JP5965771B2 - エポキシ封止及び積層用接着剤及び製造方法 - Google Patents

エポキシ封止及び積層用接着剤及び製造方法 Download PDF

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Publication number
JP5965771B2
JP5965771B2 JP2012171561A JP2012171561A JP5965771B2 JP 5965771 B2 JP5965771 B2 JP 5965771B2 JP 2012171561 A JP2012171561 A JP 2012171561A JP 2012171561 A JP2012171561 A JP 2012171561A JP 5965771 B2 JP5965771 B2 JP 5965771B2
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semiconductor device
passivation layer
adhesive
insulating
present
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Japanese (ja)
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JP2013040333A5 (https=
JP2013040333A (ja
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トーマス・バート・ゴルチカ
ポール・アラン・マックコネリー
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General Electric Co
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General Electric Co
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
JP2012171561A 2011-08-16 2012-08-02 エポキシ封止及び積層用接着剤及び製造方法 Active JP5965771B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/210,763 US8431444B2 (en) 2011-08-16 2011-08-16 Epoxy encapsulating and lamination adhesive and method of making same
US13/210,763 2011-08-16

Publications (3)

Publication Number Publication Date
JP2013040333A JP2013040333A (ja) 2013-02-28
JP2013040333A5 JP2013040333A5 (https=) 2015-09-17
JP5965771B2 true JP5965771B2 (ja) 2016-08-10

Family

ID=46640593

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JP2012171561A Active JP5965771B2 (ja) 2011-08-16 2012-08-02 エポキシ封止及び積層用接着剤及び製造方法

Country Status (5)

Country Link
US (2) US8431444B2 (https=)
EP (1) EP2559732B1 (https=)
JP (1) JP5965771B2 (https=)
KR (1) KR101951836B1 (https=)
CN (2) CN102952511B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
JP2016500744A (ja) * 2012-10-24 2016-01-14 ダウ グローバル テクノロジーズ エルエルシー 常温硬化耐候性コーティング
JP6374722B2 (ja) * 2014-07-23 2018-08-15 積水化学工業株式会社 インクジェット用熱硬化性接着剤、半導体装置の製造方法及び電子部品
JP6787900B2 (ja) * 2015-09-01 2020-11-18 リンテック株式会社 粘着シート
US10043541B1 (en) * 2015-12-12 2018-08-07 Magnecomp Corporation Disk drive head stack assembly having height-controlled suspension circuit tail tack
WO2017170452A1 (ja) * 2016-03-29 2017-10-05 三井化学東セロ株式会社 半導体装置製造用粘着性フィルムおよび半導体装置の製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5136800B2 (https=) * 1972-03-15 1976-10-12
DE3109803A1 (de) * 1981-03-13 1982-09-30 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Epoxy-imid-zusammensetzungen
CA1162684A (en) * 1981-03-17 1984-02-21 E.I. Du Pont De Nemours And Company Epoxy imide compositions
US4554342A (en) * 1984-07-30 1985-11-19 Shell Oil Company Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt
US4795680A (en) * 1986-05-09 1989-01-03 General Electric Company Polyimide-siloxanes, method of making and use
JPH0749572B2 (ja) * 1987-06-12 1995-05-31 住友スリ−エム株式会社 電食防止用電気絶縁性接着剤
US4916202A (en) * 1987-09-17 1990-04-10 University Of Dayton Epoxy resin
JPH07138537A (ja) * 1993-11-17 1995-05-30 Matsushita Electric Works Ltd 熱硬化性接着シート
US6090486A (en) * 1999-04-22 2000-07-18 Virginia Polytechnic Institute & State University Fiber materials for manufacturing fiber reinforced phenolic composites and adhesives with nucleophilic initiators positioned on the fiber surfaces
US6242282B1 (en) 1999-10-04 2001-06-05 General Electric Company Circuit chip package and fabrication method
US6232151B1 (en) 1999-11-01 2001-05-15 General Electric Company Power electronic module packaging
US6459561B1 (en) 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
BR0212508B1 (pt) * 2001-09-12 2011-08-09 rede polimérica, peça moldada de resina, pelìcula, substrato revestido, artigo, processo para formação do mesmo, camada adesiva ou agente de ligação, compósito, mistura polimérica e composição curável.
US6734262B2 (en) * 2002-01-07 2004-05-11 General Electric Company Methods of forming conductive thermoplastic polyetherimide polyester compositions and articles formed thereby
US6737002B1 (en) 2002-02-04 2004-05-18 Lockheed Martin Corporation Fabrication of plastic module with exposed backside contact
DE10313891A1 (de) 2003-03-27 2004-10-14 Epcos Ag Elektrisches Vielschichtbauelement
US7071263B2 (en) * 2003-05-19 2006-07-04 3M Innovative Properties Company Epoxy adhesives and bonded substrates
US7015260B2 (en) * 2003-06-04 2006-03-21 E.I. Du Pont De Nemours And Company High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto
WO2005015309A2 (en) * 2003-07-17 2005-02-17 Cytec Surface Specialties, S.A. Alkali-developable radiation curable composition
CN1288194C (zh) * 2005-01-31 2006-12-06 南京工业大学 一种挠性印刷线路板用聚酰亚胺薄膜的制备方法
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
TWI460249B (zh) * 2006-02-16 2014-11-11 Shinetsu Chemical Co 黏合組成物、黏合膜及製造半導體元件的方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
GB0700960D0 (en) * 2007-01-18 2007-02-28 3M Innovative Properties Co High strength epoxy adhesive and uses thereof
CN102077341B (zh) * 2008-06-26 2014-04-23 Nxp股份有限公司 封装半导体产品及其制造方法
ES2379691T3 (es) * 2008-07-22 2012-04-30 Basf Se Preparados que contienen resina de epóxido y mezclas de aminas con derivados de guanidina
US8114708B2 (en) 2008-09-30 2012-02-14 General Electric Company System and method for pre-patterned embedded chip build-up
US7964974B2 (en) 2008-12-02 2011-06-21 General Electric Company Electronic chip package with reduced contact pad pitch
US8008781B2 (en) 2008-12-02 2011-08-30 General Electric Company Apparatus and method for reducing pitch in an integrated circuit
CA2750703A1 (en) * 2009-02-24 2010-09-02 Gary A. Hunter Curable epoxy resin compositions and cured products therefrom
US8008125B2 (en) 2009-03-06 2011-08-30 General Electric Company System and method for stacked die embedded chip build-up
JP5881931B2 (ja) * 2009-07-21 2016-03-09 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置の製造方法、半導体装置
JP5263050B2 (ja) * 2009-07-21 2013-08-14 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置の製造方法、半導体装置
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
US9059108B2 (en) * 2012-02-28 2015-06-16 Stats Chippac Ltd. Integrated circuit packaging system with interconnects

Also Published As

Publication number Publication date
KR20130019359A (ko) 2013-02-26
US20130045575A1 (en) 2013-02-21
CN102952511B (zh) 2016-06-29
EP2559732B1 (en) 2017-04-26
JP2013040333A (ja) 2013-02-28
EP2559732A2 (en) 2013-02-20
CN106047245B (zh) 2019-10-22
US20130214435A1 (en) 2013-08-22
CN106047245A (zh) 2016-10-26
EP2559732A3 (en) 2015-12-09
KR101951836B1 (ko) 2019-02-25
US8431444B2 (en) 2013-04-30
CN102952511A (zh) 2013-03-06
US8629003B2 (en) 2014-01-14

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