JP5975589B2 - 半導体装置実装用ペースト - Google Patents

半導体装置実装用ペースト Download PDF

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Publication number
JP5975589B2
JP5975589B2 JP2012185020A JP2012185020A JP5975589B2 JP 5975589 B2 JP5975589 B2 JP 5975589B2 JP 2012185020 A JP2012185020 A JP 2012185020A JP 2012185020 A JP2012185020 A JP 2012185020A JP 5975589 B2 JP5975589 B2 JP 5975589B2
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Japan
Prior art keywords
silica
based fine
fine particles
paste
treated silica
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JP2012185020A
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English (en)
Japanese (ja)
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JP2014044984A (ja
JP2014044984A5 (https=
Inventor
光章 熊澤
光章 熊澤
山口　純
純 山口
良 村口
良 村口
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JGC Catalysts and Chemicals Ltd
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JGC Catalysts and Chemicals Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50396077&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5975589(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by JGC Catalysts and Chemicals Ltd filed Critical JGC Catalysts and Chemicals Ltd
Priority to JP2012185020A priority Critical patent/JP5975589B2/ja
Publication of JP2014044984A publication Critical patent/JP2014044984A/ja
Publication of JP2014044984A5 publication Critical patent/JP2014044984A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Silicon Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2012185020A 2012-08-24 2012-08-24 半導体装置実装用ペースト Active JP5975589B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012185020A JP5975589B2 (ja) 2012-08-24 2012-08-24 半導体装置実装用ペースト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012185020A JP5975589B2 (ja) 2012-08-24 2012-08-24 半導体装置実装用ペースト

Publications (3)

Publication Number Publication Date
JP2014044984A JP2014044984A (ja) 2014-03-13
JP2014044984A5 JP2014044984A5 (https=) 2015-09-17
JP5975589B2 true JP5975589B2 (ja) 2016-08-23

Family

ID=50396077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012185020A Active JP5975589B2 (ja) 2012-08-24 2012-08-24 半導体装置実装用ペースト

Country Status (1)

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JP (1) JP5975589B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019031194A1 (ja) * 2017-08-08 2019-02-14 ソニー株式会社 接着剤、電子機器及び光学機器
WO2025203629A1 (ja) * 2024-03-29 2025-10-02 株式会社アドマテックス 樹脂組成物及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5912249B2 (ja) * 2010-12-28 2016-04-27 日揮触媒化成株式会社 半導体装置実装用ペ−スト
JP2012142439A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト

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JP2014044984A (ja) 2014-03-13

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