WO2021205891A1 - Lead frame production method, lead frame, and power source device - Google Patents

Abstract

This lead frame production method includes: a conductor plate preparation step in which two conductor plates are prepared, namely a conductor plate which has a conductor piece and a connecting piece (21), and a conductor plate in which, when overlapped with the other conductor plate, conductor portions are not formed in portions corresponding to portions (114a, 124a) of the conductor piece; an overlapping step in which the two conductor plates are overlapped such that the outer edges thereof coincide; and a punching step in which, where the -Z direction side is defined as the negative side, and the +Z direction side is defined as the positive side, and with a first mould in contact with the conductor piece from the positive side, said first mould being configured so as to be capable of contacting the portions (114a, 124a) of the conductor plate and so as not to make contact with the connecting piece (21), a second mould is brought into contact with the connecting piece (21) from the negative side, and the connecting piece (21) is punched out.

Description

Lead frame manufacturing method, lead frame and power supply

The present invention relates to a lead frame manufacturing method, a lead frame, and a power supply device.

A circuit board has been proposed in which a plurality of lead frames corresponding to a circuit pattern are superposed to form a conductive portion (see, for example, Patent Document 1). This circuit board has a configuration in which a plurality of lead frames are superposed, so that a larger amount of current can flow without widening the width of the separation groove that separates the circuit patterns.

Japanese Unexamined Patent Publication No. 2005-056982

By the way, some circuit boards of the same type as the circuit board described in Patent Document 1 have a conductive portion divided by a separation groove over the entire circumference. When manufacturing such a circuit board, a so-called press method is used in which a plurality of lead frames provided with a support portion for temporarily supporting the conductive portion are stacked around the conductive portion, and then the support portion is punched out. Will be adopted. However, when a plurality of lead frames are stacked, a plurality of support portions are also laminated, so that the thickness of the punching target portion to be punched increases accordingly. Then, when punching the punching target portion, a large force is applied to the periphery of the punching target portion in the lead frame in the thickness direction, and as a result, the periphery of the punching target portion in the lead frame may be unintentionally deformed. ..

The present invention has been made in view of the above reasons, and an object of the present invention is to provide a lead frame manufacturing method, a lead frame, and a power supply device capable of suppressing unintended deformation during manufacturing.

In order to achieve the above object, the method for manufacturing a lead frame according to the present invention is:
It is a manufacturing method of a lead frame formed by superimposing a plurality of conductor plates forming a circuit pattern.
A first conductor piece, a second conductor piece, and a first connecting piece connecting the first part of the first conductor piece and the second part of the second conductor piece are continuously and integrally formed. 1 The first conductor plate preparation process to prepare the conductor plate and
Preparation of a second conductor plate that prepares a second conductor plate in which no conductor portion is formed in the first portion, the second portion, and the portion corresponding to the first connecting piece when superposed on the first conductor plate. Process and
The first conductor plate and the second conductor plate are the outer edge of the portion of the first conductor plate excluding the first portion, the second portion, and the portion corresponding to the first connecting piece, and the second conductor plate. Overlapping process and overlapping so that the outer edges of the
A first die for punching the first connecting piece from the first conductor plate so as to be able to abut the first portion and the second portion and not to abut the first connecting piece. Using the first mold configured in the above and the second mold arranged adjacent to the first mold when viewed from the thickness direction of the first conductor plate, the first conductor plate and the first conductor plate When the side on which the first conductor plate is arranged is defined as the negative side and the side on which the second conductor plate is arranged is defined as the positive side in the thickness direction of the second conductor plate, the first mold is referred to as the first mold. A punching step of bringing the second mold into contact with the first connecting piece from the negative side in a state of being in contact with the first conductor piece from the positive side and punching out the first connecting piece is included. ..

Further, the method for manufacturing a lead frame according to the present invention is as follows.
When the second conductor plate is overlapped with the first conductor plate, the second conductor plate has a third portion facing the first conductor piece, a fourth portion facing the second conductor piece, and the third portion. The second connecting piece that connects the fourth portion is formed continuously and integrally.
In the punching step, the first die configured to be in contact with the third portion and the fourth portion and not to be in contact with the first connecting piece and the second connecting piece. The second mold is brought into contact with the first connecting piece and the second connecting piece from the negative side in a state where the first conductor piece, the third part, and the fourth part are brought into contact with each other from the positive side. Then, the first connecting piece and the second connecting piece may be punched out.

Further, the method for manufacturing a lead frame according to the present invention is as follows.
When overlapped with the second conductor plate, the conductor portion is not formed in a part of the third part, a part of the fourth part, and a part corresponding to the second connecting piece, and the other part of the third part is not formed. Further having a third conductor plate preparation step of preparing a third conductor plate in which a conductor is formed in a portion of the above and a portion corresponding to the other part of the fourth portion.
A part of the third part and a part of the fourth part are connected by the second connecting piece.
A first die for punching the first connecting piece and the second connecting piece from the first conductor plate and the second conductor plate in the punching step, and a part of the third part and the fourth. A first mold configured to be in contact with a part of the portion and not to be in contact with the other part of the third portion and the other part of the fourth portion, and the first mold. Using a second mold arranged adjacent to the first mold when viewed from the thickness direction of the conductor plate, the first mold is mounted on the first conductor piece and the first mold from the positive side. The second mold is brought into contact with the first connecting piece and the second connecting piece from the negative side in a state where a part of the three parts and a part of the fourth part are brought into contact with each other. The first connecting piece and the second connecting piece may be punched out.

Further, the method for manufacturing a lead frame according to the present invention is as follows.
The length of the first connecting piece in the direction from the first portion to the second portion may be longer than the thickness of the first conductor plate.

The lead frame according to the present invention from another viewpoint is
A lead frame formed by superimposing a plurality of conductor pieces forming a circuit pattern.
A first region composed of at least one piece of conductor and
A second region in which a plurality of conductor pieces are superposed and is configured to be thicker than the first region and adjacent to the first region is provided.
It has a first staircase portion and a second staircase portion including a step formed by the first region and the second region.
The first staircase portion and the second staircase portion are arranged so as to face each other with a region in which a conductor is not formed.

The power supply device according to the present invention from another viewpoint is
With the lead frame
It includes an electronic component arranged on the lead frame.

According to the present invention, in the first conductor plate preparation step, the first conductor piece, the second conductor piece, the first connecting piece connecting the first part of the first conductor piece and the second part of the second conductor piece When the first conductor plate including the above is prepared and overlapped with the first conductor plate in the second conductor plate preparation step, the conductor portion is formed in the first portion, the second portion, and the portion corresponding to the first connecting piece. Prepare a second conductor plate that has not been formed. Further, in the superimposition step, the first conductor plate and the second conductor plate are overlapped so that their outer edges overlap. Then, in the punching process, when the side on which the first conductor plate is arranged is defined as the negative side and the side on which the second conductor plate is arranged is defined as the positive side in the thickness direction of the first conductor plate and the second conductor plate, The second mold is in contact with the first conductor piece from the positive side, with the first mold configured so as to be able to contact the first and second parts and not to contact the first connecting piece. The mold is brought into contact with the first connecting piece from the negative side, and the first connecting piece is punched out. Thereby, in the punching step, each of the at least one connecting piece can be punched in a state where the first portion of the conductor plate adjacent to the at least one connecting piece is supported by the second die. Therefore, it is possible to suppress unintended deformation of the first portion adjacent to at least one connecting piece in the conductor plate when punching at least one connecting piece.

