JP7005116B2 - 回路モジュールと回路モジュールの製造方法 - Google Patents
回路モジュールと回路モジュールの製造方法 Download PDFInfo
- Publication number
- JP7005116B2 JP7005116B2 JP2019082138A JP2019082138A JP7005116B2 JP 7005116 B2 JP7005116 B2 JP 7005116B2 JP 2019082138 A JP2019082138 A JP 2019082138A JP 2019082138 A JP2019082138 A JP 2019082138A JP 7005116 B2 JP7005116 B2 JP 7005116B2
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- circuit
- circuit module
- conductor
- coaxial cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
2 絶縁体
3 外部導体
4 シース
5 接続部
6 非露出部
h1 接続部5の厚み
w1 接続部5の幅
h2 非露出部6の厚み
w2 非露出部6の幅
11 素線
20 回路体
21 誘電体
22 グランド体
30 ハンダ
40 金型
50 アンテナ
100 回路モジュール
200 同軸ケーブル
300 回路基板
Claims (6)
- 回路基板の回路体に、同軸ケーブルの内部導体をハンダで接続する、回路モジュールであって、
前記回路基板は、
誘電体と、
前記誘電体の表面上に形成された回路体と、
前記誘電体の裏面上に形成されたグランド体と、
を備え、
前記同軸ケーブルは、
内部導体と、
前記内部導体を囲うように設けられた絶縁体と、
前記絶縁体を囲うように設けられた外部導体と、
前記外部導体を囲うように設けられたシースと、
を備え、
前記内部導体は、前記回路体に接続する接続部と、前記シースの内部にある非露出部と、を有し、
前記接続部の厚みは、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積が同一であり、
前記外部導体は、前記グランド体とハンダで接続することを特徴とする回路モジュール。 - 前記接続部の厚みは、前記非露出部の厚みの25%~35%であることを特徴とする請求項1に記載の回路モジュール。
- 前記接続部の幅が、前記非露出部の幅よりも大きいことを特徴とする請求項1または請求項2に記載の回路モジュール。
- 前記内部導体は、複数の素線で形成されており、
前記接続部の厚みは、複数の前記素線が変形することで、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積が同一となることを特徴とする請求項1~3のいずれか1項に記載の回路モジュール。 - 回路基板の回路体に、同軸ケーブルの内部導体をハンダで接続する、回路モジュールの製造方法であって、
前記回路基板は、
誘電体と、
前記誘電体の表面上に形成された回路体と、
前記誘電体の裏面上に形成されたグランド体と、を備え、
前記同軸ケーブルは、
内部導体と、
前記内部導体を囲うように設けられた絶縁体と、
前記絶縁体を囲うように設けられた外部導体と、
前記外部導体を囲うように設けられたシースと、
を備え、
前記内部導体は、前記回路体に接続する接続部と、前記シースの内部にある非露出部と、を有し、
前記同軸ケーブルの前記絶縁体、前記外部導体及び前記シースを取り除いて前記接続部を外部に露出させる露出工程と、
前記接続部の厚みが、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積とが同一となるように圧縮する圧縮工程と、
前記接続部を、前記回路体にハンダで接続する接続工程と、
を含み、
前記接続工程は、前記外部導体を、前記グランド体にハンダで接続する工程を含むことを特徴とする回路モジュールの製造方法。 - 前記内部導体は、複数の素線で形成されており、
前記圧縮工程は、前記接続部の厚みが、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積が同一となるように、複数の前記素線を変形させることを特徴とする請求項5に記載の回路モジュールの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019082138A JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
DE102020203697.7A DE102020203697A1 (de) | 2019-04-23 | 2020-03-23 | Schaltungsmodul und verfahren zum herstellen eines schaltungsmoduls |
US16/836,990 US10910783B2 (en) | 2019-04-23 | 2020-04-01 | Circuit module and method for manufacturing circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019082138A JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020181648A JP2020181648A (ja) | 2020-11-05 |
JP7005116B2 true JP7005116B2 (ja) | 2022-01-21 |
Family
ID=72840010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019082138A Active JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10910783B2 (ja) |
JP (1) | JP7005116B2 (ja) |
DE (1) | DE102020203697A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11555731B2 (en) | 2017-11-14 | 2023-01-17 | Rochester Sensors, Llc | TDR transducer with boomerang waveguide |
US11099052B2 (en) * | 2017-11-14 | 2021-08-24 | Rochester Gauges, Inc. | Low-cost measurement system using time domain reflectometry |
EP4286890A3 (en) | 2018-10-29 | 2024-01-17 | Rochester Sensors, LLC | Tdr transducer |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277218A (ja) | 1999-03-19 | 2000-10-06 | Ace Five:Kk | ケーブル組立体 |
JP2004335155A (ja) | 2003-04-30 | 2004-11-25 | Hitachi Cable Ltd | アンテナ装置 |
JP2013016457A (ja) | 2011-06-09 | 2013-01-24 | Sumitomo Electric Ind Ltd | 極細電線の接続方法及び回路基板の製造方法 |
JP2014509061A (ja) | 2011-03-24 | 2014-04-10 | ケーエムダブリュ・インコーポレーテッド | ケーブル接続装置 |
JP2016127008A (ja) | 2014-12-26 | 2016-07-11 | 日本電業工作株式会社 | 同軸ケーブル接続部材、通信回路及び通信装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3934783A (en) * | 1974-09-30 | 1976-01-27 | Larrison John E | Multiface wire bonding method and tool |
US4415115A (en) * | 1981-06-08 | 1983-11-15 | Motorola, Inc. | Bonding means and method |
JPS6032402A (ja) * | 1983-08-01 | 1985-02-19 | Matsushita Electric Ind Co Ltd | 同軸−ストリップライン変換装置 |
