JP6807200B2 - Mounting device and mounting method - Google Patents

Description

The present invention relates to a mounting device and a mounting method.

Conventionally, as a mounting device, in a mounting device provided with a plurality of transport conveyors and a plurality of mounting heads, a synchronous mode in which the board is carried out after mounting parts is synchronized between the transport conveyors, and an asynchronous mode in which the board is carried out independently. It has been proposed to obtain the production efficiency when operating in each of the above, and to select and execute a mode with high production efficiency (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2009-224764

However, in the mounting apparatus described in Patent Document 1, although the synchronization mode of the conveyor is considered, the synchronization of the mounting head is not considered. In such a mounting device, the parts collected by the mounting head may be imaged by a parts camera and then placed on a substrate. In the device of Patent Document 1, the board is stopped at the center of the device to perform the mounting process. For example, the distance from the first part camera through which the first mounting head passes to the board and the second mounting head pass through. The distance from the second part camera to the board may be different. In this case, when the mounting process is performed by a plurality of mounting heads, since the moving distance of one mounting head is long, a waiting time occurs in the other mounting head, and the balance of the mounting process is lost, which is an ideal operation. It was sometimes difficult to do. As described above, in the mounting apparatus, it has been required to further improve the balance of the mounting process by the plurality of mounting heads.

The present invention has been made in view of such problems, and an object of the present invention is to provide a mounting device and a mounting method capable of further improving the balance of mounting processes by a plurality of mounting robots.

The present invention has taken the following measures to achieve the above-mentioned main object.

The mounting device disclosed in this specification is
Multiple mounting robots that mount components on the board,
A first imaging unit that is arranged on the first region side separated by a transport path of the substrate and that images a component held by the mounting robot, and a first imaging unit.
A second imaging unit that is arranged on a second region side different from the first region separated by a transport path of the substrate and that images a component held by the mounting robot.
Balance the first distance between the first imaging unit and the substrate and the second distance between the second imaging unit and the substrate, and at a position deviated from the position corresponding to the center of the device. A transport unit that transports and fixes the substrate in the transport path, and
It is equipped with.

In this apparatus, the first distance between the first imaging unit and the substrate arranged on the first region side separated by the transport path and the second arranged on the second region side different from the first region. The substrate is transported and fixed by a transport path at a position deviated from the position corresponding to the center of the device while balancing the second distance between the image pickup unit and the substrate. For example, when the substrate is fixed at the center of the device, the first distance and the second distance may be significantly different. In this case, when the mounting process is performed by a plurality of mounting robots, the moving distance of one mounting robot is long, so that the other mounting robot has a waiting time or the like, and the balance of the mounting process is lost, which is an ideal operation. Is difficult to do. In this device, since the substrate is arranged at a position that balances the first distance and the second distance, it is possible to reduce such a waiting state of the mounting robot. Therefore, in this device, the balance of the mounting process by the plurality of mounting robots can be further improved. In this device, the transport unit may fix the substrate at a position where the first distance and the second distance are the same.

In this mounting device, when the distance between the first imaging unit and the transport path is shorter than the distance between the second image pickup unit and the transport path, the transport unit is located closer to the second image pickup unit. May be fixed. In this device, the distance between the first imaging unit and the substrate becomes longer, and the distance between the second imaging unit and the substrate becomes closer, so that the first distance and the second distance can be balanced. Similarly, when the distance between the second imaging unit and the transport path is shorter than the distance between the first image pickup unit and the transport path, the transfer unit is located closer to the first image pickup unit. May be fixed.

In this mounting device, the first imaging unit and the second imaging unit may be arranged at positions deviated from the positions facing the transport path. In this device, for example, a difference between the first distance and the second distance is more likely to occur than when the first imaging unit and the second imaging unit are located opposite to the transport path, and a plurality of mounting robots It is possible to further improve the balance of the mounting process by.

In this mounting device, the transport unit may have a plurality of the transport paths. In this device, there is a tendency for a difference between the first distance and the second distance to occur between the transfer of the substrate in the plurality of transfer paths, for example, the transfer of the substrate in the first transfer path and the transfer of the substrate in the second transfer path, and a plurality of transfer paths. The balance of mounting processing by the mounting robot can be further improved.

In this mounting device, the transfer unit may have the transfer path including a fixed fixed conveyor and a moving conveyor that can change the transfer width. In this device, the difference between the first distance between the first imaging unit and the substrate and the second distance between the second imaging unit and the substrate occurs depending on the position of the mobile conveyor, so that the mounting process by a plurality of mounting robots can be balanced. It can be improved further.

In this mounting device, the plurality of mounting robots include a first mounting robot and a second mounting robot, the first mounting robot moves the component on the first region side, and the second mounting robot is said. The component may be moved on the second region side. In this device, the balance of the mounting process between the first mounting robot working on the first region side and the second mounting robot working on the second region side can be further improved. The mounting robot may be a mounting unit that slides and moves the mounting head in the XY directions, or may be an articulated arm robot.

The implementation methods disclosed herein are:
A plurality of mounting robots for mounting components on a substrate, a first imaging unit for imaging components arranged on the first region side separated by a transport path of the substrate and held by the mounting robot, and a substrate. It is a mounting method using a mounting device including a second imaging unit that is arranged on a second region side different from the first region separated by a transport path and images a component held by the mounting robot.
Balance the first distance between the first imaging unit and the substrate and the second distance between the second imaging unit and the substrate, and at a position deviated from the position corresponding to the center of the device. A step of transporting and fixing the substrate in the transport path,
May be included.

In this mounting method, as with the mounting device described above, the substrate is placed at a position that balances the first distance and the second distance, so that the waiting state of the mounting robot can be reduced, and a plurality of mounting robots can be mounted. It is possible to further improve the balance of the mounting process by. In this mounting method, various aspects of the mounting device described above may be adopted, or steps may be added to realize each function of the mounting device described above.

Explanatory drawing which shows an example of the outline of the structure of the mounting system 1. The explanatory view which shows an example of the outline of the structure of the mounting apparatus 10. Explanatory drawing of the fixing position of the substrate S1 and S2 in a double lane. The explanatory view of the fixed position of the substrate S3 and S4 in a single lane.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing an outline example of the configuration of the mounting system 1. FIG. 2 is an explanatory diagram showing a schematic example of the configuration of the mounting device 10. The mounting system 1 is, for example, a system that executes a mounting process related to a process of mounting an electronic component (component P) on the boards S1 and S2. In this mounting system 1, a plurality of mounting devices 10 for executing mounting processes are arranged from upstream to downstream to form a production line. Further, the mounting system 1 includes a management personal computer (PC) 50. The management PC 50 manages information related to processing in each mounting device 10. In this embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

The mounting device 10 includes two mounting units, and has a dual lane and dual robot device configuration in which two boards S1 and S2 are conveyed and fixed and mounting processing is performed on them. As shown in FIG. 1, the mounting device 10 includes a first component supply unit 11, a second component supply unit 12, a first component camera 13, a second component camera 14, a substrate transfer unit 20, and a second. It includes one mounting unit 31, a second mounting unit 32, and a control unit 18. The control unit 18 is configured as a microprocessor centered on a CPU, and includes a storage unit for storing a processing program and various data. The control unit 18 outputs a control signal to each unit and controls these units. Further, the control unit 18 controls each unit so as to input a signal from each unit and execute processing according to the signal.

In the mounting device 10, the first component supply unit 11 is mounted on the front surface of the device body, and the second component supply unit 12 is mounted on the rear surface. The first component supply unit 11 mainly supplies the component P to the first mounting unit 31, and includes a feeder provided with a reel in which the tape containing the component P is wound, a tray on which the component P is placed, and the like. ing. The second component supply unit 12 mainly supplies the component P to the second mounting unit 32, and includes a feeder provided with a reel in which the tape containing the component P is wound, a tray on which the component P is placed, and the like. ing.

