JP5963500B2 - Electronic component mounting device - Google Patents

Description

  In the present invention, an electronic component supplied from a component supply device is taken out by a plurality of suction nozzles provided in a plurality of mounting heads, and an electronic component sucked and held by the suction nozzle is imaged by a component recognition camera. The present invention relates to a component mounting apparatus.

  The above-described electronic component mounting apparatus is disclosed in Patent Document 1 and the like. Then, in the electronic component mounting apparatus having a plurality of mounting heads each having a plurality of suction nozzles, the electronic components suctioned and held by the plurality of suction nozzles are collectively imaged in units of mounting heads. The position of the electronic component relative to each suction nozzle is grasped by recognizing the generated image, and the electronic component is mounted on a printed circuit board as a substrate so as to correct the position shift.

JP 2010-87305 A

  However, since the electronic components sucked and held by the plurality of suction nozzles are collectively imaged in units of mounting heads, when there are two mounting heads, the number of times of imaging is two times, and the recognition process Since the number of times is also twice, the imaging / recognition processing of the electronic component is not efficient.

  Accordingly, an object of the present invention is to efficiently perform imaging and recognition processing of an electronic component by performing imaging once even if there are two mounting heads including a plurality of suction nozzles.

Therefore, according to the first aspect of the present invention, the electronic component supplied from the component supply device is taken out by a plurality of suction nozzles provided in a plurality of mounting heads, and the electronic component sucked and held by the suction nozzle is imaged by a component recognition camera. In the electronic component mounting apparatus as described above,
A prism for superimposing the images of the two mounting heads is provided, and a plurality of suction nozzles provided on one mounting head and a plurality of suction nozzles provided on the other mounting head are provided by a single component recognition camera. It is characterized by superimposing images without being in the same position .

According to a second invention, in the first invention, each of the mounting heads is provided with the plurality of suction nozzles at predetermined intervals on the circumference, and the one mounting head is rotated to The suction nozzles are not in the same position .

  According to the present invention, even when there are two mounting heads provided with a plurality of suction nozzles, the imaging and recognition processing of the electronic component can be performed efficiently by performing the number of imaging operations once.

It is a top view of an electronic component mounting apparatus. It is a front view which shows the relationship between a mounting head and an imaging device. It is a longitudinal cross-sectional view of an imaging device. It is a control block diagram of an electronic component mounting apparatus. It is a figure which shows the image before the synthesis | combination of both mounting heads. It is a figure which shows the image of both the mounting heads synthesize | combined.

  An embodiment of the present invention will be described below with reference to FIG. 1 for an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P as a substrate. The electronic component mounting apparatus 1 includes a transport device 2 that transports each printed circuit board P, component supply devices 3A and 3B that are disposed on the front side and the back side of the device main body and supply electronic components, and a drive source. A pair of beams 4A and 4B that can move in one direction (reciprocating in the Y direction) and mounting heads 6A1 and 6A2, 6B1 and 6B2 are arranged adjacent to each other in the X direction, and the direction along each of the beams 4A and 4B. Are provided with head mounting bodies 10A and 10B which can be moved by respective driving sources. A plurality of suction nozzles 5 are provided on the mounting heads 6A and 6B, respectively.

  As for the said conveying apparatus 2, the electronic component mounting apparatus 1 is provided with 2 A of supply conveyors, the positioning part 2B which positions and fixes the printed circuit board P, and the discharge conveyor 2C. Then, the supply conveyor 2A conveys each printed circuit board P received from the upstream to the positioning unit 2B, and after the electronic components are mounted on each substrate positioned by the positioning device in each positioning unit 2B, the discharge conveyor 2C It is the structure conveyed to the downstream apparatus after that.

  The component supply devices 3A and 3B are disposed at the back side and the front side of the transport device 2, and a large number of component supply units 8 are arranged in parallel on the feeder bases of the cart bases 7A and 7B as mounting bases. Is. Each cart base 7A, 7B is detachably disposed on the apparatus main body via a connector so that the tip on the component supply side of the component supply unit 8 faces the conveyance path of the printed circuit board P, and each cart base 7A, When 7B is properly attached to the apparatus main body, power is supplied to the component supply unit 8 mounted on the cart bases 7A and 7B, and when the handle is released and the handle is pulled, it can be moved by a caster provided on the lower surface. It is a configuration.