US5378857A (en) * | 1993-01-15 | 1995-01-03 | Advanced Interconnection Technology, Inc. | Directly bondable termination for a fixed discrete wire |
US6154103A (en) * | 1994-04-15 | 2000-11-28 | Superconductor Technologies, Inc. | Push on connector for cryocable and mating weldable hermetic feedthrough |
US5797765A (en) * | 1996-11-01 | 1998-08-25 | Hewlett-Packard Company | Coaxial connector for mounting on a circuit substrate |
US6007347A (en) * | 1998-05-20 | 1999-12-28 | Tektronix, Inc. | Coaxial cable to microstrip connection and method |
EP1366544A4 (en) * | 2001-02-16 | 2007-08-22 | Ems Technologies Inc | METHOD AND SYSTEM FOR CONNECTING A CABLE TO A CIRCUIT BOARD |
US7498523B2 (en) * | 2006-02-06 | 2009-03-03 | Efficere Inc. | Direct wire attach |
JP4998741B2 (ja) | 2008-03-11 | 2012-08-15 | 住友電気工業株式会社 | アダプタ構造,高周波ケーブル体および配線板接続体 |
US8357998B2 (en) * | 2009-02-09 | 2013-01-22 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
US9271391B2 (en) * | 2012-05-28 | 2016-02-23 | Waka Manufacturing Co., Ltd. | Multilayer wiring board |
JP6853998B2 (ja) | 2016-10-14 | 2021-04-07 | 日本圧着端子製造株式会社 | 同軸コネクタの実装構造 |
-
2019
- 2019-04-23 JP JP2019082138A patent/JP7005116B2/ja active Active
-
2020
- 2020-03-23 DE DE102020203697.7A patent/DE102020203697A1/de active Pending
- 2020-04-01 US US16/836,990 patent/US10910783B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277218A (ja) | 1999-03-19 | 2000-10-06 | Ace Five:Kk | ケーブル組立体 |
JP2004335155A (ja) | 2003-04-30 | 2004-11-25 | Hitachi Cable Ltd | アンテナ装置 |
JP2014509061A (ja) | 2011-03-24 | 2014-04-10 | ケーエムダブリュ・インコーポレーテッド | ケーブル接続装置 |
JP2013016457A (ja) | 2011-06-09 | 2013-01-24 | Sumitomo Electric Ind Ltd | 極細電線の接続方法及び回路基板の製造方法 |
JP2016127008A (ja) | 2014-12-26 | 2016-07-11 | 日本電業工作株式会社 | 同軸ケーブル接続部材、通信回路及び通信装置 |
Also Published As
Publication number | Publication date |
---|---|
DE102020203697A1 (de) | 2020-10-29 |
US20200343678A1 (en) | 2020-10-29 |
JP2020181648A (ja) | 2020-11-05 |
US10910783B2 (en) | 2021-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7005116B2 (ja) | 回路モジュールと回路モジュールの製造方法 | |
JP5391405B2 (ja) | 差動信号用ケーブル及びこれを用いたケーブルアセンブリ並びに多対差動信号用ケーブル | |
US7381089B2 (en) | Coaxial cable-connector termination | |
US8998641B2 (en) | Terminal structure of electrical cable, shielded connector and terminal treatment method of electrical cable | |
JP2017004905A (ja) | 高速伝送用ケーブル及びその製造方法 | |
CN110914927B (zh) | 同轴电缆及其制造方法以及带有同轴电缆的同轴连接器 | |
US20140060882A1 (en) | Communication cable having at least one insulated conductor | |
CN205564941U (zh) | 高频信号传输线路及电子设备 | |
JP2022103384A (ja) | 同軸ケーブル及びケーブルアセンブリ | |
JP2010192287A (ja) | 高速伝送用フレキシブルフラット高周波ケーブル端末接続構造及びその製造方法 | |
US11798710B2 (en) | Cable having a pair of inner conductors and an inner insulating layer extrusion molded around the pair of inner conductors | |
US7361831B2 (en) | Coaxial cable and multi-coaxial cable | |
CN112449492B (zh) | 具有高速线材的电路板组件 | |
JP6331152B2 (ja) | マイクロ波ケーブルならびにかかるマイクロ波ケーブルの製造方法および使用方法 | |
US20030176085A1 (en) | Electrical connector assembly | |
US20160203887A1 (en) | Shielded electrical cable | |
JP2006302790A (ja) | 同軸ケーブル及び同軸コネクタ | |
US20160099092A1 (en) | Coaxial cable | |
JP3680604B2 (ja) | シールド電線 | |
JP7205078B2 (ja) | 車載用ワイヤハーネス | |
JP7081699B2 (ja) | 同軸ケーブル及びケーブルアセンブリ | |
CN113196420B (zh) | 高频同轴线缆 | |
KR101759286B1 (ko) | 트랜지션 도파관 및 트랜지션 부재 | |
TWM622362U (zh) | 具有金屬箔遮蔽補強板的柔性扁平排線 | |
JP2024148544A (ja) | 複合ケーブル |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201019 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210812 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210817 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211008 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220104 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7005116 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |