JP5792586B2 - Electronic component mounting system, electronic component mounting method, and electronic component mounting computer program - Google Patents

Description

  The present invention relates to an electronic component mounting system, an electronic component mounting method, and an electronic component mounting computer program used when mounting electronic components on a substrate.

  As an apparatus for mounting an electronic component on a substrate, there is an electronic component mounting device that has a head having a number of nozzles and sucks the electronic component with the nozzle and mounts it on the substrate. Here, the head mounts the sucked electronic component on the substrate by moving the nozzle in a direction perpendicular to the surface of the substrate. An electronic component is supplied to the head from a device that supplies the electronic component. The electronic component is held by a component tape. The supply device sends out the component tape by the feeder and conveys the electronic component to the suction position by the head. Some supply devices have only one lane corresponding to the component tape, and others have a plurality of the lanes. A supply device having a plurality of the lanes is described in Patent Document 1, for example.

Japanese Patent Laid-Open No. 2003-188591

  So far, control for a supply device having a plurality of lanes has not been particularly considered, and there is room for improvement. It is an object of the present invention to provide control suitable for an electronic component supply apparatus having a plurality of lanes corresponding to component tapes holding electronic components.

  The present invention provides a first supply device having a plurality of lanes for supplying an electronic component holding member holding a plurality of electronic components, a second supply device having a single lane, and at least one of the first supply device and the second supply device. A plurality of production plans for mounting a plurality of types of electronic components on a plurality of types of substrates are determined and shared among a plurality of production plans, including an electronic component mounting apparatus including a head for mounting electronic components supplied from one side on the substrate. The electronic parts used in this manner are grouped by distinguishing between those that are inherited and those that are not inherited among the plurality of production plans, and the electronic parts that are commonly used among the plurality of production plans are And a management device that is preferentially assigned to the lane of the first supply device.

  In the present invention, when the number of electronic components belonging to the group obtained by the grouping is not divisible by the number of the lanes of the first supply device, the management device assigns it as a surplus component together with a different group. Or it is preferably assigned to the second supply device.

  In this invention, it is preferable that the said management apparatus allocates the said electronic component so that the width | variety which the whole said several lane used in these production plans occupies becomes the smallest.

  The present invention provides a first supply device having a plurality of lanes for supplying an electronic component holding member holding a plurality of electronic components, a second supply device having a single lane, and at least one of the first supply device and the second supply device. When mounting electronic components on a substrate using an electronic component mounting device that includes a head for mounting electronic components supplied from one side to a substrate, multiple production plans for mounting multiple types of electronic components on multiple types of substrates are determined. A plurality of the electronic parts that are commonly used among the plurality of production plans are grouped by distinguishing between those that are inherited and those that are not inherited between the plurality of production plans; The electronic component used in common between the production plans is an electronic component mounting method including a procedure of preferentially assigning to the lane of the first supply device.

  In the present invention, when assigning the electronic component to the lane, if the number of electronic components belonging to a group is not divisible by the number of the lanes of the first supply device, is it assigned as a surplus component with a different group? Or it is preferable to allocate to the said 2nd supply apparatus.

  In the present invention, when assigning the electronic parts to the lanes, it is preferable to assign the electronic parts so that a width occupied by all of the plurality of lanes used in the plurality of production plans is minimized.

  In the present invention, when the electronic device is set in a plurality of the lanes when the arrangement of the first supply device is determined, the management device sets the electronic devices set in the plurality of lanes. Arrangement is determined in units of the first supply device based on the combination of components, and if the electronic components are not set in a plurality of the lanes, they are arranged in units of each lane of the first supply device Is preferably determined.

  The present invention is a computer program for mounting an electronic component that causes a computer to execute the electronic component mounting method.

  The present invention can provide control suitable for an electronic component supply apparatus having a plurality of lanes corresponding to component tapes holding electronic components.

FIG. 1 is a perspective view showing an electronic component mounting apparatus and an electronic equipment mounting system according to the first embodiment. FIG. 2 is a perspective view showing the component supply unit. FIG. 3 is a plan view of an electronic component mounting apparatus in which a plurality of first supply devices are arranged. FIG. 4 is a flowchart of an electronic component mounting method executed by the electronic component mounting system according to the second embodiment. FIG. 5 is an explanatory diagram illustrating a combination example of electronic components in the electronic component mounting system according to the second embodiment. FIG. 6 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 7 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 8 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 9 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 10 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 11 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment. FIG. 12 is an explanatory diagram illustrating an example of a combination of electronic components in the electronic component mounting system according to the second embodiment.

