JPWO2019167258A1 - Surface mounter - Google Patents

Abstract

It is a surface mounter 1 having two lanes L parallel to each other on which the substrate P is transported, and is arranged on both sides of the two lanes L, respectively, with a component supply area on the upstream side in the transport direction of the substrate P. Two component supply devices (a component supply device composed of tape component supply devices 3A and 3B and a component supply device composed of tape component supply devices 3C and 3D) having a component supply area on the downstream side. The control unit 30 includes two head units 14 that hold the component E supplied by the component supply device 3 and mount the component E on the substrate P, and the control unit 30 is one head unit 14 in one lane L. A surface mounter 1 that switches the one lane L to the two-board, two-head method when an idle state occurs in the other lane L while the component E is mounted by the one-board, one-head method.

Description

The techniques disclosed herein relate to surface mounters having two parallel lanes on which substrates are conveyed.

Conventionally, a surface mounter having two parallel lanes on which a substrate is conveyed is known to have a plurality of mounting methods (see, for example, Patent Documents 1 and 2).
For example, in the electronic component mounting system described in Patent Document 1, the first component mounting device and the second component mounting device are respectively mounted on both substrates transported by both the first transport device and the second transport device. Both the first component mounting device and the second component mounting device are mounted on the board transported by either the first transport device or the second transport device in the mounting mode (one board, one head method) for mounting components. There is a mounting mode (1 board, 2 heads method) for mounting electronic components.

Further, in the electronic component mounting device described in Patent Document 2, the electronic component is taken out from the component supply device on the front side by the beam mounting head on the front side and mounted on the substrate in the transport device on the front side. The mounting mode (1 board, 1 head method) in which electronic components are taken out from the component supply device on the back side and mounted on the board in the transport device on the back side by the mounting head of the beam on the back side, and the mounting head of one beam. When is in the idle state, the mounting head in the idle state for the electronic component not mounted on the substrate in the other transport device is taken out from the component supply device close to the other transport device, and is in the other transport device. There is a mounting mode (1 board, 2 heads method) for mounting on a board.

JP-A-2017-11024 Japanese Patent No. 5756345

However, in the one-board, two-head system, one component mounting device (or mounting head) and the other component mounting device (or mounting head) mount components on one board at the same time, so that two component mounting devices are used. Interference is likely to occur between them. If interference occurs between two component mounting devices, one component mounting device must wait until the interference no longer occurs. Therefore, there is a problem that time loss (hereinafter referred to as “interference loss”) occurs and it is difficult to improve production efficiency.

This specification discloses a technique for improving the production efficiency of a surface mounter having two lanes and two head portions.

The surface mounter disclosed in the present specification is a surface mounter having two lanes parallel to each other on which a substrate is conveyed, and is arranged on both sides of the two lanes so as to convey the substrate. Two component supply devices having a component supply area on the upstream side and a component supply area on the downstream side, two head units that hold the components supplied by the component supply device and mount them on the board, and a control unit. In one mounting method of the lane, the board conveyed to the working position on the lane has the component supply area on the upstream side of the component supply device arranged on the lane side and the component supply area and the component supply area on the upstream side of the component supply device. A one-board, one-head system in which the parts supplied in the parts supply area on the downstream side are mounted by one head portion, and the board conveyed to the work position on the upstream side on the lane, on the lane side. The component supplied in the component supply area on the upstream side of the component supply device arranged is mounted by one of the head portions, and in parallel with this mounting, the component is mounted at the working position on the upstream side. 2 boards 2 on which the components supplied in the component supply area on the downstream side of the component supply device are mounted by the other head portion on another substrate that has been transferred to a work position on the downstream side of the lane. There is a head method, and when the control unit mounts the component in one of the lanes by the one-board, one-head method, and an idle state occurs in the other lane, the control unit is said to be the one. The lane is switched to the two-board, two-head system.

In the two-board, two-head system, the head portion of one lane (hereinafter, simply referred to as “one head portion”) and the head portion of the other lane (hereinafter, simply referred to as “the other head portion”) are on the upstream side and the downstream side. Since the mounting is carried out in a different manner from the above, interference loss is less likely to occur as compared with the one-board, two-head method. Therefore, according to the above surface mounter, it is possible to improve the production efficiency of the surface mounter having two lanes and two heads as compared with the case of switching between the one-board one-head method and the one-board two-head method. it can.

Further, when the one reciprocating operation of holding the component supplied in the component supply area, mounting the component on the substrate, and then returning to the component supply area is defined as a sequence, the control unit has the upstream side of the component. 1 board 1 consisting of sequence data defining a sequence for mounting only the components supplied in the component supply area and sequence data defining a sequence for mounting only the components supplied in the component supply area on the downstream side. A program for the head system is stored for each lane, and the control unit uses a part of the plurality of sequence data constituting the program for the one substrate and one head system in the one lane. By allocating to the head portion of the other lane, the one lane may be switched to the two-board two-head system.

When switching between the 1-board 1-head method and the 2-board 2-head method, it is conceivable to separately create a program for the 1-board 1-head method and a program for the 2-board 2-head method by an optimization program in advance. .. However, the calculation by the optimization program usually takes a very long time such as one day, which increases the program creation cost. In addition, since one product has a plurality of programs, management costs and maintenance costs become burdensome. For example, when a certain modification is included in a program, two or more programs must be modified, which increases the burden on the operator.
According to the above surface mounter, by allocating a part of a plurality of sequence data constituting the program for one board and one head system in one lane to the other head portion (that is, the head portion on the supporting side). Since one of the lanes is switched to the 2-board 2-head system, it is not necessary to create a program for the 2-board 2-head system in advance by the optimization program. Therefore, the cost of creating the program can be suppressed, and the burden on the operator can be reduced, so that the management cost and the maintenance cost can also be suppressed.

Further, the program for the one-board, one-head system includes the number of sequence data for mounting the components supplied in the component supply area on the upstream side and the sequence data for mounting the components supplied in the component supply area on the downstream side. The mounting time for mounting the components supplied in the component supply area on the upstream side and the mounting time for mounting the components supplied in the component supply area on the downstream side are created so that the numbers of the components are substantially the same. Are created so as to be substantially the same, or the number of parts supplied in the component supply area on the upstream side and the number of parts supplied in the component supply area on the downstream side are substantially the same. It may be created as follows.

According to the above surface mounter, the mounting time of one head portion and the mounting time of the other head portion when switching to the two-board two-head system can be made substantially the same, so that the mounting time is large. Production efficiency can be improved as compared with different cases.

