JP6049121B2 - Functional material, electronic device, electromagnetic wave absorption / shielding device, and manufacturing method thereof - Google Patents

Description

  The present invention relates to a functional material, an electronic device, an electromagnetic wave absorption / shielding device, and a manufacturing method thereof.

  In an electronic device typified by a semiconductor device, a micromachine, or the like, it may be necessary to form a fine conductor structure. Conventionally, various types of functional materials for realizing such a fine structure have been known.

  For example, in a passive component having an internal electrode structure, for example, a multilayer ceramic capacitor, a conductive paste containing Ni as a main component is used as disclosed in Patent Document 1. Since the conductive paste contains an organic binder and is removed in the binder removal step, traces of the organic binder remain on the electrode, and a continuous dense electrode cannot be obtained.

  Patent Documents 2 and 3 disclose a molten metal material as a functional material applied to a TSV (Through Silicon Via) technique for realizing a three-dimensional wiring structure. This technology has a very good advantage that it has a dense structure with no voids, gaps or cavities, and can form through-electrodes with low stress, but it has the thermal energy to obtain molten metal. is necessary

JP 2010-173910 A JP 2002-368083 A JP 2005-109515 A

  An object of the present invention is to provide a functional material capable of realizing a dense metal / alloy filling structure.

Another object of the present invention is to provide a functional material with a wide range of applications that can be applied not only to electrode materials but also to wiring materials or electronic component bonding materials.

  Still another object of the present invention is to provide a functional material that can be applied to sputtering targets and the like.

  Still another object of the present invention is to provide an electronic device and an electromagnetic wave absorption / shielding device in which the above-described functional material is applied to a functional part.

  Still another object of the present invention is to provide a functional material or a functional part that consumes less heat energy and that can minimize thermal damage to an object, and a method for manufacturing the same.

  In order to achieve the above-described problems, the functional material, electronic component, electromagnetic wave absorption / shielding device, and production thereof according to the present invention have the following configurations.

1. Functional Material The functional material according to the present invention includes two aspects. In this specification, the functional material refers to a material of a type used for the purpose of expressing functions such as electrical properties, dielectric properties, magnetism, and optical properties of the material.

(1) First functional material The first functional material is a bulk-shaped molded body, and includes metal / alloy particles and a binding region, and the binding region is a nano material including an intermetallic compound or a metal compound. It has a composite structure and fills around the metal / alloy particles with a size of 200 nm or less.

  As described above, the first functional material includes a bonding region together with metal / alloy particles, and the bonding region has a nanocomposite structure including an intermetallic compound or a metal compound, and has a size of 200 nm or less. Since the periphery of the metal / alloy particle is buried, the metal / alloy particle is bonded by a nano-sized bonding region of 200 nm or less. For this reason, a dense metal / alloy filling structure is realized.

  The bonding region includes an intermetallic compound or a metal compound, but has a nanocomposite structure and a size of 200 nm or less, and therefore, a substantially continuous functional portion is formed between metal / alloy particles by the tunnel effect. It will be.

In addition, the present invention can also be applied to electrode materials, wiring materials, or electronic component bonding materials by selecting metal / alloy particles and a binding material constituting the binding region. These materials are improved in quality and function by a dense metal / alloy filling structure.

  Furthermore, since the first functional material is a bulk-like molded body in which metal / alloy particles are bonded by a nano-sized bonding region of 200 nm or less, it can be used as a dense and high-quality sputtering target. . In addition, various sputtering targets according to requirements can be realized by selecting the metal / alloy particles and the binding material constituting the binding region.

(2) Second Functional Material The second functional material is also a bulk molded body and includes metal / alloy particles and a bonding region. The bonding region has a nanocomposite structure containing a crystalline or amorphous glass component or ceramic and fills around the metal / alloy particles with a size of 200 nm or less.

  The bonding region includes a crystalline or amorphous glass component or ceramic, but has a nanocomposite structure and a size of 200 nm or less. Therefore, a continuous conductive path is secured between metal / alloy particles by the tunnel effect. It will be.

  Also in the first functional material, the bonding region fills the periphery of the metal / alloy particles with a size of 200 nm or less, so the metal / alloy particles are filled with a nano-size region of 200 nm or less. For this reason, a dense metal / alloy filling structure is realized.

Further, the present invention can also be applied to electrode materials, wiring materials, or electronic component bonding materials by selecting metal / alloy particles and a binding material that constitutes a binding region. These materials are improved in quality and function by a dense metal / alloy filling structure.