  A mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The configurations described below include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those that are equivalent. Furthermore, the structures described below can be combined as appropriate. The configuration can be omitted, replaced, or changed without departing from the gist of the present invention.

(Embodiment 1)
FIG. 1 is a perspective view showing an electronic component mounting apparatus and an electronic equipment mounting system according to the first embodiment. The electronic component mounting system 100 includes an electronic component mounting device 10 and a management device 23. The electronic component mounting apparatus 10 is an apparatus for mounting (mounting) electronic components on the surface of the substrate 8. The electronic component mounting apparatus 10 includes a board transport unit 12, a component supply unit 14, a head 15, an XY movement mechanism 16, and a component recognition camera 18. The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. A bonding member (solder or the like) for bonding the wiring pattern and the electronic component by reflow adheres to the surface of the wiring pattern provided on the substrate 8.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X direction in FIG. The substrate transport unit 12 includes a rail extending in the X direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 moves the substrate 8 along the rail by the transport mechanism so that one (mounting surface) of the two surfaces having the largest area of the substrate 8 faces the head 15. Transport in the direction. The board transport unit 12 transports the board 8 supplied from a device that supplies the board 8 to the electronic component mounting apparatus 10 to a predetermined position on the rail.

  The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step (for example, reflow). Various configurations can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system that integrates a transport mechanism that combines a rail disposed along the transport direction of the substrate 8 and an endless belt that rotates along the rail, and transports the substrate 8 mounted on the endless belt. A transport mechanism can be used.

  The component supply unit 14 includes an electronic component holding member that holds a plurality of electronic components mounted on the surface of the substrate 8, and a feeder unit that supplies the electronic components held by the electronic component holding member to the head 15. The feeder unit is in a state where the head 15 can suck the electronic component supplied from the electronic component holding member. In the present embodiment, the electronic component holding member has a structure in which the electronic component is held in a plurality of holes provided in the component tape or a structure in which the electronic component is attached to the component tape. The feeder unit feeds the component tape by a certain amount to expose the electronic component at a predetermined position. Thus, the component supply part 14 is a tape feeder containing a component tape and a feeder part. The component supply unit 14 is detachable from the electronic component mounting apparatus 10.

  The head 15 is a device that sucks an electronic component held by the component supply unit 14 and mounts the sucked electronic component on the mounting surface of the substrate 8 moved to a predetermined position by the substrate transport unit 12. The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X direction and Y direction in FIG. 1, that is, on a plane parallel to the mounting surface of the substrate 8, and the X axis driving unit 22, the Y axis driving unit 24, and the like. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The Z-axis direction is a direction orthogonal to the mounting surface of the substrate 8.

  The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the feeder portion of the component supply unit 14 by moving the head 15 in the XY direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. By doing so, the XY moving mechanism 16 can move the electronic component held by the head 15 to an arbitrary position on the surface of the substrate 8, and mount the electronic component at an arbitrary position on the mounting surface of the substrate 8. It becomes possible to do. Various mechanisms for moving the head 15 in a predetermined direction (bidirectional) can be used as the X-axis drive unit 22. As the Y-axis drive unit 24, various mechanisms for moving the X-axis drive unit 22 in a predetermined direction (bidirectional) can be used. As a mechanism for moving the object in a predetermined direction (bidirectional), for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a belt, or the like can be used.

  The component recognition camera 18 is an imaging device arranged near the component supply unit 14 and at a position facing the head 15. The component recognition camera 18 detects whether an electronic component is attracted to the head 15 by photographing the head 15.

  The control device 21 controls the electronic component mounting device 10. More specifically, the control device 21 controls the operations of the substrate transport unit 12, the component supply unit 14, the head 15, and the like. The control device 21 is, for example, a computer, and has an external storage device such as a hard disk device as necessary. For example, the management device 23 performs production management of the electronic component mounting apparatus 10 and state management of the electronic component mounting apparatus 10. That is, an optimal setup is obtained from a board and components necessary for a circuit board (an electronic component is mounted on the board) produced by the electronic component mounting apparatus 10, or the operating status of the plurality of electronic component mounting apparatuses 10 Grasp the status of defects and make adjustments to ensure productivity.