It is a perspective view of the module which concerns on embodiment of this invention. It is a perspective view of the lead frame which concerns on embodiment. It is a top view of a part of the lead frame which concerns on embodiment. FIG. 5 is a cross-sectional arrow view taken along the line AA of FIG. 2A in the lead frame according to the embodiment. It is a top view of the conductor plate which concerns on embodiment. It is a top view of the conductor plate which concerns on embodiment. It is a top view of the conductor plate which concerns on embodiment. It is a top view of the conductor plate which concerns on embodiment. It is a top view of the laminated body which concerns on embodiment. It is sectional drawing for demonstrating the punching process which concerns on embodiment. It is sectional drawing for demonstrating the punching process which concerns on embodiment. It is a perspective view of the 1st mold which concerns on embodiment. It is a side view of the 1st mold which concerns on embodiment. It is sectional drawing which shows a part of the laminated body which concerns on a modification. It is sectional drawing which shows a part of the laminated body which concerns on a modification. It is a perspective view of the power supply device which concerns on a modification. It is a top view of the power supply device which concerns on a modification. It is a perspective view of the lead frame which concerns on a modification. It is a perspective view of the lead frame which concerns on a modification. It is a perspective view of the lead frame which concerns on a modification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The lead frame manufacturing method according to the present embodiment is a lead frame manufacturing method in which a plurality of conductor plates forming a circuit pattern are superposed, and includes a first conductor plate preparation step and a second conductor plate preparation step. Includes a superimposition process and a punching process. In the first conductor plate preparation step, the first conductor piece, the second conductor piece, and the first connecting piece connecting the first part of the first conductor piece and the second part of the second conductor piece are continuously integrally formed. Prepare the first conductor plate. Further, in the second conductor plate preparation step, when the first conductor plate is overlapped, the second conductor plate has no conductor portion formed in the first portion, the second portion, and the portion corresponding to the first connecting piece. Prepare. Further, in the superimposition step, the first conductor plate and the second conductor plate are overlapped so that their outer edges overlap each other. Then, in the punching step, when the side on which the first conductor plate is arranged is defined as the negative side and the side on which the second conductor plate is arranged is defined as the positive side in the thickness direction of the first conductor plate and the second conductor plate, The second mold is in contact with the first conductor piece from the positive side, with the first mold configured so as to be able to contact the first and second parts and not to contact the first connecting piece. The mold is brought into contact with the first connecting piece from the negative side, and the first connecting piece is punched out.

As shown in FIG. 1A, the module 10 according to the present embodiment includes a lead frame 1 and an electronic component 2 mounted on the lead frame 1. The electronic component 2 is, for example, a semiconductor chip on which an integrated circuit is formed. A plurality of electrodes (not shown) are exposed on the −Z direction side of the electronic component 2 at relatively narrow intervals. The electronic component 2 is fixed to the lead frame 1 in a state where each of the plurality of electrodes is in contact with the conductor portions 11, 12, 13, and 14 corresponding to them.

The lead frame 1 forms a circuit pattern electrically connected to the electronic component 2, and is formed by superimposing a plurality of conductor pieces. As shown in FIG. 1B, the lead frame 1 includes conductor portions 11, 12, 13, 14, 151, 152, and 153. The conductor portions 11, 12, 13, 14, 151, 152, and 153 are arranged apart from each other. The conductor portion 11 is formed by stacking four plate-shaped conductor pieces 111, 112, 113, and 114 in the thickness direction, that is, in the Z-axis direction. The conductor pieces 111, 112, 113, 114 are formed of a metal such as Cu and welded to each other. Here, the conductor piece 114 in the first stage from the −Z direction side of the conductor portion 11 has a portion 114a in which the conductor piece 113 in the second stage from the −Z direction side does not abut. Further, the portion 114a is a first portion that is located inside the notch portion 113b formed in the conductor piece 113 that is overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 113 in the second stage from the −Z direction side of the conductor portion 11 has a portion 113a in which the conductor piece 112 in the third stage from the −Z direction side does not abut. The portion 113a is located inside the notch 112b formed in the conductor piece 112 stacked on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 112 in the third stage from the −Z direction side of the conductor portion 11 has a portion 112a in which the conductor piece 111 in the fourth stage from the −Z direction side does not abut. The portion 112a is located inside the notch 111b formed in the conductor piece 111 overlapped on the + Z direction side and is exposed on the + Z direction side. That is, the conductor pieces 113 and 112 in the nth stage from the −Z direction side (n is an integer of 2 or more) are the portions 113a and 112a in which the conductor pieces 112 and 111 in the n + 1th stage from the −Z direction side do not abut, respectively. Has. Here, the notch 113b of the conductor piece 113 is arranged inside the notch 112b of the conductor piece 112 when viewed from the + Z direction side. Further, the notch 112b of the conductor piece 112 is arranged inside the notch 111b of the conductor piece 111 when viewed from the + Z direction side. As a result, a staircase portion 11s having a stepped cross section is formed in a part of the peripheral portion of the conductor portion 11. Here, the region inside the notch portion 111b in the conductor portion 11 corresponds to the first region composed of at least one of the conductor pieces 114, 113, 112. Further, the region outside the notch 111b in the conductor portion 11 corresponds to a second region thicker than the first region inside the notch 111b in which the four conductor pieces 114, 113, 112, 111 are overlapped. do.

The conductor portion 12 is formed by stacking four plate-shaped conductor pieces 121, 122, 123, and 124 in the Z-axis direction. The conductor pieces 121, 122, 123, 124 are also formed of a metal such as Cu and welded to each other. Here, the conductor piece 124 in the first stage from the −Z direction side of the conductor portion 12 has a portion 124a in which the conductor piece 123 in the second stage from the −Z direction side does not abut. The portion 124a is located inside the notch 123b formed in the conductor piece 123 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 123 in the second stage from the −Z direction side of the conductor portion 12 has a portion 123a in which the conductor piece 122 in the third stage from the −Z direction side does not abut. The portion 123a is located inside the notch 122b formed in the conductor piece 122 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 122 in the third stage from the −Z direction side of the conductor portion 12 has a portion 122a in which the conductor piece 121 in the fourth stage from the −Z direction side does not abut. The portion 122a is a second portion that is located inside the notch portion 121b formed in the conductor piece 121 that is overlapped on the + Z direction side and is exposed on the + Z direction side. That is, the conductor pieces 123 and 122 in the nth stage (n is an integer of 2 or more) from the −Z direction side are the portions 123a and the portions where the conductor pieces 122 and 121 in the n + 1th stage from the −Z direction side do not abut, respectively. It has 122a. Here, the notch 123b of the conductor piece 123 is arranged inside the notch 122b of the conductor piece 122 when viewed from the + Z direction side. Further, the notch portion 122b of the conductor piece 122 is arranged inside the notch portion 121b of the conductor piece 121 when viewed from the + Z direction side. As a result, a staircase portion 12s having a stepped cross section is formed in a part of the peripheral portion of the conductor portion 12. The cutouts 111b, 112b, 113b of the conductor portion 11 and the cutouts 121b, 122b, 123b of the conductor portion 12 are arranged so as to face each other. Then, as shown in FIGS. 2A and 2B, the staircase portion 11s formed on a part of the peripheral portion of the conductor portion 11 and the staircase portion 12s formed on a part of the peripheral portion of the conductor portion 12 are conductors. Is not formed, and is arranged so as to face each other via a separation region SN for separating the region where the conductor is formed. Here, the region inside the notch 121b in the conductor portion 12 corresponds to the first region composed of at least one of the conductor pieces 124, 123, 122. Further, the region outside the notch 121b in the conductor portion 12 corresponds to a second region thicker than the first region inside the notch 121b in which four conductor pieces 124, 123, 122, 121 are overlapped. do. Further, if the conductor portion 11 corresponds to the "first conductor portion", the conductor portion 12 corresponds to the "second conductor portion". In this case, the staircase portion 11s corresponds to the "first staircase portion", and the staircase portion 12s corresponds to the "second staircase portion". The staircase portions 11s and 12s include a step formed by the above-mentioned first region and the second region. The staircase portions 11s and 12s are arranged so as to face each other with the separation region SN interposed therebetween.

