CN103052310B - Electronic component mounting apparatus, electronic component mounting system and installation method - Google Patents
Electronic component mounting apparatus, electronic component mounting system and installation method Download PDFInfo
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- CN103052310B CN103052310B CN201210387286.4A CN201210387286A CN103052310B CN 103052310 B CN103052310 B CN 103052310B CN 201210387286 A CN201210387286 A CN 201210387286A CN 103052310 B CN103052310 B CN 103052310B
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- path
- feedway
- electronic unit
- component mounting
- mistake
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of electronic component mounting apparatus, electronic component mounting system and electronic component mounting method, and it is suitable for the control with the corresponding path of multiple part bands with maintaining electronic unit.It is included：1st feedway, it has multiple paths, and the path maintain the electronic unit holding member supply of multiple electronic units；Boarded head, it is by the electro part carrying supplied from the 1st feedway on substrate；Control device, it is controlled according to the mistake occurred on path to the 1st feedway；And managing device, multiple production schedules of the electronic unit of multiple species are installed in its determination on the substrate of multiple species, the electronic unit being used in conjunction between multiple production schedules is divided into the electronic unit joined between multiple production schedules and the electronic unit not joined, and be grouped, and the preferential path allocation to the 1st feedway of the electronic unit being used in conjunction between multiple production schedules.
Description
Technical field
System is installed the present invention relates to the electronic component mounting apparatus used when installing electronic unit on substrate, electronic unit
System and electronic component mounting method.
Background technology
As the device that electronic unit is installed on substrate, there is a kind of electronic component mounting apparatus, it has boarded head,
The boarded head has multiple adsorption mouths, and the electronic component mounting apparatus adsorbs electronic unit using the adsorption mouth and is mounted in
On substrate.Herein, boarded head is by making adsorption mouth be moved up in the side orthogonal with substrate surface, so that by the electronics of absorption
Part is arranged on substrate.From the device of progress electronic unit supply to boarded head supply electronic unit.Electronic unit utilizes portion
Part band is kept.Feedway is sent out part band by feeder, and electronic unit is delivered into the position that boarded head is adsorbed.
Feedway includes the structure in the only one of which path corresponding with part band and the structure with multiple above-mentioned paths.With many
The feedway in individual above-mentioned path, for example, be recorded in patent document 1.
Patent document 1：Japanese Unexamined Patent Publication 2003-188591 publications
The content of the invention
But, do not have especially to consider for the efficient of the feedway with multiple paths in the invention of patent document 1
Control.
For example, in the case that part is finished in 1 path only in multiple paths, in order to change the portion in 1 path
Part band, it is necessary to be not yet finished in part and the path of part supply can be carried out also while being changed after stopping.Herein,
Even if making the path that can carry out part supply stop and carry out the replacing of part band, also do not made to whether production efficiency reduces
Judge, accordingly, there exist room for improvement.It is an object of the present invention to provide a kind of be applied to this electricity with multiple paths
The control of the feedway of subassembly, the path is corresponding with keeping the part band of electronic unit.
The present invention is a kind of electronic component mounting apparatus, and it installs electronic unit on substrate, it is characterised in that have：
Feedway, it has multiple paths, and the path is carried out to the electronic unit holding member for maintaining multiple electronic units
Supply；And control device, it selects to drive path in the multiple path of the feedway, described in being supplied
Electronic unit is carried on the substrate by boarded head, at least one path of the control device in the multiple path
On make a mistake in the case of, change the selection mode of the feedway to the driving path.
In the present invention, it is preferred in the case that the control device makes a mistake at least one path, stop using this
The All Paths of feedway.
In the present invention, it is preferred in the case that the control device makes a mistake at least one path, only stop using
The path made a mistake in the feedway.
In the present invention, it is preferred to which mistake occurs at least one path that the feedway has for the control device
In the case of by mistake, normal path is continuing with, untill being made a mistake on the All Paths that the feedway has.
