which includes metal / alloy particles and a bonding region, and the bonding region has a nanocomposite structure including an intermetallic compound or a metal compound, and has a thickness of 200 nm or less. Functional material that fills around the metal / alloy particles in size. 機能部分を有する電子デバイスであって、前記機能部分は、金属/合金粒子と、結合領域とを含んでおり、前記結合領域は、金属間化合物又は金属化合物を含むナノコンポジット構造を有し、200ｎｍ以下のサイズで前記金属/合金粒子の周りを埋めている電子デバイス。   An electronic device having a functional part, wherein the functional part includes metal / alloy particles and a bonding region, and the bonding region has a nanocomposite structure including an intermetallic compound or a metal compound, and has a thickness of 200 nm. An electronic device filled around the metal / alloy particles with the following sizes: 機能部分を有する電子デバイスであって、前記機能部分は、金属/合金粒子と、結合領域とを含んでおり、前記結合領域は、結晶または非結晶のガラス成分もしくはセラミックを含むナノコンポジット構造を有し、200ｎｍ以下のサイズで前記金属/合金粒子の周りを埋めている電子デバイス。   An electronic device having a functional portion, wherein the functional portion includes metal / alloy particles and a bonding region, and the bonding region has a nanocomposite structure including a crystalline or amorphous glass component or ceramic. An electronic device in which the metal / alloy particles are filled with a size of 200 nm or less. バルク状成形体でなる機能性材料、又は、機能部分を形成する方法であって、
金属/合金粒子を、揮発性有機分散媒または水性分散媒に分散させた分散系を調製し、
前記分散系を型入れした後、前記型内において、前記分散媒を気化させることにより200ｎｍ以下のサイズの空隙を形成し、
次に、加熱・加圧して、前記空隙を埋める結合領域を生じさせる、
工程を含む方法。

A functional material comprising a bulk molded body, or a method for forming a functional part,
Prepare a dispersion system in which metal / alloy particles are dispersed in a volatile organic dispersion medium or an aqueous dispersion medium,
After casting the dispersion, in the mold, the dispersion medium is vaporized to form a void having a size of 200 nm or less,
Next, heating and pressurizing to produce a bonded region that fills the gap,
A method comprising steps.

JP2012002034A 2012-01-10 2012-01-10 Functional material, electronic device, electromagnetic wave absorption / shielding device, and manufacturing method thereof Active JP6049121B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012002034A JP6049121B2 (en) 2012-01-10 2012-01-10 Functional material, electronic device, electromagnetic wave absorption / shielding device, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012002034A JP6049121B2 (en) 2012-01-10 2012-01-10 Functional material, electronic device, electromagnetic wave absorption / shielding device, and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2013143216A JP2013143216A (en) 2013-07-22
JP2013143216A5 true JP2013143216A5 (en) 2014-12-18
JP6049121B2 JP6049121B2 (en) 2016-12-21

Family

ID=49039691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012002034A Active JP6049121B2 (en) 2012-01-10 2012-01-10 Functional material, electronic device, electromagnetic wave absorption / shielding device, and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP6049121B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885351B2 (en) * 2013-10-09 2016-03-15 有限会社 ナプラ Junction and electrical wiring
JP6038270B1 (en) * 2015-12-22 2016-12-07 有限会社 ナプラ Electronic equipment
KR102662146B1 (en) 2018-12-17 2024-05-03 삼성전자주식회사 Semiconductor package

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591095B (en) * 2000-10-25 2004-06-11 Harima Chemical Inc Electro-conductive metal paste and method for production thereof
JP4255847B2 (en) * 2004-01-27 2009-04-15 田中貴金属工業株式会社 Method of forming bumps on semiconductor wafer using metal paste
JP2007173131A (en) * 2005-12-26 2007-07-05 Hitachi Ltd Particulate dispersion solution and conductive pattern forming device using it
WO2009110095A1 (en) * 2008-03-07 2009-09-11 富士通株式会社 Conductive material, conductive paste, circuit board, and semiconductor device
JP2010161331A (en) * 2008-12-12 2010-07-22 Hitachi Ltd Electrode, electrode paste, and electronic component using same
JP4563506B1 (en) * 2010-01-13 2010-10-13 有限会社ナプラ Electrode material
JP2011021255A (en) * 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp Three-metallic-component type composite nanometallic paste, method of bonding, and electronic component
JP5660426B2 (en) * 2010-03-17 2015-01-28 独立行政法人情報通信研究機構 Wireless communication system
JP5750259B2 (en) * 2010-11-30 2015-07-15 ハリマ化成株式会社 Conductive metal paste

Similar Documents

Publication Publication Date Title
JP2013115177A5 (en)
JP2015226935A5 (en)
JP2011516606A5 (en)
JP2013528829A5 (en)
JP2011509921A5 (en)
JP2015164123A5 (en)
WO2012164078A3 (en) Method for producing a moulded body and device
JP2011014556A5 (en)
EP3181333A3 (en) Method of manufacturing three-dimensionally formed object
WO2013066669A3 (en) Structures incorporating silicon nanoparticle inks, densified silicon materials from nanoparticle silicon deposits and corresponding methods
MY152943A (en) Method for producing a silicon ingot
JP2014507971A5 (en)
WO2010117875A3 (en) Composite thermoelectric material and method for producing the same
JP2013051033A5 (en)
JP2011029609A5 (en) Method for manufacturing semiconductor device
JP2013143216A5 (en)
WO2015102732A3 (en) Amorphous alloy containing feedstock for powder injection molding
JP2014011456A5 (en)
JP2013511602A5 (en)
JP2012248845A5 (en)
JP2011516635A5 (en)
JP2016507379A5 (en)
JP2015507560A5 (en)
JP2012030220A5 (en) Method of producing extremely small diameter particles and method of producing positive electrode active material
JP2011251959A5 (en)