JP2018056387A - Mounting device and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a balance of a mounting processing by a plurality of mounting robots.SOLUTION: A mounting device 10 comprises: a first mounting head 34 and a second mounting head 37 in which a component is mounted to substrates S1 and S2; a first part camera 13 that is distributed on a first region side divided by a conveying passage of the substrate and images the component held by the first mounting head 34; a second part camera 14 that is distributed on a second region side different from the first region side divided by the conveying passage of the substrate and images the component held by a second mounting head 37; and an a substrate conveying part 20 that keeps a balance of the first distance between the first part camera 13 and the substrate S1 and the second distance between the second part camera 14 and the substrate S1, and conveys and fixes the substrate S1 by a first conveying passage 21 at a position deviated from the position corresponded to a center of a device.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting apparatus and a mounting method.

  Conventionally, as a mounting apparatus, in a mounting apparatus having a plurality of transport conveyors and a plurality of mounting heads, a synchronous mode for synchronizing the carry-out of the board after component mounting between the respective transport conveyors, and an asynchronous mode for performing independently A method has been proposed in which production efficiency is calculated when each of the devices is operated, and a mode with high production efficiency is selected and executed (see, for example, Patent Document 1).

JP 2009-224664 A

  However, in the mounting apparatus described in Patent Document 1, the synchronization mode of the conveyor is considered, but the synchronization of the mounting head is not considered. In such a mounting apparatus, a part picked up by a mounting head may be imaged with a parts camera and then placed on a substrate. In the apparatus of Patent Document 1, the substrate is stopped at the center of the apparatus to perform the mounting process. For example, the distance from the first part camera to the substrate through which the first mounting head passes and the second mounting head pass through. In some cases, the distance from the second part camera to the substrate was different. In this case, when mounting processing is performed with multiple mounting heads, because the moving distance of one mounting head is long, there is a waiting time for the other mounting head, resulting in an unbalanced mounting process and ideal operation. There were cases where it was difficult to do. As described above, the mounting apparatus has been required to further improve the balance of mounting processing by a plurality of mounting heads.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a mounting apparatus and a mounting method that can further improve the balance of mounting processing by a plurality of mounting robots.

  The present invention adopts the following means in order to achieve the main object described above.

The mounting apparatus disclosed in this specification is:
A plurality of mounting robots for mounting components on the board;
A first imaging unit that images a component that is disposed on a first region side separated by a conveyance path of the substrate and that is held by the mounting robot;
A second imaging unit that images a component that is disposed on a second region side different from the first region divided by the substrate conveyance path and that is held by the mounting robot;
The first distance between the first imaging unit and the substrate is balanced with the second distance between the second imaging unit and the substrate, and the position is shifted from the position corresponding to the center of the apparatus. A transport unit for transporting and fixing the substrate in the transport path;
It is equipped with.

  In this apparatus, the first distance between the first imaging unit and the substrate disposed on the first area side delimited by the transport path and the second distance disposed on the second area side different from the first area. The substrate is transported and fixed on the transport path at a position that is balanced with the second distance between the imaging unit and the substrate and is shifted from the position corresponding to the center of the apparatus. For example, when the substrate is fixed at the center of the apparatus, the first distance and the second distance may be greatly different. In this case, when the mounting process is performed with multiple mounting robots, the moving distance of one mounting robot is long, causing a waiting time for the other mounting robot, resulting in an unbalanced mounting process and ideal operation. Is difficult to do. In this apparatus, since the substrate is arranged at a position that balances the first distance and the second distance, the waiting state of the mounting robot can be reduced. Therefore, this apparatus can further improve the balance of mounting processing by a plurality of mounting robots. In this apparatus, the transfer unit may fix the substrate at a position where the first distance and the second distance are the same.

  In this mounting apparatus, when the distance between the first imaging unit and the conveyance path is shorter than the distance between the second imaging unit and the conveyance path, the conveyance unit is located closer to the second imaging unit. It is good also as what fixes. In this apparatus, since the distance between the first imaging unit and the substrate is further increased, and the distance between the second imaging unit and the substrate is further decreased, the first distance and the second distance can be balanced. Similarly, when the distance between the second image capturing unit and the transport path is shorter than the distance between the first image capturing unit and the transport path, the transport unit is located closer to the first image capturing unit. It is good also as what fixes.

