JP6879706B2 - Mounting condition setting device, mounting system and mounting condition setting method - Google Patents

Description

The present invention relates to a mounting condition setting device, a mounting system, and a mounting condition setting method.

Conventionally, the mounting device is provided with one mounting head and one board transport path, and the total transfer distance of the mounting head from the component carry-out portion (feeder) to the board mounting position is calculated with respect to the board position. It has been proposed that the fixed position of the substrate having the shortest transfer distance is determined by performing the calculation process for different substrate positions (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 3-99498

However, in the mounting apparatus described in Patent Document 1, it is considered to set the position of the substrate that minimizes the transfer distance between the component carry-out portion and the mounting position. Was not considered. For example, it has been desired to further improve the mounting process, such as further improving the production balance in a plurality of mounting robots.

The present invention has been made in view of such problems, and an object of the present invention is to provide a mounting condition setting device, a mounting system, and a mounting condition setting method capable of further improving the mounting process in a plurality of mounting robots. To do.

The present invention has taken the following measures to achieve the above-mentioned main object.

The mounting condition setting device disclosed in this specification is
It is a mounting condition setting device that sets mounting conditions for a mounting device including a first mounting robot that mounts components on a board, a second mounting robot that mounts components on a board, and a transport unit that conveys the board. hand,
The first mounting time required for the mounting process by the first mounting robot when the board is fixed at a plurality of fixed positions is calculated, and the second mounting robot is used when the board is fixed at a plurality of fixed positions. A calculation unit that calculates the second mounting time required for mounting processing, and
A setting unit that sets a fixed position of the board to be used in the mounting process based on the calculated first mounting time of the first mounting robot and the plurality of second mounting times of the second mounting robot.
It is equipped with.

In this device, the first mounting time in the first mounting robot and the second mounting time in the second mounting robot when the board is fixed at a plurality of fixed positions are calculated, and the calculated first mounting time and the calculated first mounting time and the plurality of first mounting times are calculated. The fixed position of the substrate used in the mounting process is set based on the second mounting time. In this device, since the fixed position of the board is set according to the mounting time of the first mounting robot and the mounting time of the second mounting robot when the fixed position of the board is changed, the mounting process in a plurality of mounting robots is further improved. can do.

In this mounting condition setting device, the setting unit sets a fixed position that balances the first mounting time of the first mounting robot and the second mounting time of the second mounting robot to a fixed position used in the mounting process. It may be set. In this device, the balance of the mounting process between the first mounting robot and the second mounting robot can be further improved. Here, "balancing the mounting time" means that the difference between the first mounting time and the second mounting time is smaller.

In this mounting condition setting device, the setting unit uses a fixed position in the mounting process in which the total of the first mounting time of the first mounting robot and the second mounting time of the second mounting robot is shorter. It may be set to a fixed position. With this device, the time required for the entire mounting process can be further reduced.

In this mounting condition setting device, the mounting device includes the transport unit having a first transport path for transporting the substrate and a second transport path for transporting the substrate, and the calculation unit includes the first transport unit. The plurality of first mounting times and the second mounting time based on the plurality of fixed positions on the road are calculated, and the plurality of the first mounting times and the plurality of first mounting times based on the plurality of fixed positions on the second transport path are calculated. The second mounting time is calculated, and the setting unit sets a fixed position to be used in the mounting process based on the plurality of the first mounting time and the second mounting time in the first transport path, and also sets the fixed position to be used in the mounting process. The fixed position to be used at the time of the mounting process may be set based on the plurality of the first mounting time and the second mounting time in the second transport path. When there are a plurality of transport paths, a difference is likely to occur between the moving distances of the plurality of mounting robots. In this device, a more suitable fixing position of the substrate can be set for a plurality of transport paths.

In this mounting condition setting device, the calculation unit includes the number of parts to be mounted, the moving distance to the mounting position of the board fixed at the fixed position, and the mounting of the parts by the first mounting robot and the second mounting robot. The first mounting time and the second mounting time corresponding to the fixed position may be calculated based on the order and one or more of the transport speeds of the parts by the first mounting robot or the second mounting robot. Good. In this device, a more accurate mounting time can be calculated by using the above conditions.