The first part camera 13 is, for example, a camera that captures a part P or the like collected and held by the first mounting head 34 from below. The first parts camera 13 is arranged on the side of the first region 41, which is in front of the substrate transport portion 20 (see FIG. 2). It is assumed that the first region 41 is a region divided at the center of the transport path of the substrate transport unit 20, and the second region 42 is a region different from the first region 41. The imaging range of the first part camera 13 is above the first part camera 13. The second part camera 14 is, for example, a camera that captures a part P or the like collected and held by the second mounting head 37 from below. The second part camera 14 is arranged on the second region 42 side behind the substrate transport portion 20. The imaging range of the second part camera 14 is above the second part camera 14. The first part camera 13 and the second part camera 14 are respectively arranged at positions deviated from the positions facing the transfer path of the substrate transfer unit 20 (see FIG. 3). That is, the first part camera 13 and the second part camera 14 are not arranged on a line drawn perpendicular to the transport path (see, for example, the alternate long and short dash line in FIG. 3). The first part camera 13 is fixed at a position closer to the left side of the device, and the second part camera 14 is fixed at a position closer to the right side of the device. The control unit 18 confirms the misalignment and shape of the part P collected and held by using the images captured by the first part camera 13 and the second part camera 14. After collecting the component P from the first component supply unit 11, the first mounting unit 31 passes over the first component camera 13 and mounts the component P on the substrate S1. Further, the second mounting unit 32 collects the component P from the second component supply unit 12, and then passes the component P on the second component camera 14 to mount the component P on the substrate S2.

The board transfer unit 20 is a unit that carries in the boards S1 and S2 and positions and supports the carried-in boards S1 and S2. The substrate transport section 20 has a first transport path 21 and a second transport path 22. The first transport path 21 constitutes the first lane of the mounting process, and is composed of a fixed conveyor 23, a moving conveyor 24, and a fixing mechanism 25 (FIG. 1). As shown in FIGS. 2 and 3, the fixed conveyor 23 and the moving conveyor 24 are provided on each of the pair of side frames, and each of them supports the end portion of the substrate S1 and conveys the substrate S1. The fixed conveyor 23 serves as a reference position for the substrate transport path, and is immovably fixed to the housing. The moving conveyor 24 is arranged in the housing so as to slide and move with respect to the fixed conveyor 23 so that the transport width can be changed according to the width of the substrate S1. The fixing mechanism 25 is a mechanism for clamping and fixing the substrate S1. The second transport path 22 constitutes the second lane of the mounting process, and is composed of the moving conveyors 26 and 27 and the fixing mechanism 28 (FIG. 1). As shown in FIGS. 2 and 3, the mobile conveyors 26 and 27 are provided on each of the pair of side frames, and each of them supports the end portion of the substrate S2 and conveys the substrate S2. The moving conveyors 26 and 27 are arranged in the housing so as to slide and move so that the transport width can be changed according to the width of the substrate S2. The moving conveyor 26 slides according to the position of the moving conveyor 24. The fixing mechanism 28 is a mechanism for clamping and fixing the substrate S2. The first transport path 21 is provided with a substrate support portion that supports the substrate S1 from below, and the second transport path 22 is provided with a substrate support portion that supports the substrate S2 from below.

The mounting device 10 includes a first mounting unit 31 on the front side of the main body of the device and a second mounting unit 32 on the rear side, and is configured to be capable of executing mounting processes in parallel in two lanes. The first mounting unit 31 mainly performs a mounting process of arranging the component P collected from the first component supply unit 11 on the substrate S1 fixed to the first transport path 21 and the substrate S2 fixed to the second transport path 22. It is a thing. The first mounting unit 31 includes a first head moving unit 33, a first mounting head 34, and a suction nozzle 35. The first head moving unit 33 includes a slider that is guided by a guide rail and moves in the XY directions, and a motor that drives the slider. The first mounting head 34 is detachably mounted on the slider, and is moved in the XY direction by the first head moving portion 33. One or more suction nozzles 35 for collecting the component P are detachably mounted on the lower surface of the first mounting head 34. The suction nozzle 35 is a collecting member that collects the component P by using the pressure. The first mounting head 34 may be equipped with a mechanical chuck that mechanically grips the component P instead of the suction nozzle 35. The second mounting unit 32 performs a mounting process in which the component P mainly collected from the second component supply unit 12 is arranged on the substrate S2 fixed to the second transport path 22 and the substrate S1 fixed to the first transport path 21. It is a thing. The second mounting unit 32 includes a second head moving portion 36, a second mounting head 37, and a suction nozzle 38. The second mounting unit 32 may have the same configuration as the first mounting unit 31, or may have a different configuration. The description of the second mounting unit 32 will be omitted assuming that the second mounting unit 32 has the same configuration as the first mounting unit 31.

