CN106879246B - Electronic component mounting apparatus, electronic component mounting system and installation method - Google Patents
Electronic component mounting apparatus, electronic component mounting system and installation method Download PDFInfo
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- CN106879246B CN106879246B CN201610887361.1A CN201610887361A CN106879246B CN 106879246 B CN106879246 B CN 106879246B CN 201610887361 A CN201610887361 A CN 201610887361A CN 106879246 B CN106879246 B CN 106879246B
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- electronic component
- feedway
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of electronic component mounting apparatus, electronic component mounting system and electronic component mounting method, is suitable for the control with multiple paths corresponding with the component band of electronic component is maintained.It includes: the 1st feedway, with multiple paths, which maintain the electronic component holding member supply of multiple electronic components；Boarded head, by the electro part carrying supplied from the 1st feedway on substrate；Control device controls the 1st feedway according to the mistake occurred on path；And managing device, it determines multiple production plans that the electronic component of multiple types is installed on the substrate of multiple types, the electronic component that the electronic component being used in conjunction between multiple production plans is divided into the electronic component joined between multiple production plans and is not joined, and the electronic component for being grouped, and being used in conjunction between multiple production plans is preferentially to the path allocation of the 1st feedway.
Description
The application is that application No. is 201210387286.4 applications for the China national based on proposition on October 12nd, 2012
The divisional application of (electronic component mounting apparatus, electronic component mounting system and installation method), its content referenced below.
Technical field
The present invention relates to the electronic component mounting apparatus used when installing electronic component on substrate, electronic component installation system
System and electronic component mounting method.
Background technique
As the device for installing electronic component on substrate, there are a kind of electronic component mounting apparatus, with boarded head,
The boarded head has multiple adsorption mouths, which adsorbs electronic component using the adsorption mouth and be mounted in
On substrate.Herein, boarded head is by moving adsorption mouth on the direction orthogonal with substrate surface, thus by the electronics of absorption
Component is installed on substrate.Electronic component is supplied to boarded head from the device for carrying out electronic component supply.Electronic component utilizes portion
Part band is kept.Feedway is sent out component band by feeder, and electronic component is delivered to the position that boarded head adsorbs.
Feedway includes the structure in only one path corresponding with component band and the structure with multiple above-mentioned paths.With more
The feedway in a above-mentioned path, such as be recorded in patent document 1.
Patent document 1: Japanese Unexamined Patent Publication 2003-188591 bulletin
Summary of the invention
But special consideration should be given to for the efficient of the feedway with multiple paths in the invention of patent document 1
Control.
For example, in the case that component is finished in 1 path only in multiple paths, in order to replace the portion in 1 path
Part band, it is necessary to component be not yet finished and can carry out component supply path be also simultaneously stopped after replaced.Herein,
The replacement that component band is carried out even if stopping the path that can carry out component supply, does not also make to whether production efficiency reduces
Judgement, accordingly, there exist room for improvement.The object of the present invention is to provide a kind of suitable for this electricity with multiple paths
The control of the feedway of subassembly, the path are corresponding with the component band of electronic component is kept.
The present invention is a kind of electronic component mounting apparatus, on substrate install electronic component comprising:
Feedway, with multiple paths, which carries out the electronic component holding member for maintaining multiple electronic components
Supply；And control device, the selection driving path in the multiple path of the feedway, described in being supplied
Electronic component is carried on the substrate by boarded head, at least one path of the control device in the multiple path
In the case where upper generation mistake, the feedway is changed to the selection mode in the driving path.
In the present invention, it is preferred to which the control device stops using this in the case where mistake occurs at least one path
The All Paths of feedway.
In the present invention, it is preferred to which the control device is only stopped using in the case where mistake occurs at least one path
The path of mistake occurs in the feedway.
In the present invention, it is preferred to which mistake occurs at least one path possessed by the feedway for the control device
In the case where accidentally, continue to use normal path, until occur on All Paths possessed by the feedway it is wrong until.
In the present invention, it is preferred to be, exist in the feedway to the path supply by mistake occurs
In the case where other paths that the electronic component of electronic component identical type is supplied, the control device use is to the phase
Other paths that congener electronic component is supplied, to the electronic component phase with the path supply by mistake occurs
The congener electronic component is supplied.
In the present invention, it is preferred to be, there are the roads of the electronic component of multiple supply identical types in the feedway
In the case where diameter, the control device is finished after the electronic component that 1 path supplies is finished, using other paths pair with component
The electronic component of electronic component identical type of above-mentioned 1 path supply supplied.
The present invention is a kind of electronic component mounting method, and the ministry of electronics industry is installed on substrate by electronic component mounting apparatus
Part, the electronic component mounting method are characterized in that thering is feedway, which has multiple paths, the path pair
The electronic component holding member for maintaining multiple electronic components is supplied, and is filled by the control of electronic component mounting apparatus
It sets, selection driving path, passes through carrying for the electronic component supplied in the multiple path of the feedway
Head carries on the substrate, at this moment, described in the case where mistake occurs at least one path in the multiple path
Control device changes feedway to the selection mode in the driving path.
In the present invention, it is preferred to which the control device stops using this in the case where mistake occurs at least one path
The All Paths of feedway.
In the present invention, it is preferred to which the control device is only stopped using in the case where mistake occurs at least one path
The path of mistake occurs in the feedway.
In the present invention, it is preferred to be, the control device occurs at least one path possessed by the feedway
In the case where mistake, normal path is continued to use, until mistake occurs for the All Paths possessed by the feedway.
In the present invention, it is preferred to be, exist in the feedway to the path supply by mistake occurs
In the case where other paths that the electronic component of electronic component identical type is supplied, the control device use is to the phase
Other paths that congener electronic component is supplied, to the electronic component phase with the path supply by mistake occurs
The congener electronic component is supplied.
In the present invention, it is preferred to be, there are the roads of the electronic component of multiple supply identical types in the feedway
In the case where diameter, the control device is after the electronic component that 1 path supplies is finished, using other paths, to component
The electronic component of the electronic component identical type for the above-mentioned 1 path supply being finished is supplied.
In addition, the present invention is a kind of electronic component mounting system, it includes electronic component mounting apparatus and managing devices, should
Electronic component mounting apparatus includes: the 1st feedway, and with multiple paths, the path is to maintaining multiple electronic components
Electronic component holding member is supplied；2nd feedway has the single path；And boarded head, it will be from described
The electro part carrying of at least one party's supply in 1st feedway and the 2nd feedway is on substrate, management dress
It sets, determines the multiple production plans for installing the electronic component of multiple types on the substrate of multiple types, it will be in the multiple life
The electronic component being used in conjunction between production plan is divided into the electronic component joined between the multiple production plan and is not handed over
The electronic component connect and the electronic component for being grouped, also, being used in conjunction between the multiple production plan, preferentially to institute
State the path allocation of the 1st feedway.
In the present invention, it is preferred to be the managing device, the affiliated electronic component in the group formed by the grouping
Number is not in the case that the number of path possessed by the 1st feedway divides exactly, as remainder, from different groups one
It plays distribution or is distributed to the 2nd feedway.
In the present invention, it is preferred to be, the managing device is allocated the electronic component, so that the multiple
Width shared by multiple path entirety used in production plan is minimum.
The present invention is a kind of electronic component mounting method, installs the ministry of electronics industry to substrate using electronic component mounting apparatus
Part, the electronic component mounting apparatus includes: the 1st feedway, and with multiple paths, the path is to maintaining multiple electronics
The electronic component holding member of component is supplied；2nd feedway has the single path；And boarded head, it will
The electro part carrying supplied from at least one party in the 1st feedway and the 2nd feedway is on substrate, the electricity
Subassembly installation method is included the following process when installing electronic component to substrate: determining that installation is more on the substrate of multiple types
Multiple production plans of the electronic component of a type；The electronic component that will be used in conjunction between the multiple production plan, area
It is divided into the electronic component joined between the multiple production plan and the electronic component that does not join and is grouped；And institute
The electronic component being used in conjunction between multiple production plans is stated preferentially to the path allocation of the 1st feedway.
In the present invention, it is preferred to be, when by the electronic component to the path allocation, in the group belonging to the ministry of electronics industry
In the case that number of packages is not divided exactly by the number of path that the 1st feedway has, as remainder, from different groups one
It plays distribution or is distributed to the 2nd feedway.
In the present invention, it is preferred to be, when by the electronic component to the path allocation, the electronic component is carried out
Distribution, so that width shared by multiple path entirety used in the multiple production plan is minimum.
In the present invention, it is preferred to be the managing device, the case where determining the configuration of multiple 1st feedways
Under, when being set with the electronic component on multiple paths, according to the ministry of electronics industry set on multiple paths
The combination of part determines the configuration of each 1st feedway, also, in multiple paths as unit of the 1st feedway
On when not setting the electronic component, as unit of each path of the 1st feedway, determine matching for each 1st feedway
It sets.
The effect of invention
The present invention can provide a kind of suitable for multiple paths corresponding with the component band of electronic component is kept
The control of the feedway of electronic component.
Detailed description of the invention
Fig. 1 is the oblique view of the electronic component mounting apparatus and electronic component mounting system that indicate that embodiment 1 is related to.
Fig. 2 is the oblique view for indicating component supply unit.
Fig. 3 is equipped with the top view of the electronic component mounting apparatus of multiple 1st feedways.
Fig. 4 is the flow chart for the electronic component mounting method that the electronic component mounting system that embodiment 2 is related to executes.
Fig. 5 is the explanatory diagram for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to.
Fig. 6 is the explanatory diagram for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to.
Fig. 7 is the explanatory diagram for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to.
Fig. 8 is the explanatory diagram for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to.
Fig. 9 is the explanatory diagram for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to.
Figure 10 is the explanation for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to
Figure.
Figure 11 is the explanation for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to
Figure.
Figure 12 is the explanation for indicating the combination example of the electronic component in electronic component mounting system that embodiment 2 is related to
Figure.
Specific embodiment
Referring to attached drawing, mode for carrying out the present invention (hereinafter referred to as embodiment) is described in detail.This hair
It is bright not limited by the content recorded in following implementation.In addition, including those skilled in the art in the structure of following record
Technology, substantially the same technology, the technology of equivalency range that member can be readily apparent that.Moreover, the structure recorded below can be with
It is appropriately combined.In addition, without departing from the scope of the subject in the invention, the omission, displacement or change of structure can be carried out.
(embodiment 1)
Fig. 1 is the oblique view of the electronic component mounting apparatus and electronic component mounting system that indicate that embodiment 1 is related to.Electricity
Subassembly installation system 100 includes electronic component mounting apparatus 10 and managing device 23.Electronic component mounting apparatus 10 is in base
The device of the surface mounted electronic parts of plate 8.Electronic component mounting apparatus 10 have substrate delivery section 12, component supply unit 14,
Boarded head 15, XY mobile mechanism 16 and parts recognition camera 18.As long as substrate 8 carries the component of electronic component,
Structure is not particularly limited.The substrate 8 of present embodiment is the component of plate, is equipped with Wiring pattern on surface.It is arranged in substrate 8
On the surface of Wiring pattern be attached with and connect by the solder etc. that reflow soldering engages above-mentioned Wiring pattern and electronic component
Close component.
Substrate delivery section 12 is the conveying mechanism of the X-direction conveying by substrate 8 in Fig. 1.Substrate delivery section 12, which includes, to be led
Rail extends in X direction；And conveying mechanism, supporting substrate 8, and move substrate 8 along guide rail.Substrate delivery section 12 with
So that the one i.e. mounting surface direction opposite with boarded head 15 in maximum 2 faces of the area of substrate 8, by utilizing conveyer
Structure moves substrate 8 along guide rail, conveys to carry out substrate 8 in the X direction.Substrate 8 is delivered to guide rail by substrate delivery section 12
On specified position, the substrate 8 to the equipment of 10 supplying substrate 8 of electronic component mounting apparatus supply.
Boarded head 15 is at above-mentioned defined position, by electro part carrying in the surface of substrate 8.Substrate delivery section 12 exists
It is delivered to after carrying electronic component on the substrate 8 of above-mentioned specified position, substrate 8 is delivered to and carries out subsequent processing (for example, reflux
Welding) device.As the conveying mechanism of substrate delivery section 12, various structures can be used.It is, for example, possible to use make conveyer
The belt type conveying mechanism being integrally constituted, the conveying mechanism make the guide rail configured along the conveying direction of substrate 8 and along above-mentioned
The endless belt of guide rail rotation, is conveyed with the state of the mounted board 8 on above-mentioned endless belt.
Component supply unit 14 includes electronic component holding member, keeps multiple electronics carried on the surface of substrate 8
Component；And feeder portion, the electronic component that above-mentioned electronic component holding member is kept is supplied to boarded head 15.Above-mentioned confession
The electronic component supplied from above-mentioned electronic component holding member is set to become the state that boarded head 15 adsorbs to device portion.In this reality
Apply in mode, above-mentioned electronic component holding member be kept in multiple holes for being arranged on component band electronic component construction or
The construction of electronic component is pasted on component band.Above-mentioned feeder portion keeps above-mentioned component band feeding a certain amount of, becomes electronic component
The state exposed to specified position.As described above, component supply unit 14 is the belt-type feeder comprising component band and feeder portion.
In addition, component supply unit 14 can be loaded and unloaded relative to electronic component mounting apparatus 10.
Boarded head 15 is the electronic component that is maintained on component supply unit 14 of absorption, and by the electro part carrying of absorption in
The device being moved to by substrate delivery section 12 on the mounting surface of the substrate 8 of specified position.XY mobile mechanism 16 is to make boarded head
The mobile mechanism moved in 15 x-direction and y-directions in Fig. 1, face i.e. parallel with the mounting surface of substrate 8 has X-axis driving
Portion 22 and Y-axis driving portion 24.X-axis driving portion 22 and boarded head 15 link, and move boarded head 15 in the X-axis direction.Y-axis driving
Portion 24 links via X-axis driving portion 22 and boarded head 15, by moving X-axis driving portion 22 in the Y-axis direction, to make to carry
First 15 move in the Y-axis direction.Z-direction is the direction orthogonal with the mounting surface of substrate 8.
XY mobile mechanism 16 is by moving boarded head 15 on the direction XY, so as to so that boarded head 15 is moved to and base
The opposite position of plate 8 or the position opposite with the feeder portion of component supply unit 14.In addition, XY mobile mechanism 16 is by making to carry
First 15 is mobile, adjusts the relative position of boarded head 15 and substrate 8.XY mobile mechanism 16 can be such that boarded head 15 keeps as a result,
Electronic component is moved to any position on the surface of substrate 8, can be by electro part carrying in any position of the mounting surface of substrate 8
It sets.As X-axis driving portion 22, the various mechanism for moving boarded head 15 in the prescribed direction can be used.As Y-axis driving portion
24, the various mechanism for moving X-axis driving portion 22 in the prescribed direction can be used.As moving object in the prescribed direction
Dynamic mechanism, it is, for example, possible to use linear motor, rack-and-pinion, using ball-screw conveying mechanism, use transmission belt
Conveying mechanism etc..
Parts recognition camera 18 is disposed near component supply unit 14 and in the position opposite with boarded head 15
Photographic device.For parts recognition camera 18 by shooting to boarded head 15, whether detection boarded head 15 is adsorbed with the ministry of electronics industry
Part.
Control device 21 controls electronic component mounting apparatus 10.More specifically, 21 control base board of control device
The movement of delivery section 12, component supply unit 14 and boarded head 15 etc..In addition, control device 21 executes electricity of the present embodiment
Subassembly installation method.Control device 21 is, for example, computer, corresponding to needing to be equipped with the external memories such as hard disk device.Pipe
Reason device 23 for example carries out the production management of electronic component mounting apparatus 10 and the condition managing of electronic component mounting apparatus 10.
That is, electronic component mounting apparatus 10 finds out optimal change according to the substrate and component etc. that need in the production of circuit substrate
Adjustment is produced, alternatively, grasp working condition or situation of problem of multiple electronic component mounting apparatus 10 etc., is adjusted with can be true
Protect productivity.
Fig. 2 is the oblique view for indicating component supply unit.Component supply unit 14 has the feedway as electronic component
1st feedway 30 and the 2nd feedway 32.1st feedway 30 and the 2nd feedway 32 are comprising keeping multiple electronics
The belt-type feeder of component band (the electronic component holding member) and feeder portion of component 9.1st feedway 30 has multiple roads
Diameter 31,31 pairs of the path keep the component band of multiple electronic components 9 to supply.2nd feedway 32 has single path 31,
31 pairs of the path keeps the component band of multiple electronic components 9 to supply.1st feedway 30 and the equal structure of the 2nd feedway 32
As can be installed and be dismantled relative to electronic component mounting apparatus 10.The absorption of boarded head 15 from the 1st feedway 30 or
The electronic component 9 of 2nd feedway 32 supply, is equipped on the specified position of substrate 8.In the present embodiment, the ministry of electronics industry
The component supply unit 14 of part mounting device 10 has multiple 1st feedways 30.
Fig. 3 is equipped with the top view of the electronic component mounting apparatus of multiple 1st feedways.It installs and fills in electronic component
10 are set in the case where the 1st feedway 30 comprising multiple paths 31, control device 21 executes of the present embodiment
Electronic component mounting method controls the 1st feedway 30 according to the mistake occurred in path 31.More specifically,
Control device 21 changes the driving of the 1st feedway 30 in the case where mistake occurs at least one path 31 in path 31
The selection mode in path.The change of selection mode refers to the change path 31 possessed by the 1st feedway 30 of control device 21
The middle mode selected for carrying out the path of the supply of electronic component 9.The change of selection mode, such as can be listed below, that is,
All Paths 31 possessed by 1st feedway 30 are not selected as the supply for electronic component 9 by control device 21
Path stops using the All Paths 31 of the 1st feedway 30, or the normal path 31 of selection up to whole paths 31
Until mistake occurs, that is, normal path 31 is continued to use until mistake occurs for All Paths 31 etc..