In the present invention, it is preferred to be, there is what is pair supplied with the path by making a mistake in the feedway
In the case of other paths that the electronic unit of electronic unit identical type is supplied, the control device is used to the phase
Other paths that congener electronic unit is supplied, pair electronic unit phase supplied with the path by making a mistake
The congener electronic unit is supplied.
In the present invention, it is preferred to be, there is the road of the electronic unit of multiple supply identical types in the feedway
In the case of footpath, the control device is finished after the electronic unit that 1 path is supplied is finished using other paths pair and part
The electronic unit of electronic unit identical type of above-mentioned 1 path supply supplied.
The present invention is a kind of electronic component mounting method, and it installs the ministry of electronics industry by electronic component mounting apparatus on substrate
Part, the electronic component mounting method is characterised by, with feedway, and the feedway has multiple paths, the path pair
The electronic unit holding member for maintaining multiple electronic units is supplied, and is filled by the control of electronic component mounting apparatus
Put, the selection driving path in the multiple path of the feedway, by the electronic unit supplied by carrying
Head is carried on the substrate, at this moment, described in the case of being made a mistake at least one path in the multiple path
Control device changes selection mode of the feedway to the driving path.
In the present invention, it is preferred in the case that the control device makes a mistake at least one path, stop using this
The All Paths of feedway.
In the present invention, it is preferred in the case that the control device makes a mistake at least one path, only stop using
The path made a mistake in the feedway.
In the present invention, it is preferred to be, the control device occurs at least one path that the feedway has
In the case of mistake, normal path is continuing with, untill the All Paths that the feedway has make a mistake.
In the present invention, it is preferred to be, there is what is pair supplied with the path by making a mistake in the feedway
In the case of other paths that the electronic unit of electronic unit identical type is supplied, the control device is used to the phase
Other paths that congener electronic unit is supplied, pair electronic unit phase supplied with the path by making a mistake
The congener electronic unit is supplied.
In the present invention, it is preferred to be, there is the road of the electronic unit of multiple supply identical types in the feedway
In the case of footpath, the control device is after the electronic unit that 1 path is supplied is finished, using other paths, pair and part
The electronic unit of the electronic unit identical type for the above-mentioned 1 path supply being finished is supplied.
In addition, the present invention is a kind of electronic component mounting system, it includes electronic component mounting apparatus and managing device, should
Electronic component mounting apparatus is included：1st feedway, it has multiple paths, and the path is to maintaining multiple electronic units
Electronic unit holding member is supplied；2nd feedway, it has the single path；And boarded head, it will be from described
The electro part carrying of at least one party's supply in 1st feedway and the 2nd feedway is on substrate, management dress
Put, it is determined that multiple production schedules of the electronic unit of multiple species are installed on the substrate of multiple species, will be in the multiple life
The electronic unit being used in conjunction between production plan, divides into the electronic unit joined between the multiple production schedule and does not hand over
The electronic unit that connects and be grouped, also, the electronic unit being used in conjunction between the multiple production schedule, preferentially to institute
State the path allocation of the 1st feedway.
In the present invention, it is preferred to be, the managing device, the electronic unit belonging in the group formed by the packet
In the case that number is not divided exactly by the number of path that the 1st feedway has, as remainder, from different groups one
Play distribution or distributed to the 2nd feedway.
In the present invention, it is preferred to be, the managing device is allocated to the electronic unit, to cause the multiple
Width shared by the multiple path entirety used in the production schedule is minimum.
The present invention is a kind of electronic component mounting method, and it installs the ministry of electronics industry using electronic component mounting apparatus to substrate
Part, the electronic component mounting apparatus is included：1st feedway, it has multiple paths, and the path is to maintaining multiple electronics
The electronic unit holding member of part is supplied；2nd feedway, it has the single path；And boarded head, it will
Electro part carrying from least one party's supply in the 1st feedway and the 2nd feedway is on substrate, the electricity
Subassembly installation method includes following process when installing electronic unit to substrate：It is determined that being installed on the substrate of multiple species many
Multiple production schedules of the electronic unit of individual species；The electronic unit that will be used in conjunction between the multiple production schedule, area
It is divided into the electronic unit joined between the multiple production schedule and the electronic unit not joined and is grouped；And institute
State the preferential path allocation to the 1st feedway of electronic unit being used in conjunction between multiple production schedules.