  The pair of front and rear beams 4A and 4B that are long in the X direction are fixed to the beams 4A and 4B along a pair of front and rear guides that are driven by a Y direction motor 9 composed of linear motors. The slider slides and moves individually in the Y direction. The Y-direction motor 9 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are provided with mounting heads 6A1 and 6A2 and 6B1 and 6B2 that are moved along the guide by an X-direction motor 11 composed of a linear motor in the longitudinal direction (X direction). The X-direction motor 11 includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided between the stators and mounted on the mounting heads 6A1 and 6A2 and 6B1 and 6B2. It consists of.

  Accordingly, the mounting heads 6A1 and 6A2, 6B1 and 6B2 are provided inside the beams 4A and 4B so as to face each other. The components can be taken out and can be mounted on the printed circuit board P on the transport device 2. The mounting heads 6B1 and 6B2 take out the electronic components from the corresponding front-side component supply device 3B and mount them on the printed circuit board P. be able to.

  Each mounting head 6A1, 6A2, 6B1, 6B2 is provided with eight suction nozzles 5 biased downward by respective springs at predetermined intervals on the circumference every 45 degrees. The suction nozzle 5 can be moved up and down by a vertical axis motor 12, and the mounting heads 6A1, 6A2, 6B1, and 6B2 are rotated around the vertical axis by a θ-axis motor 13, resulting in the mounting heads 6A1, 6A2, and 6B1. , 6B2 can move in the X and Y directions, can rotate around a vertical line, and can move up and down.

  In addition, each imaging device 14 collectively images the electronic components sucked and held by the suction nozzles 5 provided in the mounting heads 6A1 and 6A2 and 6B1 and 6B2. Each imaging device 14 will be described. A component recognition camera 15 disposed in the lower part, and a prism that is disposed above the component recognition camera 15 and combines the images of the two mounting heads 6A1 and 6A2 or 6B1 and 6B2. 16, a lens storage device 20 that stores a lens 17, a diaphragm 18, and a lens 19, a pair of half mirrors 21A and 21B disposed at positions sandwiching the lens storage device, and above the half mirrors 21A and 21B. It comprises illumination devices 23A and 23B configured by arranging a plurality of reflective LEDs 22 in a ring shape. The illumination devices 23A and 23B irradiate illumination light toward the electronic component D sucked and held by the suction nozzle 5.

  The lighting devices 23A and 23B are positioned above the pair of half mirrors 21A and 21B, and the mounting heads 6A1 and 6A2 or 6B1 and 6B2 are positioned above the lighting devices 23A and 23B, respectively. The

  The prism 16 is formed by combining and combining four triangular prisms, which are half mirrors 16A, 16B, 16C, and 16D, without a gap. The four coupling surfaces become half mirror surfaces. The lower surfaces 6C of the mounting heads 6A1, 6A2, 6B1, and 6B2 are colored black, and a diffusion plate 25 is attached to each suction nozzle 5.

  FIG. 4 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is comprehensively controlled by the control device 30, and a storage device 31 for storing various data is connected to the control device 30 via a bus line 32. Further, a monitor 33 as a display device for displaying an operation screen or the like and a touch panel switch 34 as an input means formed on the display screen of the monitor 33 are connected to the control device 30 via an interface 35. The Y-direction motor 9 and the like are connected to the control device 30 via a drive circuit 36 and an interface 35. The control device 30 functions as a control device, a determination device, a comparison device, a calculation device, an update device, and the like.

  The storage device 31 stores mounting data for each type of printed circuit board P. The mounting data includes, for each mounting order (mounting step number), position information in the X direction (mounting coordinates X) and position information in the Y direction (mounting coordinates Y) on each printed circuit board P. , Mounting angle information (mounting angle θ), component arrangement number information of each component supply unit 8, and the like.

  Further, the storage device 31 stores component arrangement data of each electronic component type (component ID) corresponding to the component arrangement number of each of the component supply units 8 arranged on the cart bases 7A and 7B. Yes.