Next, the operation of the mounting device 10 of the present embodiment configured in this way, particularly the process of fixing the substrates S1 and S2 and executing the mounting process will be described. FIG. 3 is an explanatory diagram of fixed positions of the substrates S1 and S2 in the double lane having the first transport path 21 and the second transport path 22. When the operator inputs the start of the mounting process from the operation panel, the control unit 18 starts the mounting process. When the mounting process is started, the control unit 18 acquires mounting job information including the contents of the boards S1 and S2 to be produced this time from the management PC 50. The mounting job information includes the size of the boards S1 and S2, the position, number, and type of parts to be arranged. Next, the control unit 18 moves and fixes the moving conveyors 24, 26, and 27 according to the widths of the substrates S1 and S2, and the substrate transport unit 20 so as to carry in the substrates S1 and S2 and fix them at a predetermined fixed position. To control. The fixed positions of the boards S1 and S2 may be the positions set by the management PC 50 or may be set by the control unit 18.

Here, as shown in FIG. 3, the substrate transport unit 20 has a first distance A1 between the first part camera 13 and the substrate S1 and a second distance between the second part camera 14 and the substrate S1. The substrate S1 is transported and fixed in the first transport path 21 at a position that is balanced with A2 and deviates from the position corresponding to the center of the device (see the two-dot chain line in FIG. 3). Further, when the distance between the first parts camera 13 and the first transport path 21 is shorter than the distance between the second parts camera 14 and the first transport path 21, the substrate transport unit 20 is second on the first transport path 21. The substrate S1 is fixed at a position closer to the parts camera 14. Similarly, the substrate transport unit 20 balances the first distance B1 between the first parts camera 13 and the substrate S2 and the second distance B2 between the second parts camera 14 and the substrate S2. Further, the substrate S2 is transported and fixed by the second transport path 22 at a position deviated from the position corresponding to the center of the device. Further, when the distance between the second parts camera 14 and the second transport path 22 is shorter than the distance between the first parts camera 13 and the second transport path 22, the substrate transport unit 20 is the first on the second transport path 22. The substrate S2 is fixed at a position closer to the parts camera 13. Here, "balancing" means making the difference in distance smaller. Further, the distance to the substrates S1 and S2 shall be based on the center of the substrates S1 and S2.

For example, as shown by the dotted line in FIG. 3, when the substrate S1 is fixed at the position of the transport path corresponding to the center of the device (see the alternate long and short dash line), the first distance a1 and the second distance a2 are significantly different. .. In this case, when the mounting process is performed by a plurality of mounting heads, since the moving distance of one mounting head is long, a waiting time occurs in the other mounting head, and the balance of the mounting process is lost, which is an ideal operation. Is difficult to do. In this mounting device 10, since the difference between the first distance A1 and the second distance A2 is relatively small, the movement time of the mounting head can be balanced, the mounting process can be well-balanced, and ideal operation can be performed. it can. If the substrate S1 is fixed at a position closer to the second part camera 14 side and offset from the center, the difference in distance becomes smaller, which is preferable. Regarding the fixed position, for example, a specific position may be set in consideration of the width of the substrate S1 in addition to the first and second distances. At this time, the substrate transport unit 20 may fix the substrate S1 at a position where the first distance A1 and the second distance A2 are the same. Also in the substrate S2, the relationship between the first distance B1 and the second distance B2 and the first distance b1 and the second distance b2 is the same as that of the substrate S1. The specific fixing position can also be determined in the same manner as in the substrate S1.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The first mounting unit 31 and the second mounting unit 32 of the present embodiment correspond to the mounting robot, the first parts camera 13 corresponds to the first imaging unit, and the second parts camera 14 corresponds to the second imaging unit. The substrate transport section 20 corresponds to the transport section, the first transport path 21 and the second transport path 22 correspond to the transport path, the fixed conveyor 23 corresponds to the fixed conveyor, and the mobile conveyor 24 corresponds to the mobile conveyor.