The implementation system disclosed herein is
The mounting condition setting device described in any of the above and
The first mounting robot that mounts the components on the board, the second mounting robot that mounts the components on the board, the transport unit that conveys the board, the first mounting robot, and the second mounting robot are controlled and mounted. A mounting device including a control unit that controls the transfer unit so as to transfer the substrate to the fixed position set by the condition setting device.
It is equipped with.

In this mounting system, the mounting process in a plurality of mounting robots can be further improved as in the mounting condition setting device described above. Further, in this mounting system, it is possible to obtain an effect according to the one adopted among the mounting condition setting devices described above.

The implementation condition setting method disclosed in this specification is
It is a mounting condition setting method for setting mounting conditions of a mounting device including a first mounting robot for mounting components on a board, a second mounting robot for mounting components on a board, and a transport unit for transporting the board. hand,
(A) The first mounting time required for the mounting process by the first mounting robot when the board is fixed at a plurality of fixed positions is calculated, and the second mounting time when the board is fixed at a plurality of fixed positions is calculated. Steps to calculate the second mounting time required for mounting processing by the mounting robot, and
(B) A step of setting a fixed position of the substrate to be used in the mounting process based on the calculated plurality of first mounting times of the first mounting robot and the plurality of second mounting times of the second mounting robot. When,
Is included.

In this method, similarly to the mounting condition setting device described above, the fixing position of the board is set according to the mounting time of the first mounting robot and the mounting time of the second mounting robot when the fixing position of the board is changed. It is possible to further improve the mounting process in a plurality of mounting robots. In this mounting condition setting method, various aspects of the mounting condition setting device described above may be adopted, or steps may be added to realize each function of the mounting condition setting device described above. ..

Explanatory drawing which shows an example of the outline of the structure of the mounting system 1. The explanatory view which shows an example of the outline of the structure of the mounting apparatus 10. Explanatory drawing of the fixed position of the substrate S1 and S2 in a double lane. The flowchart which shows an example of the implementation condition setting processing routine. The explanatory view of the fixed position of the substrate S3 in a single lane.

A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing an outline example of the configuration of the mounting system 1. FIG. 2 is an explanatory diagram showing a schematic example of the configuration of the mounting device 10. FIG. 3 is an explanatory diagram of fixed positions of the substrates S1 and S2 in the double lanes of the first transport path 21 and the second transport path 22. The mounting system 1 is, for example, a system that executes a mounting process related to a process of mounting an electronic component (component P) on the boards S1 and S2. In this mounting system 1, a plurality of mounting devices 10 for executing mounting processes are arranged from upstream to downstream to form a production line. Further, the mounting system 1 includes a management personal computer (PC) 50. The management PC 50 manages information related to processing in each mounting device 10. In the present embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

The mounting device 10 includes two mounting units, and has a dual lane and dual robot device configuration in which two boards S1 and S2 are conveyed and fixed and mounting processing is performed on them. As shown in FIG. 1, the mounting device 10 includes a first component supply unit 11, a second component supply unit 12, a first component camera 13, a second component camera 14, a board transfer unit 20, and a second. It includes one mounting unit 31, a second mounting unit 32, and a control unit 18. The control unit 18 is configured as a microprocessor centered on a CPU, and includes a storage unit for storing a processing program and various data. The control unit 18 outputs a control signal to each unit and controls these units. Further, the control unit 18 controls each unit so as to input a signal from each unit and execute processing according to the signal.

The mounting device 10 mounts the first component supply unit 11 on the front surface of the apparatus main body and the second component supply unit 12 on the rear surface. The first component supply unit 11 mainly supplies the component P to the first mounting unit 31, and accommodates a feeder provided with a reel in which the tape containing the component P is wound and a tray on which the component P is placed. Equipped with a tray unit, etc. The second component supply unit 12 mainly supplies the component P to the second mounting unit 32, and has the same configuration as the first component supply unit 11.