  In this mounting apparatus, the first imaging unit and the second imaging unit may be disposed at a position shifted from a position facing the conveyance path. In this apparatus, for example, the difference between the first distance and the second distance is more likely to occur than in the case where the first imaging unit and the second imaging unit are at positions facing the conveyance path, and a plurality of mounting robots Can improve the balance of the mounting process.

  In this mounting apparatus, the conveyance unit may have a plurality of the conveyance paths. In this apparatus, a difference between the first distance and the second distance is likely to occur between a plurality of transport paths, for example, a transport of a substrate on the first transport path and a transport of a substrate on the second transport path. The balance of the mounting process by the mounting robot can be further improved.

  This mounting apparatus WHEREIN: The said conveyance part is good also as what has the said conveyance path containing the fixed conveyor fixed and the moving conveyor which moves a conveyance width so that a change is possible. In this apparatus, the difference between the first distance between the first image pickup unit and the substrate and the second distance between the second image pickup unit and the substrate occurs depending on the position of the moving conveyor. It can be improved further.

  In the mounting apparatus, the plurality of mounting robots include a first mounting robot and a second mounting robot, the first mounting robot moves the component on the first region side, and the second mounting robot The part may be moved on the second region side. In this apparatus, the balance of the mounting process between the first mounting robot working on the first area side and the second mounting robot working on the second area side can be further improved. Note that the mounting robot may be a mounting unit that slides the mounting head in the XY directions, or may be an articulated arm robot.

The implementation method disclosed in this specification is:
A plurality of mounting robots for mounting components on a substrate; a first imaging unit that is disposed on a first region side separated by a transport path of the substrate; and that images the components held by the mounting robot; A mounting method comprising: a second imaging unit that images a component that is disposed on a second region side different from the first region separated by a conveyance path and that is held by the mounting robot;
The first distance between the first imaging unit and the substrate is balanced with the second distance between the second imaging unit and the substrate, and the position is shifted from the position corresponding to the center of the apparatus. Transporting and fixing the substrate in the transport path;
May be included.

  In this mounting method, similarly to the mounting apparatus described above, since the substrate is arranged at a position that balances the first distance and the second distance, it is possible to reduce the waiting state of the mounting robot and the like. Can improve the balance of the mounting process. In this mounting method, various aspects of the mounting apparatus described above may be adopted, and steps for realizing each function of the mounting apparatus described above may be added.

FIG. 3 is an explanatory diagram illustrating an example of a schematic configuration of the mounting system 1. FIG. 3 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 10. Explanatory drawing of the fixed position of board | substrates S1 and S2 in a double lane. Explanatory drawing of the fixed position of board | substrates S3 and S4 in a single lane.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram illustrating an example of a schematic configuration of the mounting system 1. FIG. 2 is an explanatory diagram illustrating an example of a schematic configuration of the mounting apparatus 10. The mounting system 1 is a system that executes a mounting process related to a process of mounting an electronic component (component P) on the substrates S1 and S2, for example. In this mounting system 1, a plurality of mounting apparatuses 10 that execute mounting processing are arranged from upstream to downstream to constitute a production line. The mounting system 1 includes a management personal computer (PC) 50. The management PC 50 manages information related to processing in each mounting apparatus 10. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

  The mounting apparatus 10 includes two mounting units, and has a dual lane and dual robot apparatus configuration in which two substrates S1 and S2 are transported and fixed and mounting processing is performed on them. As shown in FIG. 1, the mounting apparatus 10 includes a first component supply unit 11, a second component supply unit 12, a first parts camera 13, a second parts camera 14, a board transport unit 20, The first mounting unit 31, the second mounting unit 32, and the control unit 18 are provided. The control unit 18 is configured as a microprocessor centered on a CPU, and includes a storage unit that stores processing programs and various data. The control unit 18 outputs a control signal to each unit and controls these units. Moreover, the control part 18 inputs the signal from each unit, and controls each unit so that the process according to it may be performed.

  The mounting apparatus 10 has the first component supply unit 11 mounted on the front surface of the apparatus main body, and the second component supply unit 12 mounted on the rear surface. The first component supply unit 11 mainly supplies the component P to the first mounting unit 31, and includes a feeder including a reel wound with a tape that accommodates the component P, a tray on which the component P is placed, and the like. ing. The second component supply unit 12 mainly supplies the component P to the second mounting unit 32. The second component supply unit 12 includes a feeder including a reel wound with a tape accommodating the component P, a tray on which the component P is placed, and the like. ing.

