JP6015145B2 - IC tag and manufacturing method of IC tag - Google Patents

Description

  The present invention relates to an IC tag and an IC tag manufacturing method.

  As a conventional technology of the IC tag, there is one described in Patent Document 1, for example. Moreover, according to the manufacturing method described in Patent Document 1, the IC tag can be formed by a welder process. Furthermore, according to this manufacturing method, the size of the IC tag can be further reduced with respect to the size of the inlet.

JP 2011-81471 A

However, in the IC tag 30 (see FIG. 6) according to the prior art, the inlet 4 moves in the inlet accommodating portion 5 that accommodates the inlet 4 (that is, the inlet 4 cannot be fixed). When the IC tag 30 is attached when the IC tag 30 is attached, the inlet 4 and the outer layer portion collide with each other.
An object of this invention is to provide the manufacturing method of an IC tag and an IC tag which can suppress a movement of an inlet within the inlet accommodating part of an IC tag in view of the said situation.

One aspect of the present invention for solving the above problems is an IC tag in which an inlet is interposed between a laminated first resin sheet and a second resin sheet, wherein the second resin sheet An IC tag characterized in that a third resin sheet having a convex portion protruding toward the inlet is provided between the inlet and the inlet.
If it is said structure, compared with the case where a 3rd resin sheet is not provided, an inlet accommodating part will become narrow. For this reason, it can suppress that an inlet moves within an inlet accommodating part. Therefore, when the product is transported and the IC tag is attached, the inlet and the outer layer portion collide with each other, so that a possibility that a sound is generated and the product is handled as a defective product can be reduced.

In another aspect of the present invention, the inlet may be sandwiched between a concave portion formed in the first resin sheet and the convex portion of the third resin sheet.
With the above configuration, the inlet is sandwiched between the first resin sheet and the third resin sheet. For this reason, it can further suppress that an inlet moves within an inlet accommodating part.
Another aspect of the present invention may seal the inlet by welding the first resin sheet, the second resin sheet, and the third resin sheet.
If it is said structure, an inlet can be sealed by welding of a 1st resin sheet, a 2nd resin sheet, and a 3rd resin sheet.

Another aspect of the present invention may have a cushion portion between the second resin sheet and the third resin sheet.
If it is said structure, even if force is added to an IC tag from the outside, the force from the outside can be relieved by this cushion part. Therefore, destruction of the IC tag or the inlet can be reduced.

Another aspect of the present invention may be configured such that the planar shape of the bottom surface of the concave portion matches the planar shape of the inlet, and the convex portion is fitted in the concave portion.
If it is said structure, the planar shape of the bottom face of a recessed part corresponds with the planar shape of an inlet. Therefore, compared with the case where the planar shape of the bottom surface of the recess does not match the planar shape of the inlet, the movement of the inlet in the inlet accommodating portion can be further suppressed. Moreover, if it is said structure, since the recessed part and the convex part are fitting, in the state before a welder (that is, the state which only laminated | stacked the 1st resin sheet and the 3rd resin sheet). Even in such a case, the inlet is difficult to move in the inlet accommodating portion during movement.

Another aspect of the present invention may be configured such that the first resin sheet, the second resin sheet, and the third resin sheet are the same thermoplastic member.
If it is said structure, since the 1st resin sheet, the 2nd resin sheet, and the 3rd resin sheet are the same thermoplastic members, compared with the case where each sheet | seat is used as another member, the manufacturing cost You can avoid up.

Another aspect of the present invention includes a step of arranging an inlet in a first resin sheet, a step of laminating a second resin sheet on the side of the first resin sheet on which the inlet is arranged, and the second Providing a third resin sheet having a convex portion protruding toward the inlet between the second resin sheet and the inlet before the step of laminating the resin sheet. This is a method for manufacturing an IC tag.
If it is said method, compared with the case where a 3rd resin sheet is not provided, an inlet accommodating part can be narrowed. For this reason, it can suppress that an inlet moves within an inlet accommodating part. Therefore, it is possible to manufacture an IC tag that suppresses the sound generated by the collision between the inlet and the outer layer portion when the product is transported or the IC tag is attached.

Another aspect of the present invention includes a welding step of welding the first resin sheet, the second resin sheet, and the third resin sheet after the step of laminating the second resin sheet, In the process, high-frequency welder processing may be used.
In the case of the above method, since the inlet is sealed by high-frequency welder processing, unlike the case of laminate sealing, the inlet housing portion is not easily deformed when the inlet is sealed. Therefore, it is possible to prevent the size of the IC tag from changing.

