JP5981786B2 - 集積回路チップ上にセンサを垂直に積み重ねるためのシステムおよび方法 - Google Patents

集積回路チップ上にセンサを垂直に積み重ねるためのシステムおよび方法 Download PDF

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JP5981786B2
JP5981786B2 JP2012145725A JP2012145725A JP5981786B2 JP 5981786 B2 JP5981786 B2 JP 5981786B2 JP 2012145725 A JP2012145725 A JP 2012145725A JP 2012145725 A JP2012145725 A JP 2012145725A JP 5981786 B2 JP5981786 B2 JP 5981786B2
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Prior art keywords
circuit board
printed circuit
chip
asic
sensor
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Expired - Fee Related
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JP2012145725A
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Japanese (ja)
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JP2013012743A5 (https=
JP2013012743A (ja
Inventor
チア−ミーン・リウ
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Honeywell International Inc
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Honeywell International Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10537—Attached components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Gyroscopes (AREA)
JP2012145725A 2011-06-29 2012-06-28 集積回路チップ上にセンサを垂直に積み重ねるためのシステムおよび方法 Expired - Fee Related JP5981786B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/172,604 US8476720B2 (en) 2011-06-29 2011-06-29 Systems and methods for vertically stacking a sensor on an integrated circuit chip
US13/172,604 2011-06-29

Publications (3)

Publication Number Publication Date
JP2013012743A JP2013012743A (ja) 2013-01-17
JP2013012743A5 JP2013012743A5 (https=) 2015-08-13
JP5981786B2 true JP5981786B2 (ja) 2016-08-31

Family

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Family Applications (1)

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JP2012145725A Expired - Fee Related JP5981786B2 (ja) 2011-06-29 2012-06-28 集積回路チップ上にセンサを垂直に積み重ねるためのシステムおよび方法

Country Status (3)

Country Link
US (1) US8476720B2 (https=)
EP (1) EP2542037A1 (https=)
JP (1) JP5981786B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007147137A2 (en) 2006-06-15 2007-12-21 Sitime Corporation Stacked die package for mems resonator system
JP5633493B2 (ja) * 2011-09-16 2014-12-03 オムロン株式会社 半導体装置及びマイクロフォン
US9695036B1 (en) * 2012-02-02 2017-07-04 Sitime Corporation Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same
US8816513B2 (en) * 2012-08-22 2014-08-26 Texas Instruments Incorporated Electronic assembly with three dimensional inkjet printed traces
KR102107961B1 (ko) 2013-11-14 2020-05-28 삼성전자 주식회사 반도체 장치 및 이의 제조 방법
CN103730379A (zh) * 2014-01-16 2014-04-16 苏州晶方半导体科技股份有限公司 芯片封装方法及结构
CN105036067A (zh) * 2015-05-29 2015-11-11 中国科学院电子学研究所 Mems传感器倒装叠层封装结构及其制备方法
CN109292727A (zh) * 2018-11-13 2019-02-01 北方电子研究院安徽有限公司 一种具有温度补偿功能的两片式mems陀螺仪
TWI738044B (zh) * 2019-08-29 2021-09-01 新唐科技股份有限公司 感測器以及積體電路模組
CN116193972B (zh) * 2023-04-27 2023-07-18 宁波中车时代传感技术有限公司 一种传感器制备方法及结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6956283B1 (en) * 2000-05-16 2005-10-18 Peterson Kenneth A Encapsulants for protecting MEMS devices during post-packaging release etch
US20030124599A1 (en) 2001-11-14 2003-07-03 Shiping Chen Biochemical analysis system with combinatorial chemistry applications
JP3718205B2 (ja) * 2003-07-04 2005-11-24 松下電器産業株式会社 チップ積層型半導体装置およびその製造方法
US7863720B2 (en) * 2004-05-24 2011-01-04 Honeywell International Inc. Method and system for stacking integrated circuits
KR100666919B1 (ko) * 2005-12-20 2007-01-10 삼성전자주식회사 반도체 패키지용 접착 시트, 이를 포함하는 반도체 소자,이를 포함하는 멀티 스택 패키지, 반도체 소자의 제조 방법및 멀티 스택 패키지의 제조 방법
WO2007147137A2 (en) * 2006-06-15 2007-12-21 Sitime Corporation Stacked die package for mems resonator system
TWM315922U (en) 2006-12-08 2007-07-21 Delta Electronics Inc Filter device and apparatus
US20090051447A1 (en) 2007-08-24 2009-02-26 Mccracken Jeffrey A Ovenized oscillator
JP2009076588A (ja) * 2007-09-19 2009-04-09 Dainippon Printing Co Ltd センサーパッケージとその製造方法
TWI355068B (en) 2008-02-18 2011-12-21 Cyntec Co Ltd Electronic package structure
US20090282917A1 (en) * 2008-05-19 2009-11-19 Cenk Acar Integrated multi-axis micromachined inertial sensing unit and method of fabrication
US10251273B2 (en) * 2008-09-08 2019-04-02 Intel Corporation Mainboard assembly including a package overlying a die directly attached to the mainboard
JP5406487B2 (ja) * 2008-09-17 2014-02-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2010262992A (ja) * 2009-04-30 2010-11-18 Sanyo Electric Co Ltd 半導体モジュールおよび携帯機器

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Publication number Publication date
US8476720B2 (en) 2013-07-02
JP2013012743A (ja) 2013-01-17
EP2542037A1 (en) 2013-01-02
US20130001709A1 (en) 2013-01-03

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