  Furthermore, since the second functional material is a bulk molded body in which metal / alloy particles are filled with a nano-sized region of 200 nm or less, it can be used as a dense and high-quality sputtering target. it can. In addition, various sputtering targets according to requirements can be realized by selecting the metal / alloy particles and the binding material constituting the binding region.

(3) Common matters In both the first functional material and the second functional material, it is preferable that the metal / alloy particles have a nanocomposite structure and have a minimum passing size of 1 μm or less. The metal / alloy particles can take any shape such as spherical shape, scale shape, flat shape, flake shape, needle shape and the like. In such an arbitrary shape, the meaning that the minimum passing size is 1 μm or less is that the minimum size is 1 μm or less in the three dimensions of length, width and thickness.

  If the nanocomposite structure has a minimum passing size of 1 μm or less, the nanosize effect represented by the quantum size effect can be used to control the physical properties that cannot be obtained in the past, such as control of the melting point of metal / alloy particles and stress control. is there.

  Further, the first functional material and the second functional material may contain carbon nanotubes together with the metal / alloy particles and the bonding region.

Furthermore, the first functional material and the second functional material can be used as an electrode material, a wiring material, or an electronic component bonding material. This point has already been described.

2. Electronic device The electronic device according to the present invention is an application of the above-described functional material to a functional part, and has two modes, one according to a first functional material and one according to a second functional material. Common matters also apply.

  Therefore, in the electronic device according to the present invention, the effects described in the first functional material and the second functional material can be obtained as they are. In the present invention, an electronic device refers to a device that applies the function of electrons. Typically, a system LSI, a memory LSI, an image sensor, a MEMS, or the like. It may be an electronic device including an analog or digital circuit, a memory circuit such as a DRAM, a logic circuit such as a CPU, or different types of circuits such as an analog high frequency circuit and a low frequency, low power consumption circuit. It may be an electronic device made by laminating them and laminating them. In addition, sensor modules, photoelectric modules, unipolar transistors, MOS FETs, CMOSFETs, memory cells, or their integrated circuit components (ICs), or LSIs of various scales, etc. Most of the things can be included. In the present invention, the term “integrated circuit LSI” includes all of small scale integrated circuits, medium scale integrated circuits, large scale integrated circuits, ultra large scale integrated circuits VLSI, ULSI, and the like. Furthermore, the device is not limited to an active device, and may be a passive device or a composite device including both an active element and a passive element.

3. Electromagnetic wave absorption / shielding device The electromagnetic wave absorption / shielding device according to the present invention is also the one in which the functional material described above is applied to the functional part, and is in accordance with the first functional material and in accordance with the second functional material. In addition, matters common to them also apply.

  Therefore, also in the electromagnetic wave absorption / shielding device according to the present invention, the effects described in the first functional material and the second functional material can be obtained as they are. The electromagnetic wave absorption / shielding device is meant to include both the electromagnetic wave absorbing device and the electromagnetic wave shielding device.

4). Method for producing functional material and functional part The method according to the present invention is a method for producing a functional material or a functional part made of a bulk molded article, and first, metal / alloy particles are dispersed in a volatile organic dispersion. A dispersion is prepared by dispersing in a medium or an aqueous dispersion medium. Next, after placing the dispersion system in the mold, the dispersion medium is vaporized in the mold to form voids having a size of 200 nm or less. Next, a step of forming a bulk having a nanocomposite structure including an intermetallic compound or a metal compound is generated by heating and pressurizing to form a bonding region filling the void.

  In this specification, the dispersion system refers to a suspension or paste in which fine solid particles are dispersed in a liquid dispersion medium, a monodispersed system in which particles of the same particle size are gathered, and polydispersion in which the particle size changes irregularly. Includes both systems. Further, not only a coarse-grained dispersion system but also a colloidal dispersion system is included. As the dispersion medium, an aqueous dispersion medium or a volatile organic dispersion medium can be used. The dispersion system may further contain carbon nanotubes. As described above, the metal / alloy particles preferably have a nanocomposite structure and have a minimum passing size of 1 μm or less.

  In the method according to the present invention, since a dispersion system in which metal / alloy particles are dispersed in a dispersion medium is used, metal / alloy particles having a fine powder form that is inherently difficult to handle are used by using the fluidity of the dispersion material. Thus, a functional material or a functional part can be formed. Therefore, it is possible to provide a low-temperature functional material that consumes less heat energy and can minimize thermal damage to the object.