In another aspect of the present invention, in the welding step, the first resin sheet, the second resin sheet, and the third resin sheet are separated from the first resin sheet side and the second resin sheet side. The first mold and the second mold are sandwiched and welded. During the welding, the force sandwiched between the first mold and the second mold is adjusted, and the welded portion of the welded portion is welded. It is good also as making the outer side continue.
If it is said method, since it welded so that the outer side of a welding part may continue, a several IC tag is attached on the sheet | seat of 1 sheet. For this reason, the concern that the IC tags are individually separated at the time of transportation is solved, and the labor of packing is reduced.

1 is a longitudinal sectional view schematically showing the structure of an IC tag according to an embodiment of the present invention. The longitudinal cross-sectional view which shows typically the manufacturing method of the IC tag which concerns on embodiment of this invention. The top view which shows typically the form of the IC tag formed in multiple numbers on one sheet | seat. The longitudinal cross-sectional view which shows typically the modification of the manufacturing method of the IC tag which concerns on embodiment of this invention. The longitudinal cross-sectional view which shows typically the structure of the IC tag which concerns on an Example and a comparative example. The longitudinal cross-sectional view which shows typically the structure of the IC tag which concerns on a prior art.

Hereinafter, an IC tag according to an embodiment of the present invention will be described with reference to FIGS.
(1) Structure of IC Tag 10 (1-1) Structure FIG. 1 is a longitudinal sectional view schematically showing the structure of the IC tag 10 according to the embodiment of the present invention.
As shown in FIG. 1, an IC tag 10 according to the present embodiment is an IC tag in which an inlet 4 is interposed between a laminated upper layer 1 and a lower layer 3, and is between the lower layer 3 and the inlet 4. And an intermediate layer 2 having a convex portion 2 a protruding toward the inlet 4. In the present embodiment, a space between the upper layer 1 and the intermediate layer 2 is referred to as an inlet storage portion 5.
The diameter of the IC tag 10 according to this embodiment is φ6 mm, and the thickness of the IC tag 10 is about 1.3 mm to 1.5 mm.
Hereinafter, each part of the IC tag 10 described above will be described. In the present embodiment, the “HF band winding inlet welder-sealed IC tag” will be described.

(Upper layer 1)
The upper layer 1 is made of a thermoplastic resin and has a sheet shape. The thermoplastic resin used for the upper layer 1 is, for example, PVC (polyvinyl chloride). Further, the thickness of the upper layer 1 is, for example, 200 μm. In addition, the film thickness (layer thickness) of the upper layer 1 is substantially uniform.
The upper layer 1 is formed with an accommodation recess 1a for accommodating an inlet 4 described later. The depth of the housing recess 1a is deeper than the thickness of the inlet 4 described later. Further, the planar shape of the surface (bottom surface) 1 c of the housing recess 1 a is a shape that matches the planar shape of the inlet 4. Note that one inlet 4 is accommodated in the accommodating recess 1a.

(Inlet 4)
The inlet 4 has an IC chip and an antenna. This IC chip is, for example, a chip corresponding to the HF band (for example, a product conforming to ISO15693). The antenna is a copper winding, and the coil dimension is 4 mm. The antenna has a thickness of about 200 μm. In addition, the shape of the inlet 4 is disk shape, for example.

(Intermediate layer 2)
The intermediate layer 2 is formed of the same member as the upper layer 1. That is, the intermediate layer 2 is formed of a thermoplastic resin, and the shape thereof is a sheet shape. The thermoplastic resin used for the intermediate layer 2 is, for example, PVC (polyvinyl chloride). Moreover, the thickness of the intermediate layer 2 is, for example, 200 μm. Note that the thickness (layer thickness) of the intermediate layer 2 is substantially uniform.
The intermediate layer 2 is formed with a convex portion 2a that can be fitted into the accommodating concave portion 1a. And the convex part 2a is arrange | positioned in the accommodation recessed part 1a. Further, the surface 2b of the convex portion 2a faces the surface 1c of the accommodating concave portion 1a. The inlet 4 may be sandwiched between the surface 2b of the convex portion 2a and the surface 1c of the accommodating concave portion 1a.