  FIG. 2 is a perspective view showing the component supply unit. The component supply unit 14 includes a first supply device 30 and a second supply device 32 as electronic device supply devices. Each of the first supply device 30 and the second supply device 32 is a tape feeder including a component tape (electronic component holding member) holding a plurality of electronic components 9 and a feeder unit. The first supply device 30 has a plurality of lanes 31 for supplying a component tape holding a plurality of electronic components 9. The second supply device 32 has a single lane 31 for supplying a component tape holding a plurality of electronic components 9. Both the first supply device 30 and the second supply device 32 can be attached to and detached from the electronic component mounting apparatus 10. The head 15 sucks the electronic component 9 supplied from the first supply device 30 or the second supply device 32 and mounts it on a predetermined position of the substrate 8. In the present embodiment, the component supply unit 14 of the electronic component mounting apparatus 10 includes a plurality of first supply devices 30.

  FIG. 3 is a plan view of an electronic component mounting apparatus in which a plurality of first supply devices are arranged. When the electronic component mounting apparatus 10 includes the first supply device 30 having the plurality of lanes 31, the control device 21 executes the electronic component mounting method according to the present embodiment, and based on an error that occurs in the lane 31, 1 The supply device 30 is controlled. More specifically, when an error occurs in at least one lane 31 among the lanes 31, the control device 21 selects the drive lane (the lane 31 driven by the control device 21) of the first supply device 30. change. The change of the selection form means that the form when the control device 21 selects the lane 31 included in the first supply device 30 to be used for supplying the electronic component 9 is changed. For changing the selection mode, for example, the control device 21 does not select all the lanes 31 included in the first supply device 30 for use in supplying the electronic component 9, that is, the first supply device 30 Stop using all lanes 31 or select normal lanes 31 until errors occur in all lanes 31, that is, use normal lanes 31 until errors occur in all lanes 31. For example.

  An error is an abnormality that must be interrupted or stopped when the supply device (the first supply device 30 or the second supply device 32) is used in the production of a circuit board. Absorption errors due to out of parts that normally occur are also included in the error. Error processing is processing when an error occurs. In the present embodiment, in the error processing, it is determined whether any control for each supply device or each lane 31 is appropriate depending on the processing component mounting state or production state for each supply device or each lane 31.

  As the first control for error processing, when an error occurs in at least one lane 31 of the first supply device 30, the control device 21 stops using the first supply device 30 having the lane 31 in which the error has occurred. To do. By doing so, when an error occurs in the lane 31, the unit cannot be used in the unit of the first supply device 30 having the lane 31, so the first supply device 30 supplies the electronic component 9. Can not be. For this reason, since the suction operation performed by the head 15 for all the lanes 31 included in the first supply device 30 is also stopped, the first supply device 30 can be removed from the electronic component mounting apparatus 10 to recover from the error. . In addition, when an error occurs in at least one of the plurality of lanes 31, the control device 21 stops using the first supply device 30. For this reason, even if the first supply device 30 having the lane 31 in which an error has occurred at the timing when the head 15 is lowered during the production of the electronic component mounting apparatus 10 is removed, the control device 21 may identify the lane 31 in which the error has occurred. Since the head 15 is not accessed with respect to the first supply device 30 having, the possibility of interference between the head 15 and the lane 31 or the like can be avoided.

  As a second control for error processing, when an error occurs in at least one lane 31 included in the first supply device 30, the control device 21 determines that the error occurs in the first supply device 30. Only stop using. Then, the control device 21 continues to use the normal lane 31 until an error occurs in all the lanes 31 included in the first supply device 30.

  In this control, when there is a lane 31 that supplies the same type of electronic component 9 as the lane 31 in which the error has occurred in the first supply device 30, the control device 21 uses the lane 31 to generate the lane 31 in which the error has occurred. It is possible to supply the same type of electronic component as the electronic component 9 that has been supplied. By doing in this way, the frequency | count of stopping the 1st supply apparatus 30 and the frequency | count of removing the 1st supply apparatus 30 from the electronic component mounting apparatus 10 can be decreased. In the example shown in FIG. 3, in the first supply device 30 </ b> A having three lanes 31, when the two lanes 31 are the electronic components A or the three lanes 31 are the electronic components C, the first error processing is performed. Two controls can be applied.

  In the second control for error processing, when supplying the same type of electronic component, after the supply of the electronic component included in the lane 31 is completed, that is, after the lane 31 is out of components, An electronic component of the same type as the electronic component supplied by the lane 31 that has run out of components may be supplied. In this way, the electronic component 9 of one lane 31 can be used up, so that waste of the electronic component can be suppressed. Next, determination of the arrangement of the first supply device 30 and the second supply device 32 with respect to the electronic component mounting apparatus 10 will be described.

