JP6002083B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP6002083B2
JP6002083B2 JP2013107583A JP2013107583A JP6002083B2 JP 6002083 B2 JP6002083 B2 JP 6002083B2 JP 2013107583 A JP2013107583 A JP 2013107583A JP 2013107583 A JP2013107583 A JP 2013107583A JP 6002083 B2 JP6002083 B2 JP 6002083B2
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JP
Japan
Prior art keywords
wiring board
multilayer wiring
ground
coaxial structure
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013107583A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014007390A (ja
JP2014007390A5 (enExample
Inventor
浩 岡山
浩 岡山
透 高田
透 高田
Original Assignee
株式会社ワカ製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ワカ製作所 filed Critical 株式会社ワカ製作所
Priority to JP2013107583A priority Critical patent/JP6002083B2/ja
Publication of JP2014007390A publication Critical patent/JP2014007390A/ja
Publication of JP2014007390A5 publication Critical patent/JP2014007390A5/ja
Application granted granted Critical
Publication of JP6002083B2 publication Critical patent/JP6002083B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2013107583A 2012-05-28 2013-05-22 多層配線基板 Expired - Fee Related JP6002083B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013107583A JP6002083B2 (ja) 2012-05-28 2013-05-22 多層配線基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012121419 2012-05-28
JP2012121419 2012-05-28
JP2013107583A JP6002083B2 (ja) 2012-05-28 2013-05-22 多層配線基板

Publications (3)

Publication Number Publication Date
JP2014007390A JP2014007390A (ja) 2014-01-16
JP2014007390A5 JP2014007390A5 (enExample) 2016-06-30
JP6002083B2 true JP6002083B2 (ja) 2016-10-05

Family

ID=49620704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013107583A Expired - Fee Related JP6002083B2 (ja) 2012-05-28 2013-05-22 多層配線基板

Country Status (2)

Country Link
US (1) US9271391B2 (enExample)
JP (1) JP6002083B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM531078U (zh) * 2015-12-31 2016-10-21 Zhi-Shou Wang 電連接器
JP6853655B2 (ja) * 2016-11-14 2021-03-31 ヒロセ電機株式会社 基板とコネクタとの接続構造および基板
JP7005116B2 (ja) * 2019-04-23 2022-01-21 矢崎総業株式会社 回路モジュールと回路モジュールの製造方法
US10971838B1 (en) * 2019-11-14 2021-04-06 Chun-Te Lee Combination structure of clamping member and circuit board for signal connector
CN114512868A (zh) * 2022-01-19 2022-05-17 中国电子科技集团公司第十研究所 键合式射频同轴连接器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4125570B2 (ja) * 2002-09-19 2008-07-30 日本電気株式会社 電子装置
US20040248437A1 (en) 2003-06-03 2004-12-09 Wong Marvin Glenn Reinforced substrates having edge-mount connectors
DE10345218B3 (de) * 2003-09-29 2004-12-30 Siemens Ag Vorrichtung zur Verbindung einer Koaxialleitung mit einer Koplanarleitung
TWI290443B (en) * 2005-05-10 2007-11-21 Via Tech Inc Signal transmission structure, wire board and connector assembly structure
EP2012131A4 (en) * 2006-04-21 2012-11-28 Nat Inst Of Advanced Ind Scien CONTACT PROBE AND METHOD FOR MANUFACTURING THE SAME
JP5482663B2 (ja) * 2008-11-26 2014-05-07 日本電気株式会社 回路モジュールの基板及びその製造方法
US8758053B2 (en) * 2010-06-07 2014-06-24 Andrew Llc Low PIM coaxial connector
JP2012114365A (ja) * 2010-11-26 2012-06-14 Japan Radio Co Ltd プリント基板

Also Published As

Publication number Publication date
JP2014007390A (ja) 2014-01-16
US20130313003A1 (en) 2013-11-28
US9271391B2 (en) 2016-02-23

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