(Lower layer 3)
The lower layer 3 is formed of the same member as the upper layer 1. That is, the lower layer 3 is formed of a thermoplastic resin, and the shape thereof is a sheet shape. The thermoplastic resin used for the lower layer 3 is, for example, PVC (polyvinyl chloride). The thickness of the lower layer 3 is, for example, 200 μm. Note that the film thickness (layer thickness) of the lower layer 3 is substantially uniform.
The lower layer 3 covers the opening 1b of the housing recess 1a via the intermediate layer 2.
An upper layer 1, an intermediate layer 2, and a lower layer 3 are stacked around the housing recess 1a. And these three laminated | stacked layers are welded by the high frequency welder process, and the inlet 4 is sealed. In the present embodiment, this welded portion is called a welder sealing portion 7.
A space may be formed between the lower layer 3 and the intermediate layer 2. In the present embodiment, this space is referred to as a cushion portion 6.

(1-2) Effect As described above, in the IC tag 10 according to the present embodiment, the inlet accommodating portion 5 is narrowed by arranging the convex portion 2a in the space in the accommodating concave portion 1a. Therefore, it is possible to suppress the movement of the inlet 4 in the inlet accommodating portion 5. Therefore, when the product is transported and the IC tag 10 is attached, the inlet 4 and the outer layer portion collide with each other, so that a possibility that a sound is generated and the product is handled as a defective product can be reduced.

  As a conventional technique for suppressing the movement of the inlet 4, for example, there is a method using laminate sealing. However, in this method, since a force is applied to the inlet 4 from the outside during sealing, a load may be applied to the inlet 4. Further, in this method using laminate sealing, the inlet accommodating portion 5 may be deformed at the time of sealing, and the dimensions (for example, height) of the IC tag may be greatly changed. As these countermeasures, for example, a protective sheet may be provided in the inlet accommodating part 5 or a raised part may be provided in the inlet 4. However, in these countermeasures, manufacturing costs are increased because separate members are used. It may go up.

  However, in the case of the IC tag 10 according to this embodiment, since the inlet 4 is sealed by high-frequency welder processing, the inlet accommodating portion 5 is sealed when the inlet 4 is sealed as compared with the case of laminate sealing. Is difficult to deform. Therefore, it is possible to prevent the dimensions of the IC tag 10 from changing. Moreover, since the laminate sealing is not performed, the load applied to the inlet 4 when the inlet 4 is sealed can be reduced.

Further, in the case of the IC tag 10, since the upper layer 1, the intermediate layer 2 and the lower layer 3 are the same thermoplastic resin member, an increase in manufacturing cost can be avoided as compared with the case where each layer is a separate member. .
In the case of the IC tag 10, the planar shape of the surface 1 c of the housing recess 1 a matches the planar shape of the inlet 4, so the planar shape of the surface 1 c of the housing recess 1 a matches the planar shape of the inlet 4. Compared with the case where it does not, the movement of the inlet 4 in the accommodation recessed part 1a can be prevented more.

In the case of the IC tag 10, since the cushion portion 6 is formed between the intermediate layer 2 and the lower layer 3, even if a force is applied to the IC tag 10 from the outside, the cushion portion 6 from the outside The power of can be relaxed. Therefore, destruction of the IC tag 10 or the inlet 4 can be reduced.
Further, in the IC tag 30 according to the related art, the inlet 4 may be fixed to the inlet accommodating portion 5 with an adhesive. However, in the case of the IC tag 10 according to the present embodiment, an adhesive or the like is used for fixing the inlet 4. Not done. Therefore, for example, even when the IC tag 10 is put in an autoclave, no gas is generated from the adhesive or the like. Moreover, the adhesive force of the adhesive used for fixing the inlet 4 is not lowered, and the fixing of the inlet 4 is not incomplete.

In addition, although this embodiment demonstrated the inlet 4 of the winding of the HF band, it is not limited to this. The frequency and material of the inlet 4 are not particularly limited. As the frequency of the IC tag 10, for example, those in the HF band, UHF band, and LF band can be used. Further, as the type of antenna, for example, a wire, etching, or printing can be used. As the antenna material, for example, Al, Cu, Ag, conductive ink, or the like can be used. Moreover, as an antenna base material, for example, a film such as PET, PEN, or PI, a printed circuit board such as FR4, paper, or the like can be used.
Further, in the present embodiment, the case where the film thicknesses of the upper layer 1, the intermediate layer 2, and the lower layer 3 are the same has been described, but the present invention is not limited to this. The film thickness of each layer may be different.

