JP5974009B2 - 改良超音波洗浄方法および装置 - Google Patents

改良超音波洗浄方法および装置 Download PDF

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Publication number
JP5974009B2
JP5974009B2 JP2013529756A JP2013529756A JP5974009B2 JP 5974009 B2 JP5974009 B2 JP 5974009B2 JP 2013529756 A JP2013529756 A JP 2013529756A JP 2013529756 A JP2013529756 A JP 2013529756A JP 5974009 B2 JP5974009 B2 JP 5974009B2
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article
ultrasonic
fluid
megasonic energy
processing
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Japanese (ja)
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JP2013543653A (ja
JP2013543653A5 (https=
Inventor
ホルステインズ・フランク・ルートヴィヒ
リッパート・アレクサンダー
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Lam Research AG
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Lam Research AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2013529756A 2010-09-24 2011-09-23 改良超音波洗浄方法および装置 Active JP5974009B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,975 2010-09-24
US12/889,975 US9662686B2 (en) 2010-09-24 2010-09-24 Ultrasonic cleaning method and apparatus
PCT/IB2011/054195 WO2012038933A2 (en) 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus

Publications (3)

Publication Number Publication Date
JP2013543653A JP2013543653A (ja) 2013-12-05
JP2013543653A5 JP2013543653A5 (https=) 2014-11-13
JP5974009B2 true JP5974009B2 (ja) 2016-08-23

Family

ID=45869372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013529756A Active JP5974009B2 (ja) 2010-09-24 2011-09-23 改良超音波洗浄方法および装置

Country Status (7)

Country Link
US (1) US9662686B2 (https=)
JP (1) JP5974009B2 (https=)
KR (1) KR20130107287A (https=)
CN (1) CN103118810B (https=)
SG (1) SG188535A1 (https=)
TW (1) TWI473668B (https=)
WO (1) WO2012038933A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10391526B2 (en) 2013-12-12 2019-08-27 Lam Research Corporation Electrostatic chuck cleaning fixture
TWI698291B (zh) * 2016-11-02 2020-07-11 大陸商盛美半導體設備（上海）股份有限公司 襯底清洗方法及清洗裝置
JP6554128B2 (ja) 2017-02-28 2019-07-31 株式会社Ｓｕｂａｒｕ 繊維強化複合材料の製造方法
US10995422B2 (en) * 2017-05-26 2021-05-04 Sumitomo Electric Industries, Ltd. GaAs substrate and method for manufacturing the same
CN107570482A (zh) * 2017-07-06 2018-01-12 天津大学 界面的非特异性吸附物的去除装置及方法
JP6715226B2 (ja) 2017-10-25 2020-07-01 株式会社Ｓｕｂａｒｕ 複合材成形治具及び複合材成形方法
CN110560425B (zh) * 2019-09-20 2021-01-29 深圳先进技术研究院 超声清洗装置、清洗方法及其应用
US12269070B2 (en) * 2020-12-16 2025-04-08 The Boeing Company Flexible cavitation apparatus
CN116581067B (zh) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 基于器件湿法处理的兆声波系统的控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625249A (en) 1994-07-20 1997-04-29 Submicron Systems, Inc. Megasonic cleaning system
JP3511441B2 (ja) 1996-11-29 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法
US6290778B1 (en) 1998-08-12 2001-09-18 Hudson Technologies, Inc. Method and apparatus for sonic cleaning of heat exchangers
JP4608748B2 (ja) * 1999-08-05 2011-01-12 東京エレクトロン株式会社 洗浄装置、洗浄システム及び洗浄方法
US6729339B1 (en) * 2002-06-28 2004-05-04 Lam Research Corporation Method and apparatus for cooling a resonator of a megasonic transducer
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
WO2004112093A2 (en) 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
CN1822905A (zh) 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
CN1976765B (zh) 2004-06-29 2011-11-09 株式会社鹿儿岛超音波综合研究所 超声波清洗的方法与装置
US7392814B2 (en) 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
TWI259110B (en) 2005-09-22 2006-08-01 Delta Electronics Inc Ultrasonic cleaning system and method
JP4652959B2 (ja) * 2005-11-30 2011-03-16 芝浦メカトロニクス株式会社 基板の処理装置
KR100710803B1 (ko) * 2006-01-23 2007-04-23 삼성전자주식회사 기판 세정 장치
JP2008021672A (ja) * 2006-07-10 2008-01-31 Sony Corp ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置
WO2008008921A2 (en) * 2006-07-12 2008-01-17 Akrion Technologies, Inc. Tranducer assembly incorporating a transmitter having through holes, and method of cleaning
KR100931856B1 (ko) * 2007-08-24 2009-12-15 세메스 주식회사 기판 세정 장치 및 기판 세정 방법
JP2009178440A (ja) 2008-01-31 2009-08-13 Sammy Corp 演出表示装置及び遊技機

Also Published As

Publication number Publication date
TW201223652A (en) 2012-06-16
SG188535A1 (en) 2013-05-31
CN103118810A (zh) 2013-05-22
TWI473668B (zh) 2015-02-21
US20120073596A1 (en) 2012-03-29
CN103118810B (zh) 2015-07-01
WO2012038933A3 (en) 2012-07-12
JP2013543653A (ja) 2013-12-05
US9662686B2 (en) 2017-05-30
WO2012038933A2 (en) 2012-03-29
KR20130107287A (ko) 2013-10-01

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