In the mounting device 10 of the present embodiment described above, the first distance A1 between the first parts camera 13 and the substrate S1 arranged on the first region 41 side separated by the transport path and the first region 41 The substrate S1 is transported to a position deviated from the position corresponding to the center of the device while balancing the second distance A2 between the second part camera 14 and the substrate S1 arranged on the second region 42 side different from the above. Transported and fixed on the road 21. In this mounting device 10, since the substrate S1 is arranged at a position that balances the first distance A1 and the second distance A2, a wait that may occur due to the difference in moving time between the first mounting head 34 and the second mounting head 37. The state etc. can be reduced. Therefore, in this device, the balance of the mounting process by a plurality of mounting units (mounting heads) can be further improved.

Further, when the distance between the first parts camera 13 and the first transport path 21 is shorter than the distance between the second parts camera 14 and the first transport path 21, the substrate transport unit 20 is moved closer to the second parts camera 14. The substrate S1 is fixed. In this device, the first distance A1 between the first part camera 13 and the board S1 is farther, and the second distance A2 between the second part camera 14 and the board S1 is closer, so that these distances are balanced. be able to. Similarly, when the distance between the second parts camera 14 and the second transport path 22 is shorter than the distance between the first parts camera 13 and the second transport path 22, the board transport unit 20 is located closer to the first parts camera 13. The substrate S2 is fixed to. In this device, the second distance B2 between the second part camera 14 and the board S2 is farther, and the first distance B1 between the first part camera 13 and the board S2 is closer, so that these distances are balanced. be able to.

Further, the first parts camera 13 and the second parts camera 14 are arranged at positions deviated from the positions facing the first transport path 21 and the second transport path 22. In the mounting device 10, for example, a difference between the first distance and the second distance is more likely to occur than when the first parts camera 13 and the second parts camera 14 are located at positions facing each other with respect to the transport path. The balance of mounting processing by a plurality of mounting heads can be further improved. Further, since the substrate transport unit 20 has a plurality of transport paths, for example, in the transport of the substrate S1 in the first transport path 21 and the transport of the substrate S2 in the second transport path 22, the first The difference between the distance and the second distance is likely to occur, and the balance of the mounting process by the plurality of mounting heads can be further improved. Furthermore, since the substrate transfer unit 20 includes a fixed fixed conveyor 23 and a moving conveyor 24 that can change the transfer width, the first parts camera 13 and the substrate S1 may be moved depending on the position of the moving conveyor 24. Since there is a difference between the first distance and the second distance between the second part camera 14 and the substrate S1, the balance of the mounting process by the plurality of mounting heads can be further improved.

It is needless to say that the present invention is not limited to the above-described embodiment, and can be implemented in various aspects as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the substrate transport unit 20 has the first transport path 21 and the second transport path 22, but the present invention is not particularly limited to this, and the substrate transport unit 20 may not include the second transport path 22. Good. FIG. 4 is an explanatory diagram of fixed positions of the substrates S3 and S4 in the mounting device 10B provided with a single lane. In FIG. 4, an example of fixing substrates S3 and S4 having different sizes is shown in one figure. In the mounting device 10B, the same reference numerals are given to the same configurations as those of the mounting device 10 described above, and the description thereof will be omitted. Further, in the mounting device 10B, the center line (see the alternate long and short dash line) between the fixed conveyor 23 and the moving conveyor 24 is defined as the boundary between the first region 41 and the second region 42. In the narrow substrate S3, the mobile conveyor 24 is located closer to the fixed conveyor 23, and the first transport path 21 is farther from the second parts camera 14. Then, the substrate transport unit 20 has a first distance C1 between the first part camera 13 and the substrate S3 and a second distance between the second part camera 14 and the substrate S3, similarly to the mounting device 10 described above. The substrate S3 is conveyed and fixed at a position that is balanced with the distance C2 and deviates from the position corresponding to the center of the device (see the two-dot chain line in FIG. 4). Further, when the distance between the first parts camera 13 and the first transport path 21 is shorter than the distance between the second parts camera 14 and the first transport path 21, the substrate transport unit 20 is second on the first transport path 21. The substrate S3 is fixed at a position closer to the parts camera 14. For example, as shown by the dotted line in FIG. 4, when the substrate S3 is fixed at the position of the transport path corresponding to the center of the device (see the alternate long and short dash line), the first distance c1 and the second distance c2 are significantly different. .. In this case, similarly to the above, a waiting time or the like occurs in the mounting head, and the balance of the mounting process is lost. In this mounting device 10B, since the difference between the first distance C1 and the second distance C2 is relatively small, the movement time of the mounting head can be balanced, and the mounting process can be well-balanced to perform ideal operation. it can. Even in the substrate S4 having a relatively large width, the relationship between the first distance D1 and the second distance D2 and the first distance d1 and the second distance d2 is the same as that of the substrate S3. The specific fixing position of the substrate S4 can be determined in the same manner as the substrates S1 to S3.