So-called mistake refers in the production of circuit substrate, must when using the 1st feedway 30 or 2 feedway 32
It must make the exception for acting interrupting or stopping.Usually occur by component be finished caused by absorption mistake be also contained in mistake.It is wrong
Accidentally processing refers to processing when mistake occurs.In the present embodiment, error handle is according to each feedway or each path
The processing component installation situation of any one or production status in 31 determine times in each feedway or each path 31
Controlling whether for meaning one is appropriate.
As the 1st control for error handle, at least one road possessed by the 1st feedway 30 of control device 21
In the case where mistake occurs in diameter 31, the 1st feedway 30 with the path 31 that mistake has occurred is stopped using.Exist as a result,
In the case where mistake occurs in path 31, as unit of the 1st feedway 30 with the path 31, the 1st feedway 30
It cannot use, therefore, the 1st feedway 30 not can be carried out the supply of electronic component 9.Therefore, boarded head 15 fills the 1st supply
The absorption movement that All Paths 31 possessed by setting 30 carry out also stops, so as to by the 1st feedway 30 from electronic component
Mounting device 10 disassembles, and restores it from error condition.In addition, at least one of control device 21 in multiple paths 31
In the case where mistake occurs, the 1st feedway 30 is stopped using, that is, stop using whole road possessed by the 1st feedway 30
Diameter.Therefore, even if in the production process of electronic component mounting apparatus 10, in the timing that boarded head 15 declines, there will be generation
1st feedway 30 in the path 31 of mistake disassembles, and control device 21 will not make boarded head 15 to generation mistake
Path 31 the 1st feedway 30 it is close, it can thus be avoided the possibility of the equal interference of boarded head 15 and path 31.
As the 2nd control for error handle, at least one road possessed by the 1st feedway 30 of control device 21
In the case where mistake occurs on diameter 31, control device 21 only stops using the path 31 of the generation mistake of the 1st feedway 30.And
And control device 21 continues to use normal route 31, until mistake occurs in All Paths 31 possessed by the 1st feedway 30
Until.
In this control, there is the path 31 that mistake occurs in the 1st feedway 30 and carry out identical in control device 21
In the case where the path 31 that the electronic component 9 of type supplies, the path 31 can be used and supplied with the path 31 that mistake occurs
The supply of the electronic component for 9 identical type of electronic component given.Thus, it is possible to reduce stop the 1st feedway 30 number and
The number of the 1st feedway 30 is dismantled from electronic component mounting apparatus 10.In the example shown in Fig. 3, there are 3 paths 31
The 1st feedway 30A in, in the case where 2 paths 31 are electronic component A or 3 paths 31 are the feelings of electronic component C
Under condition, the 2nd control for error handle can be used.
In the 2nd control for error handle, in the case where supplying the electronic component of identical type, in 31 institute of path
After the electronic component supply having, that is, can also be by other paths 31 for giving component after the component in path 31 is finished
The electronic component for the electronic component identical type that the path 31 being finished supplies.Thus, it is possible to by electronics possessed by 1 path 31
Component 9 has used, and therefore, can inhibit the waste of electronic component.In the following, for the 1st feedway 30 and the 2nd feedway 32
The determination of configuration relative to electronic component mounting apparatus 10 is illustrated.
Managing device 23 shown in FIG. 1, imagination in the 1st feedway 30 set electronic component state, according to
The combination of the electronic component set on multiple paths 31 determines the configuration in path 31 as unit of the 1st feedway 30.Pass through
Managing device 23 etc. optimize after the 1st feedway 30 configuration, as unit of the 1st feedway 30, therefore can press down
Make the replacement of the electronic component in each path 31.Therefore, the more situation of adjustment is produced suitable for changing.
Managing device 23 can not also consider the arrangement of the electronic component in the 1st feedway 30, and configuration path 31 and
1st feedway 30.Most initial in the case where not being set with electronic component in the 1st feedway 30, without the concern for the 1st
Path 31 in feedway 30, therefore in this case, determination is matched as unit of each path 31 of the 1st feedway 30
It sets.Due to considering to the configuration in path 31, the 1st feedway 30 can be efficiently configured.In addition, in the 1st feedway
After setting electronic component in 30, the configuration in path 31 is determined as unit of the 1st feedway 30.
Managing device 23 supplies dress in the configuration for determining feedway, to the 1st feedway 30 and the 2nd of identical size
32 distribution is set to be managed.In the quantity for the feedway that can be set in the 1st receiving portion 13F and the 2nd receiving portion 13R,
In the case where being mixed the 1st feedway 30 and the 2nd feedway 32, managing device 23 is distributed so that whole multiple 1
After feedway 30 reaches the path 31 for the maximum quantity having, the 2nd feedway 32 is allocated.In addition, can root
It is judged automatically in the suitable situation of which of the control in each path, the control of each feedway according to situation, automatically
It is controlled, is set as condition, the control for carrying out each path can be preset or carry out each feedway
Control.
The 1st feedway 30 in the identical path 31 of combination with electronic component, configures in the 1st receiving portion 13F
In the case where and configuration in the 2nd receiving portion 13R in the case where, path 31 relative to substrate conveying direction (from L to T in Fig. 3
Direction) sequence it is different.For example, if the 1st supply in the path 31 in path 31 and electronic component B with electronic component A
Device 30 configures in the 1st receiving portion 13F, then the sequence in path 31 is to be followed successively by electronics from the conveying direction upstream side of substrate
Components A, B.If the 1st feedway 30 is arranged in the 2nd receiving portion 13R with the state, the sequence in path 31 is from defeated
Direction upstream side is sent to be followed successively by electronic component B, A, it is opposite with situation of the configuration in the 1st receiving portion 13F.
Therefore, the 1st feedway 30 in path 31 with electronic component A, B of the configuration in the 2nd receiving portion 13R,
The sequence in path 31 can be set as being followed successively by electronic component A, B from the conveying direction upstream side of substrate.But if with above-mentioned
Mode is arranged, even then the 1st feedway 30 in the path with electronic component A, B, it is also necessary to correspond respectively to the 1st receiving
Portion 13F and the 2nd receiving portion 13R carries out the sequence switching in path 31, lacks versatility.Therefore, control device 21, which is directed to, has electricity
1st feedway 30 in the identical path 31 of combination of subassembly, is identified as in the 1st receiving portion 13F and the 2nd receiving portion 13R,
Putting in order for path 31 is opposite.1st feedway 30 in the identical path 31 of combination with electronic component as a result, is not necessarily to
It carries out path 31 between the 1st receiving portion 13F and the 2nd receiving portion 13R to switch, thus versatility is improved.