In the present invention, it is preferred to be, when by the electronic unit to the path allocation, the ministry of electronics industry belonging in group
In the case that number of packages is not divided exactly by the number of path that the 1st feedway has, as remainder, from different groups one
Play distribution or distributed to the 2nd feedway.
In the present invention, it is preferred to be that when by the electronic unit to the path allocation, the electronic unit is carried out
Distribution, to cause the width shared by the multiple path entirety used in the multiple production schedule minimum.
In the present invention, it is preferred to be, the managing device, it is determined that the situation of the configuration of multiple 1st feedways
Under, when being set with the electronic unit on multiple paths, according to the ministry of electronics industry set on multiple paths
The combination of part, in units of the 1st feedway, determines the configuration of each 1st feedway, also, in multiple paths
On when not setting the electronic unit, in units of each path of the 1st feedway, determine matching somebody with somebody for each 1st feedway
Put.
The effect of invention
The present invention can provide a kind of be applied to multiple part bands with keeping electronic unit
The control of the feedway of the electronic unit in corresponding path.
Brief description of the drawings
Fig. 1 is the oblique view for representing electronic component mounting apparatus that embodiment 1 is related to and electronic component mounting system.
Fig. 2 is the oblique view for representing part supply unit.
Fig. 3 is equipped with the top view of the electronic component mounting apparatus of multiple 1st feedways.
Fig. 4 is the flow chart for the electronic component mounting method that the electronic component mounting system that embodiment 2 is related to is performed.
Fig. 5 is the explanation figure for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to.
Fig. 6 is the explanation figure for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to.
Fig. 7 is the explanation figure for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to.
Fig. 8 is the explanation figure for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to.
Fig. 9 is the explanation figure for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to.
Figure 10 is the explanation for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to
Figure.
Figure 11 is the explanation for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to
Figure.
Figure 12 is the explanation for the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to
Figure.
Embodiment
Referring to the drawings, to the mode for implementing the present invention（Hereinafter referred to as embodiment）It is described in detail.This hair
It is bright not limited by the content described in implementation below.In addition, in the structure of following record, including people in the art
Technology, substantially the same technology, the technology of equivalency range that member can be readily apparent that.Moreover, the structure recorded below can be with
It is combined as.In addition, without departing from the scope of the subject in the invention, the omission, displacement or change of structure can be carried out.
（Embodiment 1）
Fig. 1 is the oblique view for representing electronic component mounting apparatus that embodiment 1 is related to and electronic component mounting system.Electricity
Subassembly installation system 100 includes electronic component mounting apparatus 10 and managing device 23.Electronic component mounting apparatus 10 is in base
The device of the surface mounted electronic parts of plate 8.Electronic component mounting apparatus 10 have substrate delivery section 12, part supply unit 14,
Boarded head 15, XY travel mechanisms 16 and parts recognition camera 18.As long as substrate 8 carries the part of electronic unit, its
Structure is not particularly limited.The substrate 8 of present embodiment is the part of tabular, and Wiring pattern is provided with surface.It is arranged on substrate 8
On the surface attachment of Wiring pattern there is solder for engaging above-mentioned Wiring pattern and electronic unit by reflow soldering etc. to connect
Close part.
Substrate delivery section 12 is the conveying mechanism along the X-direction conveying in Fig. 1 by substrate 8.Substrate delivery section 12 has：Lead
Rail, it extends in X direction；And conveying mechanism, its supporting substrate 8, and substrate 8 is moved along guide rail.Substrate delivery section 12 with
So that the one i.e. mounting surface direction relative with boarded head 15 in 2 maximum faces of the area of substrate 8, by using conveyer
Structure makes substrate 8 be moved along guide rail, is conveyed so as to carry out substrate 8 in the X direction.Substrate 8 is delivered to guide rail by substrate delivery section 12
On assigned position, the substrate 8 to the supplying substrate 8 of electronic component mounting apparatus 10 equipment supply.
