JP6010423B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package and an electronic apparatus that store electronic components.

  Small electronic devices are widely used in electronic devices such as mobile phones and computers. The electronic device is an electronic device in which an electronic component such as a crystal resonator or an infrared sensor element is accommodated in an electronic component storage package made of an insulating material such as ceramic (see, for example, Patent Document 1).

  An electronic component storage package used in an electronic device includes, for example, a wiring board and a silicon (Si) lid. The lid is for covering and sealing an electronic component mounted on the wiring board, and the wiring board and the lid are joined by a joining member.

JP 2005-5963 A

  However, since the area of the bonding region between the wiring board and the lid is reduced due to the downsizing of the electronic component storage package, the bonding strength between the wiring board and the lid is reduced. When the bonding strength between the wiring board and the lid is lowered, there is a possibility that a crack is generated in the bonding member between the wiring board and the lid or the wiring board and the lid are peeled off.

  If a crack occurs in the bonding member between the wiring board and the lid, or if the wiring board and the lid are peeled off, the airtightness of the sealing space for sealing the electronic components surrounded by the wiring board and the lid is sealed. There was a problem that the property was impaired.

An electronic component storage package according to an aspect of the present invention includes a wiring board, a lid provided on the wiring board, and a reinforcing member provided from the side surface of the wiring board to the side surface of the lid. . The lid is provided so as to seal an electronic component provided on the wiring board. The reinforcing member contains glass as a main component, and further contains a material contained in the wiring board and Si contained in the lid. The reinforcing member is integrally provided up to the upper surface of the lid and the lower surface of the wiring board. In a longitudinal sectional view, the reinforcing member provided on the upper surface of the lid and the reinforcing member provided on the lower surface of the wiring board face each other.

  An electronic device according to another aspect of the present invention includes an electronic component storage package having the above-described configuration and an electronic component mounted on the electronic component storage package.

Since the electronic component storage package according to one aspect of the present invention has the reinforcing member provided from the side surface of the wiring substrate to the side surface of the lid, the side surface of the wiring substrate at the side surface at the boundary between the wiring substrate and the lid. And a side surface of the lid are joined by a reinforcing member made of glass containing a material contained in the wiring board and a material contained in the lid. Further, the reinforcing member is integrally provided up to the upper surface of the lid and the lower surface of the wiring board, and the reinforcing member has a structure in which the lid and the wiring board are sandwiched from above and below. Therefore, the bonding strength between the wiring board and the lid can be improved, and the possibility of cracks starting from the boundary between the wiring board and the lid or the separation of the wiring board and the lid can be reduced.

Since the electronic device according to another aspect of the present invention includes the electronic component storage package and the electronic component mounted on the electronic component storage package, the bonding strength between the lid and the electronic component storage package is high. High and long-term reliability.

(A) is a longitudinal cross-sectional view which shows the electronic device in the 1st Embodiment of this invention, (b) is an expanded sectional view of the A section. (A) is a longitudinal cross-sectional view which shows the electronic device in the 2nd Embodiment of this invention, (b) is an expanded sectional view of the A section.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
The electronic device according to the first embodiment of the present invention includes an electronic component storage package 1 and an electronic component 2 mounted on a wiring board 10 of the electronic component storage package 1.

  The electronic component storage package 1 in this embodiment includes a wiring board 10, a lid 12 joined to the wiring board 10 by a joining member 11, and a reinforcing member provided from the side surface of the wiring board 10 to the side surface of the lid 12. And 13.

The wiring board 10 in the first embodiment includes an insulating base 100, as in the example shown in FIG.
A wiring conductor 101 provided on the upper surface and inside of the insulating base 100, a connection electrode 102 provided on the surface of the insulating base 100, and a terminal electrode 103 provided on the lower surface of the insulating base 100. In FIG. 1, the electronic device is provided in a virtual xyz space, and for the sake of convenience, “upward” means the positive direction of the virtual z-axis.

The insulating base 100 has a recess 1001 including a mounting area for the electronic component 2 at the center, and the recess 1001 is surrounded by a side wall 1002. A connection electrode 102 for joining the electronic component 2 and electrically connecting the electronic component 2 and the wiring conductor 101 is provided on the bottom surface 1003 of the recess 1001. The insulating substrate 100 has a rectangular shape in plan view. The insulating substrate 100 functions as a support for supporting the electronic component 2, and the electronic component 2 is bonded onto the mounting region of the bottom surface 1003 of the recess 1001 via a bonding agent such as a low melting point brazing material or a conductive resin. Fixed.

The material of the insulating base 100 is, for example, an aluminum oxide sintered body (alumina ceramic),
Ceramics such as an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body.

When the insulating base 100 is made of, for example, an aluminum oxide sintered body, alumina (A
A suitable organic solvent and solvent are added to and mixed with raw material powders such as l ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO) to form a slurry. Such a mud-like raw material is formed into a sheet shape by employing a doctor blade method or a calender roll method to obtain a ceramic green sheet. Thereafter, the ceramic green sheet is appropriately punched or pressed, and a plurality of sheets are laminated as necessary to form a laminate, and the laminate is fired at a high temperature (about 1500 to 1800 ° C.).