  The first parts camera 13 is, for example, a camera that captures an image of a part P or the like collected and held by the first mounting head 34 from below. The first parts camera 13 is disposed on the first area 41 side in front of the substrate transport unit 20 (see FIG. 2). Note that the first region 41 is a region delimited at the center of the transport path of the substrate transport unit 20, and the second region 42 is a region on a side different from the first region 41. The imaging range of the first parts camera 13 is above the first parts camera 13. The second parts camera 14 is, for example, a camera that captures an image of the component P collected and held by the second mounting head 37 from below. The second parts camera 14 is disposed on the second region 42 side, which is behind the substrate transport unit 20. The imaging range of the second parts camera 14 is above the second parts camera 14. Each of the first part camera 13 and the second part camera 14 is disposed at a position shifted from a position facing the transport path of the substrate transport unit 20 (see FIG. 3). That is, the first part camera 13 and the second part camera 14 are not arranged on a line drawn perpendicularly to the conveyance path (see, for example, a two-dot chain line in FIG. 3). The first part camera 13 is fixed at a position close to the left side of the apparatus, and the second part camera 14 is fixed at a position close to the right side of the apparatus. The control unit 18 uses the images captured by the first parts camera 13 and the second parts camera 14 to check the positional deviation and shape of the component P that has been collected and held. The first mounting unit 31 collects the component P from the first component supply unit 11, passes the first part camera 13, and mounts the component P on the substrate S <b> 1. The second mounting unit 32 collects the component P from the second component supply unit 12 and then mounts the component P on the substrate S2 through the second parts camera 14.

  The substrate transport unit 20 is a unit that loads the substrates S1 and S2 and positions and supports the loaded substrates S1 and S2. The substrate transport unit 20 includes a first transport path 21 and a second transport path 22. The 1st conveyance path 21 comprises the 1st lane of a mounting process, and is comprised by the fixed conveyor 23, the moving conveyor 24, and the fixing mechanism 25 (FIG. 1). As shown in FIGS. 2 and 3, the fixed conveyor 23 and the moving conveyor 24 are provided in each of the pair of side frames, and each support the end of the substrate S <b> 1 and transport the substrate S <b> 1. The fixed conveyor 23 serves as a reference position of the substrate conveyance path, and is fixed to the housing so as not to move. The moving conveyor 24 is disposed in the casing so as to slide and move with respect to the fixed conveyor 23 in accordance with the width of the substrate S1. The fixing mechanism 25 is a mechanism that clamps and fixes the substrate S1. The 2nd conveyance path 22 comprises the 2nd lane of a mounting process, and is comprised by the mobile conveyors 26 and 27 and the fixing mechanism 28 (FIG. 1). As shown in FIGS. 2 and 3, the moving conveyors 26 and 27 are provided in each of the pair of side frames, and each support the end of the substrate S <b> 2 and transport the substrate S <b> 2. The moving conveyors 26 and 27 are arranged in the casing so as to slide and move so that the transfer width can be changed according to the width of the substrate S2. Note that the moving conveyor 26 slides according to the position of the moving conveyor 24. The fixing mechanism 28 is a mechanism that clamps and fixes the substrate S2. The first transport path 21 is provided with a substrate support part that supports the substrate S1 from below, and the second transport path 22 is provided with a substrate support part that supports the substrate S2 from below.

  The mounting apparatus 10 includes a first mounting unit 31 on the front side of the apparatus main body and a second mounting unit 32 on the rear side, and is configured to be able to execute mounting processing in two lanes in parallel. The first mounting unit 31 mainly performs a mounting process in which the component P collected from the first component supply unit 11 is arranged on the substrate S1 fixed to the first transport path 21 and the substrate S2 fixed to the second transport path 22. Is. The first mounting unit 31 includes a first head moving unit 33, a first mounting head 34, and a suction nozzle 35. The first head moving unit 33 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The first mounting head 34 is detachably mounted on the slider, and moves in the XY direction by the first head moving unit 33. On the lower surface of the first mounting head 34, one or more suction nozzles 35 for collecting the component P are detachably mounted. The suction nozzle 35 is a collection member that collects the component P using pressure. The first mounting head 34 may be mounted with a mechanical chuck that mechanically grips the component P instead of the suction nozzle 35. The second mounting unit 32 mainly performs a mounting process in which the component P collected from the second component supply unit 12 is arranged on the substrate S2 fixed to the second transport path 22 and the substrate S1 fixed to the first transport path 21. Is. The second mounting unit 32 includes a second head moving unit 36, a second mounting head 37, and a suction nozzle 38. The second mounting unit 32 may have the same configuration as the first mounting unit 31 or a different configuration. Note that the second mounting unit 32 has the same configuration as the first mounting unit 31, and a description thereof is omitted.