  The management device 23 shown in FIG. 1, when electronic components are already set in the first supply device 30, the first supply device based on the combination of electronic components set in the plurality of lanes 31. The arrangement of the lanes 31 is determined in units of 30. Since the arrangement of the first supply device 30 by optimization by the management device 23 and the like is a unit of the first supply device 30, replacement of electronic components for each lane 31 can be suppressed. For this reason, it is suitable when there are many changes in setup.

  The management device 23 may arrange the lane 31 and the first supply device 30 without considering the arrangement of the electronic components in the first supply device 30. That is, the first time when no electronic component is set in the first supply device 30 does not need to consider the lanes 31 in the first supply device 30, so each lane 31 of the first supply device 30. The arrangement is determined in units. Since the arrangement up to the lane 31 is taken into consideration, the first supply device 30 can be arranged efficiently. Note that after the electronic component is set in the first supply device 30, the arrangement of the lanes 31 is determined in units of the first supply device 30.

  The management device 23 manages the distribution between the first supply device 30 and the second supply device 32 having the same size when determining the arrangement of the supply devices. In the case where the first supply device 30 and the second supply device 32 are mixed within the number of supply devices that can be set in the first bank 13F and the second bank 13R, the management device 23 includes all of the plurality of first supply devices 30. The second supply device 32 is allocated after the maximum number of lanes 31 is allocated. In addition, if it is possible to automatically determine from the situation whether the control for each lane or the control for each supply device is appropriate, the control is performed automatically, and whether the control for each lane or the control for each supply device is performed in advance as a condition setting May be set.

  The first supply device 30 having the same lane 31 with the same combination of electronic components is arranged in the first bank 13F and in the second bank 13R in the substrate transport direction (from the arrow L in FIG. 4). The order of the lanes 31 in the direction toward T) is different. For example, when the first supply device 30 having the lane 31 of the electronic component A and the lane 31 of the electronic component B is arranged in the first bank 13F, the order of the lanes 31 is upstream (L side) in the substrate transport direction. To electronic components A and B in this order. When the first supply device 30 is arranged in the second bank 13R as it is, the order of the lanes 31 is from the upstream side (L side) in the transport direction to the electronic components B and A, and is arranged in the first bank 13F. The reverse of the case.

  For this reason, the first supply device 30 having the lanes 31 of the electronic components A and B arranged in the second bank 13R changes the order of the lanes 31 from the upstream side (L side) in the substrate transport direction to the electronic components A and B. It is good. However, in this case, even in the first supply device 30 having the lanes of the electronic components A and B, it is necessary to change the order of the lanes 31 corresponding to the first bank 13F and the second bank 13R, respectively. It lacks versatility. For this reason, the control device 21 recognizes the first supply device 30 having the same lane 31 in the combination of electronic components so that the arrangement order of the lanes 31 is reversed between the first bank 13F and the second bank 13R. . By doing in this way, the 1st supply apparatus 30 which has the lane 31 with the same combination of electronic components does not need to replace the lane 31 between the 1st bank 13F and the 2nd bank 13R, and versatility improves To do.

  As described above, according to the present embodiment, the following effects can be obtained when a supply apparatus having a plurality of lanes is used. First, by performing error processing of a supply device having a plurality of lanes for each device or for each lane, the timing of error processing can be selected, so that the setup time for error processing can be reduced. Also, the supply device can be safely removed. Furthermore, by arranging a supply device having a plurality of lanes for each apparatus or for each lane, the set component tape can be used as it is, so that the setup can be facilitated and the setup time can be reduced. In addition, since a supply device having a plurality of lanes can limit the supply of electronic parts for each lane, it is possible to control a plurality of lanes by controlling not to make a component tape with halfway electronic components remaining. It can be used efficiently. The configuration of the present embodiment can also be applied as appropriate in the following. Moreover, what has the structure of this embodiment has the effect | action and effect similar to this embodiment.

(Embodiment 2)
The electronic component mounting method according to the second embodiment provides a method suitable for producing a plurality of types of circuit boards on which a plurality of types of electronic components are mounted, using a supply device having a plurality of lanes. . The present embodiment can be realized by the electronic component mounting apparatus 10 and the electronic component mounting system 100 shown in FIG.