Returning to FIG. 1, the conductor portion 13 is a stack of four plate-shaped conductor pieces 131, 132, 133, and 134 in the Z-axis direction. The conductor pieces 131, 132, 133, and 134 are also formed of a metal such as Cu and welded to each other. Here, the conductor piece 134 in the first stage from the −Z direction side of the conductor portion 13 has a portion 134a in which the conductor piece 133 in the second stage from the −Z direction side does not abut. The portion 134a is located inside the notch 133b formed in the conductor piece 133 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 133 in the second stage from the −Z direction side of the conductor portion 13 has a portion 133a in which the conductor piece 132 in the third stage from the −Z direction side does not abut. The portion 133a is located inside the notch 132b formed in the conductor piece 132 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 132 in the third stage from the −Z direction side of the conductor portion 13 has a portion 132a in which the conductor piece 131 in the fourth stage from the −Z direction side does not abut. The portion 132a is located inside the notch 131b formed in the conductor piece 131 overlapped on the + Z direction side and is exposed on the + Z direction side. That is, the conductor pieces 133 and 132 in the nth stage from the −Z direction side (n is an integer of 2 or more) are the portions 133a and 132a in which the conductor pieces 132 and 131 in the n + 1th stage from the −Z direction side do not abut, respectively. Has. Here, the notch 133b of the conductor piece 133 is arranged inside the notch 132b of the conductor piece 132 when viewed from the + Z direction side. Further, the notch 132b of the conductor piece 132 is arranged inside the notch 131b of the conductor piece 131 when viewed from the + Z direction side. As a result, a staircase portion 13s having a stepped cross section is formed in a part of the peripheral portion of the conductor portion 13. The notches 121b, 122b, 123b of the conductor portion 12 and the notches 131b, 132b, 133b of the conductor portion 13 are arranged so as to face each other. The staircase portion 12s formed on a part of the peripheral portion of the conductor portion 12 and the staircase portion 13s formed on a part of the peripheral portion of the conductor portion 13 are regions where the conductor is not formed, and the conductor is formed. They are arranged so as to face each other via a separation region SN for separating the formed regions. The separation region SN and the notches 121b, 122b, 123b, 131b, 132b, 133b are supplemented. The cutouts 121b, 122b, 123b, 131b, 132b, 133b are the conductor pieces 121, 122, 123, 124, 131, 132 in one conductor piece 121, 122, 123, 124, 131, 132, 133, 134. It shows a groove in which a conductor is not formed when viewed in a plan view from the thickness direction of 133 and 134. The separation region SN is a laminated body of the conductor pieces 121, 122, 123, 124, 131, 132, 133, 134, and the conductor pieces 121, 122, 123, 124, 131, 132 when viewed in a plan view from the stacking direction. Notches 121b, 122b, 123b, 131b, 132b, 133b of all the conductor pieces 121, 122, 123, 124, 131, 132, 133, 134 constituting the laminated body of 133, 134 are commonly formed. As a result, it is a region where a conductor is not formed. In other words, the separation region SN is part of an aggregate of notches 121b, 122b, 123b, 131b, 132b, 133b. The separation region SN in FIG. 1B and the separation region SN in FIG. 2A are different regions depending on the presence or absence of the connecting piece 21. The separation region SN of FIG. 2A is a region that does not include the connecting piece 21. Then, as shown in FIG. 1B, in the state after the connecting piece 21 is cut off, the separation region SN becomes larger than that in FIG. 2A.

Here, the region inside the notch 131b in the conductor portion 13 corresponds to the first region composed of at least one of the conductor pieces 134, 133, and 132. Further, the region outside the notch 131b in the conductor portion 13 corresponds to a second region thicker than the first region inside the notch 131b in which four conductor pieces 134, 133, 132, 131 are overlapped. do. Further, if the conductor portion 12 corresponds to the "first conductor portion", the conductor portion 13 corresponds to the "second conductor portion". In this case, the staircase portion 12s corresponds to the "first staircase portion", and the staircase portion 13s corresponds to the "second staircase portion".

The conductor portion 14 is formed by stacking four plate-shaped conductor pieces 141, 142, 143, and 144 in the Z-axis direction. The conductor pieces 141, 142, 143, 144 are also formed of a metal such as Cu and welded to each other. Here, the conductor piece 144 in the first stage from the −Z direction side of the conductor portion 14 has a portion 144a in which the conductor piece 143 in the second stage from the −Z direction side does not abut. The portion 144a is located inside the notch 143b formed in the conductor piece 143 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 143 in the second stage from the −Z direction side of the conductor portion 14 has a portion 143a in which the conductor piece 142 in the third stage from the −Z direction side does not abut. The portion 143a is located inside the notch 142b formed in the conductor piece 142 stacked on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 142 in the third stage from the −Z direction side of the conductor portion 14 has a portion 142a in which the conductor piece 141 in the fourth stage from the −Z direction side does not abut. The portion 142a is located inside the notch 141b formed in the conductor pieces 141 stacked on the + Z direction side and is exposed on the + Z direction side. That is, the conductor pieces 143 and 142 in the nth stage from the −Z direction side (n is an integer of 2 or more) are the portions 143a and 142a where the conductor pieces 142 and 141 in the n + 1th stage from the −Z direction side do not abut, respectively. Has. Here, the notch 143b of the conductor piece 143 is arranged inside the notch 142b of the conductor piece 142 when viewed from the + Z direction side. Further, the notch 142b of the conductor piece 142 is arranged inside the notch 141b of the conductor piece 141 when viewed from the + Z direction side. As a result, a staircase portion 14s having a stepped cross section is formed in a part of the peripheral portion of the conductor portion 14. The notches 131b, 132b, 133b of the conductor portion 13 and the notches 141b, 142b, 143b of the conductor portion 14 are arranged so as to face each other. The staircase portion 13s formed on a part of the peripheral portion of the conductor portion 13 and the staircase portion 14s formed on a part of the peripheral portion of the conductor portion 14 are regions where the conductor is not formed, and the conductor is formed. They are arranged so as to face each other via a separation region SN for separating the formed regions. Here, the region inside the notch portion 141b in the conductor portion 14 corresponds to the first region composed of at least one of the conductor pieces 144, 143, and 142. Further, the region outside the notch portion 141b in the conductor portion 14 corresponds to a second region thicker than the first region inside the notch portion 141b in which four conductor pieces 144, 143, 142, 141 are overlapped. do. Further, if the conductor portion 13 corresponds to the "first conductor portion", the conductor portion 14 corresponds to the "second conductor portion". In this case, the staircase portion 13s corresponds to the "first staircase portion", and the staircase portion 14s corresponds to the "second staircase portion". The conductor portions 151, 152, and 153 are formed by stacking four rectangular plate-shaped conductor pieces 1501, 1502, 1503, and 1504 in the thickness direction, respectively. The conductor pieces 1501, 1502, 1503, 1504 are also formed of a metal such as Cu and welded to each other.