(2) Manufacturing Method of IC Tag 10 FIG. 2 is a longitudinal sectional view for explaining a manufacturing method of the IC tag 10 according to the embodiment of the present invention.
The manufacturing method of the IC tag 10 according to the embodiment of the present invention shown in FIG. 2 includes a step of arranging the inlet 4 in the upper layer 1, a step of laminating the lower layer 3 on the side of the upper layer 1 where the inlet 4 is arranged, Before the step of laminating 3, the step of providing an intermediate layer 2 having a convex portion 2 a protruding toward the inlet 4 between the lower layer 3 and the inlet 4.

Hereinafter, the detail of each process mentioned above is demonstrated. In the manufacturing method according to the present embodiment, each part of the IC tag 10 described above is used. Accordingly, the same portions are denoted by the same reference numerals.
The step of disposing the inlet 4 in the upper layer 1 includes a step of plastically deforming the upper layer 1 made of a thermoplastic resin to form an accommodation recess 1a for accommodating the inlet 4 (see FIGS. 2A and 2B), And the step of housing the inlet 4 in the formed housing recess 1a (see FIG. 2C).

  The step of forming the housing recess 1a is performed by inserting a convex portion 22b protruding from the lower surface 22a of the upper mold 22 into the receiving hole 21a of the lower mold 21, so that the upper mold 22 and the lower mold 21 are The plate-like upper layer 1 disposed between them is plastically deformed in accordance with the planar shape of the inlet 4. For this reason, the convex part 1d is also formed in the upper layer 1 simultaneously with the formation of the accommodating concave part 1a (see FIG. 2C). For example, if the planar shape of the inlet 4 is circular, the convex portion 22b protruding from the lower surface 22a of the upper mold 22 is a columnar shape, and the receiving hole 21a of the lower mold 21 is a circular hole shape.

In the plastic deformation of the upper layer 1, for example, a method such as room temperature embossing, high temperature embossing or high frequency welder can be used. Moreover, the process of forming the accommodation recessed part 1a in the upper layer 1 may use a wooden mold or a resin mold instead of a mold. Furthermore, it can also be performed using an embossing roll or the like.
The step of housing the inlet 4 in the housing recess 1a is for housing the inlet 4 in the housing recess 1a formed by the above-described steps. This step may be performed in a state where the upper layer 1 is still fitted to the lower mold 21 without removing the upper layer 1 from the lower mold 21.

The step of providing the intermediate layer 2 having the convex portion 2a protruding toward the inlet 4 between the lower layer 3 and the inlet 4 described above was formed with the step of providing the convex portion 2a on the intermediate layer 2 (not shown). And a step (see FIG. 2D) of arranging the convex portion 2a toward the inlet 4.
The process of providing the convex part 2a in the intermediate layer 2 is the same process as the process of forming the accommodating concave part 1a in the upper layer 1 described above. That is, a flat plate disposed between the upper mold 22 and the lower mold 21 by inserting the convex portion 22 b protruding from the lower surface 22 a of the upper mold 22 into the receiving hole 21 a of the lower mold 21. The intermediate layer 2 is plastically deformed according to the planar shape of the inlet 4. For this reason, the recessed part 2c is also formed in the intermediate | middle layer 2 simultaneously with formation of the convex part 2a.

In the step of arranging the convex portion 2a toward the inlet 4, the convex portion 2a formed in the intermediate layer in the above-described step is arranged so as to be fitted into the housing concave portion 1a. Finally, the lower layer 3 is laminated on the side on which the inlet 4 of the upper layer 1 is disposed via the intermediate layer 2 (see FIG. 2D).
In this way, a laminate composed of three layers of the upper layer 1, the intermediate layer 2, and the lower layer 3 is formed before the welder processing.

FIG. 2 (e) shows a welding process for welding the upper layer 1, the intermediate layer 2, and the lower layer 3, which are laminated around the accommodation recess 1 a. The lower mold 23 and the upper mold 24 used in this step are high-frequency welder molds. In addition, a blade portion 23 b that protrudes upward is formed around the receiving hole 23 a of the lower mold 23. For this reason, the upper layer 1, the intermediate layer 2, and the lower layer 3 sandwiched between the blade portion 23b of the lower mold 23 and the flat lower surface 24a of the upper mold 24 are welded by high-frequency dielectric heating action.
In addition, you may perform the welding process of welding the circumference | surroundings of the above-mentioned accommodation recessed part 1a not by a high frequency welder process but by a heat seal process.

