SG188535A1 - Improved ultrasonic cleaning method and apparatus - Google Patents
Improved ultrasonic cleaning method and apparatus Download PDFInfo
- Publication number
- SG188535A1 SG188535A1 SG2013018825A SG2013018825A SG188535A1 SG 188535 A1 SG188535 A1 SG 188535A1 SG 2013018825 A SG2013018825 A SG 2013018825A SG 2013018825 A SG2013018825 A SG 2013018825A SG 188535 A1 SG188535 A1 SG 188535A1
- Authority
- SG
- Singapore
- Prior art keywords
- ultrasonic
- article
- megasonic energy
- treatment fluid
- resonator
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004506 ultrasonic cleaning Methods 0.000 title description 4
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 239000012530 fluid Substances 0.000 claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 239000006185 dispersion Substances 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 15
- 239000007924 injection Substances 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000000243 solution Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000006911 nucleation Effects 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004581 coalescence Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/889,975 US9662686B2 (en) | 2010-09-24 | 2010-09-24 | Ultrasonic cleaning method and apparatus |
| PCT/IB2011/054195 WO2012038933A2 (en) | 2010-09-24 | 2011-09-23 | Improved ultrasonic cleaning method and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG188535A1 true SG188535A1 (en) | 2013-05-31 |
Family
ID=45869372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013018825A SG188535A1 (en) | 2010-09-24 | 2011-09-23 | Improved ultrasonic cleaning method and apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9662686B2 (enExample) |
| JP (1) | JP5974009B2 (enExample) |
| KR (1) | KR20130107287A (enExample) |
| CN (1) | CN103118810B (enExample) |
| SG (1) | SG188535A1 (enExample) |
| TW (1) | TWI473668B (enExample) |
| WO (1) | WO2012038933A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10391526B2 (en) | 2013-12-12 | 2019-08-27 | Lam Research Corporation | Electrostatic chuck cleaning fixture |
| TWI698291B (zh) | 2016-11-02 | 2020-07-11 | 大陸商盛美半導體設備（上海）股份有限公司 | 襯底清洗方法及清洗裝置 |
| JP6554128B2 (ja) * | 2017-02-28 | 2019-07-31 | 株式会社Ｓｕｂａｒｕ | 繊維強化複合材料の製造方法 |
| WO2018216203A1 (ja) * | 2017-05-26 | 2018-11-29 | 住友電気工業株式会社 | ＧａＡｓ基板およびその製造方法 |
| CN107570482A (zh) * | 2017-07-06 | 2018-01-12 | 天津大学 | 界面的非特异性吸附物的去除装置及方法 |
| JP6715226B2 (ja) | 2017-10-25 | 2020-07-01 | 株式会社Ｓｕｂａｒｕ | 複合材成形治具及び複合材成形方法 |
| CN110560425B (zh) * | 2019-09-20 | 2021-01-29 | 深圳先进技术研究院 | 超声清洗装置、清洗方法及其应用 |
| US12269070B2 (en) * | 2020-12-16 | 2025-04-08 | The Boeing Company | Flexible cavitation apparatus |
| CN116581067B (zh) * | 2023-07-12 | 2023-09-22 | 北京东方金荣超声电器有限公司 | 基于器件湿法处理的兆声波系统的控制方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5625249A (en) | 1994-07-20 | 1997-04-29 | Submicron Systems, Inc. | Megasonic cleaning system |
| JP3511441B2 (ja) | 1996-11-29 | 2004-03-29 | 忠弘 大見 | 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法 |
| US6290778B1 (en) | 1998-08-12 | 2001-09-18 | Hudson Technologies, Inc. | Method and apparatus for sonic cleaning of heat exchangers |
| JP4608748B2 (ja) * | 1999-08-05 | 2011-01-12 | 東京エレクトロン株式会社 | 洗浄装置、洗浄システム及び洗浄方法 |
| US6729339B1 (en) * | 2002-06-28 | 2004-05-04 | Lam Research Corporation | Method and apparatus for cooling a resonator of a megasonic transducer |
| US7240679B2 (en) | 2002-09-30 | 2007-07-10 | Lam Research Corporation | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold |
| US7238085B2 (en) | 2003-06-06 | 2007-07-03 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
| CN1822905A (zh) | 2003-06-06 | 2006-08-23 | P.C.T.系统公司 | 用兆频声波能量处理基片的方法和设备 |
| JP4361088B2 (ja) | 2004-06-29 | 2009-11-11 | 株式会社鹿児島超音波総合研究所 | 超音波洗浄方法および装置 |
| US7392814B2 (en) | 2004-12-24 | 2008-07-01 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and method |
| TWI259110B (en) | 2005-09-22 | 2006-08-01 | Delta Electronics Inc | Ultrasonic cleaning system and method |
| JP4652959B2 (ja) * | 2005-11-30 | 2011-03-16 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
| KR100710803B1 (ko) * | 2006-01-23 | 2007-04-23 | 삼성전자주식회사 | 기판 세정 장치 |
| JP2008021672A (ja) * | 2006-07-10 | 2008-01-31 | Sony Corp | ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置 |
| WO2008008921A2 (en) * | 2006-07-12 | 2008-01-17 | Akrion Technologies, Inc. | Tranducer assembly incorporating a transmitter having through holes, and method of cleaning |
| KR100931856B1 (ko) | 2007-08-24 | 2009-12-15 | 세메스 주식회사 | 기판 세정 장치 및 기판 세정 방법 |
| JP2009178440A (ja) | 2008-01-31 | 2009-08-13 | Sammy Corp | 演出表示装置及び遊技機 |
-
2010
- 2010-09-24 US US12/889,975 patent/US9662686B2/en active Active
-
2011
- 2011-09-22 TW TW100134216A patent/TWI473668B/zh active
- 2011-09-23 SG SG2013018825A patent/SG188535A1/en unknown
- 2011-09-23 CN CN201180045874.3A patent/CN103118810B/zh active Active
- 2011-09-23 WO PCT/IB2011/054195 patent/WO2012038933A2/en not_active Ceased
- 2011-09-23 KR KR1020137007408A patent/KR20130107287A/ko not_active Ceased
- 2011-09-23 JP JP2013529756A patent/JP5974009B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012038933A3 (en) | 2012-07-12 |
| JP5974009B2 (ja) | 2016-08-23 |
| JP2013543653A (ja) | 2013-12-05 |
| TW201223652A (en) | 2012-06-16 |
| KR20130107287A (ko) | 2013-10-01 |
| CN103118810B (zh) | 2015-07-01 |
| US20120073596A1 (en) | 2012-03-29 |
| WO2012038933A2 (en) | 2012-03-29 |
| TWI473668B (zh) | 2015-02-21 |
| CN103118810A (zh) | 2013-05-22 |
| US9662686B2 (en) | 2017-05-30 |
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