Next, the manufacturing method of the lead frame 1 according to the present embodiment will be described. First, a conductor plate preparation step for preparing the conductor plates 103 and 104 shown in FIGS. 3A and 3B and the conductor plates 101 and 102 shown in FIGS. 4A and 4B is performed. As shown in FIG. 3A, the conductor plate 104 is formed by continuously integrally forming conductor pieces 114, 124, 134, 144, 1504, connecting pieces 21, 22, 23, 24, and a rectangular frame-shaped frame piece 164. It is the first conductor plate made of. Inside the frame piece 164, conductor pieces 114, 124, 134, 144, 1504 and connecting pieces 21, 22, 23, 24 are arranged. The connecting piece 21 is a first connecting piece that connects the conductor piece 114, which is the first conductor piece, and the conductor piece 124, which is the second conductor piece. Further, the connecting piece 22 connects the conductor pieces 124 and 134 to each other, and the connecting pieces 23 and 24 connect the conductor pieces 134 and 144 to each other. Further, the conductor pieces 114, 124, 134, 144, and 1504 are arranged apart from each other. The frame piece 164 is connected to both ends of the conductor piece 114 in the longitudinal direction, both ends of the conductor piece 124 in the longitudinal direction, the end of the conductor piece 144 on the + Y direction side, and the end in the X-axis direction. Has been done. Further, one end of each of the plurality of conductor pieces 1504 in the longitudinal direction is connected to the frame piece 164. A part of the edge of the conductor piece 114 on the + Y direction side and a part of the edge of the conductor piece 124 on the −Y direction side are connected via the connecting piece 21. A part of the edge of the conductor piece 124 on the + Y direction side and a part of the edge of the conductor piece 134 on the −Y direction side are connected via the connecting piece 22. A part of each edge of the conductor piece 134 in the X-axis direction is connected to the conductor piece 144 via the connecting piece 23. Further, a part of the edge of the conductor piece 134 on the + Y direction side is connected to the conductor piece 144 via the connecting piece 24. As a result, the conductor piece 134 is supported by the conductor pieces 124, 144 connected to the frame piece 164 via the connecting pieces 22, 23, and 24. Here, the length of the connecting piece 21 in the direction from the portion 114a of the conductor piece 114 toward the portion 124a of the conductor piece 124 is longer than the thickness of the conductor plate 104. The lengths of the connecting pieces 22 and 23 are the same. That is, the length of the connecting pieces 21 and 22 perpendicular to the extending direction of the connecting pieces 21 and 22 and the thickness direction of the connecting pieces 21 and 22, that is, the length in the X-axis direction is larger than the thickness of the connecting pieces 21 and 22. long. Further, the length of the connecting piece 23 in the Y-axis direction is longer than the thickness of the connecting piece 23.

As shown in FIG. 3B, the conductor plate 103 is a third conductor plate in which no conductor portion is formed in the portions 112a and 122a of the conductor plate 104 and the portions corresponding to the connecting piece 21 when the conductor plate 104 is overlapped. be. The conductor plate 103 is formed by continuously integrally forming conductor pieces 113, 123, 133, 143, 1503, a rectangular frame-shaped frame piece 163, and connecting pieces 21, 22, 23, 24. The conductor piece 113 corresponds to the third portion of the conductor plate 103 facing the conductor piece 114 when the conductor plate 103 is overlapped with the conductor plate 104. When the three conductor plates 104, 103, and 102 are stacked as in the present embodiment, the third portion may be a part 113a of the conductor piece 113 instead of the entire conductor piece 113, or a part thereof. It may be a portion including 113a.

Further, the conductor piece 123 corresponds to the fourth part of the conductor plate 103 facing the conductor piece 123 when the conductor plate 103 is overlapped with the conductor plate 104. When three conductor plates 104, 103, and 102 are stacked as in the present embodiment, the fourth portion may be 123a, which is a part of the conductor piece 123, instead of the entire conductor piece 123. However, it may be a portion including 123a. The connecting piece 21 is a second connecting piece that connects a part 113a of the conductor piece 113 and a part 123a of the conductor piece 123. Inside the frame piece 163, conductor pieces 113, 123, 133, 143, 1503 and connecting pieces 21, 22, 23, 24 are arranged. The connecting piece 21 connects the conductor pieces 113 and 123 to each other, the connecting piece 22 connects the conductor pieces 123 and 133 to each other, and the connecting pieces 23 and 24 connect the conductor pieces 133 and 143 to each other. Further, the conductor pieces 113, 123, 133, 143, and 1503 are arranged apart from each other. Notches 113b, 123b, 133b, and 143b are formed in the conductor pieces 113, 123, 133, and 134, respectively. The frame piece 163 is connected to both ends of the conductor piece 113 in the longitudinal direction, both ends of the conductor piece 123 in the longitudinal direction, the end of the conductor piece 143 on the + Y direction side, and the end in the X-axis direction. Has been done. Further, one end of each of the plurality of conductor pieces 1503 in the longitudinal direction is connected to the frame piece 163. A part of the edge of the conductor piece 113 on the + Y direction side and a part of the edge of the conductor piece 123 on the −Y direction side are connected via the connecting piece 21. A part of the edge of the conductor piece 123 on the + Y direction side and a part of the edge of the conductor piece 133 on the −Y direction side are connected via the connecting piece 22. A part of each edge of the conductor piece 133 in the X-axis direction is connected to the conductor piece 143 via the connecting piece 23. Further, a part of the edge of the conductor piece 133 on the + Y direction side is connected to the conductor piece 143 via the connecting piece 24. As a result, the conductor piece 133 is supported by the conductor pieces 123, 143 connected to the frame piece 163 via the connecting pieces 22, 23, 24.

As shown in FIG. 4A, the conductor plate 102 is formed by continuously integrally forming conductor pieces 112, 122, 132, 142, 1502, a rectangular frame-shaped frame piece 162, and connecting pieces 21, 22, 23, 24. It was done. Inside the frame piece 162, conductor pieces 112, 122, 132, 142, 1502 and connecting pieces 21, 22, 23, 24 are arranged. The connecting piece 21 connects the conductor pieces 112 and 122 to each other, the connecting piece 22 connects the conductor pieces 122 and 132 to each other, and the connecting pieces 23 and 24 connect the conductor pieces 132 and 142 to each other. Further, the conductor pieces 112, 122, 132, 142, and 1502 are arranged apart from each other. Notches 112b, 122b, 132b, and 142b are formed in the conductor pieces 112, 122, 132, and 142, respectively. The frame piece 162 is connected to both ends of the conductor piece 112 in the longitudinal direction, both ends of the conductor piece 122 in the longitudinal direction, the end portion of the peripheral portion of the conductor piece 142 on the + Y direction side, and the end portion in the X-axis direction. Has been done. Further, one end of each of the plurality of conductor pieces 1502 in the longitudinal direction is connected to the frame piece 162. A part of the edge of the conductor piece 112 on the + Y direction side and a part of the edge of the conductor piece 122 on the −Y direction side are connected via the connecting piece 21. A part of the edge of the conductor piece 122 on the + Y direction side and a part of the edge of the conductor piece 132 on the −Y direction side are connected via the connecting piece 22. A part of each edge of the conductor piece 132 in the X-axis direction is connected to the conductor piece 142 via the connecting piece 23. Further, a part of the edge of the conductor piece 132 on the + Y direction side is connected to the conductor piece 142 via the connecting piece 24. As a result, the conductor piece 132 is supported by the conductor pieces 122 and 142 connected to the frame piece 162 via the connecting pieces 22, 23 and 24.