Further, the control unit informs the substrate whether or not an idle state occurs in the other lane when the component is mounted on the substrate by the one-board one-head method in the one lane. Judgment is made based on predetermined production information before the mounting of the component is started, and if an idle state occurs, the one-board, one-head method of the one of the lanes is performed before the mounting of the component is started. 2 for mounting by the two-board two-head method in the one lane by allocating a part of the plurality of sequence data constituting the program to the head portion of the other lane. When the program for the board 2-head method or the mounting by the 1-board 1-head method is performed in the other lane, the mounting is performed by the 1-board 1-head method in the one lane and the other When the lane becomes idle, a program for a composite method for mounting by the two-board two-head method in the one lane may be generated.

As the timing for generating the program for the 2-board 2-head system from the program for the 1-board 1-head system, the timing when an idle state occurs in the other lane can be considered. However, when generated after the idle state occurs, the unexecuted sequence data of one head portion (that is, the head portion on the supported side) is the sequence data for mounting the components supplied in the same component supply area. In some cases, the two heads will go to hold the parts in the same parts supply area (that is, there will be competition in the parts supply area), so mounting with a two-board, two-head method is used. I can't do it.
According to the above surface mounter, when an idle state occurs, a program for a two-board, two-head system or a program for a composite system is performed before starting mounting of components on a board (hereinafter, also referred to as "board production"). Is generated, so that the mounting by the two-board two-head method can be performed more reliably than in the case of generating the program for the two-board two-head method after the idle state occurs in the other lane.

Further, in the control unit, after mounting the component on the one board by the one-board one-head method in the other lane, the other lane is in an idle state until the next board is conveyed. In this case, when the program for the composite method is generated, a part of the sequence data among the plurality of sequence data executed by the head portion of the one lane when the other lane is idle. Is assigned to the head portion of the other lane, and the sequence data executed by the head portion of the one said lane and the sequence data assigned to the head portion of the other lane in the idle state are used. When the component supply areas compete, the head portion of the one lane executes the competing sequence data during the period in which the component is mounted on the substrate by the one-board one-head method in the other lane. The execution order of the sequence data of the program for the composite method may be changed so as to be performed.

According to the above surface mounter, it is possible to prevent the component supply areas from competing between one head portion and the other head portion, so that the two-board, two-head system is used after an idle state occurs in the other lane. In the case of generating the program of, even if the mounting by the two-board two-head method cannot be performed, the mounting by the two-board two-head method can be performed.

Further, when the component is mounted on the substrate by the two-board two-head method in the one lane, the control unit receives the two-board 2 when a failure occurs in one of the heads. The mounting by the head method may be completed, and the component may be mounted by the head portion whichever does not cause a failure in the substrate which is conveyed in the lane.

According to the above surface mounter, even if a failure occurs in one of the heads when a component is mounted on a board by a two-board, two-head method in one lane, the head that does not have a failure. The part can be used to continue mounting components on the board.

Further, the head portion has a plurality of holding portions for holding and releasing the component, and the two head portions may have the same number of holding portions.

If the number of holding portions of one head portion and the number of holding portions of the other head portion are different, mounting by the two-board two-head method may not be possible. For example, when the number of holding portions of one head portion is larger than the number of holding portions of the other head portion, when an idle state occurs in the other lane, the other head portion has more holding portions than one head portion. Due to the small number of heads, the sequence data executed by one of the heads cannot be executed. The same applies when the number of holding portions of one head portion is smaller than the number of holding portions of the other head portion, and when an idle state occurs in one lane, one head portion holds more than the other head portion. Due to the small number of, the sequence data executed by the other head unit cannot be executed. Therefore, it is not possible to switch to the 2-board 2-head system.
According to the above surface mounter, since the number of holding portions of the two head portions is the same, it is possible to switch to the two-board, two-head system regardless of which lane the idle state occurs.

Top view of the surface mounter according to the first embodiment Side view of the head unit as seen from the rear side Block diagram showing the electrical configuration of the component mounting device (A) is a 1-board 1-head method, (B) is a 2-board 2-head method (method A), and (C) is a schematic diagram of a 2-board 2-head method (method B). The figure of the table which shows an example of the program for 1 board 1 head system (A) is a schematic diagram showing the case where the substrate is produced only in the first lane, and (B) is the time required to produce one substrate in the second lane when the substrate is produced in the first lane and the second lane. A schematic diagram showing a case where 14B, which is 1/2 of the first lane, may be "second" and 14B may be "second". The figure of the table which shows the program for 1 board 1 head system of 1st lane Schematic diagram showing a program for a two-board, two-head system in the first lane Schematic diagram showing an operation example when a substrate is produced only in the first lane (A) is a table diagram showing a program for a 1-board 1-head system in the 1st lane, and (B) showing a program for a 1-board 1-head system in the 2nd lane. The figure of the table which shows the program (before changing the execution order of sequence data) for the compound system of the 1st lane. The figure of the table which shows the program (after the execution order of sequence data was changed) for the compound system of the 1st lane. Schematic diagram showing an operation example when the other lane is in an idle state while a board is being produced by the one-board, one-head method in one lane. Flowchart of program generation process for composite method

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 14. In the following description, the left-right direction shown in FIG. 1 is referred to as an X-axis direction, the front-back direction is referred to as a Y-axis direction, and the up-down direction shown in FIG. 2 is referred to as a Z-axis direction. Further, in the following description, the left side shown in FIG. 1 is referred to as an upstream side, and the right side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted for the same constituent members except for a part.

(1) Overall Configuration of Surface Mounter As shown in FIG. 1, the surface mounter 1 has two parallel lanes L (first lane L1 and second lane L2) on which a substrate P such as a printed circuit board is conveyed. A component mounting device 2 for mounting a component E such as an electronic component on a substrate P conveyed on each lane L, and four components E housed in a component tape for being supplied to the component mounting device 2. It is equipped with a tape component supply device 3 (3A to 3D).

(1-1) Overall configuration of component mounting device The component mounting device 2 includes a base 11, a first conveyor 12, a second conveyor 13, a backup device (not shown), and a first head unit 14A (an example of a head unit). ), A second head unit 14B (an example of a head unit), a head conveyor unit 16, two component imaging cameras 17, two nozzle changers 18, a control unit 30 shown in FIG. 3, and the like.

The base 11 has a rectangular shape in a plan view and has a flat upper surface.
The first conveyor 12 conveys the substrate P along the first lane L1, and the second conveyor 13 conveys the substrate P along the second lane L2. A work position W1 on the upstream side and a work position W2 on the downstream side are set on each lane L.

Since the configurations of these conveyors are substantially the same, the first conveyor 12 will be described here as an example. The first conveyor 12 includes a pair of conveyor belts 19A and 19B that circulate and drive in the X-axis direction, a conveyor drive motor 44 that drives the conveyor belts 19A and 19B (see FIG. 3), and the like. The conveyor belt 19A on the rear side of the first conveyor 12 can move in the front-rear direction, and the distance between the two conveyor belts 19A and 19B can be adjusted according to the width of the substrate P.

Backup devices (not shown) are arranged below each working position W. The backup device fixes the substrate P conveyed to the work position W by the transfer conveyors 12 and 13 and lifts it upward.

The first head unit 14A and the second head unit 14B each support a plurality of mounting heads 20 that attract and release the component E (an example of holding). The configuration of these head units 14 will be described later.

The head transport unit 16 transports the first head unit 14A and the second head unit 14B in the X-axis direction and the Y-axis direction within a predetermined movable range. The head transport unit 16 supports the first beam 21 that reciprocates the first head unit 14A in the X-axis direction and the second head unit 14B that reciprocates in the X-axis direction. 2 beams 22, a pair of Y-axis guide rails 23 that support these beams so that they can be reciprocated in the Y-axis direction, an X-axis servomotor 40A that reciprocates the first head unit 14A in the X-axis direction, and a first The Y-axis servomotor 41A that reciprocates the beam 21 of 1 in the Y-axis direction, the X-axis servomotor 40B that reciprocates the second head unit 14B in the X-axis direction, and the second beam 22 reciprocates in the Y-axis direction. It is equipped with a Y-axis servomotor 41B and the like.

The two component imaging cameras 17 image the component E attracted to the mounting head 20 from below. The component imaging camera 17 on the front side is arranged between the two tape component supply devices 3A and the tape component supply device 3B arranged in the X-axis direction on the front side of the first conveyor 12. The rear component imaging camera 17 is arranged between the two tape component supply devices 3C and the tape component supply devices 3D arranged in the X-axis direction on the rear side of the second conveyor 13.

The two nozzle changers 18 are for automatically replacing the suction nozzles 25 (see FIG. 2) that are detachably attached to the mounting heads 20. The front nozzle changer 18 is provided between the first lane L1 and the front tape component supply device 3 in a posture extending in the X-axis direction, and the rear nozzle changer 18 is provided between the second lane L2 and the rear tape. It is provided in a posture extending in the X-axis direction with the component supply device 3.

Next, the configurations of the first head unit 14A and the second head unit 14B will be described with reference to FIG. Since the configurations of these head units 14 are substantially the same, the second head unit 14B will be described here as an example. The second head unit 14B is a so-called in-line type, and a plurality of mounting heads 20 are provided side by side in the X-axis direction. Further, the second head unit 14B includes a Z-axis servomotor 42 (see FIG. 3) that raises and lowers these mounting heads 20 individually, and an R-axis servomotor 43 (see FIG. 3) that simultaneously rotates these mounting heads 20 around an axis. (See FIG. 3) and the like are provided.

Each mounting head 20 sucks and releases the component E, and has a nozzle shaft 24 and a suction nozzle 25 (an example of a holding portion) detachably attached to the lower end of the nozzle shaft 24. Negative pressure and positive pressure are supplied to the suction nozzle 25 from an air supply device (not shown) via the nozzle shaft 24. The suction nozzle 25 sucks the component E when a negative pressure is supplied, and releases the component E when a positive pressure is supplied.
Although the in-line type head unit 14 will be described here as an example, the head unit 14 may be, for example, a so-called rotary head in which a plurality of mounting heads 20 are arranged on the circumference.

(1-2) Tape component supply device As shown in FIG. 1, the tape component supply device 3 is arranged at two locations arranged in the X-axis direction on both sides of the two lanes L, for a total of four locations. A plurality of tape feeders 26 are attached to these tape component supply devices 3 so as to be arranged side by side in the X-axis direction. Each tape feeder 26 includes a reel (not shown) around which a component tape (not shown) containing a plurality of parts E is wound, an electric delivery device (not shown) that pulls out the component tape from the reel, and the like. The parts E are supplied one by one from the parts supply position provided at the end on the conveyor side.

The two tape component supply devices 3 arranged in the X-axis direction are an example of the component supply devices. That is, in the present embodiment, one component supply device is composed of two tape component supply devices 3. The area where the tape component supply device 3 on the upstream side supplies the component E is an example of the component supply area on the upstream side, and the area where the tape component supply device 3 on the downstream side supplies the component E is the component supply area on the downstream side. This is an example.

The two tape component supply devices 3 arranged on the same side of the two lanes L may be configured by one tape component supply device long in the left-right direction. In that case, in the tape component supply device, the left side from the center in the left-right direction corresponds to the component supply area on the upstream side, and the right side corresponds to the component supply area on the downstream side.
Further, although the tape component supply device 3 will be described as an example of the component supply device here, the component supply device may supply a tray on which the component E is placed or a semiconductor wafer. It may be.

(2) Electrical Configuration of Component Mounting Device As shown in FIG. 3, the component mounting device 2 includes a control unit 30 and an operation unit 37. The control unit 30 includes an arithmetic processing unit 31, a motor control unit 32, a storage unit 33, an image processing unit 34, an external input / output unit 35, a feeder communication unit 36, and the like.

The arithmetic processing unit 31 includes a CPU, ROM, RAM, and the like, and controls each unit of the component mounting device 2 by executing a control program stored in the ROM. The arithmetic processing unit 31 may be provided with an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or the like in place of the CPU or in addition to the CPU.

The motor control unit 32 rotates each motor such as the X-axis servo motor 40, the Y-axis servo motor 41, the Z-axis servo motor 42, the R-axis servo motor 43, and the conveyor drive motor 44 under the control of the arithmetic processing unit 31.
Various types of data are stored in the storage unit 33. The various data include various information related to the production of the substrate P (hereinafter referred to as "production information"), a program for one substrate and one head system for each lane, and the like.

The image processing unit 34 is configured to capture the image signal output from the component imaging camera 17, and generates a digital image based on the output image signal.
The external input / output unit 35 is a so-called interface, and captures detection signals output from various sensors 45 (such as a board detection sensor (not shown) provided in lane L) provided in the main body of the component mounting device 2. It is configured as follows. Further, the external input / output unit 35 is configured to control the operation of various actuators 46 (backup device, air supply device, etc.) based on the control signal output from the arithmetic processing unit 31.

The feeder communication unit 36 is connected to the tape feeder 26, and controls the tape feeder 26 in an integrated manner.
The operation unit 37 includes a display device such as a liquid crystal display and an input device such as a touch panel, a keyboard, and a mouse. The operator can operate the operation unit 37 to make various settings.

(3) Mounting Method In this embodiment, there are two mounting methods for mounting the component E on the board P: a 1-board 1-head method and a 2-board 2-head method. Hereinafter, each mounting method will be described.

(3-1) 1-board, 1-head method The 1-board, 1-head method will be described with reference to FIG. 4 (A). The one-board, one-head method is a method in which the first lane L1 and the second lane L2 independently mount the component E on the board P on each lane L. In the one-board, one-head system, the component E mounted on the board P to which the first lane L1 is conveyed is the tape component supply device 3A on the upstream side of the first lane L1 and the tape component supply device on the downstream side of the first lane L1. The component E supplied by the 3B and mounted on the substrate P to be conveyed to the second lane L2 is a tape component supply device 3C on the upstream side of the second lane L2 and a tape component supply device 3D on the downstream side of the second lane L2. Supplied by.

