SG188535A1 - Improved ultrasonic cleaning method and apparatus - Google Patents

Improved ultrasonic cleaning method and apparatus Download PDF

Info

Publication number
SG188535A1
SG188535A1 SG2013018825A SG2013018825A SG188535A1 SG 188535 A1 SG188535 A1 SG 188535A1 SG 2013018825 A SG2013018825 A SG 2013018825A SG 2013018825 A SG2013018825 A SG 2013018825A SG 188535 A1 SG188535 A1 SG 188535A1
Authority
SG
Singapore
Prior art keywords
ultrasonic
article
megasonic energy
treatment fluid
resonator
Prior art date
Application number
SG2013018825A
Other languages
English (en)
Inventor
Frank Ludwig Holsteyns
Alexander Lippert
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG188535A1 publication Critical patent/SG188535A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG2013018825A 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus SG188535A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/889,975 US9662686B2 (en) 2010-09-24 2010-09-24 Ultrasonic cleaning method and apparatus
PCT/IB2011/054195 WO2012038933A2 (en) 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus

Publications (1)

Publication Number Publication Date
SG188535A1 true SG188535A1 (en) 2013-05-31

Family

ID=45869372

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013018825A SG188535A1 (en) 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus

Country Status (7)

Country Link
US (1) US9662686B2 (https=)
JP (1) JP5974009B2 (https=)
KR (1) KR20130107287A (https=)
CN (1) CN103118810B (https=)
SG (1) SG188535A1 (https=)
TW (1) TWI473668B (https=)
WO (1) WO2012038933A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10391526B2 (en) 2013-12-12 2019-08-27 Lam Research Corporation Electrostatic chuck cleaning fixture
TWI698291B (zh) * 2016-11-02 2020-07-11 大陸商盛美半導體設備（上海）股份有限公司 襯底清洗方法及清洗裝置
JP6554128B2 (ja) 2017-02-28 2019-07-31 株式会社Ｓｕｂａｒｕ 繊維強化複合材料の製造方法
US10995422B2 (en) * 2017-05-26 2021-05-04 Sumitomo Electric Industries, Ltd. GaAs substrate and method for manufacturing the same
CN107570482A (zh) * 2017-07-06 2018-01-12 天津大学 界面的非特异性吸附物的去除装置及方法
JP6715226B2 (ja) 2017-10-25 2020-07-01 株式会社Ｓｕｂａｒｕ 複合材成形治具及び複合材成形方法
CN110560425B (zh) * 2019-09-20 2021-01-29 深圳先进技术研究院 超声清洗装置、清洗方法及其应用
US12269070B2 (en) * 2020-12-16 2025-04-08 The Boeing Company Flexible cavitation apparatus
CN116581067B (zh) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 基于器件湿法处理的兆声波系统的控制方法

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US5625249A (en) 1994-07-20 1997-04-29 Submicron Systems, Inc. Megasonic cleaning system
JP3511441B2 (ja) 1996-11-29 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法
US6290778B1 (en) 1998-08-12 2001-09-18 Hudson Technologies, Inc. Method and apparatus for sonic cleaning of heat exchangers
JP4608748B2 (ja) * 1999-08-05 2011-01-12 東京エレクトロン株式会社 洗浄装置、洗浄システム及び洗浄方法
US6729339B1 (en) * 2002-06-28 2004-05-04 Lam Research Corporation Method and apparatus for cooling a resonator of a megasonic transducer
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
WO2004112093A2 (en) 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
CN1822905A (zh) 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
CN1976765B (zh) 2004-06-29 2011-11-09 株式会社鹿儿岛超音波综合研究所 超声波清洗的方法与装置
US7392814B2 (en) 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
TWI259110B (en) 2005-09-22 2006-08-01 Delta Electronics Inc Ultrasonic cleaning system and method
JP4652959B2 (ja) * 2005-11-30 2011-03-16 芝浦メカトロニクス株式会社 基板の処理装置
KR100710803B1 (ko) * 2006-01-23 2007-04-23 삼성전자주식회사 기판 세정 장치
JP2008021672A (ja) * 2006-07-10 2008-01-31 Sony Corp ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置
WO2008008921A2 (en) * 2006-07-12 2008-01-17 Akrion Technologies, Inc. Tranducer assembly incorporating a transmitter having through holes, and method of cleaning
KR100931856B1 (ko) * 2007-08-24 2009-12-15 세메스 주식회사 기판 세정 장치 및 기판 세정 방법
JP2009178440A (ja) 2008-01-31 2009-08-13 Sammy Corp 演出表示装置及び遊技機

Also Published As

Publication number Publication date
TW201223652A (en) 2012-06-16
CN103118810A (zh) 2013-05-22
TWI473668B (zh) 2015-02-21
US20120073596A1 (en) 2012-03-29
CN103118810B (zh) 2015-07-01
WO2012038933A3 (en) 2012-07-12
JP5974009B2 (ja) 2016-08-23
JP2013543653A (ja) 2013-12-05
US9662686B2 (en) 2017-05-30
WO2012038933A2 (en) 2012-03-29
KR20130107287A (ko) 2013-10-01

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