  Next, the operation of the mounting apparatus 10 according to the present embodiment configured as described above, in particular, a process for executing the mounting process while fixing the substrates S1 and S2 will be described. FIG. 3 is an explanatory diagram of the fixed positions of the substrates S1 and S2 in the double lane having the first transport path 21 and the second transport path 22. When the worker inputs the start of the mounting process from the operation panel, the control unit 18 starts the mounting process. When the mounting process is started, the control unit 18 acquires mounting job information including the contents of the boards S1 and S2 produced this time from the management PC 50. This mounting job information includes the size of the boards S1 and S2, the position, number, and type of components to be arranged. Next, the control unit 18 moves and fixes the moving conveyors 24, 26, and 27 in accordance with the widths of the substrates S1 and S2, and loads the substrates S1 and S2 so as to fix the substrates at a predetermined fixed position. To control. The fixed positions of the substrates S1 and S2 may be set by the management PC 50, or may be set by the control unit 18.

  Here, as shown in FIG. 3, the substrate transport unit 20 includes a first distance A1 between the first parts camera 13 and the substrate S1, and a second distance between the second parts camera 14 and the substrate S1. The substrate S1 is transported and fixed by the first transport path 21 at a position balanced with A2 and shifted from a position corresponding to the center of the apparatus (see a two-dot chain line in FIG. 3). In addition, the substrate transfer unit 20 has a second on the first transfer path 21 when the distance between the first parts camera 13 and the first transfer path 21 is shorter than the distance between the second parts camera 14 and the first transfer path 21. The substrate S1 is fixed at a position closer to the parts camera 14. Similarly, the substrate transport unit 20 balances the first distance B1 between the first parts camera 13 and the substrate S2 and the second distance B2 between the second parts camera 14 and the substrate S2. In addition, the substrate S2 is transported and fixed by the second transport path 22 at a position shifted from the position corresponding to the center of the apparatus. In addition, the substrate transport unit 20 is configured so that when the distance between the second parts camera 14 and the second transport path 22 is shorter than the distance between the first parts camera 13 and the second transport path 22, the first transport is performed on the second transport path 22. The substrate S2 is fixed at a position closer to the parts camera 13. Here, “to balance” means to make the difference in distance smaller. The distance to the substrates S1 and S2 is based on the center of the substrates S1 and S2.

  For example, as shown by the dotted line in FIG. 3, when the substrate S1 is fixed at the position of the transport path corresponding to the center of the apparatus (see the two-dot chain line), the first distance a1 and the second distance a2 are greatly different. . In this case, when mounting processing is performed with multiple mounting heads, because the moving distance of one mounting head is long, there is a waiting time for the other mounting head, resulting in an unbalanced mounting process and ideal operation. Is difficult to do. In the mounting apparatus 10, since the difference between the first distance A1 and the second distance A2 is relatively small, the movement time of the mounting head is balanced, and the mounting process is well balanced and an ideal operation can be performed. it can. If this board | substrate S1 is fixed in the position near the 2nd parts camera 14 side and shifted | deviated from the center, the difference of distance becomes smaller and it is preferable. As for the fixed position, for example, a specific position may be set in consideration of the width of the substrate S1 in addition to the first and second distances. At this time, the substrate transport unit 20 may fix the substrate S1 at a position where the first distance A1 and the second distance A2 are the same. Also in the substrate S2, the relationship between the first distance B1 and the second distance B2 and the first distance b1 and the second distance b2 is the same as that of the substrate S1. The specific fixing position can be determined similarly to the substrate S1.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The first mounting unit 31 and the second mounting unit 32 of the present embodiment correspond to a mounting robot, the first parts camera 13 corresponds to a first imaging unit, the second parts camera 14 corresponds to a second imaging unit, The substrate transport unit 20 corresponds to the transport unit, the first transport path 21 and the second transport path 22 correspond to the transport path, the fixed conveyor 23 corresponds to the fixed conveyor, and the moving conveyor 24 corresponds to the moving conveyor.

