JP6010511B2 - 研磨パッドの表面粗さ測定方法 - Google Patents

研磨パッドの表面粗さ測定方法 Download PDF

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Publication number
JP6010511B2
JP6010511B2 JP2013172218A JP2013172218A JP6010511B2 JP 6010511 B2 JP6010511 B2 JP 6010511B2 JP 2013172218 A JP2013172218 A JP 2013172218A JP 2013172218 A JP2013172218 A JP 2013172218A JP 6010511 B2 JP6010511 B2 JP 6010511B2
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Japan
Prior art keywords
polishing pad
surface roughness
polishing
height
roughness
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JP2013172218A
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English (en)
Japanese (ja)
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JP2015041700A5 (https=
JP2015041700A (ja
Inventor
松尾　尚典
尚典 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2013172218A priority Critical patent/JP6010511B2/ja
Priority to US14/463,214 priority patent/US9393670B2/en
Priority to KR1020140107747A priority patent/KR101680938B1/ko
Priority to CN201410414805.0A priority patent/CN104422408B/zh
Priority to TW103128748A priority patent/TWI573659B/zh
Publication of JP2015041700A publication Critical patent/JP2015041700A/ja
Publication of JP2015041700A5 publication Critical patent/JP2015041700A5/ja
Application granted granted Critical
Publication of JP6010511B2 publication Critical patent/JP6010511B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2013172218A 2013-08-22 2013-08-22 研磨パッドの表面粗さ測定方法 Active JP6010511B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013172218A JP6010511B2 (ja) 2013-08-22 2013-08-22 研磨パッドの表面粗さ測定方法
US14/463,214 US9393670B2 (en) 2013-08-22 2014-08-19 Measuring method of surface roughness of polishing pad
KR1020140107747A KR101680938B1 (ko) 2013-08-22 2014-08-19 연마 패드의 표면 거칠기 측정 방법
CN201410414805.0A CN104422408B (zh) 2013-08-22 2014-08-21 研磨垫的表面粗糙度测定方法和测定装置，及cmp方法
TW103128748A TWI573659B (zh) 2013-08-22 2014-08-21 研磨墊之表面粗糙度測定方法、cmp方法、研磨墊之表面粗糙度測定裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013172218A JP6010511B2 (ja) 2013-08-22 2013-08-22 研磨パッドの表面粗さ測定方法

Publications (3)

Publication Number Publication Date
JP2015041700A JP2015041700A (ja) 2015-03-02
JP2015041700A5 JP2015041700A5 (https=) 2016-09-01
JP6010511B2 true JP6010511B2 (ja) 2016-10-19

Family

ID=52480785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013172218A Active JP6010511B2 (ja) 2013-08-22 2013-08-22 研磨パッドの表面粗さ測定方法

Country Status (5)

Country Link
US (1) US9393670B2 (https=)
JP (1) JP6010511B2 (https=)
KR (1) KR101680938B1 (https=)
CN (1) CN104422408B (https=)
TW (1) TWI573659B (https=)

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US9685342B2 (en) * 2014-12-11 2017-06-20 GlobalFoundries, Inc. Wafer processing apparatuses and methods of operating the same
JP6809779B2 (ja) * 2015-08-25 2021-01-06 株式会社フジミインコーポレーテッド 研磨パッド、研磨パッドのコンディショニング方法、パッドコンディショニング剤、それらの利用
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
KR102683416B1 (ko) * 2017-02-15 2024-07-23 삼성전자주식회사 화학 기계적 연마 장치
US10675732B2 (en) 2017-04-18 2020-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for CMP pad conditioning
CN107292051A (zh) * 2017-07-07 2017-10-24 湘潭大学 一种硬质合金刀片化学机械抛光表面粗糙度的预测方法
KR102570853B1 (ko) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
JP6948878B2 (ja) 2017-08-22 2021-10-13 ラピスセミコンダクタ株式会社 半導体製造装置及び半導体基板の研磨方法
CN109702650A (zh) * 2017-10-26 2019-05-03 长鑫存储技术有限公司 研磨垫修整方法、化学机械研磨方法及装置
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
US10926523B2 (en) * 2018-06-19 2021-02-23 Sensel, Inc. Performance enhancement of sensors through surface processing
US11359906B2 (en) 2020-05-29 2022-06-14 Ta Liang Technology Co., Ltd. Method, system and apparatus for uniformed surface measurement
US11759909B2 (en) * 2020-06-19 2023-09-19 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US20230390882A1 (en) * 2022-06-06 2023-12-07 Taiwan Semiconductor Manufacturing Company, Ltd. System, control method and apparatus for chemical mechanical polishing
US12519020B2 (en) * 2022-06-17 2026-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN115388817B (zh) * 2022-10-27 2023-03-24 山东微晶自动化有限公司 基于图像处理分析实现铸造件打磨质量检测的方法
CN115890473A (zh) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 抛光设备及抛光垫检测方法
CN116237845B (zh) * 2023-03-17 2026-04-17 山西农业大学 一种基于图像分析的树木年轮辅助磨削设备
CN116372781B (zh) * 2023-04-20 2023-11-07 山东欣立得光电科技有限公司 一种led屏幕衬底自动化清洗抛光系统
JP2024178702A (ja) * 2023-06-13 2024-12-25 株式会社Sumco 研磨パッドのドレッシング条件設定方法、ウェーハの片面研磨方法、ウェーハの製造方法、研磨パッドのドレッシング条件設定装置およびウェーハの片面研磨装置
CN120326444B (zh) * 2025-06-20 2025-08-19 嘉兴翼波精密制造有限公司 基于视觉识别的精密制造抛光方法

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JPH1086056A (ja) * 1996-09-11 1998-04-07 Speedfam Co Ltd 研磨パッドの管理方法及び装置
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JP2005347568A (ja) * 2004-06-03 2005-12-15 Ebara Corp 基板研磨方法及び基板研磨装置
TWI290504B (en) * 2003-07-17 2007-12-01 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method
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JP2005333121A (ja) 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
KR100640141B1 (ko) 2004-04-21 2006-10-31 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법
JP4756583B2 (ja) * 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
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Also Published As

Publication number Publication date
TWI573659B (zh) 2017-03-11
KR101680938B1 (ko) 2016-11-29
US20150056891A1 (en) 2015-02-26
US9393670B2 (en) 2016-07-19
CN104422408B (zh) 2018-05-18
TW201515769A (zh) 2015-05-01
CN104422408A (zh) 2015-03-18
JP2015041700A (ja) 2015-03-02
KR20150022688A (ko) 2015-03-04

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