  In addition, since the dispersion medium is a volatile organic dispersion medium or an aqueous dispersion medium, after placing the dispersion system, the dispersion medium is vaporized in the mold to form a void having a size of 200 nm or less. Thereafter, the process includes heating and pressurizing to form a bonding region that fills the void, and forming a bulk having a nanocomposite structure containing an intermetallic compound or a metal compound. Therefore, the functional material and the functional part according to the present invention are included. Electronic devices and electromagnetic wave absorption / shielding devices can be manufactured.

As described above, according to the present invention, the following effects can be obtained.
(A) A functional material capable of realizing a dense metal / alloy filling structure can be provided.
(B) It is possible to provide a functional material with a wide range of applications that can be applied not only to electrode materials but also to wiring materials or electronic component bonding materials.
(C) A functional material applicable to a sputtering target or the like can be provided.
(D) It is possible to provide an electronic device and an electromagnetic wave absorption / shielding device in which the functional material described above is applied to a functional part.
(E) It is possible to provide a method for manufacturing a functional material or a functional part that consumes less heat energy and can minimize thermal damage to an object.

It is a figure which shows the bulk-like functional material which concerns on this invention. It is a figure which shows another example of the bulk functional material which concerns on this invention. It is a figure which shows the bulk-like functional material which concerns on this invention. It is a figure which shows an example of the electronic device which concerns on this invention. It is a figure which shows another example of the electronic device which concerns on this invention. It is a figure which shows another example of the electronic device which concerns on this invention. It is a figure which shows the method of manufacturing the bulk-like functional material shown in FIG. It is a figure which shows the method of manufacturing the bulk-like functional material shown in FIG. It is a figure which shows the method of manufacturing the bulk-like functional material shown in FIG.

1. Functional Material (1) First Functional Material Referring to FIG. 1, the first functional material is a bulk molded body, and includes a bonding region 1 and metal / alloy particles 3. Has a nanocomposite structure containing an intermetallic compound or a metal compound, and fills around the metal / alloy particles 3 with a size of 200 nm or less. Diffusion bonding or the like occurs between the bonding region 1 and the metal / alloy particle 3.

  As described above, the first functional material includes the bonding region 1 together with the metal / alloy particles 3, and the bonding region 1 has a nanocomposite structure including an intermetallic compound or a metal compound and has a thickness of 200 nm or less. Since the periphery of the metal / alloy particle 3 is filled with the size, the metal / alloy particle 3 is bonded by the bonding region of the nano-sized region of 200 nm or less. For this reason, a dense metal / alloy filling structure is realized.

  The bonding region 1 includes an intermetallic compound or a metal compound, but has a nanocomposite structure and a size of 200 nm or less. Therefore, the bonding between the metal / alloy particles 3-3 is substantially functional due to the tunnel effect. It becomes a continuous state.

Moreover, the present invention can also be applied to electrode materials, wiring materials, or electronic component bonding materials by selecting the metal / alloy particles 3 and the bonding material constituting the bonding region 1. These materials are improved in quality and function by a dense metal / alloy filling structure.

  Furthermore, since the first functional material is a bulk-shaped molded body in which the metal / alloy particles 3 are bonded by the bonding region 1 having a nano-sized region of 200 nm or less, it is used as a dense and high-quality sputtering target. Can do. In addition, by selecting the metal / alloy particles 3 and the bonding material constituting the bonding region 1, various sputtering targets can be realized according to requirements.

  In the bonding region 1, an intermetallic compound or a nanocomposite structure including a metal compound is a nanosized intermetallic compound or metal compound dispersed in a crystal grain (intragranular nanocomposite crystal structure), or nm size at a grain boundary. Or a composite in which a metal compound is dispersed (grain boundary nanocomposite crystal structure). Metal compounds can include oxides, chlorides, silicides, sulfides, carbides, hydrides, or combinations thereof. The metal constituting the intermetallic compound or the metal compound includes alloys as well as single element metals.

  The external shape of the metal / alloy particle 3 may be uniform or uniform. Further, it can take any shape such as a spherical shape, a scale shape, a flat shape, a thin piece shape, a needle shape, and the like.

  There is no restriction | limiting in particular in the metal which can be used as the metal / alloy particle 3, The thing suitable for the target functional material can be selected and used at any time. As a typical example, at least one selected from the group of Sn, Bi, Ga, In, Ag, Cu, Au, Pt, Ti, Zn, Al, Fe, Si, or Ni can be given.