Here, since the blade portion 23b is formed around the receiving hole 23a of the lower mold 23, the upper mold 24 has no blade portion, and the lower surface 24a thereof can be flat. For this reason, it is not necessary to align the upper mold 24 and the lower mold 23.
Note that the shape of the receiving hole 23a of the lower mold 23 is a round hole shape in the present embodiment because the convex portion 1d formed along with the formation of the accommodating concave portion 1a of the upper layer 1 is fitted. That is, the shape of the receiving hole 23 a of the lower mold 23 is set to a shape that matches the planar shape of the convex portion 1 d of the upper layer 1.

Moreover, in the welding process of welding the periphery of the accommodation recessed part 1a mentioned above, the force which the upper side metal mold | die 24 and the lower side metal mold | die 23 hold | grip is adjusted, and it welds so that an IC tag may continue in a sheet form.
Therefore, as shown in FIGS. 2 (f) and 3, when the IC tag 10 is taken out from the lower mold 23, the outer periphery 25 of the IC tag 10 is welded, but the IC tag 10 is individually separated. Not (not singulated). For this reason, the plurality of IC tags 10 can be easily and collectively taken out from the lower mold 23. Further, transportation or the like can be performed with a plurality of IC tags 10 attached.

  As described above, in the manufacturing method of the IC tag 10 according to the present embodiment, the space in the housing recess 1a is narrowed by arranging the projection 2a. Therefore, it is possible to manufacture an IC tag that suppresses the sound generated by the collision between the inlet and the outer layer portion when the product is transported or the IC tag is attached. For this reason, it can suppress that the inlet 4 moves within the accommodation recessed part 1a. Moreover, if it is said method, the inlet 4 can be sealed, without using laminate sealing. Therefore, the housing recess 1a is not easily deformed at the time of sealing. Therefore, it is possible to prevent the dimensions of the IC tag 10 from changing.

  In the above-described embodiment, as shown in FIGS. 2D and 2E, the case where the upper layer 1, the intermediate layer 2, and the lower layer 3 are simultaneously welded has been described. However, the present invention is not limited to this. It is not a thing. For example, as shown in FIGS. 4A to 4E, first, the upper layer 1 in which the housing recess 1a is formed and the intermediate layer 2 in which the protrusion 2a is formed are welded (FIGS. 4A to 4E). (Refer to (b)) The primary processed product 26 is manufactured. Thereafter, the lower layer 3 may be overlaid on the intermediate layer 2 of the primary processed product 26 (see FIG. 4C), and finally the upper layer 1, the intermediate two layers, and the lower layer 3 may be welded (see FIG. 4C). (Refer FIG.4 (d)). Also by this method, an IC tag similar to the IC tag 10 shown in FIGS. 2 (f) and 3 can be manufactured (see FIG. 4 (e)).

  In the above-described embodiment, as shown in FIGS. 2A and 2B, the case where the storage recess 1 a is formed in the upper layer 1 has been described. However, the present invention is not limited to this. For example, instead of the upper layer 1 in which the storage recess 1a is formed, an upper layer 1 in which the storage recess 1a is not formed (that is, a flat upper layer 1) can be used (not shown). In this case, when the upper layer 1 and the intermediate layer 2 are welded, the upper layer 1 is pushed by the convex portions 2a of the intermediate layer 2, so that the upper layer 1 extends along the shapes of the inlet 4 and the convex portions 2a. Thereby, a processed product similar to the primary processed product 26 shown in FIG. 4C can be manufactured. Thereafter, the lower layer 3 may be stacked on the intermediate layer 2 of the primary processed product 26 (see FIG. 4C), and finally the three layers of the upper layer 1, the intermediate layer 2, and the lower layer 3 may be welded ( (Refer FIG.4 (d)). Also by this method, an IC tag similar to the IC tag 10 shown in FIGS. 2 (f) and 3 can be manufactured (see FIG. 4 (e)).

Hereinafter, a result of comparing the sizes of the inlet accommodating portions 5 of the IC tag 10 according to the present embodiment and the IC tag 30 according to the related art will be described.
[Example]
In the example, the IC tag 10 was prototyped by the manufacturing method according to the above-described embodiment (prototypes 1 to 3). Then, the distance from the upper layer 1 to the intermediate layer 2 of each IC tag 10 and the distance from the intermediate layer 2 to the lower layer 3 were measured. The results are shown in Table 1. The distance described in the column of “upper layer-intermediate layer (inlet accommodating portion)” in Table 1 is the distance (A) from the upper layer 1 to the intermediate layer 2 shown in FIG. The distance described in the column “layer-lower interlayer” indicates the distance (B) from the intermediate layer 2 to the lower layer 3.