As described above, according to the present embodiment, it is available using the feedway with multiple paths
Following effects.Firstly, by being carried out at the mistake of the feedway with multiple paths for each device or each path
Reason, can choose the timing of error handle, therefore can reduce error handle changes production adjustment time.Furthermore it is possible to safely
Dismantle feedway.Moreover, by having the feedway in multiple paths for each device or the configuration of each path, so as to
With direct using the component band being provided with, therefore, it is easy change production adjustment, it is possible to reduce change production adjustment time.In addition, can
With in the feedway with multiple paths, the supply for each path setting electronic component is limited, therefore controls as not
It will cause the component band that the residue given up halfway has electronic component, so as to which multiple paths are efficiently used.Present embodiment
Structure, also can be properly used following.In addition, the construction of the structure with present embodiment, realization and present embodiment
Identical effect, effect.
(embodiment 2)
The electronic component mounting method that embodiment 2 is related to provides and is adapted for use with the feedway with multiple paths,
The method when circuit substrate of multiple types of the electronic component of multiple types is carried in production.Present embodiment can pass through Fig. 1
Shown in electronic component mounting apparatus 10 and electronic component mounting system 100 realize.
In the presence of multiple production plans are successively executed, the electronic component supplied from feedway is mounted on to the predetermined bits of substrate
The installation method for the electronic component set.In the installation method of this electronic component, 1 production plan is known as group.In group
Contain the set of circuits substrate, the substrate used in the production and electronic component etc. produced in this group as packet.?
Has the function of handover when successively executing multiple groups, that is, will be common there are when common feeder between continuous 2 groups
Feeder configures the identical installation site in electronic component mounting apparatus 10, optimizes to the configuration of remaining feeder.
By joining function, it can shorten and change production adjustment time when producing multiple circuit substrates.But handover function not with have
The corresponding algorithm of 1st feedway 30 (reference Fig. 2) in multiple paths 31, and just for each path 31 or each 1st
Feedway 30 optimizes.
In the present embodiment, the managing device 23 of electronic component mounting system 100, the electricity that will be used in conjunction between group
Subassembly, the electronic component dividing into the electronic component joined between multiple groups and not joining, and be grouped, also, excellent
First distributed to the path 31 of the 1st feedway 30.By the above-mentioned means, the 1st feedway 30 can be reduced to the greatest extent between group
Movement or the only replacement etc. of the component band in a part of path 31 in 1 the 1st feedway 30.Furthermore it is possible to reduce to the greatest extent
The electronic component not used is constrained in into the situation in path 31.In the following, executing this implementation for electronic component mounting system 100
The processing sequence when electronic component mounting method that mode is related to is illustrated.
Fig. 4 is the flow chart for the electronic component mounting method that the electronic component mounting system that embodiment 2 is related to executes.Portion
Managing device 23 possessed by part installation system 100 is installed by reading for executing electronic component of the present embodiment
The computer program of method executes the order described in above-mentioned computer program, to realize electricity of the present embodiment
Subassembly installation method.
Firstly, managing device 23 when optimizing to group, estimates that the circuit substrate of predetermined production can be used as several groups
(step S101) is produced, is stored the result into storage unit possessed by managing device 23.It through this process, can be in life
Produce electricity base board when, estimate by the way that how many groups may be implemented to produce and group includes the circuit substrate of interior predetermined production, into
And it can estimate the component used in each group.
Then, managing device 23 is directed to each group, is extracted used in the group estimated in step s101 from storage unit
Part, that is, result is stored in storage unit by the substrate (step S102) before electronic component and carrying electronic component.Then, it manages
Device 23 distinguishes the component joined between multiple groups and the component not joined, and divides the component extracted in step s 102
Group (step S103).Each component includes the component used in whole groups, component used in multiple groups in whole groups, only
The component used in 1 group.For example, be grouped shown in table 1 in the case where group is 3.English alphabet in table 1
It is the identifier of group.In 1 group, the electronic component for circuit substrate production is at least recorded.In the example shown in table 1,
Group A is used in conjunction in group 1 to 3, and group B is used in conjunction in group 1,2, and group C is used in conjunction in group 1,3.Group E, F, G exist respectively
It is used in group 1,2,3.
Table 1
| Group A | Group B | Group C | Group D | Group E | Group F | Group G | Group H | |
| Group 1 | ○ | ○ | ○ | ? | ○ | ? | ? | ? |
| Group 2 | ○ | ○ | ? | ○ | ? | ○ | ? | ? |
| Group 3 | ○ | ? | ○ | ○ | ? | ? | ○ | ? |
The case where distributing electronic component to path 31 possessed by multiple 1st feedways 30, the 2nd feedway 32
Under, managing device 23 is by the electronic component being used in conjunction between multiple above-mentioned groups preferentially to the path 31 of the 1st feedway 30
It distributes (step S104).Then, managing device 23 confirms the remainder (step S105) of each group.Remainder is as group
The quantity of the electronic component of concentration generates in the case where not divided exactly by the number of path of the 1st feedway 30 with multiple paths 31
?.Remainder merges with other groups and distributes to the 1st feedway or fill to the 2nd supply with individual path 31
Set 32 distribution.
In the case where no remainder (step S106 is yes), managing device 23 terminates the electronic component for being directed to group 1
Distribution executes the processing since step S101 and carries out electronic component distribution for group 2.In the electronics for whole groups
After component distributes, electronic component mounting apparatus 10 is distributed according to the electronic component in each group, and electronics is installed on substrate
Component produces circuit substrate.In the case where there is remainder (step S106 is no), managing device 23 for each group find out with
(step (is hereinafter referred to as combined) in the combination of 1st feedway 30 and the corresponding electronic component of the 2nd feedway 32 and remainder
Rapid S107).Then, managing device 23, which is found out, always occupies width, the replacement number of component band in path and portion in each group
Part constrains number (step S108), and Utilization assessment function evaluates the combination found out in step s 107, finds out evaluation of estimate
(step S109).It, will be in step S107 in the case that the evaluation of estimate obtained in step S109 is optimal (step S110 is yes)
Obtained in combination be stored in storage unit as optimum combination, and be updated.The evaluation of estimate obtained in step S109 is not
Be it is optimal in the case where (step S110 is no), 23 pairs of combinations of managing device change (step S112), then repeatedly step
S108 to step S110.