In the one-board, one-head system, for example, when the board P is conveyed to the first lane L1, the board P is stopped at the work position W on the upstream side (or downstream side), and the tape component supply device 3A on the upstream side and The component E supplied by the tape component supply device 3B on the downstream side is mounted by the first head unit 14A. The same applies when the substrate P is conveyed to the second lane L2, and the component E supplied by the upstream side tape component supply device 3C and the downstream side tape component supply device 3D is mounted by the second head unit 14B. Will be done.

An example of a program for the one-board, one-head system for mounting the one-board, one-head system will be described with reference to FIG. Here, in the present embodiment, one reciprocating operation in which the component E supplied by the tape component supply device 3 is attracted by the plurality of mounting heads 20 to be mounted on the substrate P and then returned to the tape component supply device 3 is referred to as a sequence. Shall be.

As shown in FIG. 5, the program for the one-board, one-head system consists of a plurality of sequence data. Each sequence data defines one sequence, the pattern name, the part number of the component E mounted on the substrate P, the head number of the mounting head 20 on which the component E is mounted, the suction order for sucking the component E, and so on. Information such as the mounting order in which the component E is mounted, the mounting position of the component E, and the mounting angle of the component E is set.

As shown in FIG. 7, the program for the one-board, one-head system according to the present embodiment includes the number of sequences for mounting the component E supplied by the tape component supply device 3 on the upstream side and the tape component supply on the downstream side. It is created by the optimization program so that the number of sequences for mounting the component E supplied by the device 3 is substantially the same. This means that when the one-board one-head method is switched to the two-board two-head method (method B) described later, approximately the same number of sequence data can be assigned to the first head unit 14A and the second head unit 14B. This is to make it so. Then, the component arrangement of each tape component supply device 3 is determined by the optimization program accordingly.

(3-2) 2-board 2-head method Next, a 2-board 2-head method will be described. The two-board, two-head method includes a method A and a method B described below.

(3-2-1) Method A
As shown in FIG. 4B, the component arrangement in the method A is different from that in the one-board, one-head method, and the component E mounted on the board P to which the first lane L1 is conveyed is on the upstream side of the first lane L1. It is supplied by the tape component supply device 3A of the above and the tape component supply device 3D on the downstream side of the second lane L2. Similarly, the component E mounted on the substrate P conveyed on the second lane L2 is supplied by the tape component supply device 3C on the upstream side of the second lane L2 and the tape component supply device 3B on the downstream side of the first lane L1. Will be done.

In the method A, for example, when mounting by the two-board two-head method in the first lane L1, the board P is first stopped at the work position W1 on the upstream side, and the tape component supply device 3A on the upstream side of the first lane L1 first stops the board P. The supplied component E is mounted by the first head unit 14A. Then, the substrate P is conveyed to the work position W2 on the downstream side of the first lane L1, and the next substrate P is conveyed to the work position W1 on the upstream side of the first lane L1.

Then, the component E supplied by the tape component supply device 3A on the upstream side of the first lane L1 is mounted on the next board P conveyed to the work position W1 on the upstream side by the first head unit 14A. At the same time, the component E supplied by the tape component supply device 3D on the downstream side of the second lane L2 is mounted on the substrate P transported to the work position W2 on the downstream side by the second head unit 14B.

(3-2-2) Method B
As shown in FIG. 4C, in the method B, the component arrangement is the same as in the one-board one-head method, and the component E mounted on the board P to which the first lane L1 is conveyed is on the upstream side of the first lane L1. The component E supplied by the tape component supply device 3A and the tape component supply device 3B on the downstream side of the first lane L1 and mounted on the substrate P to be conveyed to the second lane L2 is on the upstream side of the second lane L2. It is supplied by the tape component supply device 3C and the tape component supply device 3D on the downstream side of the second lane L2.

In the method B, for example, when mounting by the two-board two-head method in the first lane L1, the board P is first stopped at the work position W1 on the upstream side, and the tape component supply device 3A on the upstream side of the first lane L1 first stops the board P. The supplied component E is mounted by the first head unit 14A. Then, the substrate P is conveyed to the work position W2 on the downstream side of the first lane L1, and the next substrate P is conveyed to the work position W1 on the upstream side of the first lane L1.

Then, the component E supplied by the tape component supply device 3A on the upstream side of the first lane L1 is mounted on the next board P conveyed to the work position W1 on the upstream side by the first head unit 14A. In parallel, the component E supplied by the tape component supply device 3B on the downstream side of the first lane L1 is mounted on the substrate P conveyed to the work position W2 on the downstream side of the first lane L1 by the second head unit 14B. Will be done.

(4) Switching of mounting method The 1-board 1-head method has higher production efficiency than the 2-board 2-head method because there is no interference loss between the first head unit 14A and the second head unit 14B, but one lane. There is a problem that the production efficiency is lowered when the idle state occurs. Here, the idle state is a state in which the board P is not being produced, a state in which after the mounting of the component E on one board P is completed, the state is waiting until the next board P is transported, or some abnormality occurs. This refers to a state in which the component E cannot be mounted on the board P due to the occurrence, a state in which the component E cannot be mounted on the board P due to setup change of the tape component supply device 3, removal of the tape component supply device 3, or the like. That is, the idle state includes not only a state in which the substrate P is not being produced, but also a case in which production is being performed but production is interrupted for some reason and the substrate P is in a standby state.

On the other hand, the two-board, two-head method has higher production efficiency when an idle state occurs in one lane than the one-board, one-head method, and the first head unit 14A and the second head unit 14B are left and right. Since the mounting is performed with a deviation, interference loss is less likely to occur as compared with the one-board, two-head method described in the background technology.
Therefore, the control unit 30 basically produces the board P by the one-board one-head method having the highest production efficiency among these mounting methods, and when an idle state occurs in the other lane L, one lane L is changed. Switch to the 2-board 2-head system.

However, in method A, the component arrangement of the tape component supply device 3 is different from that of the 1-board 1-head method. Therefore, in order to switch between the 1-board 1-head method and method A, a program for the 2-board 2-head method is used in advance with an optimization program. Need to be created. However, doing so imposes management costs and maintenance costs.

On the other hand, in the method B, the component arrangement of the tape component supply device 3 is the same as that of the 1-board 1-head method, so that the sequence data of the program for the 1-board 1-head method can be reassigned for the 2-board 2-head method. It is possible to dynamically generate a program for a two-board, two-head system. Since the reassignment of this sequence is calculated on the RAM, it is not necessary to create a program for the 2-board 2-head system in advance by the optimization program. Therefore, management costs and maintenance costs can be suppressed.
Therefore, the control unit 30 switches between the 1-board 1-head method and the 2-board 2-head method (method B). In the following description, the term "two-board, two-head system" refers to system B.