The first part camera 13 is, for example, a camera that captures a part P or the like collected and held by the first mounting head 34 from below. The first parts camera 13 is arranged on the side of the first region 41, which is in front of the substrate transport portion 20 (see FIG. 2). It is assumed that the first region 41 is a region divided at the center of the transport path of the substrate transport unit 20, and the second region 42 is a region on a side different from that of the first region 41. The imaging range of the first part camera 13 is above the first part camera 13. The second part camera 14 is, for example, a camera that captures a part P or the like collected and held by the second mounting head 37 from below. The second part camera 14 is arranged on the side of the second region 42, which is behind the substrate transport portion 20. The imaging range of the second part camera 14 is above the second part camera 14. The first part camera 13 and the second part camera 14 are respectively arranged at positions deviated from the positions facing the transfer path of the substrate transfer unit 20 (see FIG. 3). The first part camera 13 is fixed at a position closer to the left side of the device, and the second part camera 14 is fixed at a position closer to the right side of the device. The control unit 18 confirms the misalignment and shape of the part P collected and held by using the images captured by the first part camera 13 and the second part camera 14. After collecting the component P from the first component supply unit 11, the first mounting unit 31 passes over the first component camera 13 and mounts the component P on the boards S1 and S2. Further, the second mounting unit 32 collects the component P from the second component supply unit 12, and then passes the component P on the second component camera 14 to mount the component P on the boards S1 and S2.

The board transfer unit 20 is a unit that carries in the boards S1 and S2 and positions and supports the carried-in boards S1 and S2. The substrate transport section 20 has a first transport path 21 and a second transport path 22. The first transport path 21 constitutes the first lane of the mounting process, and is composed of a fixed conveyor 23, a moving conveyor 24, and a fixing mechanism 25 (FIG. 1). As shown in FIGS. 2 and 3, the fixed conveyor 23 and the moving conveyor 24 are provided on each of the pair of side frames, and each of them supports the end portion of the substrate S1 and conveys the substrate S1. The fixed conveyor 23 serves as a reference position for the substrate transport path, and is immovably fixed to the housing. The moving conveyor 24 is arranged in the housing so as to slide and move with respect to the fixed conveyor 23 so that the transport width can be changed according to the width of the substrate S1. The fixing mechanism 25 is a mechanism for clamping and fixing the substrate S1. The second transport path 22 constitutes the second lane of the mounting process, and is composed of the moving conveyors 26 and 27 and the fixing mechanism 28 (FIG. 1). As shown in FIGS. 2 and 3, the mobile conveyors 26 and 27 are provided on each of the pair of side frames, and each of them supports the end portion of the substrate S2 and conveys the substrate S2. The moving conveyors 26 and 27 are arranged in the housing so as to slide and move so that the transport width can be changed according to the width of the substrate S2. The moving conveyor 26 slides according to the position of the moving conveyor 24. The fixing mechanism 28 is a mechanism for clamping and fixing the substrate S2. The first transport path 21 is provided with a substrate support portion that supports the substrate S1 from below, and the second transport path 22 is provided with a substrate support portion that supports the substrate S2 from below.

The mounting device 10 includes a first mounting unit 31 on the front side of the main body of the device and a second mounting unit 32 on the rear side, and is configured to be capable of executing mounting processes in parallel in two lanes. The first mounting unit 31 performs a mounting process in which the component P mainly collected from the first component supply unit 11 is arranged on the substrate S1 fixed to the first transport path 21 and the substrate S2 fixed to the second transport path 22. It is a thing. The first mounting unit 31 includes a first head moving unit 33, a first mounting head 34, and a suction nozzle 35. The first head moving unit 33 includes a slider that is guided by a guide rail and moves in the XY directions, and a motor that drives the slider. The first mounting head 34 is detachably mounted on the slider, and is moved in the XY direction by the first head moving portion 33. One or more suction nozzles 35 for collecting the component P are detachably mounted on the lower surface of the first mounting head 34. The suction nozzle 35 is a collecting member that collects the component P by using the pressure. The first mounting head 34 may be equipped with a mechanical chuck that mechanically grips the component P instead of the suction nozzle 35. The second mounting unit 32 mainly performs a mounting process of arranging the component P collected from the second component supply unit 12 on the substrate S2 fixed to the second transport path 22 and the substrate S1 fixed to the first transport path 21. It is a thing. The second mounting unit 32 includes a second head moving portion 36, a second mounting head 37, and a suction nozzle 38. The second mounting unit 32 may have the same configuration as the first mounting unit 31, or may have a different configuration. The second mounting unit 32 has the same configuration as the first mounting unit 31, and the description thereof will be omitted.

