JP5974009B2 - 改良超音波洗浄方法および装置 - Google Patents

改良超音波洗浄方法および装置 Download PDF

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Publication number
JP5974009B2
JP5974009B2 JP2013529756A JP2013529756A JP5974009B2 JP 5974009 B2 JP5974009 B2 JP 5974009B2 JP 2013529756 A JP2013529756 A JP 2013529756A JP 2013529756 A JP2013529756 A JP 2013529756A JP 5974009 B2 JP5974009 B2 JP 5974009B2
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article
ultrasonic
fluid
megasonic energy
processing
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Japanese (ja)
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JP2013543653A (ja
JP2013543653A5 (enExample
Inventor
ホルステインズ・フランク・ルートヴィヒ
リッパート・アレクサンダー
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Lam Research AG
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Lam Research AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2013529756A 2010-09-24 2011-09-23 改良超音波洗浄方法および装置 Active JP5974009B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,975 US9662686B2 (en) 2010-09-24 2010-09-24 Ultrasonic cleaning method and apparatus
US12/889,975 2010-09-24
PCT/IB2011/054195 WO2012038933A2 (en) 2010-09-24 2011-09-23 Improved ultrasonic cleaning method and apparatus

Publications (3)

Publication Number Publication Date
JP2013543653A JP2013543653A (ja) 2013-12-05
JP2013543653A5 JP2013543653A5 (enExample) 2014-11-13
JP5974009B2 true JP5974009B2 (ja) 2016-08-23

Family

ID=45869372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013529756A Active JP5974009B2 (ja) 2010-09-24 2011-09-23 改良超音波洗浄方法および装置

Country Status (7)

Country Link
US (1) US9662686B2 (enExample)
JP (1) JP5974009B2 (enExample)
KR (1) KR20130107287A (enExample)
CN (1) CN103118810B (enExample)
SG (1) SG188535A1 (enExample)
TW (1) TWI473668B (enExample)
WO (1) WO2012038933A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10391526B2 (en) 2013-12-12 2019-08-27 Lam Research Corporation Electrostatic chuck cleaning fixture
TWI698291B (zh) 2016-11-02 2020-07-11 大陸商盛美半導體設備（上海）股份有限公司 襯底清洗方法及清洗裝置
JP6554128B2 (ja) * 2017-02-28 2019-07-31 株式会社Ｓｕｂａｒｕ 繊維強化複合材料の製造方法
WO2018216203A1 (ja) * 2017-05-26 2018-11-29 住友電気工業株式会社 ＧａＡｓ基板およびその製造方法
CN107570482A (zh) * 2017-07-06 2018-01-12 天津大学 界面的非特异性吸附物的去除装置及方法
JP6715226B2 (ja) 2017-10-25 2020-07-01 株式会社Ｓｕｂａｒｕ 複合材成形治具及び複合材成形方法
CN110560425B (zh) * 2019-09-20 2021-01-29 深圳先进技术研究院 超声清洗装置、清洗方法及其应用
US12269070B2 (en) * 2020-12-16 2025-04-08 The Boeing Company Flexible cavitation apparatus
CN116581067B (zh) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 基于器件湿法处理的兆声波系统的控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625249A (en) 1994-07-20 1997-04-29 Submicron Systems, Inc. Megasonic cleaning system
JP3511441B2 (ja) 1996-11-29 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法
US6290778B1 (en) 1998-08-12 2001-09-18 Hudson Technologies, Inc. Method and apparatus for sonic cleaning of heat exchangers
JP4608748B2 (ja) * 1999-08-05 2011-01-12 東京エレクトロン株式会社 洗浄装置、洗浄システム及び洗浄方法
US6729339B1 (en) * 2002-06-28 2004-05-04 Lam Research Corporation Method and apparatus for cooling a resonator of a megasonic transducer
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7238085B2 (en) 2003-06-06 2007-07-03 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
CN1822905A (zh) 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
JP4361088B2 (ja) 2004-06-29 2009-11-11 株式会社鹿児島超音波総合研究所 超音波洗浄方法および装置
US7392814B2 (en) 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
TWI259110B (en) 2005-09-22 2006-08-01 Delta Electronics Inc Ultrasonic cleaning system and method
JP4652959B2 (ja) * 2005-11-30 2011-03-16 芝浦メカトロニクス株式会社 基板の処理装置
KR100710803B1 (ko) * 2006-01-23 2007-04-23 삼성전자주식회사 기판 세정 장치
JP2008021672A (ja) * 2006-07-10 2008-01-31 Sony Corp ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置
WO2008008921A2 (en) * 2006-07-12 2008-01-17 Akrion Technologies, Inc. Tranducer assembly incorporating a transmitter having through holes, and method of cleaning
KR100931856B1 (ko) 2007-08-24 2009-12-15 세메스 주식회사 기판 세정 장치 및 기판 세정 방법
JP2009178440A (ja) 2008-01-31 2009-08-13 Sammy Corp 演出表示装置及び遊技機

Also Published As

Publication number Publication date
WO2012038933A3 (en) 2012-07-12
JP2013543653A (ja) 2013-12-05
TW201223652A (en) 2012-06-16
KR20130107287A (ko) 2013-10-01
CN103118810B (zh) 2015-07-01
US20120073596A1 (en) 2012-03-29
SG188535A1 (en) 2013-05-31
WO2012038933A2 (en) 2012-03-29
TWI473668B (zh) 2015-02-21
CN103118810A (zh) 2013-05-22
US9662686B2 (en) 2017-05-30

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