  It is preferable that the metal / alloy particle 3 has a nanocomposite structure and a minimum passing size is 1 μm or less. The metal / alloy particle 3 has an arbitrary shape such as a spherical shape, a scale shape, a flat shape, a thin piece shape, a needle shape, etc., and the meaning that the minimum delivery size is 1 μm or less is the smallest in three dimensions of length, width and thickness. Is a size of 1 μm or less. The nanocomposite structure in the metal / alloy particle 3 also has two modes: an intragranular nanocomposite crystal structure and a grain boundary nanocomposite crystal structure.

  As described above, if the nanocomposite structure has a minimum passing size of 1 μm or less, the nanosize effect represented by the quantum size effect can be used to control the melting point of the metal / alloy particles 3 and the stress control. No physical property control is possible. For example, when the size is 100 nm or less, particularly 20 nm or less, a quantum size effect appears, and the melting point of the metal component contained in the metal / alloy particle 3 is significantly lower than the original melting point of the metal.

  However, depending on the application of the functional material, it may be necessary to improve its heat resistance. One means for meeting such a requirement is to coat the surface of the metal / alloy particle 3 with a metal oxide coating.

  Next, the functional material illustrated in FIG. 2 includes carbon nanotubes 5 along with metal / alloy particles 3. As the carbon nanotube 5, a single-wall single-wall nanotube (SWNT) and a multi-wall multi-wall nanotube (MWNT) are also known, and any type of carbon nanotube 5 can be used. .

  The multi-walled carbon nanotube 5 is also known to have excellent conductivity, elasticity, and strength, a Young's modulus of 0.9 TPa, and a specific strength of up to 150 GPa. On the other hand, the single-walled carbon nanotube 5 has excellent thermal conductivity. The Young's modulus is 1 TPa or more, and the specific strength varies depending on the structure, but is in the range of 13 to 126 GPa.

  The carbon nanotube 5 has a diameter of 0.4 to 50 nm, and basically has a structure in which uniform flat graphite (graphene sheet) is rolled into a cylindrical shape. The length of the carbon nanotube 5 is set in the range of 100 nm to several hundred nm, for example.

  The carbon nanotube 5 has characteristics such as high current density resistance 1,000 times or more that of copper, high heat conduction characteristics 10 times that of copper, high mechanical strength, and a long and narrow shape. These features significantly improve the electrical properties, thermal properties, durability and mechanical strength of the functional material.

The first functional material shown in FIGS. 1 and 2 can be used as an electrode material, a wiring material, or an electronic component bonding material in addition to a sputtering target.

(2) Second Functional Material As shown in FIG. 3, the second functional material is also a bulk molded body and includes metal / alloy particles 3 and a bonding region 1. In that respect, it is common to the first functional material, but the configuration of the bonding region 1 is different from that of the first functional material. In the second functional material, the bonding region 1 has a nanocomposite structure including a crystalline or amorphous glass component or ceramic, and is embedded around the metal / alloy particle 3 with a size of 200 nm or less.

  The bonding region 1 includes a crystalline or amorphous glass component or ceramic, but has a nanocomposite structure and a size of 200 nm or less. Therefore, a continuous conductive path is formed between the metal / alloy particles 3-3 due to a tunnel effect. Will be secured.

  Also in the second functional material, the bonding region 1 has a size of 200 nm or less and fills the periphery of the metal / alloy particle 3, so that a dense metal / alloy filling structure is realized.

Further, the present invention can also be applied to an electrode material, a wiring material, or an electronic component bonding material by selecting a metal / alloy particle 3 and a bonding material constituting the bonding region 1. These materials are improved in quality and function by a dense metal / alloy filling structure.

  Furthermore, since the second functional material is a bulk-shaped molded body in which the metal / alloy particles 3 are bonded by the bonding region 1 of the nano-sized region of 200 nm or less, it should be used as a dense and high-quality sputtering target. Can do. In addition, by selecting the metal / alloy particles 3 and the bonding material constituting the bonding region 1, various sputtering targets can be realized according to requirements.

  Also in the second functional material, it is preferable that the metal / alloy particle 3 has a nanocomposite structure and the minimum passing size is 1 μm or less. If the nanocomposite structure has a minimum passing size of 1 μm or less, the effects described in the first functional material can be obtained. The second functional material may also contain carbon nanotubes together with the metal / alloy particles 3 and the bonding region 1.