(4-1) Program generation timing As the timing for generating the program for the two-board, two-head method, after the production by the one-board, one-head method was started in both lanes L, the other lane became idle. Timing is possible. However, in that case, when the other lane L becomes idle, the unexecuted sequence data of one lane L (that is, the supported lane L) is all supplied by the same tape component supply device 3. In the case of sequence data for mounting the component E, the tape component supply device 3 competes between the first head unit 14A and the second head unit 14B, so the two-board two-head system is switched to. I can't. Therefore, the other head unit 14 cannot support the one head unit 14.

Therefore, the control unit 30 determines whether or not an idle state occurs in the other lane L when mounting in one lane L by the one-board one-head method before starting the production of the board P. Make a decision based on production information. Then, when it is determined that the idle state occurs, the control unit 30 generates a program before starting the production of the substrate P.

Here, the predetermined production information is the cycle time of each lane L (in other words, the time interval at which the substrate P is conveyed), and the production per substrate P when mounting is performed in each lane L by the one-board one-head method. Time and so on. This information can be grasped from the production information set by the operator, the program for the one-board, one-head system of each lane L, the information on the control of the printing machine on the upstream side, and the like.

(4-2) Example of Producing a Substrate Only in One Lane FIG. 6A shows a case where a substrate P is produced only in the first lane L1. In this case, the second lane L2 is always in an idle state. In this way, when the substrate P is produced in one lane L by the one-board one-head method and the other lane L is always in an idle state, the control unit 30 produces the substrate P in one lane. Of the sequence data executed by the head unit 14 of one lane L (hereinafter, also simply referred to as the one head unit 14) so that the idle state does not occur in either head unit 14 as much as possible before starting. A part is allocated to the head unit 14 of the other lane (hereinafter, also simply referred to as the other head unit 14) so that the mounting time of one lane and the mounting time of the other lane are substantially equal to each other. As a method of allocating so that the mounting times are substantially the same, for example, the following three methods can be considered.

Method 1: Allocate approximately the same number of sequence data to the first head unit 14A and the second head unit 14B Method 2: The mounting time of the first head unit 14A and the mounting time of the second head unit 14B are approximately the same. Allocate sequence data so that they are the same.
Method 3: Sequence data is allocated so that the number of parts mounted by the first head unit 14A and the number of parts mounted by the second head unit 14B are substantially the same.
In order to facilitate understanding, Method 1 will be described as an example in the following description.

In order to perform mounting by the substrate 2-head method, the tape component supply device 3 in which one head unit 14 sucks the component E and the tape component supply device 3 in which the other head unit 14 sucks the component E are different from each other. You need to be. Therefore, for example, the control unit 30 allocates sequence data for mounting the component E supplied by the tape component supply device 3A on the upstream side to the head unit 14A, and assigns the component E supplied by the tape component supply device 3B on the downstream side. The sequence data to be mounted is assigned to the head unit 14B.

For example, FIG. 7 shows an example of a program for the one-board-one-head system of the first lane L1 in the case of the example shown in FIG. 6 (A). In the example shown in FIG. 7, the first head unit 14A executes sequence data A1 to 20 in the case of the one-board, one-head system. In this case, as shown in FIG. 8, the control unit 30 transfers the sequence data A11 to A20 for mounting the components E supplied by the tape component supply device 3B on the downstream side of the first lane L1 to the next to the second head unit 14B. Allocate to the cycle time of.

In this way, the tape component supply device 3 in which one head unit 14 sucks the component E and the tape component supply device 3 in which the other head unit 14 sucks the component E can be made different from each other. It is possible to mount by the 2-head method. In the case of the program for the two-board two-head system shown in FIG. 8, the operation mode of the surface mounter 1 is changed so that the board P is stopped at the work position W1 on the upstream side and the work position W2 on the downstream side. As a result, the cycle time can be halved.

The program shown in FIG. 8 is an example of a program for a two-board two-head system for mounting in the first lane L1 by a two-board two-head system. That is, in this example, a program for the two-board two-head system of the first lane L1 is generated before the production of the board P is started in the first lane L1, and the production is started by executing the generated program. To.

With reference to FIG. 9, the mounting flow when the program for the two-board, two-head system is executed in the first lane L1 will be described. Here, it is assumed that the operation mode of the surface mounter 1 is changed so that the substrate P is stopped at the work position W1 on the upstream side and the work position W2 on the downstream side.

In cycle 1, sequence data A1 to A10 are executed by the first head unit 14A on the substrate P conveyed to the working position W1 on the upstream side of the first lane L1. In cycle 1, the second head unit 14B is in an idle state.

When the execution of the sequence data A1 to A10 is completed, the next board P is conveyed to the work position W1 on the upstream side of the first lane L1, and the board P at the work position W1 on the upstream side of the first lane L1 is downstream. It is conveyed to the work position W2 on the side.

In cycle 2, sequence data A1 to A10 are executed by the first head unit 14A on the next substrate P conveyed to the work position W1 on the upstream side of the first lane L1, and in parallel with this, the sequence data A1 to A10 are executed in the second lane L2. Sequence data A10 to A20 are executed by the second head unit 14B on the substrate P conveyed to the work position W2 on the downstream side.

Here, there are a plurality of types of suction nozzles 25 depending on the size and shape of the component E to be sucked, and a suction nozzle 25 corresponding to the type of the component E to be sucked is attached to each nozzle shaft 24. When the product type of the substrate P produced in the first lane L1 and the product type of the substrate P produced in the second lane L2 are different, the type of the suction nozzle 25 attached to the first head unit 14A and the second type of the suction nozzle 25 are different. There is a high possibility that the type of suction nozzle 25 attached to the head unit 14B is different. In that case, the second head unit 14B cannot execute the sequence data A11 to A20 as it is.

Therefore, in the second head unit 14B, when the type of the suction nozzle 25 attached to the first head unit 14A and the type of the suction nozzle 25 attached to the second head unit 14B are different, When the sequence data A10 to A20 are executed, the suction nozzle 25 is replaced by the nozzle changer 18, so that the suction nozzle 25 is replaced with the suction nozzle 25 of the same type as the suction nozzle 25 of the type attached to the first head unit 14A. Thereby, the nozzle configuration of the second head unit 14B can be matched with the nozzle configuration of the first head unit 14A.

(4-3) Example of Producing a Substrate in Both Lanes Next, referring to FIG. 6B, the same cycle time is applied to the first lane L1 and the second lane L2 from the printing machine on the upstream side, respectively. When the substrate P is conveyed in each lane L and the substrate P is produced by the one-board one-head method in each lane L, the time required to produce one substrate P in the second lane L2 is approximately 1 compared to that in the first lane L1. The case of / 2 will be described.