Boarded head 15 is at above-mentioned defined position, by electro part carrying in the surface of substrate 8.Substrate delivery section 12 exists
It is delivered on the substrate 8 of above-mentioned assigned position and carries after electronic unit, substrate 8 is delivered to carry out subsequent processing（For example, backflow
Welding）Device.As the conveying mechanism of substrate delivery section 12, various structures can be used.It is, for example, possible to use making conveyer
The belt type conveying mechanism being integrally constituted, the conveying mechanism makes along the guide rail of the conveying direction configuration of substrate 8 and along above-mentioned
The endless belt of guide rail rotation, is conveyed with the state of the mounted board 8 on above-mentioned endless belt.
Part supply unit 14 has：Electronic unit holding member, it keeps multiple to the electronics carried on the surface of substrate 8
Part；And feeder portion, it supplies the electronic unit that above-mentioned electronic unit holding member is kept to boarded head 15.Above-mentioned confession
The electronic unit supplied from above-mentioned electronic unit holding member is set to turn into the state that boarded head 15 is adsorbed to device portion.In this reality
Apply in mode, above-mentioned electronic unit holding member be keep in the multiple holes set on part band electronic unit construction or
The construction of electronic unit is pasted on part band.Above-mentioned feeder portion makes above-mentioned part band feeding a certain amount of, as electronic unit
The state exposed to assigned position.As described above, part supply unit 14 is the belt-type feeder comprising part band and feeder portion.
In addition, part supply unit 14 can be loaded and unloaded relative to electronic component mounting apparatus 10.
Boarded head 15 is that absorption is maintained at electronic unit on part supply unit 14, and by the electro part carrying of absorption in
The device being moved to by substrate delivery section 12 on the mounting surface of the substrate 8 of assigned position.XY travel mechanisms 16 are to make boarded head
The travel mechanism moved in 15 X-directions and Y-direction in Fig. 1, face i.e. parallel with the mounting surface of substrate 8, with X-axis driving
Portion 22 and Y-axis drive division 24.X-axis drive division 22 links with boarded head 15, boarded head 15 is moved in the X-axis direction.Y-axis drives
Portion 24 links via X-axis drive division 22 with boarded head 15, by making X-axis drive division 22 move in the Y-axis direction, so that carrying
First 15 move in the Y-axis direction.Z-direction is the direction orthogonal with the mounting surface of substrate 8.
XY travel mechanisms 16 are by making boarded head 15 be moved up in XY side, so as to so that boarded head 15 is moved to and base
The relative position of plate 8 or the position relative with the feeder portion of part supply unit 14.In addition, XY travel mechanisms 16 are by making carrying
First 15 movement, the relative position of adjustment boarded head 15 and substrate 8.Thus, XY travel mechanisms 16 can make what boarded head 15 was kept
Electronic unit is moved to the optional position on the surface of substrate 8, can be by electro part carrying in any position of the mounting surface of substrate 8
Put.As X-axis drive division 22, the various mechanism that boarded head 15 can be used to move in the prescribed direction.It is used as Y-axis drive division
24, the various mechanism that X-axis drive division 22 can be used to move in the prescribed direction.Moved in the prescribed direction as object is made
Dynamic mechanism, it is, for example, possible to use linear motor, rack-and-pinion, the conveying mechanism using ball-screw, using transmission belt
Conveying mechanism etc..
Parts recognition camera 18 is disposed on the vicinity of part supply unit 14 and in the position relative with boarded head 15
Camera device.Parts recognition camera 18 to boarded head 15 by shooting, and whether detection boarded head 15 is adsorbed with the ministry of electronics industry
Part.
Control device 21 is controlled to electronic component mounting apparatus 10.More specifically, the control base board of control device 21
The action of delivery section 12, part supply unit 14 and boarded head 15 etc..In addition, control device 21 performs electricity of the present embodiment
Subassembly installation method.Control device 21 is, for example, computer, corresponding to needing provided with the external memory such as hard disk unit.Pipe
Reason device 23 for example carries out the production management of electronic component mounting apparatus 10 and the condition managing of electronic component mounting apparatus 10.