2. Electronic Device The functional material shown in FIGS. 1 to 3 can be applied to configure a functional part in the various electronic devices described above. As a typical example, the functional portion is, for example, an electrode in a passive component such as a capacitor or an inductor or an active component such as a semiconductor chip, or a through electrode in a semiconductor substrate or interposer. An example thereof is shown in FIGS.

  First, referring to FIG. 4, in a multilayer capacitor, among a plurality of internal electrodes embedded in a dielectric layer 71, adjacent pairs of internal electrodes 91 and 92 are shown. The internal electrodes 91 and 92 have a structure as shown in FIG. That is, the internal electrodes 91 and 92 have the metal / alloy particles 3 and the bonding region 1 as shown in FIG. The bonding region 1 has a nanocomposite structure containing an intermetallic compound or a metal compound, and fills around the metal / alloy particle 3 with a size of 200 nm or less. The metal / alloy particles 3 preferably have a nanocomposite structure and have a minimum passing size of 1 μm or less. More specifically, the bonding region 1 is made of a solidified metal after melting.

  If the melting temperature of the functional material constituting the internal electrodes 91 and 92 is too lower than the firing temperature of the dielectric material, the functional material is melted before the ferroelectric material is sintered, It may diffuse into the body layer 71 and deteriorate the characteristics. Therefore, the size, material, and the like of the functional material are selected so that the melting temperature is close to the firing temperature of the ferroelectric layer 19. Alternatively, the surface of the metal / alloy particle 3 may be covered with a metal compound layer. As illustrated in FIG. 2, the internal electrodes 91 and 92 can include the carbon nanotubes 5 together with the metal / alloy particles 3.

  Next, FIG. 5 shows a through electrode 93 provided on a semiconductor substrate or interposer substrate 72 as a functional part. The through electrode 93 is made of the functional material shown in FIG. 1 or 2, and includes the metal / alloy particle 3 and the bonding region 1. The metal / alloy particle 3 has a nanocomposite structure and a minimum passing size is 1 μm or less. In the bonding region 1, the metal / alloy particles 3 are filled with an amorphous and nanocomponent structure region. Also in this case, the functional part can contain carbon nanotubes together with the metal / alloy particles 3.

  The bulk functional material illustrated in FIGS. 1 and 2 can be used as a sputtering target for forming a thin film electrode 94 on a substrate 73 in an electronic device, for example, as illustrated in FIG.

3. Electromagnetic wave absorption / shielding device The electromagnetic wave absorption / shielding device according to the present invention is also the one in which the functional material described above is applied to the functional part, and is in accordance with the first functional material and in accordance with the second functional material. In addition, matters common to them also apply. Therefore, also in the electromagnetic wave absorption / shielding device according to the present invention, the effects described in the first functional material and the second functional material can be obtained as they are. In particular, the second functional material shown in FIG. 3 is suitable as an electromagnetic wave absorption / shielding device.

4). Functional Material and Method for Producing Functional Part The functional part in the bulk functional material and electronic device shown in FIGS. 1 to 6 can be produced according to the processes shown in FIGS. FIG. 7 shows a method of forming the bulk functional material or functional part shown in FIG. First, a dispersion system in which the metal / alloy particles 3 are dispersed in a volatile organic dispersion medium or an aqueous dispersion medium is prepared. Dispersion refers to a suspension or paste in which fine solid particles are dispersed in a liquid dispersion medium, and includes both monodispersed systems in which particles of the same particle size are gathered and polydispersed systems in which the particle size varies irregularly. Including. Further, not only a coarse-grained dispersion system but also a colloidal dispersion system is included. As the dispersion medium, an aqueous dispersion medium or a volatile organic dispersion medium can be used. The metal / alloy particles 3 preferably have a nanocomposite structure and have a minimum passing size of 1 μm or less.

  Next, the dispersion system 13 shown in FIG. 1 is filled (poured into the mold 11) into the molding chamber 111 of the mold 11 (FIG. 7A). The dispersion system 13 is a functional material including the dispersion medium 131 and the metal / alloy particles 3, and the dispersion medium 131 is a volatile organic dispersion medium or an aqueous dispersion medium. The metal / alloy particles 3 have a minimum diameter of 1 μm or less, have a nanocomposite structure containing a metal compound, and are dispersed in the dispersion medium 131.

  Next, the dispersion medium 131 is evaporated inside the molding chamber 111 (FIG. 7B). Thereby, a gap G <b> 1 is generated between the metal / alloy particles 3.