As shown in FIG. 1, the management PC 50 includes a control unit 51, a storage unit 52, and a communication unit 53. The control unit 51 is configured as a microprocessor centered on a CPU, and includes a ROM for storing a processing program and a RAM used as a work area. The storage unit 52 is composed of an HDD or the like that stores various types of information. The communication unit 53 is an interface for exchanging information with an external device (for example, a mounting device 10). The storage unit 52 stores mounting condition information and the like in which various conditions for mounting processing by the mounting device 10 are set. The mounting condition information includes board information of the production target such as the type of parts to be mounted on the boards S1 and S2, the number of parts, and the arrangement position (coordinates) of the parts, as well as the mounting order of the parts and the fixed positions of the boards S1 and S2. Information etc. are included. The management PC 50 creates this mounting condition information and outputs it to the mounting device 10 before the start of the mounting process. The transmitted mounting condition information is used in the mounting process by the mounting device 10.

In the following description, the first parts supply unit 11 and the second parts supply unit 12 are collectively referred to as a "parts supply unit", and the first parts camera 13 and the second parts camera 14 are collectively referred to as a "parts camera". The same applies to the transport path, mounting unit, mounting head, head moving portion, and the like.

Next, the operation of the mounting device 10 of the present embodiment configured in this way, particularly the process of fixing the substrates S1 and S2 and setting the conditions for executing the mounting process will be described. FIG. 4 is a flowchart showing an example of the mounting condition setting processing routine executed by the CPU of the control unit 51. This routine is stored in the storage unit 52 of the management PC 50 and executed by the start instruction by the operator. When this routine is started, the control unit 51 first acquires the board information to be produced (step S100). The board information can be obtained from information such as design drawings of the boards S1 and S2 to be produced, for example.

Next, the control unit 51 performs a process of setting a mounting position of the feeder of the component supply unit and the tray unit (step S110). This process may be performed based on conditions such as mounting a feeder having a large number of parts to be mounted as close to the parts camera as possible in order to further reduce the moving distance of the mounting head. Further, the control unit 51 shall perform this process on the first component supply unit 11 and the second component supply unit 12. Next, the control unit 51 performs a process of setting the mounting order of the components P (step S120). In this process, for example, the component P to be placed at the mounting position closer to the sampling position of the component P is set as the first component, the component closer to the first component is set to the second component, and the component is closer to the second component. Is the third component, and the movement of the mounting head may be performed with one stroke so as to suppress the reciprocating movement as much as possible. Further, in the first mounting head 34, the control unit 51 may set the mounting order of the components P as a locus to be mounted on the board S1 after being mounted on the board S2, or may be mounted only on the board S2 or only on the board S1. The mounting order of the component P may be set as the trajectory to be performed. Further, the mounting order may be set so that the mounting process of the first mounting head 34 and the mounting process of the second mounting head 37 are alternately performed on the board S1, or the mounting order is set so as to perform these randomly. You may. Further, the control unit 51 similarly sets the mounting order for the substrate S2.

Next, the control unit 51 sets the fixed positions of the boards S1 and S2 (step S130). This fixed position may be set to, for example, a predetermined initial position. This initial position is not particularly limited, but for example, the substrate S1 of the first transport path 21 far from the second component supply unit 12 is set to a position closer to the second component camera 14 and is far from the first component supply unit 11. The substrate S2 of the 2 transport path 22 may be located closer to the first part camera 13. It is more preferable that this initial position is, for example, a position where the moving time of the first mounting head 34 and the moving time of the second mounting head 37 are more balanced (the difference is smaller).

Next, the control unit 51 has a first mounting time required for the mounting process of the first mounting head 34 and a second mounting time required for the mounting process of the second mounting head 37 at the fixed positions of the boards S1 and S2 set above. And are calculated (step S140). The control unit 51 is, for example, the number of parts to be mounted, the moving distance to the mounting position of the boards S1 and S2 fixed at the fixed position, the mounting order of the parts P by the first mounting unit 31, and the parts by the first mounting unit 31. The first mounting time corresponding to this fixed position may be calculated based on one or more of the transport speeds of P. The control unit 51 estimates the movement time from the movement distance and the transport speed in one movement of the first mounting head 34, and the time required to stop and start the movement of the first mounting head 34 from the number of parts to be arranged in the movement. The process of obtaining the movement time in consideration of the time for arranging the parts and the parts may be performed for all the movements of the first mounting head 34. Further, the control unit 51 may also obtain the second mounting time of the second mounting head 37 in the same manner. The control unit 51 may calculate the first mounting time and the second mounting time in consideration of the waiting time when the first mounting head 34 and the second mounting head 37 are cooperatively controlled. The control unit 51 stores the first mounting time and the second mounting time obtained by calculation in the storage unit 52 in association with the arrangement positions of the boards S1 and S2 (step S150).