  In the mounting apparatus 10 of the present embodiment described above, the first distance A1 between the first parts camera 13 and the substrate S1 disposed on the first area 41 side divided by the conveyance path, and the first area 41. The substrate S1 is transported to a position that is balanced with the second distance A2 between the second parts camera 14 and the substrate S1 disposed on the second region 42 side different from the position corresponding to the center of the apparatus. It is conveyed and fixed by the path 21. In the mounting apparatus 10, since the substrate S1 is disposed at a position that balances the first distance A1 and the second distance A2, a waiting time that may be caused by a difference in moving time between the first mounting head 34 and the second mounting head 37 is generated. The state etc. can be reduced. Therefore, this apparatus can further improve the balance of mounting processing by a plurality of mounting units (mounting heads).

  The substrate transport unit 20 is closer to the second parts camera 14 when the distance between the first parts camera 13 and the first transport path 21 is shorter than the distance between the second parts camera 14 and the first transport path 21. The substrate S1 is fixed. In this apparatus, since the first distance A1 between the first parts camera 13 and the substrate S1 is further increased and the second distance A2 between the second parts camera 14 and the substrate S1 is closer, these distances are balanced. be able to. Similarly, when the distance between the second parts camera 14 and the second transport path 22 is shorter than the distance between the first parts camera 13 and the second transport path 22, the substrate transport unit 20 is closer to the first parts camera 13. The substrate S2 is fixed to the substrate. In this apparatus, since the second distance B2 between the second parts camera 14 and the substrate S2 is further increased and the first distance B1 between the first parts camera 13 and the substrate S2 is closer, these distances are balanced. be able to.

  Further, the first parts camera 13 and the second parts camera 14 are arranged at positions shifted from positions facing the first transport path 21 and the second transport path 22. In this mounting apparatus 10, for example, the difference between the first distance and the second distance is more likely to occur as compared to the first part camera 13 and the second part camera 14 that are in positions facing the conveyance path. The balance of mounting processing by a plurality of mounting heads can be further improved. Furthermore, since the substrate transport unit 20 has a plurality of transport paths, for example, in the transport of the substrate S1 on the first transport path 21 and the transport of the substrate S2 on the second transport path 22, the first A difference between the distance and the second distance is likely to occur, and the balance of the mounting processing by the plurality of mounting heads can be further improved. Furthermore, since the board | substrate conveyance part 20 contains the fixed conveyor 23 and the movement conveyor 24 which move so that conveyance width can be changed, depending on the position of the movement conveyor 24, the 1st parts camera 13 and board | substrate S1 are carried out. Since the difference between the first distance and the second distance between the second parts camera 14 and the substrate S1 occurs, it is possible to further improve the balance of mounting processing by a plurality of mounting heads.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the substrate transport unit 20 includes the first transport path 21 and the second transport path 22, but is not particularly limited thereto, and may not include the second transport path 22. Good. FIG. 4 is an explanatory diagram of fixed positions of the substrates S3 and S4 in the mounting apparatus 10B having a single lane. FIG. 4 shows an example in which the substrates S3 and S4 having different sizes are fixed. In the mounting apparatus 10B, the same reference numerals are given to the same configurations as those of the mounting apparatus 10 described above, and the description thereof is omitted. In the mounting apparatus 10 </ b> B, the center line (see the alternate long and short dash line) between the fixed conveyor 23 and the moving conveyor 24 is the boundary between the first area 41 and the second area 42. In the board | substrate S3 with a narrow width | variety, the moving conveyor 24 becomes a position closer to the fixed conveyor 23, and the 1st conveyance path 21 becomes farther from the 2nd parts camera 14. FIG. And the board | substrate conveyance part 20 is the 2nd between the 1st distance C1 between the 1st parts camera 13 and the board | substrate S3, and the 2nd parts camera 14 and this board | substrate S3 similarly to the mounting apparatus 10 mentioned above. The substrate S3 is transported and fixed at a position that is balanced with the distance C2 and is shifted from the position corresponding to the center of the apparatus (see the two-dot chain line in FIG. 4). In addition, the substrate transfer unit 20 has a second on the first transfer path 21 when the distance between the first parts camera 13 and the first transfer path 21 is shorter than the distance between the second parts camera 14 and the first transfer path 21. The substrate S3 is fixed at a position closer to the parts camera 14. For example, as shown by the dotted line in FIG. 4, when the substrate S3 is fixed at the position of the conveyance path corresponding to the center of the apparatus (see the two-dot chain line), the first distance c1 and the second distance c2 are greatly different. . In this case, as described above, a waiting time or the like occurs in the mounting head, and the balance of the mounting process is lost. In this mounting apparatus 10B, since the difference between the first distance C1 and the second distance C2 is relatively small, the movement time of the mounting head is balanced, and the mounting process is well balanced and an ideal operation can be performed. it can. Even in the substrate S4 having a relatively large width, the relationship between the first distance D1 and the second distance D2 and the first distance d1 and the second distance d2 is the same as that of the substrate S3. The specific fixing position of the substrate S4 can also be determined similarly to the substrates S1 to S3.