For example, when the type of the substrate P produced in the first lane L1 and the type of the substrate P produced in the second lane L2 are different, they are usually mounted in the first lane L1 and the second lane L2. The number of parts (mounting points) will not be the same. Further, for example, when a component is mounted on the front surface of a board in the first lane L1 and a component is mounted on the back surface of the board in the second lane L2, the number of mounting points is usually in the first lane L1 and the second lane L2. Will not be the same.

In such a case, for example, assuming that the substrate P to which the second lane L2 is conveyed has a smaller number of mounting points than the substrate P to which the first lane L1 is conveyed, the second lane L2 is compared to the first lane L1. The time required for the production of the first substrate P is shortened, and the state is idle from the completion of the production of the first substrate P until the next substrate P is conveyed.

In this way, when the other lane L becomes idle while the one board P is being produced by the one-board one-head method in one lane L, the control unit 30 controls the board P in one lane L. Sequence data executed in one lane L when the other lane L is idle (in other words, when the other lane L is idle, the head of one lane L is started. A part of the sequence data that the unit 14 has not executed) is allocated to the other head unit 14 so that the mounting time of one lane L and the mounting time of the other lane L are substantially equal to each other.

However, as described above, in the two-board two-head system, the tape component supply device 3 in which one head unit 14 adsorbs the component E and the tape component supply device 3 in which the other head unit 14 adsorbs the component E Must be different from each other. Therefore, the control unit 30 allocates sequence data so that the one head unit 14 and the other head unit 14 suck the component E from the different tape component supply devices 3.

However, when the other lane L is in the idle state, all the sequence data executed in the one lane L is the sequence data for adsorbing the component E supplied by the tape component supply device 3 on the upstream side (or downstream side). In some cases. In that case, the tape component supply device 3 competes with the sequence data executed by one head unit 14 and the sequence data assigned to the other head unit 14 in the idle state.

Therefore, when the tape component supply device 3 competes, the control unit transfers a part of the plurality of sequence data executed in the one lane L to the other head unit 14 when the other lane L is in the idle state. After the allocation, a sequence in which one head unit 14 sucks the component E supplied by the competing tape component supply device 3 during the period in which the component E is mounted on the substrate P by the one-board one-head method in the other lane L. The execution order of the sequence data of the program in one lane L is changed so as to execute the data.

For example, FIG. 10 (A) shows an example of a program for the one-board-one-head system of the first lane L1 in the case of the example shown in FIG. 6 (B), and FIG. 10 (B) shows FIG. 6 (B). An example of a program for the one-board, one-head system of the second lane L2 in the case of the example shown in is shown. In the examples shown in FIGS. 10A and 10B, when the second lane L2 is in the idle state (in other words, when the second head unit 14B is in the idle state), the first head unit 14A has sequence data. Execute A11 to A20.

In this case, as shown in FIG. 11, the control unit 30 executes the sequence data A16 to A20, which is half of the sequence data A11 to A20, in the execution order 11 to 15 on the downstream side of the next cycle time of the second head unit 14B. Assign to.
However, since the sequence data A11 to A20 are all sequence data for adsorbing the component E supplied by the tape component supply device 3 on the downstream side, the sequence data A11 to A15 and the first head unit 14A for executing the sequence data A11 to A15 are used as they are. The tape component supply device 3 competes with the second head unit 14B that executes the sequence data A16 to A20.

Therefore, as shown in FIG. 12, the control unit 30 replaces the execution order of the sequence data A1 to A15 executed by the first head unit 14A in the order of the sequence data A11 to A15 and A1 to A10. In this way, the first head unit 14 sequences during the period in which the second head unit 14B executes the sequence data B1 to B10 (that is, the period in which the substrate P is produced by the one-board one-head method in the second lane L2). Data A11 to A15 (ie, competing sequence data) are executed.

Therefore, the tape component supply device 3 that attracts the component E when the first head unit 14A executes the sequence data A6 to A10 in the cycle time 2 and the second head unit 14B execute the sequence data A16 to A20. It is possible to make it different from the tape component supply device 3 that attracts the component E when the component E is used. This enables mounting by a two-board, two-head method.

Here, as shown in FIG. 12, a part of the sequence data of the first lane L1 (in the program for the one-board, one-head system shown in FIG. 10A), the data is executed in the execution order 16 to 20. When the sequence data) is assigned to the execution orders 11 to 15 of the second head unit 14B, the execution order of the sequence data during one cycle time becomes 1 to 15. Therefore, the number of execution orders is 3/4 as compared with the case where the execution order during one cycle time is 1 to 20.
Therefore, in the case of the program for the composite method shown in FIG. 12, the operation mode of the surface mounter 1 is changed so that the substrate P is stopped at the work position W1 on the upstream side and the work position W2 on the downstream side. As a result, the cycle time can be reduced to approximately 3/4.

In the program shown in FIG. 12, when the other lane L is mounted by the 1-board 1-head method, one lane L is mounted by the 1-board 1-head method, and when the other lane L becomes idle, one of them is mounted. This is an example of a program for a composite method for mounting by a two-board, two-head method in the lane L of the above. That is, in this example, a program for the composite method of the first lane L1 is generated before the production of the substrate P is started in the first lane L1, and the production is started by executing the generated program.

With reference to FIG. 13, a mounting flow in the case where the program for the composite system is executed in the first lane L1 and the program for the one-board one-head system is executed in the second lane L2 will be described. Here, it is assumed that the operation mode of the surface mounter 1 is changed so that the substrate P is stopped at the work position W1 on the upstream side and the work position W2 on the downstream side.
In cycle 1, first, the substrate P is conveyed to the first lane L1 and the second lane L2, respectively, and the sequence data B1 to B10 are executed by the second head unit 14B to the substrate P conveyed to the second lane L2. At the same time, sequence data A11 to A15 and A1 to A5 are executed by the first head unit 14A on the substrate P conveyed to the working position W1 on the upstream side of the first lane L1.

Then, the sequence data A6 to A10 are executed by the first head unit 14A on the substrate P at the working position W1 on the upstream side of the first lane L1. In cycle 1, when the first head unit 14A is executing the sequence data A6 to A10, the second head unit 14B is in an idle state.

When the execution of the sequence data A6 to A10 is completed, the next substrate P is conveyed to the second lane L2, and the substrate P at the work position W1 on the upstream side of the first lane L1 is conveyed to the work position W2 on the downstream side. Then, the next substrate P is conveyed to the working position W1 on the upstream side of the first lane L1.

In cycle 2, sequence data B1 to B10 are executed by the second head unit 14B on the next substrate P conveyed to the second lane L2, and are conveyed to the work position W1 on the upstream side of the first lane L1. Sequence data A11 to A15 and A1 to A5 are executed by the first head unit 14A on the next substrate P.
Then, the system is switched to the 2-board 2-head system, and sequence data A6 to A10 are executed by the first head unit 14A on the next board P at the work position W1 on the upstream side of the first lane L1, and in parallel with this, the first Sequence data A16 to A20 are executed by the second head unit 14B on the substrate P at the working position W2 on the downstream side of the one lane L1.