Next, the control unit 51 determines whether or not the calculation end conditions for the first mounting time and the second mounting time are satisfied (step S160). The calculation end condition can be a condition that allows the mounting time of the boards S1 and S2 to be calculated at fixed positions as much as possible and avoids unnecessary calculation as much as possible. The calculation end condition may be, for example, whether or not a predetermined calculation time has elapsed. In this mounting condition setting process, the control unit 51 performs a process of calculating the first mounting time and the second mounting time for the fixed positions of the boards S1 and S2 for a large number of fixed positions, and among them, the most desirable board. The process of obtaining the fixed positions of S1 and S2 is performed. Therefore, the calculation end condition may be a condition that the calculation time for repeating the above calculation elapses so that a more suitable fixed position can be obtained. Alternatively, the calculation end condition may be a condition for executing a predetermined number of calculations empirically determined so that a more suitable fixed position can be obtained. Here, for convenience of explanation, the calculation end condition will be described below assuming that a predetermined calculation time (for example, several hours) has elapsed.

When the calculation end condition is not satisfied in step S160, the control unit 51 changes and sets the fixed positions of the boards S1 and S2, and executes the processes after step S140. That is, the control unit 51 calculates the first mounting time and the second mounting time for the boards S1 and S2 at the fixed positions after the change. When changing the fixed position, the control unit 51 may, for example, change the fixed position to a position shifted by a predetermined distance from the current fixed position. The control unit 51 may change the fixing position of both the boards S1 and S2, or may change the fixing position of only one of the boards S1 and S2. It is preferable to calculate the first mounting time and the second mounting time at various fixed positions in order to obtain a better fixed position. In this way, the control unit 51 calculates the first and second mounting times corresponding to the first fixed positions of the boards S1 and S2, and the first and second fixed positions different from the first fixed positions are calculated. A series of arithmetic processes such as calculating the second mounting time ... are repeated.

On the other hand, when the calculation end condition is satisfied in step S160, the control unit 51 sets a fixed position for balancing the first mounting time and the second mounting time as the fixed position used in the mounting process from the calculation results. (Step S180). Here, the control unit 51 extracts one or more fixed positions where the difference between the first mounting time and the second mounting time is smaller, and among them, the first mounting time and the second mounting time of the first mounting unit 31. It is assumed that a fixed position in which the total time with which the second mounting time of the mounting unit 32 is shorter is shorter is extracted. In this way, the overall efficiency and work load of the first mounting unit 31 and the second mounting unit 32 in the mounting process can be improved. Then, the control unit 51 outputs the mounting condition information including the set fixed position to the mounting device 10 (step S190), and ends this routine as it is.

Here, the process of setting the fixed positions of the substrates S1 and S2 will be described with reference to FIG. As shown in FIG. 3, assuming that the substrate S1 is fixed at the fixed position A1 and the substrate S2 is fixed at the fixed position B1 (step S130), the control unit 51 sets the first mounting time of the first mounting unit 31 and the first mounting time. 2 The second mounting time of the mounting unit 32 is calculated and stored in the storage unit 52 (steps S140 and S150). The control unit 51 calculates the mounting time using parameters such as the number of components to be mounted, the moving distance of the mounting head, the mounting order of the components P, and the transport speed of the components P. Next, assuming that the control unit 51 changes the fixed position, fixes the substrate S1 at the fixed position A2, and fixes the substrate S2 at the fixed position B2 (step S170), the first mounting time and the second mounting time are set. The calculation is performed and stored in the storage unit 52 (steps S140 and S150). Similarly, the control unit 51 fixes the substrate S1 at the fixed position A3, changes the fixed position of the substrate S2 at the fixed position B3, calculates the first mounting time and the second mounting time, and stores them in the storage unit 52. Let me. Then, after repeating such calculation processing, the control unit 51 sets a fixed position for balancing the first mounting time and the second mounting time from among a large number of calculations (step S180).