When the insulating base 100 is made by laminating a plurality of ceramic green sheets,
The recess 1001 is formed, for example, by laminating and firing a ceramic green sheet provided with a through hole serving as an opening and a ceramic green sheet serving as the bottom of the recess 1001. Further, the recess 1001 may be formed on a single-layer or multilayer ceramic green sheet by pressing.

The joining member 11 is made of, for example, a metal mainly composed of gold (Au), silver (Ag), zinc (Zn), tin (Sn), copper (Cu), and an alloy thereof, and includes a metal layer 12 and a lid 12. It is for joining. The bonding member 11 is provided on the upper surface of the side wall portion 1002 of the wiring board 10 so as to surround the recess 1001 in a plan view. Such a joining member 11 is arranged on the insulating substrate 100 in a sheet-like or paste-like state, and the lid 12 is arranged on the joining member 11. Thereafter, the joining member 11
As a result of heating, lid 12 and metal layer 12 are joined.

  The lid 12 is for sealing the electronic component 2 in a space surrounded by the lid 12 and the wiring board 10. The lid 12 is disposed on the wiring board 10 so as to seal the recess 1001. The lid 12 can be made of metal, ceramics, or the like. For example, when the electronic component 2 is an infrared sensor, the lid 12 may be a material that transmits infrared rays, and a material containing silicon (Si) can be used.

Further, such a lid 12 is joined to the insulating substrate 100 on the outer peripheral side via a joining member 11 such as a brazing material or solder. By bonding the insulating substrate 100 and the lid 12 via the bonding member 11, the space between the insulating substrate 100 and the lid 12 can be sealed. The joining member 11 is made of gold (Au), silver (Ag
), Zinc (Zn), tin (Sn), copper (Cu), and a metal or glass material containing these alloys as main components.

  The reinforcing member 13 is provided from the side surface of the wiring board 10 to the side surface of the lid 12. In the present embodiment, the reinforcing member 13 is provided on the side surface of the wiring board 10, the side surface of the bonding member 11, and the side surface of the lid 12. The material of the reinforcing member 13 is glass including a material contained in the wiring board 10 and a material contained in the lid 12 as main components.

As the glass contained in the reinforcing member 13, for example, SiO ₂ -based, SiO ₂ -Al ₂ O ₃ -based, SiO ₂ -MO-based (where M represents Ca, Sr, Mg, Ba, or Zn) glass is used. be able to.

  Since the reinforcing member 13 includes the material contained in the wiring board 10, it is firmly bonded to the wiring board 10. Further, since the reinforcing member 13 includes the material contained in the lid 12, the reinforcing member 13 is firmly joined to the lid 12. Therefore, since the wiring board 10 and the lid 12 are joined also by the reinforcing member 13, the joining strength between the wiring board 10 and the lid 12 can be improved.

  Even if a step or a groove is formed between the side surface of the wiring board 10 and the side surface of the lid 12, the reinforcing member 13 covers the step or the groove. Since the difference in level or groove is reduced, the occurrence of cracks between the wiring board 10 and the lid 12 is reduced.

The wiring conductor 101 is made of tungsten (W), molybdenum (Mo), manganese (Mn), silver (
A metal material such as Ag) or copper (Cu) can be used. Such a wiring conductor 101 is obtained by printing a conductive paste containing the above metal powder metallization on a ceramic green sheet for the insulating substrate 100 in a predetermined shape by a screen printing method or the like. By baking at the same time, the insulating substrate 100 is formed.

Such a conductor paste is mixed and kneaded by a kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc., with an appropriate organic solvent and organic binder added to the above metal powder, and a dispersant added as necessary. And adjusted to an appropriate viscosity. Further, glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the insulating substrate 100 after firing.

The wiring conductor 101 is for electrically connecting the connection electrode 102 and the terminal electrode 103.
The wiring conductor 101 is provided bonded to the connection electrode 102 and the terminal electrode 103. The wiring conductor 101 is provided as a through conductor that penetrates the insulating substrate 100, for example.

As in the example shown in FIG. 1, the connection electrode 102 is provided at each of two adjacent corners of the recess 1001 in a sectional view. The connection electrode 102 functions as a connection conductor for connecting the electrodes of the electronic component 2. The electronic component 2 has, for example, a rectangular outer shape, and a pair of electrodes for connection are formed at corners of the main surface. Note that the connection electrode 102 may be provided by changing the position or shape according to the number of electronic components 2 to be mounted or the arrangement of the electrodes of the electronic component 2.

The terminal electrode 103 is for connection to an external electric circuit board, and is electrically connected to the connection electrode 102 on the second main surface opposite to the first main surface provided with the recess 1001 of the insulating base 100. Is provided.