As shown in FIG. 4B, the conductor plate 101 is formed by continuously integrally forming conductor pieces 111, 121, 131, 141, 1501, a rectangular frame-shaped frame piece 161 and connecting pieces 21, 22, 23, 24. It was done. Inside the frame piece 161 are conductor pieces 111, 121, 131, 141, 1501 and connecting pieces 21, 22, 23, 24. The connecting piece 21 connects the conductor pieces 111 and 121 to each other, the connecting piece 22 connects the conductor pieces 121 and 131 to each other, and the connecting pieces 23 and 24 connect the conductor pieces 131 and 141 to each other. Further, the conductor pieces 111, 121, 131, 141, and 1501 are arranged apart from each other. Notches 111b, 121b, 131b, 141b are formed in the conductor pieces 111, 121, 131, and 141, respectively. The frame piece 161 includes both ends of the conductor piece 111 in the X-axis direction, both ends of the conductor piece 121 in the X-axis direction, an end portion of the peripheral portion of the conductor piece 141 on the + Y direction side, and an end portion in the X-axis direction. It is connected to the. Further, one end of each of the plurality of conductor pieces 1501 in the longitudinal direction is connected to the frame piece 161. A part of the edge of the conductor piece 111 on the + Y direction side and a part of the edge of the conductor piece 121 on the −Y direction side are connected via the connecting piece 21. A part of the edge of the conductor piece 121 on the + Y direction side and a part of the edge of the conductor piece 131 on the −Y direction side are connected via the connecting piece 22. A part of each edge of the conductor piece 131 in the X-axis direction is connected to the conductor piece 141 via the connecting piece 23. Further, a part of the edge of the conductor piece 131 on the + Y direction side is connected to the conductor piece 141 via the connecting piece 24. As a result, the conductor piece 131 is supported by the conductor pieces 121, 141 connected to the frame piece 161 via the connecting pieces 22, 23, 24.

Here, the shapes of the portions excluding the portions 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, and 144a of the conductor plates 102, 103, and 104, respectively, are the portions 122a of the other conductor plates 102, 103, 104. It has the same shape as the portion except 123a, 124a, 132a, 133a, 134a, 142a, 143a, and 144a. Here, the portions 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, 144a are notched portions 111b when the four conductor plates 101, 102, 103, 104 are laminated, as shown in FIG. 121b, 131b, 141b correspond to the portion included in the projection region in the −Z direction. Specifically, the connecting pieces 21, 22, 23, the portions 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, 144a, and the notches 111b, 121b, 131b, 141b.

Next, a superposition step is performed in which the four conductor plates 104, 103, 102, and 101 are overlapped so that their outer edges overlap. More specifically, the portions corresponding to the portions 112a, 113a, 114a, 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, 144a and the connecting piece 21 of the four conductor plates 104, 103, 102, 101. Overlap so that the outer edges of the parts to be removed overlap. Here, for example, the conductor plates 104, 103, 102, 101 are laminated in the thickness direction so as to be in the order of the conductor plates 104, 103, 102, 101 from the −Z direction side. Further, the conductor pieces 114, 124, 134, 144 of the first-stage conductor plate 104 from the −Z direction side are not in contact with the second-stage conductor plate 103 from the −Z direction side, respectively, 114a, 124a, 134a. , 144a and the portions 114e, 124e, 134e, 144e to which the conductor plate 103 of the second stage from the + Z direction side abuts, and the connecting pieces 21, 22, 23, 24 of the conductor plate 104, respectively. Laminate so as not to come into contact with other conductor plates 103, 102, 101.

Further, the conductor pieces 113, 123, 133, and 143 of the conductor plate 104 in the second stage from the −Z direction side are the portions 113a, 123a, 133a that the conductor plate 102 in the third stage from the −Z direction side does not abut, respectively. , 143a and portions 113e, 123e, 133e, 143e that the third-stage conductor plate 102 from the + Z direction abuts with, and the connecting pieces 21, 22, 23, 24 of the conductor plate 103, respectively. Laminate so as not to come into contact with other conductor plates 104, 102, 101. Further, the conductor pieces 112, 122, 132, 142 of the conductor plate 102 in the third stage from the −Z direction side are not in contact with the conductor plate 101 in the fourth stage from the −Z direction side, respectively, parts 112a, 122a, 132a. , 142a and portions 112e, 122e, 132e, 142e with which the conductor plate 101 of the fourth stage from the + Z direction side abuts, and the connecting pieces 21, 22, 23, 24 of the conductor plate 102, respectively. Laminate so as not to come into contact with other conductor plates 104, 103, 101. That is, in this superposition step, the conductor pieces of the conductor plates 102 and 103 in the nth stage (n is an integer of 2 or more) from the −Z direction side are the conductor plates 103 in the n + 1th stage from the −Z direction side, respectively. It is laminated so as to have a portion where the 104 does not abut and a portion where the n + 1th stage conductor plate abuts from the −Z direction side. Then, in a state where the conductor plates 104, 103, 102, 101 are laminated, the conductor plates 104, 103, 102, 101 are heated while applying pressure in the stacking direction of the conductor plates 104, 103, 102, 101. Weld together. As a result, the laminated body 100 as shown in FIG. 5 is formed.

Here, the portion 114a of the conductor piece 114 of the conductor plate 104 is located inside the notch 113b formed in the conductor piece 113 of the conductor plate 103 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 124a of the conductor piece 124 of the conductor plate 104 is located inside the notch 123b formed in the conductor piece 123 of the conductor plate 103 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 134a of the conductor piece 134 of the conductor plate 104 is located inside the notch portion 133b formed in the conductor piece 133 of the conductor plate 103 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 144a of the conductor piece 144 of the conductor plate 104 is located inside the notch portion 143b formed in the conductor piece 143 of the conductor plate 103 overlapped on the + Z direction side and is exposed on the + Z direction side.

Further, the portion 113a of the conductor piece 113 of the conductor plate 103 is located inside the notch portion 112b formed in the conductor piece 112 of the conductor plate 102 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 123a of the conductor piece 123 of the conductor plate 103 is located inside the notch portion 122b formed in the conductor piece 122 of the conductor plate 102 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 133a of the conductor piece 133 of the conductor plate 103 is located inside the notch 132b formed in the conductor piece 132 of the conductor plate 102 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 143a of the conductor piece 143 of the conductor plate 103 is located inside the notch portion 142b formed in the conductor piece 142 of the conductor plate 102 overlapped on the + Z direction side and is exposed on the + Z direction side.

Further, the portion 112a of the conductor piece 112 of the conductor plate 102 is located inside the notch portion 111b formed in the conductor piece 111 of the conductor plate 101 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 122a of the conductor piece 122 of the conductor plate 102 is located inside the notch portion 121b formed in the conductor piece 121 of the conductor plate 101 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 132a of the conductor piece 132 of the conductor plate 102 is located inside the notch 131b formed in the conductor piece 131 of the conductor plate 101 overlapped on the + Z direction side and is exposed on the + Z direction side. Further, the portion 142a of the conductor piece 142 of the conductor plate 102 is located inside the notch portion 141b formed in the conductor piece 141 of the conductor plate 101 overlapped on the + Z direction side and is exposed on the + Z direction side.