  Further, the storage device 31 stores component library data for each electronic component including shape data, recognition data, control data, and component supply data representing the characteristics of the electronic component.

  A recognition processing device 37 is connected to the control device 30 via the interface 35. The recognition processing device 37 performs recognition processing of an image captured by the component recognition camera 15, and the control device The processing result is sent to 30. That is, the control device 30 outputs an instruction to the recognition processing device 37 so as to perform recognition processing (such as calculation of a positional deviation amount) on the image captured by the component recognition camera 15 and receives a recognition processing result from the recognition processing device 37. Is.

  With the above configuration, the mounting operation of the electronic component on the printed circuit board P will be described. First, when the electronic component mounting operation of the electronic component mounting apparatus 1 is started, if the printed circuit board P is inherited from the previous process apparatus and is on the supply conveyor 2A, the electronic component mounting apparatus 1 is transported to the positioning unit 2B and positioned by the positioning apparatus. Is done.

  And the operation | movement which mounts an electronic component on the printed circuit board P positioned in this way is started. That is, since the mounting heads 6A1 and 6A2 and 6B1 and 6B2 are chain-adsorbed, the control device 30 takes out electronic components from the mounting data by one reciprocation between the component supply devices 3A and 3B and the printed circuit board P. The mounting step number for mounting is cut out, and the electronic component can be chain-sucked with respect to the maximum number “8” of the suction nozzles 5 provided in each mounting head 6A1, 6A2, 6B1, 6B2, for example, mounting head 6A1 , 6A2, 6B1, and 6B2 all eight suction nozzles 5 are suctioned.

  In other words, the mounting heads 6A1 and 6A2 on the back side move in the Y direction by the Y direction motor 9 and the beam 4A moves, and in the X direction, the X direction motor 11 drives and moves in the XY direction. The parts supply unit 8 is moved to the parts removal position. Then, the control device 30 controls the vertical axis drive motor 12 to lower the suction nozzle 5 and suck and take out the electronic components of the component supply unit 8. Similarly, each of the eight suction nozzles 5 of the mounting heads 6B1 and 6B2 takes out the electronic component from the component supply device 3B.

  Thereafter, the vertical axis drive motor 12 of the mounting heads 6A1, 6A2, 6B1, and 6B2 is controlled to start raising the suction nozzle 5, and a predetermined position on the printed circuit board P where the suction nozzle 5 of the mounting head 6A is positioned. In the middle of the movement, a recognition processing operation for the electronic component sucked and held by the suction nozzles 5 of the mounting heads 6A1 and 6A2 or 6B1 and 6B2 is performed.

  In this case, each component recognition camera 15 takes an image of the electronic component sucked and held by the suction nozzle 5 while the mounting heads 6A1 and 6A2 or 6B1 and 6B move (fly recognition), and each mounting head 6A1. 6A2 or 6B1 and 6B2 and the electronic components sucked and held by the suction nozzles 5 provided in 6B2 are collectively imaged.

  That is, as shown in FIGS. 2 and 3, the mounting heads 6A1 and 6A2 will be described as an example. The mounting heads 6A1 and 6A2 are passed over the component recognition camera 15, and the mounting heads 6A1 and 6A2 are moved during the movement. The plurality of electronic components sucked and held by the plurality of suction nozzles 15 are collectively imaged.

  That is, when the mounting heads 6A1 and 6A2 are positioned above the illumination devices 23A and 23B, respectively, the right mounting head 6A2 is rotated 45 degrees clockwise by the θ-axis motor 13, and each of the mounting heads 6A1 and 6A2 is rotated. The positions of the suction nozzles 5 are not the same. In this state, the lighting devices 23A and 23B irradiate light toward the electronic components D sucked and held by the suction nozzles 5. Then, half of the light reflected by each electronic component D is transmitted by the half mirrors 21A and 21B and half of the light is reflected and enters the prism 16 from the lateral direction. Then, half of the reflected light from the left side of FIG. 3 from the half mirror 21A is transmitted by the half mirrors 16D and 16C and half of the reflected light is reflected downward, and from the half mirror 21B in FIG. Half of the reflected light from the right is transmitted by the half mirrors 16B and 16C and half of the reflected light is reflected downward, as shown on the right of the image of the mounting head 6A1 as shown on the left in FIG. The image of the mounting head 6A2 is synthesized as one image as shown in FIG. In this case, the combined reflected image is captured by the component recognition camera 15 via the lens 17, the diaphragm 18 and the lens 19.