After obtaining optimum combination by above-mentioned treatment process, managing device 23 terminates the electronic component point for group 1
Match, for group 2, executes the processing since step S101 and carry out electronic component distribution.In the ministry of electronics industry for whole groups
After part distributes, electronic component mounting apparatus 10 installs electronics according to the distribution of the electronic component in each group on substrate
Component produces circuit substrate.In the following, the combination and its evaluation for electronic component are illustrated.
Fig. 5 to Figure 12 is the combination example for indicating the electronic component in electronic component mounting system that embodiment 2 is related to
Explanatory diagram.When carrying out electronic component combination in each path 31 of the 1st feedway 30 and the 2nd feedway 32, the ginseng that needs
Number has following 3.Each parameter is the smaller the better.
(1) always occupy width (x) in each group including the dead circuit diameter comprising can not newly distribute electronic component
(2) the replacement number (y) in path
(3) number constrained for the component band that is changed without in path and to the not predetermined electronic component used is (about
Beam number: z)
In the case where seeking always occupying width, respectively occupy width, is had been configured on the path 31 of the 1st feedway 30
In the case where electronic component, even if existing temporarily for empty path 31, also calculated as 1.That is, in this case,
Even if existing temporarily for empty path 31, also calculated as the width that occupies of 1 the 1st feedway 30.Behind
In the group of execution, in the case where there is the 1st feedway 30 for not yet determining the path for being assigned electronic component, increase is removed 1
With the value (1/ number of path) of number of path.The replacement number in path 31 is the replacement number for the component band installed in path 31.More
It changes number and does not include disassembly number, but calculated by the number of installing component band.Constraint component refers to, even if being changed without
In the case where component band itself in path 31, still becomes in multiple paths 31 that the 1st feedway 30 has and be mixed
The electronic component not used when the state of the electronic component used and the electronic component not used.Constraint number (z) refers to constraint
The number that component generates.
Evaluation method considers following methods.
It (1) is always to occupy width x first according to the principle optimized to group, followed by replacement number y is finally examined
Consider the z of the effect of constraint value of component.
(2) priority (for example, priority etc. is determined with the sequence of y, x, z) can be determined by user.
(3) it is used as evaluation of estimate, such as evaluation of estimate=x × a+y × b+z × c, for example, user's setting is to x, y, z multiplied by weight
The bounds evaluation of coefficient a, b, c select the smallest combination of value obtained by bounds evaluation.
In the present embodiment, combination is evaluated by the evaluation method of (1), but not limited to this.
As combined example, as shown in figure 5, being set as in group 1 using the 1st feedway 30 with 2 paths 31
It is 2 kinds that it is 5 kinds that the electronic component of group A, which is 5 kinds, the electronic component of group B is 4 kinds, organizes the electronic component of C, organizes the electronic component of E.
At this point, the electronic component of group A is a kind remaining, it is a kind remaining to organize the electronic component of C.In this case, by the ministry of electronics industry of remaining group of A
The electronic component of part and group C are incorporated into identical 1st feedway 30.The feelings of remaining electronic component are generated in group A and group B
Condition, group B and group C in generate remaining electronic component the case where, group B and group E in generate remaining electronic component the case where,
The case where generating remaining electronic component in group C and group E, it is also all identical.Table 2 indicates that the remainder by group A and group C merges
Situation in 1 the 1st feedway 30 and it is distributed to the 2nd feedway 32 with single path 31 respectively
In the case of always occupy width, replacement number and constraint number.The case where indicating different according to combination and changing.As described above,
If at first evaluation always occupy width x, this example it is this with group 1 be object in the case where, by group A and organize C remainder
Merge in 1 the 1st feedway 30.
Table 2
| Form | Occupy width | Replace number | Constrain number |
| A, C are merged | 8/5/5 | 0 | 0.5 |
| Keep A, C independent and configures | 9/5/5.5 | 1 | 0 |
As next combination example, as shown in fig. 6, using the 1st feedway 30 with 2 paths 31, in group 1,
It is 3 kinds that it is 5 kinds that the electronic component of group A, which is 5 kinds, the electronic component of group B is 4 kinds, organizes the electronic component of C, organizes the electronic component of E.
At this point, the electronic component of group A is a kind remaining, the electronic component for organizing C is a kind remaining, and the electronic component for organizing E is a kind remaining.In the situation
Under, it is contemplated that 3 kinds of forms below.
(1) the group A for using component number more and group C are merged, is distributed in 1 the 1st feedway 30, by group E's
Supremum distribution is in the 2nd feedway 32.
(2) the group C for using component number less and group E are merged, is distributed in 1 the 1st feedway 30, by group A's
Supremum distribution is in the 2nd feedway 32.
(3) group A and group B is merged, is distributed in 1 the 1st feedway 30, the supremum distribution of group C is filled in the 2nd supply
It sets in 32.
In this case, since mode (3) is to continuously generate the space of dummy status in 2 groups, mode (2) is to set again
The production adjustment of changing of operation when organizing C surely reduces, and group A is separately configured to be easy to cause insufficient space.Therefore selection mode
(1).It is similarly selected in the remaining situation of group A, B, E.When mode (1), (2), (3) are shown in table 3 always occupy width,
Replace number and constraint number.As described above, if evaluation of priorities always occupies width x, by this example it is this with group 1 be object
In the case where, selection mode (2).
Table 3
As next combination example, as shown in Figure 7, Figure 8, using the 1st feedway 30 with 2 paths 31, in group 1
In, it is 3 that it is 4 kinds that the electronic component for organizing A, which is 5 kinds, the electronic component of group B is 4 kinds, organizes the electronic component of C, organizes the electronic component of E
Kind.At this point, the electronic component of group A is a kind remaining, the electronic component for organizing C is a kind remaining, and the electronic component for organizing E is a kind remaining.In the feelings
Under condition, following 3 kinds of forms are considered.