  There is an electronic component mounting method for sequentially executing a plurality of production plans and mounting electronic components supplied from a supply device at predetermined positions on a substrate. In such an electronic component mounting method, one production plan is called a cluster. The cluster includes a group of circuit boards produced in the cluster, boards used for the production, electronic components, and the like as information. When a plurality of clusters are sequentially executed and a common feeder exists between two consecutive clusters, the common feeder is arranged at the same mounting position of the electronic component mounting apparatus 10 and the arrangement of the remaining feeders is optimized. There is a takeover function. The takeover function can shorten the setup time when producing a plurality of circuit boards. However, the handover function is not an algorithm corresponding to the first supply device 30 (see FIG. 2) having a plurality of lanes 31 and is optimized for each lane 31 or for each first supply device 30.

  In the present embodiment, the management device 23 of the electronic component mounting system 100 distinguishes and groups electronic components that are commonly used between clusters from those that are inherited between a plurality of clusters and those that are not inherited. At the same time, it is preferentially assigned to the lane 31 of the first supply device 30. By doing in this way, the movement of the 1st supply apparatus 30 between clusters, exchange of the component tape of only the one part lane 31 in one 1st supply apparatus 30, etc. can be reduced as much as possible. Moreover, it can reduce as much as possible that the electronic component which is not used is restrained by the lane 31. FIG. Next, a processing procedure when the electronic component mounting system 100 executes the electronic component mounting method according to the present embodiment will be described.

  FIG. 4 is a flowchart of an electronic component mounting method executed by the electronic component mounting system according to the second embodiment. The management device 23 included in the electronic component mounting system 100 reads out a computer program for executing the electronic component mounting method according to the present embodiment, and executes the instructions described in the computer program, thereby according to the present embodiment. Realize electronic component mounting method.

  First, when the cluster is optimized, the management device 23 estimates how many clusters the circuit board to be produced can be produced (step S101), and stores the result in the storage unit included in the management device 23. With this processing, in the production of circuit boards, the number of clusters that can be produced, the circuit boards that are scheduled to be included in the clusters, and the parts that are used in each cluster (electronic parts and boards before mounting electronic parts) Can be estimated.

  Next, the management apparatus 23 extracts the components used in the cluster estimated in step S101, that is, the electronic components and the board before mounting the electronic components from the storage unit for each cluster (step S102), and stores the results. Save to the department. Next, the management device 23 distinguishes between those that are inherited between the plurality of clusters and those that are not inherited, and groups the components (particularly electronic components) extracted in step S102 (step S103). Some parts are used in all clusters, some are used in a plurality of all clusters, and some are used in only one cluster. For example, when there are three clusters, grouping as shown in Table 1 is performed. The alphabets in Table 1 are group identifiers. One group describes at least the electronic components used in the production of circuit boards. In the example shown in Table 1, group A is commonly used in clusters 1 to 3, group B is commonly used in clusters 1 and 2, group C is commonly used in clusters 1 and 3, and group B D is commonly used in the clusters 2 and 3. Groups E, F, and G are used in clusters 1, 2, and 3, respectively.

  When electronic components are allocated to the lanes 31 included in the plurality of first supply devices 30 and the second supply devices 32, the management device 23 uses the first supply device 30 as the electronic components used in common among the plurality of clusters. Is preferentially assigned to the lane 31 (step S104). Next, the management device 23 checks the surplus parts of each group (step S105). The surplus parts occur when the number of electronic parts collected as a group cannot be divided by the number of lanes of the first supply device 30 having a plurality of lanes 31. The surplus parts are assigned to the first supply device 30 together with other groups or to the second supply device 32 (independent feeder) having a single lane 31.

  When there is no surplus part (step S106, Yes), the management apparatus 23 finishes the assignment of the electronic part for the cluster 1, and assigns the electronic part for the cluster 2 by executing the process from step S101. When the assignment of the electronic components is completed for all the clusters, the electronic component mounting apparatus 10 mounts the electronic components on the board based on the assignment of the electronic parts in each cluster, and produces a circuit board. When there is a surplus part (step S106, No), the management device 23 combines the electronic component and surplus part for the first supply device 30 and the second supply device 32 (hereinafter, simply referred to as a combination) for each cluster. ) Is obtained (step S107). Then, the management device 23 obtains the total occupied width in each cluster, the number of parts tape replacements and the number of parts restraints in the lane (step S108), evaluates the combination obtained in step S107 with an evaluation function, and obtains an evaluation value. (Step S109). When the evaluation value obtained in step S109 is the best (step S110, Yes), the combination obtained in step S107 is stored in the storage unit as the best combination and updated. When the evaluation value obtained in step S109 is not the best (step S110, No), the management device 23 changes the combination (step S112), and then repeats steps S108 to S110.