For example, when the substrate S1 is fixed at the fixed position of the first transport path 21 corresponding to the center of the device (see the two-dot chain line in FIG. 3), the distance from the sampling position of the component P of the first component supply unit 11 to the substrate S1. The distance (referred to as the first distance) and the distance from the sampling position of the component P of the second component supply unit 12 to the substrate S1 (referred to as the second distance) are significantly different. In this case, when the mounting process is performed by a plurality of mounting heads, since the moving distance of one mounting head is long, a waiting time occurs in the other mounting head, and the balance of the mounting process is lost, which is an ideal operation. Is difficult to do. In this mounting device 10, in order to balance the first mounting time and the second mounting time when the fixed positions of the boards S1 and S2 are changed, ideal operation is performed in the mounting process using a plurality of mounting heads. It can be carried out.

Then, the control unit 18 of the mounting device 10 uses the mounting condition information in which the fixed positions of the boards S1 and S2 are set in this way, and conveys and fixes the boards S1 and S2 to the set fixed positions. Controls the transport unit 20.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The control unit 51 of the present embodiment corresponds to the calculation unit and the setting unit of the present invention, the first mounting unit 31 corresponds to the first mounting robot, the second mounting unit 32 corresponds to the second mounting robot, and the substrate is conveyed. The unit 20 corresponds to a transport unit, the first transport path 21 corresponds to the first transport path, the second transport path 22 corresponds to the second transport path, and the control unit 18 corresponds to the control unit. In the present embodiment, an example of the mounting condition setting method of the present invention is also clarified by explaining the operation of the management PC 50.

The control unit 51 of the management PC 50 of the present embodiment described above calculates the first mounting time required for the mounting process by the first mounting unit 31 when the boards S1 and S2 are fixed at a plurality of fixed positions, and also calculates the board. The second mounting time required for the mounting process by the second mounting unit 32 when S1 and S2 are fixed at a plurality of fixed positions is calculated respectively. Further, the control unit 51 fixes the boards S1 and S2 used in the mounting process based on the calculated first mounting time of the first mounting unit 31 and the plurality of second mounting times of the second mounting unit 32. Set the position. In this management PC 50, since the fixed positions are set according to the first and second mounting times when the fixed positions of the boards S1 and S2 are changed, the mounting process in a plurality of mounting units can be further improved. Further, since the control unit 51 sets a fixed position for balancing the first mounting time and the second mounting time to the fixed position used during the mounting process, the first mounting unit 31 and the second mounting unit 32 are mounted. The processing balance can be further improved. Further, since the control unit 51 sets a fixed position in which the total of the first mounting time and the second mounting time is shorter to the fixed position used in the mounting process, the time required for the entire mounting process is further shortened. be able to.

Further, the control unit 51 sets the fixed position based on the plurality of first and second mounting times on the first transport path 21, and also sets the plurality of first and second mounting times on the second transport path 22. Set the fixed position based on. When there are a plurality of transport paths, a difference is likely to occur between the moving distances of the plurality of mounting units. In this device, a more suitable fixing position of the substrate can be set for a plurality of transport paths. Further, the control unit 51 calculates the first and second mounting times corresponding to the fixed positions based on one or more of the number of parts to be mounted, the moving distance of the mounting head, the mounting order of the parts P, and the transport speed of the parts P. Therefore, by using the above conditions, a more accurate mounting time can be calculated.

Further, since the mounting system 1 includes a management PC 50 and a mounting device 10 that transports and fixes the boards S1 and S2 to the fixed positions of the boards S1 and S2 set by the management PC 50 to execute the mounting process. Similar to the management PC 50 described above, the mounting process in a plurality of mounting units can be further improved.

It goes without saying that the present invention is not limited to the above-described embodiment, and can be implemented in various aspects as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the substrate transport unit 20 has the first transport path 21 and the second transport path 22, but the present invention is not particularly limited to this, and the substrate transport unit 20 may not include the second transport path 22. Good. FIG. 5 is an explanatory view of a fixed position of the substrate S3 in the mounting device 10B provided with a single lane. In the mounting device 10B, the same reference numerals are given to the same configurations as those of the mounting device 10 described above, and the description thereof will be omitted. In the mounting device 10B, when the wide substrate S4 is conveyed, the moving conveyor 24 is slid and fixed so as to have a wide transfer width as shown by the dotted line in the drawing. On the other hand, when transporting the narrow substrate S3, the moving conveyor 24 is located closer to the fixed conveyor 23, and the first transport path 21 is farther from the second parts camera 14. Then, the management PC 50 sets the first mounting time of the first mounting unit 31 such as the fixed positions C1, C2, C3 ... Based on the position of the moving conveyor 24 of the board transporting unit 20 according to the board S3. , The second mounting time of the second mounting unit 32 is calculated, and in the same manner as described above, a fixed position that balances these is extracted and set to the fixed position used during the mounting process. For example, when the substrate S3 is fixed at the position of the transport path corresponding to the center of the device (see the alternate long and short dash line), the first distance and the second distance are significantly different. In this case, similarly to the above, a waiting time or the like may occur in the mounting head, and the balance of the mounting process may be lost. In this mounting device 10B, in order to balance the first mounting time and the second mounting time, the mounting process by a plurality of mounting units can be an ideal operation. Even in the substrate S4 having a relatively large width, the fixed position can be determined in the same manner as in the substrate S3.