(1) it as shown in fig. 7, group A and group E is merged, distributes in 1 the 1st feedway 30.
(2) as shown in figure 8, borrowing no remaining group of C, group A and group C is merged, distributed in 1 the 1st feedway 30
In, also, group C and group E is merged, it distributes in 1 the 1st feedway 30.In this case, in next group (group 2)
Replace path, that is, replacement component band, by without remaining group of C as group G processing, to organize C and organize the combination of the E quilt in group 3
It redistributes.
(3) group A and group E are distributed respectively in the 2nd feedway 32.
In the combination example, selection occupies width in the group (group 2 and group 3) below, and there are the mode of surplus (2).Table 4
In show mode (1), (2), (3) always occupy width, replacement number and constraint number.As described above, if evaluation of priorities is total
Occupy width x, then this example it is this with group 1 be object in the case where, selection mode (2).
Table 4
As next combination example, as shown in Figure 9, Figure 10, using the 1st feedway 30 with 2 paths 31, in group
It is 3 that it is 3 kinds that in 1, the electronic component for organizing A, which is 4 kinds, the electronic component of group B is 3 kinds, organizes the electronic component of C, organizes the electronic component of E
Kind.At this point, the electronic component of group B is a kind remaining, the electronic component for organizing C is a kind remaining, and the electronic component for organizing E is a kind remaining.In the feelings
Under condition, following 3 kinds of forms are considered.
(1) it as shown in figure 9, group B and group C is merged, distributes in 1 the 1st feedway 30, remaining group of E is distributed
In the 2nd feedway 32.Replacement number is reduced as a result,.
(2) as shown in Figure 10, group C and group E are merged, is distributed in 1 the 1st feedway 30.Space is improved as a result,
Service efficiency.
(3) group B and group E are distributed respectively in the 2nd feedway 32, remaining set C is distributed in the 2nd feedway 32
In.
In the combination example, considers to reduce that replacement number is preferential and the case where selection mode (1) and select subsequent
The case where abundant mode (2) in space of group (group 2 and group 3) both.Always accounting for when showing mode (1), (2), (3) in table 5
There are width, replacement number and constraint number.As described above, if evaluation of priorities always occupies width x, it is this with group 1 in this example
In the case where object, selection mode (1).
Table 5
As next combination example, as shown in Figure 11, Figure 12, using with 2 paths 31 the 1st feedway 30,
In group 1, the electronic component for organizing A, which is 3 kinds, the electronic component of group B is 3 kinds, organizes the electronic component of C is 3 kinds, organizes the electronic component of E
It is 3 kinds.At this point, the electronic component of group A is a kind remaining, the electronic component for organizing B is a kind remaining, and the electronic component for organizing C is a kind remaining, organizes E
Remaining a kind of electronic component.In this case, consider following 3 kinds of forms.
(1) as shown in figure 11, group A and group B are merged, is distributed in 1 the 1st feedway 30, also, will group C and group E
Merge, distributes in 1 the 1st feedway 30.
(2) as shown in figure 12, group A and group C are merged, is distributed in 1 the 1st feedway 30, also, will group B and group E
Merge, distributes in 1 the 1st feedway 30.
(3) group A and group E is merged, is distributed in 1 the 1st feedway 30, also, group B and group C is merged, distribution exists
In 1 the 1st feedway 30.Shown in table 6 mode (1), (2), (3) always occupy width, replacement number and constraint number.Such as
It is upper described, if evaluation of priorities will always occupy width x, this example it is this with group 1 for object in the case where, selection mode (1).
Table 6
As described previously for group 1, for each group uniformly to the path of the 1st feedway 30 or the 2nd feedway 32
After 31 are allocated, in group 2, it is similarly directed to each group of path 31 to the 1st feedway 30 or the 2nd feedway 32
It is allocated.But the electronic component for having been configured, it is excluded from distribution object.This for original state
The electronic component distributed in the path 31 of the 1st feedway 30 or the 2nd feedway 32 is also identical.For whole groups point
After matching, managing device 23 terminates electronic component mounting method of the present embodiment.Then, electronic component mounting apparatus
10 distribute according to the electronic component that managing device 23 carries out, and electronic component is installed on substrate, produces circuit substrate.
According to the present embodiment, using having the feedway more than or equal to 2 paths, for more
When reducing the replacement of component band corresponding with path between a group, the component band replacement in each path can not be easy to carry out
Following effects may be implemented in feedway.It is possible, firstly, to be set as the component without each path in whole feedways
The replacement of band changes production adjustment time so as to shorten.In addition, making by the benchmark when being grouped to electronic component
It uses and always occupies width, replacement number and constraint number as condition, increased change of adjoint group number can be reduced respectively and produce adjustment work
Industry increases, with replacing, number is increased to change component stock control caused by production adjustment operation increases and increases due to constraint number
The increase in working hour, above-mentioned group's number increase are caused by always occupying width increase.Moreover, by always occupy width, replacement number
And constraint number is arranged priority or weight and changes evaluation method, so as to group's quantity, replacement number and part library
It deposits management and carries out the optimization for meeting the form that user uses.
Claims (7)
1. a kind of electronic component mounting system, it includes electronic component mounting apparatus and managing device,
The electronic component mounting apparatus includes: the 1st feedway, and with multiple paths, the path is to maintaining multiple electronics
The electronic component holding member of component is supplied；2nd feedway has the single path；And boarded head, it will
From in the 1st feedway and the 2nd feedway at least one party supply electro part carrying on substrate,
The managing device determines multiple production plans that the electronic component of multiple types is installed on the substrate of multiple types, will
The electronic component being used in conjunction between the multiple production plan divides into the electricity joined between the multiple production plan
Subassembly and the electronic component not joined and the electronics for being grouped, also, being used in conjunction between the multiple production plan
Component, preferentially to the path allocation of the 1st feedway.