[Comparative example]
In the comparative example, an IC tag 30 according to the related art was prototyped (prototypes 4 to 6). Then, the distance from the upper layer 1 to the lower layer 3 of each IC tag 30 was measured. The results are shown in Table 2. Similarly to the case of Table 1, the distance described in the column of “upper layer-lower layer (inlet accommodating portion)” in Table 2 is the distance from the upper layer 1 to the lower layer 3 shown in FIG. ).

In Examples and Comparative Examples, a side length microscope was used to measure the distance (space) between the layers. Moreover, the micrometer was used for the measurement of the thickness of the inlet 4 and each layer (product made from PVC). Further, the distance (space) between each layer was measured three times for each IC tag.
As shown in Tables 1 and 2, the space of the inlet accommodating portion 5 of the IC tag 10 (prototypes 1 to 3) according to the embodiment is that of the inlet accommodating portion 5 of the IC tag 30 (prototypes 4 to 6) according to the comparative example. Compared to the space, in all cases, it was reduced to about 1/3 to 1/6. Here, since the thickness of the winding inlet is about 200 μm, it has been found that there is almost no extra space in the inlet accommodating portion 5 of the IC tag 10 according to the embodiment. For this reason, in the case of the IC tag 10 according to the example, it was found that the inlet 4 is not easily displaced.

In addition, in the operation when packing the prototype IC tag of the present embodiment, the sound confirmed with the IC tags of prototypes 4 to 6 was not confirmed with prototypes 1 to 3, and this occurred when the inlet 4 collided with the outer layer portion. The sound was found to be suppressed.
The IC tag 10 and the manufacturing method thereof according to the present embodiment can be used for all sealed IC tags. For example, it can be used for pallets, basket cars, electronic devices, patches, name tags, weaving names, stationery, key holders, toys and other traceability, inventory management, cleaning management, and electronic money.

DESCRIPTION OF SYMBOLS 1 Upper layer 1a Storage recessed part 1b Opening part 1c Surface 1d Convex part 2 Middle layer 2a Convex part 2b Surface 2c Concave part 3 Lower layer 4 Inlet 5 Inlet accommodating part 6 Cushion part 7 Welder sealing part 10 IC tag 21 Lower side die 21a Receiving hole 22 Upper die 22a Surface (lower surface)
22b Projection 23 Lower mold 23a Receiving hole 23b Blade 24 Upper mold 24a Surface (lower surface)
25 IC tag circumference 26 Primary processed product 30 IC tag A Distance B between upper layer 1 and intermediate layer 2 Distance C between intermediate layer 2 and lower layer 3 Distance between upper layer 1 and lower layer 3

Claims (9)

An IC tag in which an inlet is interposed between a laminated first resin sheet and a second resin sheet,
An IC tag, characterized in that a third resin sheet having a convex portion projecting toward the inlet is provided between the second resin sheet and the inlet.   The IC tag according to claim 1, wherein the inlet is sandwiched between a concave portion formed in the first resin sheet and the convex portion of the third resin sheet. The planar shape of the bottom surface of the recess matches the planar shape of the inlet,
The IC tag according to claim 2, wherein the convex portion is fitted into the concave portion. The first resin sheet, according to any one of claims 1 to 3, characterized in that sealing the inlet by welding the second resin sheet and the third resin sheet IC tag. The IC tag according to any one of claims 1 to 4 , further comprising a cushion portion between the second resin sheet and the third resin sheet.   The IC according to any one of claims 1 to 5, wherein the first resin sheet, the second resin sheet, and the third resin sheet are the same thermoplastic member. tag. Arranging the inlet in the first resin sheet;
Laminating a second resin sheet on the side of the first resin sheet where the inlet is disposed;
Providing a third resin sheet having a protrusion protruding toward the inlet between the second resin sheet and the inlet before the step of laminating the second resin sheet. An IC tag manufacturing method characterized by the above. A step of welding the first resin sheet, the second resin sheet, and the third resin sheet after the step of laminating the second resin sheet;
8. The method of manufacturing an IC tag according to claim 7, wherein high-frequency welding is used in the welding process. In the welding step, the first resin sheet, the second resin sheet, and the third resin sheet are attached to the first mold and the second resin sheet from the first resin sheet side and the second resin sheet side. And welding between the two molds, and adjusting the force between the first mold and the second mold at the time of the welding so that the outside of the welded portion is continuous. The manufacturing method of the IC tag according to claim 8, wherein

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