JP6048524B2 - 接着剤組成物 - Google Patents

接着剤組成物 Download PDF

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Publication number
JP6048524B2
JP6048524B2 JP2015060454A JP2015060454A JP6048524B2 JP 6048524 B2 JP6048524 B2 JP 6048524B2 JP 2015060454 A JP2015060454 A JP 2015060454A JP 2015060454 A JP2015060454 A JP 2015060454A JP 6048524 B2 JP6048524 B2 JP 6048524B2
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Japan
Prior art keywords
mass
parts
acrylic resin
adhesive composition
alicyclic
Prior art date
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Application number
JP2015060454A
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English (en)
Japanese (ja)
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JP2015180726A (ja
JP2015180726A5 (OSRAM
Inventor
秀次 波木
秀次 波木
士行 蟹澤
士行 蟹澤
元気 片柳
元気 片柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2015060454A priority Critical patent/JP6048524B2/ja
Publication of JP2015180726A publication Critical patent/JP2015180726A/ja
Publication of JP2015180726A5 publication Critical patent/JP2015180726A5/ja
Application granted granted Critical
Publication of JP6048524B2 publication Critical patent/JP6048524B2/ja
Active legal-status Critical Current
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  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
JP2015060454A 2015-03-24 2015-03-24 接着剤組成物 Active JP6048524B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015060454A JP6048524B2 (ja) 2015-03-24 2015-03-24 接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015060454A JP6048524B2 (ja) 2015-03-24 2015-03-24 接着剤組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009256187A Division JP2011100927A (ja) 2009-11-09 2009-11-09 接着剤組成物

Publications (3)

Publication Number Publication Date
JP2015180726A JP2015180726A (ja) 2015-10-15
JP2015180726A5 JP2015180726A5 (OSRAM) 2015-11-26
JP6048524B2 true JP6048524B2 (ja) 2016-12-21

Family

ID=54329110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015060454A Active JP6048524B2 (ja) 2015-03-24 2015-03-24 接着剤組成物

Country Status (1)

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JP (1) JP6048524B2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7571725B2 (ja) * 2019-07-16 2024-10-23 Ａｇｃ株式会社 透明センシングデバイス、合わせガラス、及び透明センシングデバイスの製造方法
WO2021010217A1 (ja) * 2019-07-16 2021-01-21 Ａｇｃ株式会社 透明表示装置、合わせガラス、及び透明表示装置の製造方法
CN112694855B (zh) * 2020-12-24 2022-06-21 苏州赛伍应用技术股份有限公司 一种改性丙烯酸酯胶黏剂、胶带及其制备方法和使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576966B2 (ja) * 2004-09-29 2010-11-10 東亞合成株式会社 エポキシ樹脂を含有する接着剤組成物
JP2006199756A (ja) * 2005-01-18 2006-08-03 Sekisui Chem Co Ltd 接合フィルム、電子部品装置の製造方法及び電子部品装置
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP5229447B2 (ja) * 2006-08-09 2013-07-03 三菱瓦斯化学株式会社 酸無水物エステルとその組成物、熱硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP2015180726A (ja) 2015-10-15

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