  Next, pressurization and heating are performed to dissolve a part of the metal / alloy particles 3 to form the bonded region 1. Such an operation can be realized by setting a part of the metal / alloy particles 3 to a material or particle size having a low melting point and the other to a material or particle size having a high melting point. The thermally melted metal / alloy particles 3 are preferably cooled and hardened while being pressurized.

  Thereafter, the target bulk functional material 15 is obtained by taking out the molded body 15 from the molding chamber 111 (FIG. 7D).

  In this manufacturing method, since the dispersion system 13 in which the metal / alloy particles 3 are dispersed in the dispersion medium 131 is used, a melting process is unnecessary unlike the conventional technique using a molten metal. The dispersion system 13 in a low temperature state can be filled into the molding chamber 111 and molded, and heat energy for melting is not required, so energy consumption can be reduced.

  Further, when the thermally melted metal / alloy particles 3 are cooled and cured while being pressurized, the formation of a nest that may occur between the molding chamber 111 and the molded body 15 due to volume reduction during cooling is caused by the pressurization. By avoiding this, a high-quality bulk functional material without a nest can be obtained.

  Further, when the thermally melted metal / alloy particles 3 are cooled and hardened while being pressurized, metal grain growth and crystal growth are suppressed. As a result, growth of columnar crystals is suppressed, equiaxed crystallization is promoted, and a high-quality bulk functional material is obtained.

  The dispersion medium 131 is a volatile organic dispersion medium or an aqueous dispersion medium. The volatile dispersion medium 131 is particularly preferably a volatile organic dispersion medium that volatilizes at room temperature. As such a liquid dispersion medium 131, various types are known, and these may be selectively used.

  Since the metal / alloy particles 3 can contain various kinds of metals, intermetallic compounds and metal compounds as described above, various physical properties according to the type of metal can be obtained.

  Moreover, since the dispersion system 13 in which the metal / alloy particles 3 are dispersed in the dispersion medium 131 is used, the metal / alloy particles 3 having a fine powder form which is inherently difficult to handle are used by utilizing the fluidity of the dispersion system 13. Then, it is applied so as to form a defined pattern, or is filled in a minute section or a minute space to form a functional part. Therefore, it is possible to provide a low-temperature functional material that consumes less heat energy and can minimize thermal damage to the object.

  Further, since the dispersion medium 131 is a volatile organic dispersion medium or an aqueous dispersion medium, the dispersion medium 131 can be evaporated to realize a structure such as a dense electrode, wiring, and bonding wiring using a metal component.

  Next, FIG. 8 shows a method for manufacturing the bulk functional material shown in FIG. In the figure, the same reference numerals are assigned to the parts corresponding to the constituent parts appearing in FIG. A feature of the manufacturing method illustrated in FIG. 8 is that a dispersion system 13 including carbonbone nanotubes 5 is used. Other than that, there is no substantial difference from the manufacturing method shown in FIG. Therefore, all the manufacturing advantages described in FIG. 6 are exhibited.

  FIG. 9 is a diagram showing a method for manufacturing the bulk-shaped functional material shown in FIG. In the figure, the same reference numerals are assigned to the parts corresponding to the constituent parts appearing in FIG. 9 is characterized by evaporating the dispersion medium 131 from the dispersion system 13 (FIG. 9 (a)) poured into the molding chamber 111 (FIG. 9 (b)), and then metal / The gap G1 around the alloy particles 3 is impregnated with the fluid binding material 1 having fluidity, and is cured (FIG. 9C) by pressing and heating.

  The binding material 1 may be liquid glass or an organic resin. A thermosetting resin is preferred as the organic resin.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications and other applications not described will be apparent to those skilled in the art based on the basic technical idea and teachings of the present invention. It is obvious that the technical field can be conceived.

1 Bonding area
3 Metal / alloy particles
5 Carbon nanotubes

Claims (1)

An electronic device having a functional part, wherein the functional part includes metal particles or alloy particles, and a binding region;
The bonding region includes an intermetallic compound, and fills around the metal particles or alloy particles with a size of 200 nm or less,
The metal particles or alloy particles are bonded by the bonding region;
The metal particles or alloy particles are made of a metal or alloy material having a high melting point,
The bonding region is made of a metal or alloy material having a melting point lower than that of the metal particles or alloy particles,
The intermetallic compound is derived from diffusion of the metal or alloy material having a high melting point and the metal or alloy material having a low melting point,
The metal particles or alloy particles are Cu or Cu alloy,
The bonding region is Sn or Sn alloy,
Electronic devices.

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