  In the above-described embodiment, the substrate transport unit 20 includes the fixed conveyer 23 that is fixed and the movable conveyer 24 that is slidable. However, the substrate conveyer 20 may include only the movable conveyer without the fixed conveyer 23. Good. Or it is good also as what comprises a board | substrate conveyance part only with a fixed conveyor.

  In the above-described embodiment, the mounting unit that slides the mounting head on which the suction nozzles 35 and 38 are mounted in the XY directions has been described as the mounting robot. However, the present invention is not limited to this. For example, the mounting robot is an articulated arm robot. Also good. Also in this apparatus, the balance of the mounting process by a plurality of mounting robots can be further improved.

  Although the present invention has been described as the mounting apparatus 10 in the above-described embodiment, the present invention may be a mounting method or a mounting apparatus control method, or the present invention may be a program executed by a computer.

  The present invention can be used in a mounting apparatus that arranges components on a substrate.

DESCRIPTION OF SYMBOLS 1 Mounting system, 10 Mounting apparatus, 11 1st component supply unit, 12 2nd component supply unit, 13 1st parts camera, 14 2nd parts camera, 18 Control part, 20 Substrate conveyance part, 21 1st conveyance path, 22 Second transport path, 23 Fixed conveyor, 24, 26, 27 Moving conveyor, 25, 28 Fixing mechanism, 31 First mounting unit, 32 Second mounting unit, 33 First head moving unit, 34 First mounting head, 35 Adsorption Nozzle, 36 Second head moving unit, 37 Second mounting head, 38 Suction nozzle, 41 First area, 42 Second area, 50 Management PC, A1, a1, B1, b1, C1, c1, D1, d1 First Distance, A2, a2, B2, b2, C2, c2, D2, d2 Second distance, P component, S1-S4 substrate.

Claims (6)

A plurality of mounting robots for mounting components on the board;
A first imaging unit that images a component that is disposed on a first region side separated by a conveyance path of the substrate and that is held by the mounting robot;
A second imaging unit that images a component that is disposed on a second region side different from the first region divided by the substrate conveyance path and that is held by the mounting robot;
The first distance between the first imaging unit and the substrate is balanced with the second distance between the second imaging unit and the substrate, and the position is shifted from the position corresponding to the center of the apparatus. A transport unit for transporting and fixing the substrate in the transport path;
Mounting device.   The conveyance unit fixes the substrate at a position closer to the second imaging unit when a distance between the first imaging unit and the conveyance path is shorter than a distance between the second imaging unit and the conveyance path. Item 2. The mounting apparatus according to Item 1.   The mounting apparatus according to claim 1, wherein the first imaging unit and the second imaging unit are disposed at a position shifted from a position facing the transport path.   The mounting device according to claim 1, wherein the transport unit includes a plurality of the transport paths.   The mounting apparatus according to claim 1, wherein the transport unit includes the transport path including a fixed conveyor that is fixed and a moving conveyor that moves the transport width in a changeable manner. A plurality of mounting robots for mounting components on a substrate; a first imaging unit that is disposed on a first region side separated by a transport path of the substrate; and that images the components held by the mounting robot; A mounting method comprising: a second imaging unit that images a component that is disposed on a second region side different from the first region separated by a conveyance path and that is held by the mounting robot;
The first distance between the first imaging unit and the substrate is balanced with the second distance between the second imaging unit and the substrate, and the position is shifted from the position corresponding to the center of the apparatus. Transporting and fixing the substrate in the transport path;
Implementation method including