  In this case, when the mounting heads 6A1 and 6A2 are positioned above the illumination devices 23A and 23B, respectively, the right mounting head 6A2 is at a position rotated 45 degrees clockwise. The suction nozzles 5 of the heads 6A1 and 6A2 are not overlapped.

  Then, a plurality of electronic components D sucked and held by the plurality of suction nozzles 5 are collectively picked up while the mounting heads 6A1 and 6A2 are moving, and the recognition processing device 37 recognizes the picked up one image. Thus, the positional deviation with respect to each of the 16 suction nozzles 5 is grasped. In this case, since there is only one image for the mounting heads 6A1 and 6A2, the recognition process is performed quickly, so that the production efficiency is improved. In addition, regarding each electronic component sucked and held by the suction nozzle 5 of the mounting heads 6B1 and 6B2, the positional deviation with respect to each suction nozzle 5 is grasped.

  Then, each component recognition processing result is added to the mounting coordinates of the mounting data, and each electronic component is mounted on the printed circuit board P while correcting the positional deviation of the electronic component with respect to the suction nozzle 5 in the XY direction and the rotation direction. . When all the electronic components to be mounted on the printed board P are mounted in this way, the board P is transferred from the board positioning unit 2B to the post-process device via the board discharging unit 2C, and the printed circuit board P is mounted. The operation of mounting the electronic component on is completed.

  When light from a transmission illumination device (not shown) is applied to the diffusion plate 25 from the direction of the arrow X shown in FIG. 2, the diffusion plate 25 diffuses and transmits the introduced light downward from the bottom surface. Radiated, half of the transmitted light is transmitted by the half mirrors 21A and 21B, half of the light is reflected and incident on the prism 16 from the lateral direction, and the reflected light from the left in FIG. 3 from the half mirror 21A Half of the light is transmitted by the half mirrors 16D and 16C and half of the light is reflected downward, and half of the reflected light from the right side of FIG. 3 from the half mirror 21B is reflected by the half mirrors 16B and 16C. The amount is transmitted and half of the amount is reflected downward, and the images of the mounting head 6A1 and the mounting head 6A2 are combined as one image. In this case, the synthesized silhouette image is captured by the component recognition camera 15 via the lens 17, the diaphragm 18 and the lens 19.

  In the above embodiment, the mounting heads 6A1 and 6A2 are attached to one beam 4A via one head attachment body 10A, and the attachment heads 6B1 and 6B2 are attached via the other head attachment body 10B. Although it was the structure attached to the other beam 4B, the said mounting head 6A1, 6A2 is attached to one beam 4A via a separate head attachment body, and the said attachment head 6B1, 6B2 is attached to the other via a separate head attachment body. It may be configured to be attached to the beam 4B.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3A, 3B Component supply apparatus 4A, 4B Beam 5 Suction nozzle 6A1, 6A2, 6B1, 6B2 Mounting head 15 Component recognition camera 16 Prism 8 Component supply unit P Printed circuit board

Claims (2)

In an electronic component mounting apparatus in which electronic components supplied from a component supply device are taken out by a plurality of suction nozzles provided in a plurality of mounting heads, and the electronic components suctioned and held by the suction nozzles are imaged by a component recognition camera. ,
A prism for superimposing the images of the two mounting heads is provided, and a plurality of suction nozzles provided on one mounting head and a plurality of suction nozzles provided on the other mounting head are provided by a single component recognition camera. An electronic component mounting apparatus characterized by superimposing images in a state where they are not in the same position . The electronic component mounting apparatus according to claim 1,
In each mounting head, the plurality of suction nozzles are arranged at predetermined intervals on the circumference,
An electronic component mounting apparatus in which the suction nozzles are not in the same position by rotating the one mounting head .

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