JP5994239B2 - 洗浄装置及び方法 - Google Patents
洗浄装置及び方法 Download PDFInfo
- Publication number
- JP5994239B2 JP5994239B2 JP2011260553A JP2011260553A JP5994239B2 JP 5994239 B2 JP5994239 B2 JP 5994239B2 JP 2011260553 A JP2011260553 A JP 2011260553A JP 2011260553 A JP2011260553 A JP 2011260553A JP 5994239 B2 JP5994239 B2 JP 5994239B2
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- JP
- Japan
- Prior art keywords
- water
- tank
- ozone
- cleaning
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
- C02F1/78—Treatment of water, waste water, or sewage by oxidation with ozone
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
Description
図1に示すガラス基板洗浄装置において、洗浄条件を次の通りとした。なお、配管11による前段洗浄排水の回収は行わなかった。
配管5からの純水供給量 20L/min
タンク7の容量 400L
タンク7からジェット洗浄ノズル3への送水量 100L/min
配管15からの排水量 20L/min
図1の洗浄装置において、配管5に20L/minで純水を供給し、この洗浄排水を回収することなく廃棄した。また、ジェット洗浄ノズル3に対して純水を100L/minにて供給し、洗浄排水を回収せずに廃棄した。これにより、洗浄は良好に行われたが、純水消費量は合計120L/minとなり、実施例1の6倍となった。
2 ローラー
3 ジェット洗浄ノズル
4 最終リンスノズル
7 タンク
12 オゾン水供給装置
Claims (5)
- 被洗浄物の搬送方向下流側において、被洗浄物に対し洗浄水を噴出する下流側ノズルと、
該下流側ノズルからの洗浄水を収容するタンクと、
該タンクから供給される洗浄水を被洗浄物の搬送方向上流側において、被洗浄物に対して噴出する上流側ノズルと
を有する洗浄装置において、
該被洗浄物はFDP用ガラス基板であり、
該タンクのオゾン濃度が0.1〜3mg/Lとなるように該タンクにオゾンガス又はオゾン水を供給するオゾン供給手段を備えたことを特徴とする洗浄装置。 - 請求項1において、前記オゾン供給手段は、前記タンクにオゾンガス又はオゾン水を間欠的に供給することを特徴とする洗浄装置。
- 請求項1の洗浄装置によってFDP用ガラス基板を洗浄する洗浄方法。
- 請求項3において、間欠的にオゾンガス又はオゾン水を前記タンクに供給することを特徴とする洗浄方法。
- 請求項4において、3〜90日毎に、1回当り1〜20min間、該タンク内の水のオゾン濃度が0.1〜1mg/Lとなるように前記タンクにオゾンを供給することを特徴とする洗浄方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011260553A JP5994239B2 (ja) | 2011-11-29 | 2011-11-29 | 洗浄装置及び方法 |
CN201280050693.4A CN103889602B (zh) | 2011-11-29 | 2012-04-27 | 清洗装置及方法 |
KR1020147009635A KR20140097124A (ko) | 2011-11-29 | 2012-04-27 | 세정 장치 및 방법 |
PCT/JP2012/061356 WO2013080580A1 (ja) | 2011-11-29 | 2012-04-27 | 洗浄装置及び方法 |
TW101115449A TWI600477B (zh) | 2011-11-29 | 2012-05-01 | Wash device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011260553A JP5994239B2 (ja) | 2011-11-29 | 2011-11-29 | 洗浄装置及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013111536A JP2013111536A (ja) | 2013-06-10 |
JP5994239B2 true JP5994239B2 (ja) | 2016-09-21 |
Family
ID=48535067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011260553A Active JP5994239B2 (ja) | 2011-11-29 | 2011-11-29 | 洗浄装置及び方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5994239B2 (ja) |
KR (1) | KR20140097124A (ja) |
CN (1) | CN103889602B (ja) |
TW (1) | TWI600477B (ja) |
WO (1) | WO2013080580A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109354112B (zh) * | 2018-10-15 | 2021-11-02 | Tcl华星光电技术有限公司 | 清洗设备 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63272040A (ja) * | 1987-04-30 | 1988-11-09 | Fujitsu Ltd | 循環濾過洗浄装置 |
JP3057599B2 (ja) * | 1994-07-06 | 2000-06-26 | キヤノン株式会社 | 洗浄装置及び洗浄方法 |
JPH1144877A (ja) * | 1997-07-24 | 1999-02-16 | Nec Kagoshima Ltd | 基板洗浄装置 |
JP4602540B2 (ja) * | 2000-12-12 | 2010-12-22 | オメガセミコン電子株式会社 | 基板処理装置 |
KR101232249B1 (ko) * | 2004-08-10 | 2013-02-12 | 간또 가가꾸 가부시끼가이샤 | 반도체 기판 세정액 및 반도체 기판 세정방법 |
JP2006247470A (ja) * | 2005-03-08 | 2006-09-21 | Sanyo Electric Co Ltd | 洗浄水生成装置 |
CN1986085A (zh) * | 2005-12-22 | 2007-06-27 | 财团法人工业技术研究院 | 气泡式反应清洗装置及其方法 |
JP4875922B2 (ja) * | 2006-04-20 | 2012-02-15 | 株式会社岡常歯車製作所 | 洗浄水リサイクル装置 |
TW200900361A (en) * | 2007-06-20 | 2009-01-01 | Bai-Cheng Chen | Improved sterilization and filter device for glass substrate cleaner using pure water/ultra pure water |
JP5630808B2 (ja) * | 2010-03-26 | 2014-11-26 | 住友精密工業株式会社 | 搬送式基板処理装置における節水型洗浄システム |
-
2011
- 2011-11-29 JP JP2011260553A patent/JP5994239B2/ja active Active
-
2012
- 2012-04-27 WO PCT/JP2012/061356 patent/WO2013080580A1/ja active Application Filing
- 2012-04-27 CN CN201280050693.4A patent/CN103889602B/zh active Active
- 2012-04-27 KR KR1020147009635A patent/KR20140097124A/ko active Search and Examination
- 2012-05-01 TW TW101115449A patent/TWI600477B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20140097124A (ko) | 2014-08-06 |
CN103889602B (zh) | 2016-04-06 |
CN103889602A (zh) | 2014-06-25 |
TW201321089A (zh) | 2013-06-01 |
TWI600477B (zh) | 2017-10-01 |
WO2013080580A1 (ja) | 2013-06-06 |
JP2013111536A (ja) | 2013-06-10 |
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