Here, in a part of the portion corresponding to the conductor portion 11 of the laminated body 100, the staircase portion 11s in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 112a, 113a, 114a are arranged in a staircase pattern is formed. It is formed. Further, in a part of the portion corresponding to the conductor portion 12 of the laminated body 100, a staircase portion 12s in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 122a, 123a, 124a are arranged in a staircase pattern is formed. Has been done. Further, a staircase portion 13s in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 132a, 133a, 134a are arranged in a staircase pattern is formed in a part of the portion corresponding to the conductor portion 13 of the laminated body 100. Has been done. Further, in a part of the portion corresponding to the conductor portion 13 of the laminated body 100, a staircase portion 14s in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 142a, 143a, 144a are arranged in a staircase pattern is formed. Has been done.

After that, the laminated body 100 is punched out by punching out a plurality of connecting pieces 21, 22, and 23. In the punching step, for example, as shown in FIGS. 6A and 6B, the side where the conductor plate 104 is arranged with respect to the conductor plate 103 in the thickness direction of each of the conductor plates 104, 103, 102, 101, that is, the side in the −Z direction. Is defined as the negative side, that is, the side on which the conductor plate 103 is arranged with respect to the conductor plate 104, that is, the + Z direction side is defined as the positive side. The second mold P1 is brought into contact with the connecting piece 21 from the negative side, that is, the −Z direction side, and the connecting piece 21 is punched out. Here, the first mold D1 is configured to be able to come into contact with the portions 112a and 122a of the conductor plate 104 and the conductor pieces 113 and 123 of the conductor plate 103 and not to come into contact with the connecting piece 21. There is. That is, in the punching step, the second die (punch) P1 is placed in the second direction opposite to the + Z direction in a state where the laminated body 100 is brought into contact with the first die (die) D1 from the + Z direction side. That is, the connecting piece 21 is punched out in the + Z direction by pressing it from the −Z direction side as shown by the arrow AR1. Here, as shown in FIGS. 7A and 7B, the first mold D1 has a plate-like shape and a base D11 having an opening D15 through which the second mold D2 can be inserted at the center thereof. The base D11 includes support portions D121, D122, D131, D132, and D141 erected on one side in the thickness direction of the base D11. The first mold D1 is made of a material that is harder than the metal forming the conductor plates 101, 102, 103, 104. The support portions D121, D122, D131, D132, and D141 can be fitted inside the notches 111b, 112b, 113b, 121b, 122b, and 123b of the conductor plates 101, 102, and 103, respectively. The second mold P1 is formed in a plate shape from a material harder than the metal forming the conductor plates 101, 102, 103, 104. Then, in the punching step, the tip surfaces D121a, D122a, D131a, D132a, and D141a of the support portions D121, D122, D131, D132, and D141 are formed from the + Z direction side, respectively, of the conductor plates 102a, 103, and 104, respectively. The second mold P1 is pressed against the connecting piece 21 from the −Z direction side in a state of being in contact with the 114a, 122a, 123a, and 124a. At this time, one side of the base D11 on which the support portions D121, D122, D131, D132, and D141 are erected comes into contact with the conductor plate 101.

That is, in this punching step, for example, the first mold is individually formed for the conductor piece 114 portion 114a in the first-stage conductor plate 104 and the conductor piece 124 portion 124a in the first-stage conductor plate 104. The second mold D2 is pressed from the −Z direction side to the + Z direction side of the connecting piece 21 of the conductor plate 104 in a state where the D1 is brought into contact with the connecting piece 21 and the first mold D1 is not brought into contact with the connecting piece 21. Punches out the connecting piece 21 of the conductor plate 104. Similarly, the portions 113a and 112a of the conductor pieces 113 and 112 in the second and third stage conductor plates 103 and 102 and the portions of the conductor pieces 123 and 124 in the second and third stage conductor plates 103 and 102. -Z of the connecting pieces 21 of the conductor plates 103 and 102 in a state where the first mold D1 is individually brought into contact with each of 123a and 124a and the first mold D1 is not brought into contact with the connecting piece 21. By pressing the second die D2 from the direction side to the + Z direction side, the connecting piece 21 of the conductor plates 103 and 102 is punched out.

In the step of punching the connecting piece 22, a first die having a support portion that can be fitted inside the cutout portions 121b, 122b, 123b, 131b, 132b, 133b of the conductor plates 101, 102, 103 is used. Further, in the step of punching the connecting piece 23, a first die having a support portion that can be fitted inside the cutout portions 131b, 132b, 133b, 141b, 142b, 143b of the conductor plates 101, 102, 103 is used.

As described above, according to the method for manufacturing a lead frame according to the present embodiment, the connecting pieces of the conductor plates 102, 103, 104 are connected in a state where the four conductor plates 101, 102, 103, 104 are laminated. The portions 112a, 113a, 114a, 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, 144a adjacent to 21, 22, and 23 are overlapped on the other conductor plates 101, 102, 103 in the + Z direction. It is arranged inside the formed notches 111b, 112b, 113b, 121b, 122b, 123b, 131b, 132b, 133b, 141b, 142b, 143b and is exposed in the + Z direction. Then, in the punching step, the support portion of the first die is moved from the + Z direction side to each of the conductor plates 102a, 113a, 114a, 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, respectively. It is brought into contact with 144a. After that, the connecting pieces 21, 22, and 23 are punched out in the + Z direction by pressing the second die from the −Z direction side. As a result, in the punching process, the connecting pieces 21, 22, and 23 are each connected to the portions 112a, 113a, 114a, 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, respectively, which are adjacent to the connecting pieces 21, 22, and 23. 144a can be punched in a state of being supported by the first die D1. Therefore, the portions 112a, 113a, 114a, 122a, 123a of the conductor pieces 112, 113, 114, 122, 123, 124, 132, 133, 134, 142, 143, 144 when punching the connecting pieces 21, 22, 23, Unintended deformation of 124a, 132a, 133a, 134a, 142a, 143a, and 144a can be suppressed.

By the way, as a method of cutting the connecting pieces 21, 22 and 23, it is conceivable to trim the connecting pieces 21, 22 and 23 one by one using a laser cutting machine. However, in this case, it takes a relatively long time to remove all the connecting pieces 21, 22, and 23. On the other hand, according to the lead frame manufacturing method according to the present embodiment, all the connecting pieces 21, 22, and 23 can be punched out at once by using a press processing machine, so that the lead frame can be punched by that amount. There is an advantage that the time required for manufacturing can be shortened.

Further, in a part of the portion corresponding to the conductor portion 11 of the laminated body 100 according to the present embodiment, the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 112a, 113a, 114a are arranged in a staircase pattern. The shape is formed. Further, in a part of the portion corresponding to the conductor portion 12 of the laminated body 100, a shape is formed in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 122a, 123a, 124a are arranged in a staircase pattern. There is. Further, in a part of the portion corresponding to the conductor portion 13 of the laminated body 100, a shape is formed in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 132a, 133a, 134a are arranged in a staircase pattern. There is. Further, in a part of the portion corresponding to the conductor portion 13 of the laminated body 100, a shape is formed in which the surfaces of the conductor plates 102, 103, 104 on the + Z direction side of the portions 142a, 143a, 144a are arranged in a staircase pattern. There is. As a result, the support portions D121, D122, D131, D132, and D141 of the first mold D1 can be formed in a stepped shape, so that there is an advantage that the production of the first mold becomes relatively easy.