Although the case where the production time of one substrate P in the second lane L2 is 1/2 of that of the first lane L1 has been described here as an example, the production time of one substrate P in the second lane L2 is, for example, the first. It may be 1/4 or 3/4 of one lane. Even in such a case, the method of allocating the sequence data is the same as in the case of 1/2.

(5) Program generation process for the two-board two-head system and program generation process for the composite system Here, first, the program generation process for the composite system will be described with reference to FIG. This process is started when the operator instructs the start of production of the substrate P.

In S101, whether or not an idle state occurs in the other lane L when the control unit 30 is producing the substrate P in one lane L by the one-board one-head method before starting the production of the substrate P. It is determined based on the predetermined production information, and if it occurs, the process proceeds to S102, and if it does not occur, this process ends.

In S102, the control unit 30 has half of the sequence data executed by the head unit 14 of the one lane L (that is, the head unit 14 on the supported side) when the other lane L is idle. Is assigned to the other head unit 14.
More specifically, the control unit 30 of the tape component supply device 3 on the upstream side and the downstream side of the plurality of sequence data executed by the one head unit 14 when the other head unit 14 is in the idle state. From the sequence data for mounting the component E supplied from any one of the tape component supply devices 3, a number corresponding to the above-mentioned half of the sequence data is assigned to the other head unit 14.

In S103, as a result of allocating sequence data to each head unit 14 in S102, the control unit 30 determines whether or not the tape component supply device 3 conflicts between one head unit 14 and the other head unit 14, and conflicts. If so, proceed to S104, and if there is no conflict, proceed to S105.

In S104, the control unit 30 has one head so that the other head unit 14 executes the competing sequence data during the period in which the component E is mounted on the board P by the one-board one-head method. The execution order of the sequence data executed by the unit 14 is changed.

Next, a program generation process for the two-board, two-head system will be described. In the generation of the program for the two-board two-head system, in S102 described above, the sequence data for mounting the component E supplied by the tape component supply device 3A on the upstream side is assigned to the head unit 14A, and the tape component supply device on the downstream side is generated. Sequence data for mounting the component E supplied by 3B may be assigned to the head unit 14B.

(6) Effect of Embodiment According to the surface mounter 1 according to the first embodiment described above, when the substrate P is produced by the one-board one-head method in one lane L, the idle state is in the other lane L. If it occurs, one lane L is switched to the 2-board 2-head system. Since interference loss is less likely to occur in the 2-board 2-head method as compared with the 1-board 2-head method, two lanes L and two head units 14 are compared with the case of switching between the 1-board 1-head method and the 1-board 2-head method. The production efficiency of the surface mounter 1 having the above can be improved.

Further, according to the surface mounter 1, a part of the plurality of sequence data constituting the program for the one-board, one-head system of one lane L is used as the other head unit 14 (that is, the head unit 14 on the supporting side). Since one lane L is switched to the 2-board 2-head system by assigning to, it is not necessary to create a program for the 2-board 2-head system in advance by the optimization program. Therefore, the cost of creating the program can be suppressed, and the burden on the operator can be reduced, so that the management cost and the maintenance cost can also be suppressed. Therefore, the production efficiency can be further improved.

According to the surface mounter 1, the program for the one-board, one-head system mounts the number of sequence data for mounting the components supplied in the upstream component supply area and the components supplied in the downstream component supply area. Since it is created so that the number of sequence data to be processed is substantially the same, the mounting time of one head portion and the mounting time of the other head portion when switching to the two-board two-head system are substantially the same. be able to. Therefore, the production efficiency can be improved as compared with the case where the mounting times are significantly different.

Further, according to the surface mounter 1, if an idle state occurs in the other lane L while the substrate P is being produced in one lane L by the one-board one-head method, before the production of the substrate P is started. In addition, since the program for the 2-board 2-head system or the program for the composite system is generated, it is more reliable than the case where the program for the 2-board 2-head system is generated after the idle state occurs in the other lane L. It can be mounted by the two-board, two-head method.

Further, according to the surface mounter 1, when the tape component supply device 3 conflicts between the sequence data executed by one head unit 14 and the sequence data assigned to the other head unit 14, the sequence data of the program for the composite method is used. Since the execution order of the above is changed, it is possible to prevent the tape component supply device 3 from competing with the one head unit 14 and the other head unit 14. Therefore, when the program for the 2-board 2-head system is generated after the idle state occurs in the other lane L, the 2-board 2-head system cannot be mounted even if the 2-board 2-head system cannot be mounted. It can be implemented by the method.

Further, according to the surface mounter 1, the head unit 14 has a plurality of nozzle shafts 24 for holding and releasing the component E, and the two head units 14 have the same number of nozzle shafts 24. If the number of nozzle shafts 24 of one head unit 14 and the number of nozzle shafts 24 of the other head unit 14 are different, mounting by the two-board two-head method may not be possible.
For example, when the number of nozzle shafts 24 of one head unit 14 is larger than the number of nozzle shafts 24 of the other head unit 14, when an idle state occurs in the other lane, the other head unit 14 is the one head unit. Since the number of nozzle shafts 24 is smaller than that of 14, the sequence data executed by one of the head units 14 cannot be executed. Therefore, it is not possible to switch to the 2-board 2-head system.
The same applies when the number of nozzle shafts 24 of one head unit 14 is smaller than the number of nozzle shafts 24 of the other head unit 14, and when an idle state occurs in one lane, one head unit 14 becomes the other. Since the number of nozzle shafts 24 is smaller than that of the head unit 14, the sequence data executed by the other head unit 14 cannot be executed. Therefore, it is not possible to switch to the 2-board 2-head system.
On the other hand, according to the surface mounter 1, since the number of nozzle shafts 24 of the two head units 14 is the same, the system is switched to the two-board, two-head system regardless of which lane the idle state occurs. be able to.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described.
In the first embodiment described above, it is determined whether or not an idle state occurs in the other lane L before the production of the substrate P is started, and if an idle state occurs, a program is generated before the production is started. The case has been described as an example. On the other hand, in the second embodiment, after the idle state occurs in the other lane L, the program for the two-board two-head system in the one lane L is generated.

For example, after starting production by the one-board, one-head method in both lanes L, the other lane L may be in an idle state for an unexpected reason. An unexpected error is, for example, when some trouble occurs in a device (printing machine or the like) arranged on the upstream side of the other lane L and the substrate P is not conveyed to the other lane L, or the other If some trouble occurs in the head unit 14 on the lane L side and the mounting is stopped, or if the tape component supply device 3 on the other lane L side runs out of parts, the tape component supply device 3 on the other lane L side For example, when the mounting is stopped due to the setup change of. In this case, the control unit 30 generates a program for the two-board, two-head system of one lane L after the idle state occurs in the other lane L.