In the above-described embodiment, the substrate transport unit 20 includes a fixed fixed conveyor 23 and a slide-movable mobile conveyor 24, but the substrate transport unit 20 may be composed of only the mobile conveyor without the fixed conveyor 23. Good. Alternatively, the substrate transfer unit may be composed of only the fixed conveyor.

In the above-described embodiment, the mounting unit that slides and moves the mounting head equipped with the suction nozzles 35 and 38 in the XY directions has been described as the mounting robot, but the mounting robot is not particularly limited to this, and the mounting robot is, for example, an articulated arm robot. May be good. Also in this device, the balance of mounting processing by a plurality of mounting robots can be further improved.

In the above-described embodiment, the present invention has been described as the mounting device 10, but the present invention may be used as a mounting method or a control method for the mounting device, or the present invention may be used as a program for executing the above-described processing by a computer.

The present invention can be used in mounting devices for arranging components on a substrate.

1 mounting system, 10 mounting device, 11 1st component supply unit, 12 2nd component supply unit, 13 1st parts camera, 14 2nd parts camera, 18 control unit, 20 board transfer unit, 21 1st transfer path, 22 2nd transport path, 23 fixed conveyor, 24, 26, 27 mobile conveyor, 25, 28 fixed mechanism, 31 1st mounting unit, 32 2nd mounting unit, 33 1st head moving part, 34 1st mounting head, 35 suction Nozzle, 36 2nd head moving part, 37 2nd mounting head, 38 Suction nozzle, 41 1st area, 42 2nd area, 50 Management PC, A1, a1, B1, b1, C1, c1, D1, d1 1st Distance, A2, a2, B2, b2, C2, c2, D2, d2 Second distance, P component, S1 to S4 substrate.

Claims (5)

Multiple mounting robots that mount components on the board,
A first imaging unit that is arranged on the first region side separated by a transport path of the substrate and that images a component held by the mounting robot, and a first imaging unit.
A second imaging unit that is arranged on a second region side different from the first region separated by a transport path of the substrate and that images a component held by the mounting robot.
A first distance between the center of the substrate and the first image pickup unit, balanced to smaller difference between the second distance between the center of the second image pickup unit and the substrate, and device A transport unit for transporting and fixing the substrate on the transport path at a position deviated from the position corresponding to the center is provided .
A mounting device in which the first imaging unit and the second imaging unit are arranged at positions deviated from positions facing the transport path . When the distance between the first imaging unit and the transport path is shorter than the distance between the second image pickup unit and the transport path, the transport unit fixes the substrate at a position closer to the second image pickup unit. Item 1. The mounting device according to item 1. The mounting device according to claim 1 or 2 , wherein the transport unit has a plurality of transport paths. The mounting apparatus according to any one of claims 1 to 3 , wherein the transport unit has the transport path including a fixed fixed conveyor and a mobile conveyor whose transport width can be changed. A plurality of mounting robots for mounting components on a substrate, a first imaging unit for imaging components arranged on the first region side separated by a transport path of the substrate and held by the mounting robot, and a substrate. The first imaging unit and the second imaging unit are provided with a second imaging unit that is arranged on a second region side different from the first region separated by a transport path and images a component held by the mounting robot . The image pickup unit is a mounting method using a mounting device arranged at a position deviated from a position facing the transport path .
A first distance between the center of the substrate and the first image pickup unit, balanced to smaller difference between the second distance between the center of the second image pickup unit and the substrate, and device A step of transporting and fixing the substrate in the transport path at a position deviated from the position corresponding to the center.
Implementation method including.