Further, the lengths of the connecting pieces 21 and 22 according to the present embodiment in the Y-axis direction are longer than the thickness of the connecting pieces 23. Further, the plurality of conductor plates 101, 102, 103, 104 are welded to each other. As a result, the connecting pieces 21, 22, and 23 can be smoothly punched out, so that the conductor pieces 112, 113, 114, 122, 123, 124, 132, 133, 134, 142, 143, and 144 can be punched out smoothly. Unintended deformation of 114a, 122a, 123a, 124a, 132a, 133a, 134a, 142a, 143a, and 144a can be suppressed.

Although the embodiments of the present invention have been described above, the present invention is not limited to the configuration of the above-described embodiments. For example, as shown in FIG. 8A, the connecting pieces 21, 22, and 23 may be punched out from the laminated body 2100 formed by laminating the three conductor plates 102, 103, and 104 to produce a lead frame. In this case, the first mold D2 includes, for example, a base D21 and support portions D131, D132, and D141 erected on one surface side in the thickness direction of the base D21, and the support portions D131, D132, and D141 are provided. However, those that can be fitted inside the notches 112b, 113b, 122b, and 123b of the conductor plates 102 and 103, respectively, may be adopted. Alternatively, as shown in FIG. 8B, for example, the connecting pieces 21, 22 and 23 may be punched out from the laminated body 3100 formed by laminating the two conductor plates 103 and 104 to produce a lead frame. In this case, the first mold D3 includes, for example, a base D31 and a support portion D141 erected on one side in the thickness direction of the base D31, and the support portions D141 are the conductor plates 102, respectively. Anything that can be fitted inside the notches 113b and 123b of 103 may be adopted. The laminated body is not limited to a laminate of 2 to 4 conductor plates, and may be a laminate of 5 or more conductor plates.

In the embodiment, an example in which the module 10 includes a lead frame 1 and one electronic component 2 mounted on the lead frame 1 has been described. However, the module is not limited to this, and for example, as shown in FIGS. 9A and 9B, the lead frame 4001 and the semiconductor integrated circuit component 4003 and the inductor 4004 arranged on the lead frame 4001 are included. It may be the power supply device 4010 provided. In addition, in FIG. 9A and FIG. 9B, the same reference numerals as those in FIGS. 1A and 1B are attached to the same configurations as those in the embodiment.

The lead frame 4001 includes conductor portions 11, 12, 13, 4014, 151, 152, and 153. The conductor portion 4014 is formed by stacking four plate-shaped conductor pieces 4111, 4112, 4113, and 4114 in the thickness direction. The conductor pieces 4111, 4112, 4113, and 4114 are formed of a metal such as Cu and welded to each other. Here, the conductor piece 4114 in the first stage from the −Z direction side of the conductor portion 11 has a portion where the conductor piece 4113 in the second stage from the −Z direction side does not abut. Further, this portion is located inside a notch (not shown) formed in the conductor piece 4113 stacked on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 4113 in the second stage from the −Z direction side of the conductor portion 4014 has a portion where the conductor piece 4112 in the third stage from the −Z direction side does not abut. This portion is located inside a notch (not shown) formed in the conductor piece 4112 stacked on the + Z direction side and is exposed on the + Z direction side. Further, the conductor piece 4112 in the third stage from the −Z direction side of the conductor portion 4014 has a portion where the conductor piece 4111 in the fourth stage from the −Z direction side does not abut. This portion is located inside a notch (not shown) formed in the conductor piece 4111 stacked on the + Z direction side and is exposed on the + Z direction side. As a result, a staircase portion (not shown) having a stepped cross section is formed in a part of the peripheral portion of the conductor portion 4014.

Further, the conductor portion 4014 is bent in a C shape that is continuous with each of the pair of long reed portions 4014a extending in the Y-axis direction and the pair of lead portions 4014a and partially functions as a coil portion of the inductor 4004. It has a coil portion 4014b in which the bent portion 4014c is formed, and a connecting portion 4014d that connects the ends of the coil portion 4014b on the side opposite to the lead portion 4014a side.

According to this configuration, a part of the lead frame 4001 functions as a coil portion of the inductor 4004, and the length of the lead portion 4014a connecting the semiconductor integrated circuit component 4003 and the inductor 4004 can be shortened. Therefore, the power conversion efficiency of the power supply device 4010 can be increased.

Note that the lead frame 4001 according to this modification is not limited to the configuration described with reference to FIGS. 9A and 9B. For example, as in the lead frame 5001 shown in FIG. 10, the conductor portion 5014 is continuous with each of the pair of long lead portions 5014a extending in the Y-axis direction and the pair of lead portions 5014a, and a coil of the inductor 4004 is partially formed. It may have a coil portion 5014b in which a hook-shaped bent portion 5014c that functions as a portion is formed. In FIG. 10, the same reference numerals as those in FIG. 1B are attached to the same configurations as those in the embodiment. Further, the conductor portion 5014 is formed by stacking four plate-shaped conductor pieces 5141, 5142, 5143, and 5144 in the thickness direction. The conductor pieces 5142, 5143, and 5144 are formed with notches (not shown) in which a part of the inner region overlaps when viewed from the Z-axis direction, and these are formed in the peripheral portion of the conductor portion 5014. A staircase portion (not shown) having a stepped cross section is formed in a part corresponding to the notch portion.

Alternatively, as in the lead frame 6001 shown in FIG. 11, the conductor portion 6014 is continuous with each of the pair of long lead portions 6014a extending in the Y-axis direction and the pair of lead portions 6014a, and partly in the + Z direction. It has a coil portion 6014b in which a bent portion 6014c bent in a C shape in a convex shape is formed, and a connecting portion 6014d that connects the ends of the coil portion 6014b on the side opposite to the lead portion 6014a side. There may be. In FIG. 11, the same reference numerals as those in FIG. 1B are attached to the same configurations as those in the embodiment. Here, the coil portion 6014b is further bent in a C shape so as to be convex in the + Y direction when viewed from the Z-axis direction, and both ends in the stretching direction are the top portions of the bent portion 6014c on the + Z direction side, respectively. It has a bent portion 6014e continuous with. Here, the bent portions 6014 and 6014e function as coil portions of the inductor 4004. The conductor portion 6014 is formed by stacking four plate-shaped conductor pieces 6141, 6142, 6143, and 6144 in the thickness direction. The conductor pieces 6142, 6143, and 6144 are formed with notches (not shown) in which a part of the inner region overlaps when viewed from the Z-axis direction, and these are formed in the peripheral portion of the conductor portion 6014. A staircase portion (not shown) having a stepped cross section is formed in a part corresponding to the notch portion.