In the above-described embodiment, the substrate transport unit 20 includes a fixed fixed conveyor 23 and a slide-movable mobile conveyor 24, but the substrate transport unit 20 may be composed of only the mobile conveyor without the fixed conveyor 23. Good. Alternatively, the substrate transfer unit may be composed of only the fixed conveyor.

In the above-described embodiment, after extracting one or more fixed positions that balance the first and second mounting times, the fixed positions in which the total time of the first and second mounting times is shorter are extracted, that is, the mounting. The time balance was given the highest priority, but it is not limited to this, and after extracting one or more fixed positions where the total time of the first and second mounting times is shorter, the first and second mounting times are set. The fixed position to be balanced may be extracted. In this apparatus, the time required for the entire mounting process can be further shortened, and the balance of the mounting processes of a plurality of mounting units can be further improved. Further, the control unit 51 shall extract the fixed position that balances the first and second mounting times, and omits the process of extracting the fixed position in which the total time of the first and second mounting times is shorter. May be good. In this apparatus, the balance of the mounting process of a plurality of mounting units can be further improved. Alternatively, fixed positions where the total time of the first and second mounting times is shorter may be extracted, and balancing the first and second mounting times may be omitted. With this device, the time required for the entire mounting process can be further reduced.

In the above-described embodiment, the arrangement of the feeder and the like of the component supply unit is set, the mounting order of the component P is set, and then the fixed position of the board is changed to calculate the first and second mounting times. The first and second mounting times may be calculated by combining changes between the fixed position of the board and the arrangement of the component supply unit, and the fixed position of the board and the component P may be calculated. The first and second mounting times may be calculated by combining changes with the mounting order, or first and first by combining changes with the fixed position of the board, the arrangement of the component supply unit, and the mounting order of the component P. 2 The mounting time may be calculated. Further, the frequency of mounting processing of the first mounting unit 31 and the second mounting unit 32 may be changed in combination. As the number of combinations increases, the calculation time of the first and second mounting times becomes longer, but a more desirable fixed position can be set.

In the above-described embodiment, the mounting unit that slides and moves the mounting head equipped with the suction nozzles 35 and 38 in the XY directions has been described as the mounting robot, but the mounting robot is not particularly limited to this, and may be, for example, an articulated arm robot. Also in this device, since the fixed positions that make the first and second mounting times suitable are set, the mounting process in a plurality of mounting robots can be further improved.

In the above-described embodiment, the first parts camera 13 is fixed at a position closer to the left side of the device, and the second parts camera 14 is fixed at a position closer to the right side of the device, but the present invention is particularly limited to this. They may not be fixed to each other and may be fixed to each other or may be fixed to the center of the device.

In the above-described embodiment, the present invention has been described as the mounting device 10, but the present invention may be used as a mounting method or a control method for the mounting device, or the present invention may be used as a program for executing the above-described processing by a computer.

The present invention can be used in mounting devices for arranging components on a substrate.

1 Mounting system, 10 Mounting device, 11 1st component supply unit, 12 2nd component supply unit, 13 1st parts camera, 14 2nd parts camera, 18 control unit, 20 board transfer unit, 21 1st transfer path, 22 2nd transport path, 23 fixed conveyor, 24, 26, 27 mobile conveyor, 25, 28 fixed mechanism, 31 1st mounting unit, 32 2nd mounting unit, 33 1st head moving part, 34 1st mounting head, 35 suction Nozzle, 36 2nd head moving part, 37 2nd mounting head, 38 suction nozzle, 41 1st area, 42 2nd area, 50 management PC, A1 to A3, B1 to B3, C1 to C3 fixed positions, P parts, S1 to S4 board, 51 control unit, 52 storage unit, 53 communication unit.