  When the best combination is obtained by the above-described processing procedure, the management apparatus 23 finishes assigning the electronic components for cluster 1 and assigns the electronic components for cluster 2 by executing the processing from step S101. When the assignment of the electronic components is completed for all the clusters, the electronic component mounting apparatus 10 mounts the electronic components on the board based on the assignment of the electronic parts in each cluster, and produces a circuit board. Next, combinations of electronic components and their evaluation will be described.

5 to 12 are explanatory views showing examples of combinations of electronic components in the electronic component mounting system according to the second embodiment. When combining electronic components with each lane 31 of the first supply device 30 and the second supply device 32, the following three parameters are required. Each parameter should be small.
(1) Total occupied width (x) in each cluster including empty lanes where new electronic components cannot be placed
(2) Number of lane exchanges (y)
(3) Number of times electronic parts that are not scheduled to be used are restrained because the parts tape in the lane is not replaced (number of times of restraint: z)

  When the total occupied width is obtained, each occupied width is calculated as one even if there is an empty lane 31 if electronic components are already arranged in the lane 31 of the first supply device 30. . In other words, in this case, even if there is an empty lane 31, the occupancy width of one first supply device 30 is calculated. In a cluster executed later, when there is a first supply device 30 to which electronic components are not assigned to lanes, a value obtained by dividing 1 by the number of lanes (1 / lane number) is added. The number of replacements of the lane 31 is the number of replacements of the component tape attached to the lane 31. The number of replacements does not include the number of removals, but is calculated by the number of times the component tape is attached. Even when there is no replacement of the component tape itself in the lane 31, the restraint component is in a state in which the electronic components to be used and the electronic components not to be used are mixed among the plurality of lanes 31 included in the first supply device 30. Means electronic parts that are not used. The number of times of restraint (z) refers to the number of times that restraint parts are generated.

The following evaluation methods can be considered.
(1) In accordance with the principle of optimizing the cluster, the total occupied width x is given the highest priority, then the number of replacements is y, and finally z is taken into account the influence of component constraints.
(2) The user can set the priority (for example, set the priority in the order of y, x, z).
(3) As the evaluation value, for example, the evaluation value = x × a + y × b + z × c etc., for example, the user sets an evaluation formula obtained by multiplying x, y, z by weighting coefficients a, b, c, and the evaluation formula A combination with a smaller value (evaluation value) obtained from is selected.
In the present embodiment, the combination is evaluated by the evaluation method (1), but the present invention is not limited to this.

  As a combination example, as shown in FIG. 5, a first supply device 30 having two lanes 31 is used. In cluster 1, five types of electronic components of group A, four types of electronic components of group B, and four types of electronic components of group C are used. Assume that there are five types of electronic components and two types of electronic components of group E. At this time, there are one type of electronic component of group A and one type of electronic component of group C. In this case, the remaining group A electronic components and group C electronic components are merged into the same first supply device 30. When surplus electronic parts occur in group A and group B, surplus electronic parts occur in group B and group C, surplus electronic parts occur in group B and group E, group C The same applies to the case where surplus electronic parts are generated in the group E. Table 2 shows all the cases where the surplus parts of group A and group C are merged into one first supply device 30 and when each is assigned to the second supply device 32 having a single lane 31. Indicates the occupation width, number of replacements, and number of restraints. Shows what happens in combination. As described above, when the total occupied width x is evaluated as the highest priority, the surplus parts of the group A and the group C are merged into one first supply device 30 when the cluster 1 as in this example is targeted. become.

As an example of the next combination, as shown in FIG. 6, a first supply device 30 having two lanes 31 is used. In cluster 1, five types of electronic components of group A, four types of electronic components of group B, and group Assume that there are five types of electronic components of C and three types of electronic components of group E. At this time, there are one type of electronic component of group A, one type of electronic component of group C, and one type of electronic component of group E. In this case, the following three patterns can be considered.
(1) The group A and the group C with a large number of parts used are assigned to one first supply device 30 and the remainder of the group E is assigned to the second supply device 32.
(2) The group C and the group E with a small number of parts used are assigned to one first supply device 30, and the remainder of the group A is assigned to the second supply device 32.
(3) Group A and group B are combined and assigned to one first supply device 30, and the remainder of group C is assigned to the second supply device 32.