Further, as in the lead frame 7001 shown in FIG. 12, the conductor portion 7014 is continuous with each of the pair of long lead portions 7014a extending in the Y-axis direction and the pair of lead portions 7014a, and partly in the + Z direction. A coil portion 7014b in which a bent portion 7014c bent in a C shape in a convex shape is formed, and a connecting portion 7014d connecting the ends of the coil portion 7014b on the side opposite to the lead portion 7014a side, and two extensions. It may have a protrusion 7014e and a protrusion 7014e. In FIG. 12, the same reference numerals as those in FIG. 1B are attached to the same configurations as those in the embodiment. Here, the two bent portions 7014c have a curved shape that is convex in a direction approaching each other when viewed from the Z-axis direction. The two extending portions 7014e extend in a direction away from each other from the apex on the + Z direction side of each of the two bending portions 6014c. Here, the bent portion 7014c functions as a coil portion of the inductor 4004. The conductor portion 7014 is formed by stacking four plate-shaped conductor pieces 7141, 7142, 7143, and 7144 in the thickness direction. The conductor pieces 7142, 7143, and 7144 are formed with notches (not shown) in which a part of the inner region overlaps when viewed from the Z-axis direction, and these are formed in the peripheral portion of the conductor portion 7014. A staircase portion (not shown) having a stepped cross section is formed in a part corresponding to the notch portion.

By setting the shape of the conductor portions 5014, 6014, 7014 to a shape different from the shape of the conductor portion 4014 shown in FIGS. 9A and 9B as in the lead frames 5001, 6001, 7001 shown in FIGS. 10 to 12, the inductor is formed. The inductance of 4004 can be changed.

The present invention enables various embodiments and modifications without departing from the broad spirit and scope of the present invention. Moreover, the above-described embodiment is for explaining the present invention, and does not limit the scope of the present invention. That is, the scope of the present invention is indicated not by the embodiment but by the claims. And various modifications made within the scope of the claims and within the equivalent meaning of the invention are considered to be within the scope of the invention.

This application is based on Japanese Patent Application No. 2020-069426 filed on April 7, 2020. The specification, claims and the entire drawings of Japanese Patent Application No. 2020-069426 are incorporated herein by reference.

The present invention is suitable for a lead frame on which an electronic component through which a relatively large current flows is mounted.

1,4001,5001,6001,7001: Lead frame, 2: Electronic component, 10: Module, 11,12,13,14,151,152,153,401,504,5014,6014,7014: Conductor part, 11s, 12s , 13s, 14s: Stairs, 21,22,23,24: Connecting pieces, 100,2100,3100: Laminates, 101,102,103,104: Conductor plates, 111,112,113,114,121,122 , 123, 124, 131, 132, 133, 134, 141, 142, 143, 144, 1501, 1502, 1503, 1504, 4141, 4142, 4143, 4144, 5141, 5142, 5143, 5144, 6141, 6142, 6143. , 6144,7141,7142,7143,7144: Conductor pieces, 111b, 112b, 113b, 121b, 122b, 123b, 131b, 132b, 133b, 141b, 142b, 143b: Notches, 112a, 113a, 114a, 122a, 123a , 124a, 132a, 133a, 134a, 142a, 143a, 144a, 112e, 113e, 114e, 122e, 123e, 124e, 132e, 133e, 134e, 142e, 143e, 144e: Part, 161, 162, 163, 164: Frame Piece, 4003: Semiconductor integrated circuit component, 4004: Inductor, 4010: Power supply, 4014a, 5014a, 6014a, 7014a: Lead part, 4014b, 5014b, 6014b, 7014b: Coil part, 4014c, 5014c, 6014c, 7014c: Bending part , 4014d, 6014d, 7014d: Connecting part, 7014e: Extension part, D1, D2, D3: First mold, D11, D21, D31: Base, D121, D122, D131, D132, D141: Support part, D121a, D122a, D131a, D132a, D141a: tip surface, SN: separation region

Claims (6)

1. It is a manufacturing method of a lead frame formed by superimposing a plurality of conductor plates forming a circuit pattern.
   A first conductor piece, a second conductor piece, and a first connecting piece connecting the first part of the first conductor piece and the second part of the second conductor piece are continuously and integrally formed. 1 The first conductor plate preparation process to prepare the conductor plate and
   Preparation of a second conductor plate that prepares a second conductor plate in which no conductor portion is formed in the first portion, the second portion, and the portion corresponding to the first connecting piece when superposed on the first conductor plate. Process and
   The first conductor plate and the second conductor plate are the outer edge of the portion of the first conductor plate excluding the first portion, the second portion, and the portion corresponding to the first connecting piece, and the second conductor plate. Overlapping process and overlapping so that the outer edges of the
   A first die for punching the first connecting piece from the first conductor plate so as to be able to abut the first portion and the second portion and not to abut the first connecting piece. Using the first mold configured in the above and the second mold arranged adjacent to the first mold when viewed from the thickness direction of the first conductor plate, the first conductor plate and the first conductor plate When the side on which the first conductor plate is arranged is defined as the negative side and the side on which the second conductor plate is arranged is defined as the positive side in the thickness direction of the second conductor plate, the first mold is referred to as the first mold. A punching step of bringing the second mold into contact with the first connecting piece from the negative side in a state of being in contact with the first conductor piece from the positive side and punching out the first connecting piece is included. ,
   Lead frame manufacturing method.
2. When the second conductor plate is overlapped with the first conductor plate, the second conductor plate has a third portion facing the first conductor piece, a fourth portion facing the second conductor piece, and the third portion. The second connecting piece that connects the fourth portion is formed continuously and integrally.
   In the punching step, the first die configured to be in contact with the third portion and the fourth portion and not to be in contact with the first connecting piece and the second connecting piece. The second mold is brought into contact with the first connecting piece and the second connecting piece from the negative side in a state where the first conductor piece, the third part, and the fourth part are brought into contact with each other from the positive side. Then, the first connecting piece and the second connecting piece are punched out.
   The method for manufacturing a lead frame according to claim 1.
3. When overlapped with the second conductor plate, the conductor portion is not formed in a part of the third part, a part of the fourth part, and a part corresponding to the second connecting piece, and the other part of the third part is not formed. Further having a third conductor plate preparation step of preparing a third conductor plate in which a conductor is formed in a portion of the above and a portion corresponding to the other part of the fourth portion.
   A part of the third part and a part of the fourth part are connected by the second connecting piece.
   A first die for punching the first connecting piece and the second connecting piece from the first conductor plate and the second conductor plate in the punching step, and a part of the third part and the fourth. A first mold configured to be in contact with a part of the portion and not to be in contact with the other part of the third portion and the other part of the fourth portion, and the first mold. Using a second mold arranged adjacent to the first mold when viewed from the thickness direction of the conductor plate, the first mold is mounted on the first conductor piece and the first mold from the positive side. The second mold is brought into contact with the first connecting piece and the second connecting piece from the negative side in a state where a part of the three parts and a part of the fourth part are brought into contact with each other. Punching out the first connecting piece and the second connecting piece,
   The method for manufacturing a lead frame according to claim 2.
4. The length of the first connecting piece in the direction from the first portion to the second portion is longer than the thickness of the first conductor plate.
   The method for manufacturing a lead frame according to any one of claims 1 to 3.
5. A lead frame formed by superimposing a plurality of conductor pieces forming a circuit pattern.
   A first region composed of at least one piece of conductor and
   A second region in which a plurality of conductor pieces are superposed and is configured to be thicker than the first region and adjacent to the first region is provided.
   It has a first staircase portion and a second staircase portion including a step formed by the first region and the second region.
   The first staircase portion and the second staircase portion are arranged so as to face each other with a region in which a conductor is not formed.
   Lead frame.
6. The lead frame according to claim 5 and
   An electronic component disposed on the lead frame.
   Power supply.

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