2. electronic component mounting system according to claim 1, wherein
The managing device, affiliated ministry of electronics industry's number of packages is not by the 1st feedway in the group formed by the grouping
In the case that the possessed number of path divides exactly, as remainder, distributes together with different groups or supplied to the described 2nd
Device distribution.
3. electronic component mounting system according to claim 2, wherein
The managing device is allocated the electronic component, so that multiple institutes used in the multiple production plan
State the minimum of width shared by the entirety of path.
4. a kind of electronic component mounting method installs electronic component, the electronics to substrate using electronic component mounting apparatus
Apparatus for mounting component includes: the 1st feedway, and with multiple paths, the path is to the electronics for maintaining multiple electronic components
Member retainer section part is supplied；2nd feedway has the single path；And boarded head, it will be from the described 1st
In feedway and the 2nd feedway at least one party supply electro part carrying on substrate,
The electronic component mounting method is included the following process when installing electronic component to substrate:
Determine multiple production plans that the electronic component of multiple types is installed on the substrate of multiple types；
The electronic component that will be used in conjunction between the multiple production plan is divided between the multiple production plan and is handed over
The electronic component connect and the electronic component not joined and be grouped；And
The electronic component being used in conjunction between the multiple production plan is preferentially to the path of the 1st feedway point
Match.
5. electronic component mounting method according to claim 4, wherein
When by the electronic component to the path allocation, in the group belonging to ministry of electronics industry's number of packages do not filled by the 1st supply
In the case that the number of path that setting has divides exactly, as remainder, distributes together with different groups or supplied to the described 2nd
Device distribution.
6. electronic component mounting method according to claim 5, wherein
When by the electronic component to the path allocation, the electronic component is allocated, so that the multiple
Width shared by multiple path entirety used in production plan is minimum.
7. electronic component mounting method according to claim 4, wherein
Managing device is set on multiple paths in the case where determining the configuration of multiple 1st feedways
When stating electronic component, according to the combination of the electronic component set on multiple paths, it is with the 1st feedway
Unit determines the configuration of each 1st feedway, also, when not setting the electronic component on multiple paths, with described
Each path of 1st feedway is unit, determines the configuration of each 1st feedway.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-225314 | 2011-10-12 | ||
| JP2011225314A JP2013084862A (en) | 2011-10-12 | 2011-10-12 | Electronic component mounting apparatus |
| JP2011233293A JP5792586B2 (en) | 2011-10-24 | 2011-10-24 | Electronic component mounting system, electronic component mounting method, and electronic component mounting computer program |
| JP2011-233293 | 2011-10-24 | ||
| CN201210387286.4A CN103052310B (en) | 2011-10-12 | 2012-10-12 | Electronic component mounting apparatus, electronic component mounting system and installation method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210387286.4A Division CN103052310B (en) | 2011-10-12 | 2012-10-12 | Electronic component mounting apparatus, electronic component mounting system and installation method |
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| CN106879246A CN106879246A (en) | 2017-06-20 |
| CN106879246B true CN106879246B (en) | 2019-08-23 |
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| CN201610887361.1A Active CN106879246B (en) | 2011-10-12 | 2012-10-12 | Electronic component mounting apparatus, electronic component mounting system and installation method |
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| KR101970794B1 (en) * | 2014-04-07 | 2019-04-22 | 한화정밀기계 주식회사 | Method for controlling operation of component mounter |
| JP6524416B2 (en) * | 2015-12-03 | 2019-06-05 | パナソニックＩｐマネジメント株式会社 | Component supply method and component mounting system |
| US11076521B2 (en) * | 2016-07-08 | 2021-07-27 | Fuji Corporation | Production plan creation system and production plan creation method |
| JP6500245B2 (en) * | 2016-09-12 | 2019-04-17 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component sorting method and component mounting apparatus |
| US10824137B2 (en) * | 2017-06-19 | 2020-11-03 | Panasonic Intellectual Property Management Co., Ltd. | Mounting board manufacturing system |
| CN109581995B (en) * | 2017-09-28 | 2021-09-17 | 上海微电子装备（集团）股份有限公司 | Intelligent diagnosis system and method |
| JP6986148B2 (en) * | 2018-05-25 | 2021-12-22 | 株式会社Fuji | Component mounting system |
| WO2020016987A1 (en) * | 2018-07-19 | 2020-01-23 | 株式会社Ｆｕｊｉ | Component mounting system |
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| JPH08148884A (en) * | 1994-11-19 | 1996-06-07 | Nitto Kogyo Co Ltd | Chip mounting device |
| CN1672480A (en) * | 2002-07-23 | 2005-09-21 | 松下电器产业株式会社 | Component mounting order optimization method, component mounting order optimization program, recording medium for the program, and component mounting apparatus using the method |
| CN1863451A (en) * | 2005-04-04 | 2006-11-15 | 重机公司 | Component assembling optimizing method for baseplate producing |
| JP3955210B2 (en) * | 2001-12-19 | 2007-08-08 | 松下電器産業株式会社 | Component mounting method and component mounting apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3978910B2 (en) * | 1998-12-07 | 2007-09-19 | 松下電器産業株式会社 | Electronic component mounting equipment |
| JP4326748B2 (en) * | 2002-04-25 | 2009-09-09 | パナソニック株式会社 | Parts mounting method |
-
2012
- 2012-10-10 KR KR1020120112580A patent/KR20130039692A/en not_active Application Discontinuation
- 2012-10-12 CN CN201210387286.4A patent/CN103052310B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148884A (en) * | 1994-11-19 | 1996-06-07 | Nitto Kogyo Co Ltd | Chip mounting device |
| JP3955210B2 (en) * | 2001-12-19 | 2007-08-08 | 松下電器産業株式会社 | Component mounting method and component mounting apparatus |
| CN1672480A (en) * | 2002-07-23 | 2005-09-21 | 松下电器产业株式会社 | Component mounting order optimization method, component mounting order optimization program, recording medium for the program, and component mounting apparatus using the method |
| CN1863451A (en) * | 2005-04-04 | 2006-11-15 | 重机公司 | Component assembling optimizing method for baseplate producing |
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| CN103052310A (en) | 2013-04-17 |
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| CN106879246A (en) | 2017-06-20 |
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