Note that the exposed surfaces of the wiring conductor 101, the connection electrode 102, and the terminal electrode 103 are coated with a plating layer by a plating method such as an electrolytic plating method or an electroless plating method. The plating layer is made of a metal having excellent corrosion resistance such as nickel and gold or connectivity with a connecting member, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating having a thickness of about 0.1 to 3 μm. The layers are deposited sequentially. Accordingly, corrosion of the metal layer 12, the wiring conductor 101, the connection electrode 102, and the terminal electrode 103 can be effectively suppressed. Further, the connection between the connection electrode 102 and the connection member and the connection between the terminal electrode 103 and the wiring of the external electric circuit board can be strengthened.

Each electrode of the electronic component 2 and the connection electrode 102 are joined and electrically connected by a joining material such as a conductive adhesive. That is, the electronic component 2 is arranged so that the electrodes formed at the corners of the main surface of the electronic component 2 face the connection electrode 102, and the bonding material previously deposited on the connection electrode 102 is heated. If cured, the electrode of the electronic component 2 and the connection electrode 102 are joined.

  The electronic component 2 is sealed in a space surrounded by the recess 1001 and the lid 12 by bonding the wiring substrate 10 and the lid 12 after being housed in the recess 1001.

  The electronic component 2 is accommodated in the recess 1001 and sealed by the recess 1001 of the wiring substrate 10 and the lid 12, whereby an electronic device can be manufactured.

  The electronic component storage package in this embodiment includes a wiring board 10, a lid 12 provided on the wiring board 10 so as to seal the electronic component 2 provided on the wiring board 10, and a side surface of the wiring board 10. And the reinforcing member 13 provided over the side surface of the lid 12, the reinforcing member 13 includes glass as a main component, and further includes the material contained in the wiring board 10 and the lid 12. Therefore, the bonding strength at the boundary between the wiring substrate 10 and the lid 12 can be improved, and the possibility of cracks starting from the boundary between the wiring substrate 10 and the lid 12 can be reduced.

  Even when a plurality of voids are generated in the joining member 11 between the space surrounded by the recess 1001 and the lid 12 and the external space of the electronic component storage package 1, the side surface of the joining member 11 is Since it is covered with the reinforcing member 13, it is possible to reduce the connection between the void and the external space of the electronic component storage package 1.

Further, in the electronic component storage package 1 of the present embodiment, since the reinforcing member 13 is integrally provided up to the upper surface of the lid 12, it is assumed that a stress that pulls upward is applied to the lid body 12. Since the hook 13 is caught by the reinforcing member 13 located on the upper surface of the lid 12, the lid 13 is connected to the wiring board.
The possibility of peeling upward from 10 can be reduced.

  Since the electronic device according to the present embodiment includes the electronic component storage package 1 and the electronic component 2 mounted on the electronic component storage package 1, the lid 12 and the electronic component storage package 1 are joined to each other. High strength and excellent long-term reliability.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIG.

  The electronic component storage package 1 according to this embodiment differs from the electronic component storage package 1 according to the first embodiment described above in that the reinforcing member 13 is provided on the upper surface of the lid 12 as in the example shown in FIG. The reinforcing member 13 provided on the upper surface of the lid 12 and the reinforcing member 13 provided on the lower surface of the wiring substrate 10 are opposed to each other in a longitudinal sectional view. Is a point.

  As described above, when the reinforcing member 13 is integrally provided up to the upper surface of the lid 12 and the lower surface of the wiring board 10, the reinforcing member 13 has a structure in which the lid 12 and the wiring board 10 are sandwiched from above and below. The peeling in the vertical direction between 12 and the wiring board 10 can be more effectively reduced.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the reinforcing member 13 may be provided over the entire circumference of the side surface of the wiring board and the side surface of the lid in plan view.

  Further, when the electronic component storage package has a rectangular shape with different vertical and horizontal lengths in plan view, the long side of the electronic component storage package may include the reinforcing member 13.

1 ... Electronic component storage package
10 ... wiring board
100 ・ ・ ・ Insulating substrate
1001 ・ ・ ・ Recess
1002 ・ ・ ・ Side wall
1003 ... Bottom
101 ・ ・ ・ Wiring conductor
102 ... Connection electrode
103 ... Terminal electrode
11 ... Joint member
12 ... Lid
13 ... Reinforcing member 2 ... Electronic components

Claims (3)

A wiring board;
A lid provided on the wiring board so as to seal an electronic component provided on the wiring board;
A reinforcing member provided from the side surface of the wiring board to the side surface of the lid,
The reinforcing member includes glass as a main component, and further includes a material included in the wiring board and Si included in the lid ,
The reinforcing member is integrally provided up to the upper surface of the lid and the lower surface of the wiring board, and in a longitudinal sectional view, the reinforcing member provided on the upper surface of the lid and the reinforcing member provided on the lower surface of the wiring board And an electronic component storage package characterized by facing each other.   The electronic component storage package according to claim 1, wherein the reinforcing member is integrally provided up to an upper surface of the lid. The electronic component storage package according to claim 1;
An electronic device comprising: an electronic component mounted on the wiring board of the electronic component storage package.

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