Claims (6)

It is a mounting condition setting device that sets mounting conditions for a mounting device including a first mounting robot that mounts components on a board, a second mounting robot that mounts components on a board, and a transport unit that conveys the board. hand,
It is required for the mounting process by the first mounting robot when the board is fixed at a predetermined fixed position and the mounting process is performed on the same board by using the first mounting robot and the second mounting robot. A calculation unit that changes the fixed position and calculates each of the first mounting time and the second mounting time required for the mounting process by the second mounting robot for each of the plurality of fixed positions.
A first mounting time of the first mounting robot in the computed plurality of fixed positions, based on the second mounting time of the second mounting robot, the said first mounting time of the plurality of fixed positions the second A setting unit that sets a fixed position where the difference from the mounting time becomes smaller as a fixed position of the board used in the mounting process, and a setting unit.
Mounting condition setting device equipped with. It is a mounting condition setting device that sets mounting conditions for a mounting device including a first mounting robot that mounts components on a board, a second mounting robot that mounts components on a board, and a transport unit that conveys the board. hand,
It is required for the mounting process by the first mounting robot when the board is fixed at a predetermined fixed position and the mounting process is performed on the same board by using the first mounting robot and the second mounting robot. The first mounting robot and the second mounting robot cooperate with each other for a plurality of fixed positions by changing the fixed positions of the first mounting time and the second mounting time required for the mounting process by the second mounting robot. The calculation unit that calculates each by taking into account the waiting time,
Based on the first mounting time of the first mounting robot at the plurality of calculated fixed positions and the second mounting time of the second mounting robot, the first mounting at a specific fixed position among the plurality of fixed positions. A setting unit that sets a fixed position that takes a shorter time to mount a single substrate by collaborative work between the robot and the second mounting robot to a fixed position used during the mounting process.
Mounting condition setting device equipped with. The mounting device includes the transport unit having a first transport path for transporting the substrate and a second transport path for transporting the substrate.
The calculation unit calculates a plurality of the first mounting time and the second mounting time based on the plurality of fixed positions in the first transport path, and at the same time, at the plurality of fixed positions in the second transport path. Calculate the plurality of the first mounting time and the second mounting time based on the calculation,
The setting unit sets a fixed position to be used in the mounting process based on the plurality of the first mounting times and the second mounting time in the first transport path, and the plurality of the setting units in the second transport path. The mounting condition setting device according to claim 1 or 2, wherein a fixed position to be used at the time of the mounting process is set based on the first mounting time and the second mounting time. The calculation unit includes the number of parts to be mounted, the moving distance to the mounting position of the board fixed at the fixed position, the mounting order of the parts by the first mounting robot and the second mounting robot, and the first mounting. Any one of claims 1 to 3 that calculates the first mounting time and the second mounting time corresponding to the fixed position based on one or more of the transport speeds of the parts by the robot or the second mounting robot. The mounting condition setting device described in the section. The mounting condition setting device according to any one of claims 1 to 4.
The first mounting robot that mounts the components on the board, the second mounting robot that mounts the components on the board, the transport unit that conveys the board, the first mounting robot, and the second mounting robot are controlled and mounted. A mounting device including a control unit that controls the transfer unit so as to transfer the substrate to the fixed position set by the condition setting device.
Implementation system with. It is a mounting condition setting method for setting mounting conditions of a mounting device including a first mounting robot for mounting components on a board, a second mounting robot for mounting components on a board, and a transport unit for transporting the board. hand,
(A) Mounting by the first mounting robot when the board is fixed at a predetermined fixed position and mounting processing is performed on the same board by using the first mounting robot and the second mounting robot. A step of changing the fixed position and calculating each of the first mounting time required for the process and the second mounting time required for the mounting process by the second mounting robot for each of the plurality of fixed positions.
(B) a first mounting time of the first mounting robot in the computed plurality of fixed positions, based on the second mounting time of the second mounting robot, and the first mounting time of the plurality of fixed positions A step of setting a fixed position where the difference from the second mounting time becomes smaller as a fixed position of the substrate used in the mounting process, and a step of setting the fixed position.
Implementation condition setting method including.

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