  In this case, the pattern (3) is that the empty space is continuously generated in two clusters, and the pattern (2) is that the group A is independent of the work setup reduction when the group C is reset. It is easy to run out of space. Therefore, the pattern (1) is selected. When the groups A, B, and E are left, they are selected in the same manner. Table 3 shows the total occupied width, the number of replacements, and the number of restraints in patterns (1), (2), and (3). As described above, when the total occupied width x is evaluated with the highest priority, the pattern (2) is selected when the cluster 1 as in this example is targeted.

As a next combination example, as shown in FIGS. 7 and 8, a first supply device 30 having two lanes 31 is used, and five electronic components of group A and four electronic components of group B are included in cluster 1. It is assumed that there are four types of seeds, group C electronic components, and group E electronic components. At this time, there are one type of electronic component of group A, one type of electronic component of group C, and one type of electronic component of group E. In this case, the following three patterns can be considered.
(1) As shown in FIG. 7, group A and group E are assigned to one first supply device 30 together.
(2) As shown in FIG. 8, borrow the group C which is not excessive, and assign the group A and the group C together to one first supply device 30, and also combine the group C and the group E into one first 1 is assigned to the supply device 30. In this case, the combination of group C and group E is that the lane is replaced in the next cluster (cluster 2), that is, the component tape is replaced, and the remaining group C is treated as group G. Assigned.
(3) Assign group A and group E to the second supply device 32, respectively.
In this combination example, the pattern (2) that leaves a margin in the occupied width in the subsequent clusters (cluster 2 and cluster 3) is selected. Table 4 shows the total occupied width, the number of replacements, and the number of restraints in patterns (1), (2), and (3). As described above, when the total occupied width x is evaluated with the highest priority, the pattern (2) is selected when the cluster 1 as in this example is targeted.

As a next combination example, as shown in FIGS. 9 and 10, a first supply device 30 having two lanes 31 is used. In cluster 1, four types of electronic components in group A and three electronic components in group B are used. It is assumed that there are three types of electronic components in the group C and three types of electronic components in the group E. At this time, there are one type of electronic component of group B, one type of electronic component of group C, and one type of electronic component of group E. In this case, the following three patterns can be considered.
(1) As shown in FIG. 9, group B and group C are assigned to one first supply device 30, and the surplus group E is assigned to the second supply device 32. In this way, the number of exchanges is reduced.
(2) As shown in FIG. 10, group C and group E are allocated to one first supply device 30 together. In this way, the space use efficiency is improved.
(3) Group B and Group E are assigned to the second supply device 32, respectively, and the surplus group C is assigned to the second supply device 32.
In this combination example, priority is given to the small number of exchanges, pattern (1) is selected, and pattern (2) with a margin in the space of subsequent clusters (cluster 2 and cluster 3) is selected. There are two possible ways. Table 5 shows the total occupied width, the number of replacements, and the number of restraints in patterns (1), (2), and (3). As described above, when the total occupied width x is evaluated with the highest priority, the pattern (1) is selected when the cluster 1 as in this example is targeted.

As a next combination example, as shown in FIGS. 11 and 12, a first supply device 30 having two lanes 31 is used, and three types of electronic components of group A and three types of electronic components of group B are used in cluster 1. It is assumed that there are three types of electronic components in the group C and three types of electronic components in the group E. At this time, there are one type of electronic component of group A, one type of electronic component of group B, one type of electronic component of group C, and one type of electronic component of group E. In this case, the following three patterns can be considered.
(1) As shown in FIG. 11, group A and group B are assigned to one first supply device 30 together, and group C and group E are assigned to one first supply device 30 together.
(2) As shown in FIG. 12, group A and group C are assigned to one first supply device 30 together, and group B and group E are assigned to one first supply device 30 together.
(3) Group A and group E are assigned to one first supply device 30 together, and group B and group C are assigned to one first supply device 30 together. Table 6 shows the total occupied width, the number of replacements, and the number of restraints in patterns (1), (2), and (3). As described above, when the total occupied width x is evaluated with the highest priority, the pattern (1) is selected when the cluster 1 as in this example is targeted.