According to the surface mounter 1 according to the second embodiment described above, when the other lane L becomes idle due to an unexpected error or the like after starting the production by the one-board one-head method in both lanes L. Since one lane L is switched to the 2-board 2-head system, the production efficiency of the surface mounter 1 can be improved as compared with the case of switching to the 1-board 2-head system.

<Other embodiments>
The technology disclosed herein is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the first embodiment, when the other head unit 14 is in an idle state, half of the sequence data executed by the one head unit 14 is assigned to the other head unit 14. Explained to. However, the number of sequence data to be allocated is not limited to half. For example, when the execution time differs depending on the sequence data, the sequence data is allocated so that the time for the first head unit 14A to execute the sequence data and the time for the second head unit 14B to execute the sequence data are substantially the same. You may.

(2) If a failure occurs in one of the head units 14 when the component E is mounted on the board P by the two-board two-head method in one lane L, the control unit 30 uses the two-board two-head method. The component E may be mounted by the head unit 14 whichever has not caused a failure on the substrate P which is conveyed through the lane L.

For example, if a failure occurs in the second head unit 14B while the board P is being produced by the two-board two-head method in the first lane, the first head unit 14A is one board and one head in the first lane. The substrate P may be produced by a method. Further, if a failure occurs in the first head unit 14A while the board P is being produced by the two-board two-head method in the first lane, the second head unit 14B is one board and one head in the first lane. The substrate P may be produced by a method.

In this way, even if a failure occurs in one of the head units 14 when the component E is mounted on the board P by the two-board two-head method, the head unit 14 in which the failure has not occurred is used. It can be used to continue mounting the component E on the substrate P.
If a failure occurs in one of the head units 14 while the component E is mounted on the board P by the two-board two-head method, the other head unit 14 does not continue the mounting, but an alarm sound is emitted. A warning may be issued by issuing a warning.

(3) In the first embodiment, the head unit 14 that attracts the component E has been described as an example of the head unit that holds the component E, but the head unit may be a so-called chuck that sandwiches and holds the component E.

1 ... Surface mounter, 2 ... Parts mounting device, 3A, 3B ... Tape parts supply device (example of parts supply device), 3C, 3D ... Tape parts supply device (example of parts supply device), 14A ... First head Unit (example of head unit), 14B ... 2nd head unit (example of head unit), 18 ... nozzle changer (example of changer), 24 ... nozzle shaft (example of holding unit), 30 ... control unit, E ... Parts, L1 ... 1st lane (example of lane), L2 ... 2nd lane (example of lane), P ... board, W1 ... working position, W2 ... working position

Claims (7)

A surface mounter with two parallel lanes on which substrates are transported.
Two component supply devices arranged on both sides of the two lanes and having a component supply area on the upstream side and a component supply area on the downstream side in the transport direction of the substrate, respectively.
Two head portions that hold the components supplied by the component supply device and mount them on the board.
Control unit and
With
One of the lane mounting methods is
The components supplied in the component supply area on the upstream side and the component supply area on the downstream side of the component supply device arranged on the lane side are connected to the substrate conveyed to the work position on the lane. 1 board 1 head system mounted by the head part of
The components supplied in the component supply area on the upstream side of the component supply device arranged on the lane side are supplied to the substrate conveyed to the work position on the upstream side on the lane by one of the head portions. The component is mounted, and in parallel with this mounting, the component is mounted at the work position on the upstream side and transported to the work position on the downstream side of the lane on another substrate on the downstream side of the component supply device. A two-board, two-head system in which the components supplied in the component supply area are mounted by the other head portion.
There is
When the component is mounted in one of the lanes by the one-board, one-head method and an idle state occurs in the other lane, the control unit uses the two-board, two-heads in the other lane. Surface mounter that switches to the method. The surface mounter according to claim 1.
When the one-way operation of holding the component supplied in the component supply area, mounting the component on the substrate, and then returning to the component supply area is defined as a sequence, the component supply on the upstream side is supplied to the control unit. A one-board, one-head system consisting of sequence data that defines a sequence for mounting only the components supplied in the region and sequence data that defines a sequence for mounting only the components supplied in the component supply region on the downstream side. Program is stored for each lane.
The control unit allocates a part of the plurality of sequence data constituting the program for the one-board-one-head system of the one lane to the head unit of the other lane. A surface mounter that switches the lane to the two-board, two-head system. The program according to claim 2.
The program for the one-board, one-head system includes the number of sequence data for mounting the components supplied in the component supply area on the upstream side and the number of sequence data for mounting the components supplied in the component supply area on the downstream side. Are created so that they are substantially the same, or the mounting time for mounting the components supplied in the component supply area on the upstream side and the mounting time for mounting the components supplied in the component supply area on the downstream side are It is created so as to be substantially the same, or the number of parts supplied in the component supply area on the upstream side and the number of parts supplied in the component supply area on the downstream side are substantially the same. A surface mounter that has been created. The surface mounter according to claim 2 or 3.
The control unit tells the substrate whether or not an idle state occurs in the other lane when the component is mounted on the substrate by the one-board one-head method in the one lane. Judgment is made based on predetermined production information before starting mounting of parts, and if an idle state occurs, before starting mounting of the parts, for the one-board-one-head system of the one lane. By allocating a part of the plurality of sequence data constituting the program to the head portion of the other lane, the two-board 2 for mounting by the two-board two-head method in the one lane. When the program for the head method or the other lane is mounted by the one-board one-head method, the one board is mounted by the one-head method and the other lane is mounted. A surface mounter that generates a program for a composite method for mounting by the two-board, two-head method in the one lane when is in an idle state. The surface mounter according to claim 4.
When the control unit mounts the component on one board by the one-board, one-head method in the other lane, and then the other lane is idle until the next board is conveyed. When generating a program for the composite method, the sequence data of a part of a plurality of sequence data executed by the head portion of the one lane when the other lane is idle is used. The component is assigned to the head portion of the other lane, and the sequence data executed by the head portion of the one lane in the idle state and the sequence data assigned to the head portion of the other lane are used. When the supply areas conflict, the head portion of the one lane executes the competing sequence data during the period in which the component is mounted on the board by the one-board one-head method in the other lane. A surface mounter that changes the execution order of the sequence data of the program for the composite method. The surface mounter according to any one of claims 1 to 5.
When the component is mounted on the board by the two-board two-head method in the one lane, the control unit uses the two-board two-head method when a failure occurs in one of the heads. A surface mounter for mounting the component by the head portion of whichever one of the boards conveyed in the lane has not failed. The surface mounter according to any one of claims 1 to 6.
The head portion has a plurality of holding portions for holding and releasing the component.
A surface mounter in which the two head portions have the same number of holding portions.

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