KR20130107287A - 개선된 초음파 세정 방법 및 장치 - Google Patents

개선된 초음파 세정 방법 및 장치 Download PDF

Info

Publication number
KR20130107287A
KR20130107287A KR1020137007408A KR20137007408A KR20130107287A KR 20130107287 A KR20130107287 A KR 20130107287A KR 1020137007408 A KR1020137007408 A KR 1020137007408A KR 20137007408 A KR20137007408 A KR 20137007408A KR 20130107287 A KR20130107287 A KR 20130107287A
Authority
KR
South Korea
Prior art keywords
article
ultrasonic
megasonic energy
processing
resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137007408A
Other languages
English (en)
Korean (ko)
Inventor
프랑크 루드비히 홀슈타인스
알렉산더 리퍼트
Original Assignee
램 리서치 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리서치 아게 filed Critical 램 리서치 아게
Publication of KR20130107287A publication Critical patent/KR20130107287A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020137007408A 2010-09-24 2011-09-23 개선된 초음파 세정 방법 및 장치 Ceased KR20130107287A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,975 2010-09-24
US12/889,975 US9662686B2 (en) 2010-09-24 2010-09-24 Ultrasonic cleaning method and apparatus
PCT/IB2011/054195 WO2012038933A2 (en) 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus

Publications (1)

Publication Number Publication Date
KR20130107287A true KR20130107287A (ko) 2013-10-01

Family

ID=45869372

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137007408A Ceased KR20130107287A (ko) 2010-09-24 2011-09-23 개선된 초음파 세정 방법 및 장치

Country Status (7)

Country Link
US (1) US9662686B2 (https=)
JP (1) JP5974009B2 (https=)
KR (1) KR20130107287A (https=)
CN (1) CN103118810B (https=)
SG (1) SG188535A1 (https=)
TW (1) TWI473668B (https=)
WO (1) WO2012038933A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10391526B2 (en) 2013-12-12 2019-08-27 Lam Research Corporation Electrostatic chuck cleaning fixture
TWI698291B (zh) * 2016-11-02 2020-07-11 大陸商盛美半導體設備（上海）股份有限公司 襯底清洗方法及清洗裝置
JP6554128B2 (ja) 2017-02-28 2019-07-31 株式会社Ｓｕｂａｒｕ 繊維強化複合材料の製造方法
US10995422B2 (en) * 2017-05-26 2021-05-04 Sumitomo Electric Industries, Ltd. GaAs substrate and method for manufacturing the same
CN107570482A (zh) * 2017-07-06 2018-01-12 天津大学 界面的非特异性吸附物的去除装置及方法
JP6715226B2 (ja) 2017-10-25 2020-07-01 株式会社Ｓｕｂａｒｕ 複合材成形治具及び複合材成形方法
CN110560425B (zh) * 2019-09-20 2021-01-29 深圳先进技术研究院 超声清洗装置、清洗方法及其应用
US12269070B2 (en) * 2020-12-16 2025-04-08 The Boeing Company Flexible cavitation apparatus
CN116581067B (zh) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 基于器件湿法处理的兆声波系统的控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625249A (en) 1994-07-20 1997-04-29 Submicron Systems, Inc. Megasonic cleaning system
JP3511441B2 (ja) 1996-11-29 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法
US6290778B1 (en) 1998-08-12 2001-09-18 Hudson Technologies, Inc. Method and apparatus for sonic cleaning of heat exchangers
JP4608748B2 (ja) * 1999-08-05 2011-01-12 東京エレクトロン株式会社 洗浄装置、洗浄システム及び洗浄方法
US6729339B1 (en) * 2002-06-28 2004-05-04 Lam Research Corporation Method and apparatus for cooling a resonator of a megasonic transducer
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
WO2004112093A2 (en) 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
CN1822905A (zh) 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
CN1976765B (zh) 2004-06-29 2011-11-09 株式会社鹿儿岛超音波综合研究所 超声波清洗的方法与装置
US7392814B2 (en) 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
TWI259110B (en) 2005-09-22 2006-08-01 Delta Electronics Inc Ultrasonic cleaning system and method
JP4652959B2 (ja) * 2005-11-30 2011-03-16 芝浦メカトロニクス株式会社 基板の処理装置
KR100710803B1 (ko) * 2006-01-23 2007-04-23 삼성전자주식회사 기판 세정 장치
JP2008021672A (ja) * 2006-07-10 2008-01-31 Sony Corp ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置
WO2008008921A2 (en) * 2006-07-12 2008-01-17 Akrion Technologies, Inc. Tranducer assembly incorporating a transmitter having through holes, and method of cleaning
KR100931856B1 (ko) * 2007-08-24 2009-12-15 세메스 주식회사 기판 세정 장치 및 기판 세정 방법
JP2009178440A (ja) 2008-01-31 2009-08-13 Sammy Corp 演出表示装置及び遊技機

Also Published As

Publication number Publication date
TW201223652A (en) 2012-06-16
SG188535A1 (en) 2013-05-31
CN103118810A (zh) 2013-05-22
TWI473668B (zh) 2015-02-21
US20120073596A1 (en) 2012-03-29
CN103118810B (zh) 2015-07-01
WO2012038933A3 (en) 2012-07-12
JP5974009B2 (ja) 2016-08-23
JP2013543653A (ja) 2013-12-05
US9662686B2 (en) 2017-05-30
WO2012038933A2 (en) 2012-03-29

Similar Documents

Publication Publication Date Title
KR20130107287A (ko) 개선된 초음파 세정 방법 및 장치
US8486199B2 (en) Ultrasonic cleaning method and apparatus
US8327861B2 (en) Megasonic precision cleaning of semiconductor process equipment components and parts
CN102725824B (zh) 改进的超声波清洁液，方法及其设备
US20070207710A1 (en) Method and apparatus to process substrates with megasonic energy
JP2007311756A (ja) 超音波洗浄装置及び超音波洗浄方法
WO2017104194A1 (ja) 洗浄装置および洗浄方法、並びに膜分離バイオリアクタ
JP4248257B2 (ja) 超音波洗浄装置
JP4623706B2 (ja) 超音波洗浄処理装置
KR100579613B1 (ko) 초음파세정용 노즐 및 초음파세정장치
US20130319472A1 (en) Method and apparatus for processing wafer-shaped articles
KR20230107333A (ko) 초음파 세정을 위한 캐러셀 및 그 사용 방법
JP3927936B2 (ja) 枚葉式洗浄方法及び洗浄装置
JP4683841B2 (ja) ワイヤ、プロファイル、パイプなど互いに平行に移動するいくつかのストランド状（ｓｔｒａｎｇｆｏｅｒｍｉｇｅｎ、より糸状、素線、ひもを通したような）の製品を超音波洗浄するための構成
JP2005158913A (ja) 超音波ノズルおよび基板処理装置
KR100576823B1 (ko) 기판세정장치
Suzuki et al. Novel ultrasonic cleaning equipment using waveguide mode
JP5169264B2 (ja) 洗浄装置
JP2011155240A (ja) 半導体ウェーハの超音波洗浄方法及び超音波洗浄装置
RU2173587C2 (ru) Устройство для мегазвуковой очистки полупроводниковых пластин
KR20070073311A (ko) 웨이퍼 초음파 세정장치 및 이를 이용한 웨이퍼 세정방법
JP2006043622A (ja) 超音波水処理装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20130322

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160922

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20171019

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180425

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20171019

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I