  As described above, after assigning the cluster 1 to the lanes 31 of the first supply device 30 or the second supply device 32 for each group, the first supply device 30 or the second supply for each group in the cluster 2 as well. Assign to lane 31 of device 32. However, electronic parts that have already been placed are excluded from assignment. The same applies to the electronic components already assigned to the lane 31 of the first supply device 30 or the second supply device 32 in the initial state. When the assignment in cluster 2 is completed, the assignment is performed in cluster 3 in the same manner. When the assignment is completed for all the clusters, the management device 23 ends the electronic component mounting method according to the present embodiment. Thereafter, the electronic component mounting apparatus 10 mounts the electronic components on the board based on the assignment of the electronic parts by the management apparatus 23 to produce a circuit board.

  According to the present embodiment, when a supply device having two or more lanes is used, it is not easy to replace the component tape for each lane when reducing the replacement of the component tape corresponding to the lane among a plurality of clusters. The following effects can be obtained with respect to a supply device that is not provided. First, since it is possible not to exchange the component tape for each lane in all the supply devices, the setup time can be shortened. In addition, by using the total occupied width, the number of replacements and the number of restraints as criteria for grouping electronic components, the increase in setup with the increase in the number of clusters caused by the increase in the total occupied width, the number of replacements Increases in parts inventory management due to an increase in setup and an increase in the number of times of restraint can be reduced. Furthermore, by changing the evaluation method by setting priorities or weights for the total occupied width, the number of replacements and the number of constraints, the number of clusters, the number of replacements and the parts inventory management in a form that is in line with the operation on the user side Optimization is possible.

8 Substrate 10 Electronic component mounting device 12 Substrate transport unit 13F First bank 13R Second bank 14 Component supply unit 15 Head 16 Moving mechanism 18 Component recognition camera 21 Control device 22 X-axis drive unit 23 Management device 24 Y-axis drive unit 30 30A First supply device 31 Lane 32 Second supply device 100 Electronic component mounting system

Claims (8)

Supplied from at least one of a first supply device having a plurality of lanes for supplying an electronic component holding member holding a plurality of electronic components, a second supply device having a single lane, and the first supply device and the second supply device. An electronic component mounting apparatus including a head for mounting the electronic component on the substrate;
A plurality of production plans for mounting a plurality of types of electronic components on a plurality of types of substrates are determined, and electronic components used in common among the plurality of production plans are taken over between the plurality of production plans. A management device that preferentially assigns electronic components that are used in common among a plurality of the production plans to the lanes of the first supply device, while distinguishing and grouping those that are not taken over
Electronic component mounting system including.   If the number of electronic components belonging to the group obtained by the grouping is not divisible by the number of the lanes of the first supply device, the management device allocates a surplus component with a different group or the first component. The electronic component mounting system according to claim 1, wherein the electronic component mounting system is assigned to two supply devices.   The electronic component mounting system according to claim 2, wherein the management device assigns the electronic component such that a width occupied by all of the plurality of lanes used in the plurality of production plans is minimized. Supplied from at least one of a first supply device having a plurality of lanes for supplying an electronic component holding member holding a plurality of electronic components, a second supply device having a single lane, and the first supply device and the second supply device. In mounting an electronic component on a board using an electronic component mounting apparatus including a head for mounting the electronic component on the board,
Procedures for determining multiple production plans for mounting multiple types of electronic components on multiple types of boards,
Electronic parts commonly used among a plurality of the production plans, a procedure for distinguishing and grouping what is inherited between the plurality of production plans and those not inherited,
A procedure for preferentially allocating electronic parts used in common among a plurality of the production plans to the lane of the first supply device;
An electronic component mounting method including:   When assigning the electronic component to the lane, if the number of electronic components belonging to the group is not divisible by the number of the lanes of the first supply device, it is assigned as a surplus component together with a different group or the second The electronic component mounting method according to claim 4, wherein the electronic component mounting method is assigned to a supply device.   3. The electronic component mounting method according to claim 2, wherein, when assigning the electronic component to the lane, the electronic component is assigned such that a width occupied by all of the plurality of lanes used in the plurality of production plans is minimized.   When the electronic device is set in a plurality of the lanes when determining the arrangement of the first supply device, the management device selects a combination of the electronic components set in the plurality of lanes. Originally, the arrangement is determined in units of the first supply device, and when the electronic component is not set in a plurality of the lanes, the arrangement is determined in units of each lane of the first supply device. Item 5. The electronic component mounting method according to Item 4.   A computer program for mounting an electronic component, which causes a computer to execute the electronic component mounting method according to any one of claims 3 to 7.

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