That is, electronic component mounting apparatus 10 obtains optimal change according to substrate and part needed in the production of circuit substrate etc.
Production adjustment, or, working condition or situation of problem of multiple electronic component mounting apparatus 10 etc. are grasped, is adjusted with can be true
Protect productivity.
Fig. 2 is the oblique view for representing part supply unit.Part supply unit 14 is with the feedway as electronic unit
1st feedway 30 and the 2nd feedway 32.1st feedway 30 and the 2nd feedway 32 are comprising the multiple electronics of holding
The part band of part 9（Electronic unit holding member）With the belt-type feeder in feeder portion.1st feedway 30 has multiple roads
Footpath 31,31 pairs of path keeps the part band of multiple electronic units 9 to supply.2nd feedway 32 has single path 31,
31 pairs of the path keeps the part band of multiple electronic units 9 to supply.1st feedway 30 and the equal structure of the 2nd feedway 32
As can be installed and dismantled relative to electronic component mounting apparatus 10.Boarded head 15 adsorb from the 1st feedway 30 or
The electronic unit 9 of 2nd feedway 32 supply, is equipped on the assigned position of substrate 8.In the present embodiment, the ministry of electronics industry
The part supply unit 14 of part erecting device 10 has multiple 1st feedways 30.
Fig. 3 is equipped with the top view of the electronic component mounting apparatus of multiple 1st feedways.Install and fill in electronic unit
10 are put with the case of the 1st feedway 30 comprising multiple paths 31, control device 21 performs of the present embodiment
Electronic component mounting method, according to the mistake occurred in path 31, is controlled to the 1st feedway 30.More specifically,
In the case that control device 21 makes a mistake at least one path 31 in path 31, the driving of the 1st feedway 30 is changed
The selection mode in path.The change of selection mode, refers to change the path 31 that control device 21 has in the 1st feedway 30
The mode in the middle path for selecting the supply for carrying out electronic unit 9.The change of selection mode, for example, can be listed below, i.e.
The All Paths 31 that control device 21 has the 1st feedway 30, supply for electronic unit 9 is not selected as
Path, that is, stop using the All Paths 31 of the 1st feedway 30, or the normal path 31 of selection until the path 31 of whole
Untill making a mistake, that is, normal path 31 is continuing with untill All Paths 31 make a mistake etc..
So-called mistake, refers in the production of circuit substrate, must during using the 1st feedway 30 or 2 feedway 32
The exception of action interrupting or stopping must be made.Generally occur by part be finished caused by absorption mistake be also contained in mistake.It is wrong
Processing when processing refers to make a mistake by mistake.In the present embodiment, error handle is according to each feedway or each path
The processing component of any one in 31 installs situation or production status, it is determined that times in each feedway or each path 31
Controlling whether for meaning one is appropriate.
As the 1st control for error handle, at least one road that control device 21 has in the 1st feedway 30
In the case of being made a mistake in footpath 31, the 1st feedway 30 with the path 31 that there occurs mistake is stopped using.Thus, exist
In the case of being made a mistake in path 31, in units of the 1st feedway 30 with the path 31, the 1st feedway 30
It can not use, therefore, the 1st feedway 30 can not carry out the supply of electronic unit 9.Therefore, 15 pair of the 1st supply dress of boarded head
The absorption action that 30 All Paths 31 that have carry out is put also to stop, so as to by the 1st feedway 30 from electronic unit
Erecting device 10 is disassembled, and it is recovered from error condition.In addition, at least one of control device 21 in multiple paths 31
In the case of making a mistake, the 1st feedway 30 is stopped using, i.e. the whole roads for stopping using the 1st feedway 30 to have
Footpath.Therefore, in the production process of electronic component mounting apparatus 10, the timing declined in boarded head 15 will have and occur
1st feedway 30 in the path 31 of mistake is disassembled, and control device 21 will not also make boarded head 15 to making a mistake
The 1st feedway 30 in path 31 approach, it can thus be avoided the possibility of boarded head 15 and the grade interference of path 31.
As the 2nd control for error handle, at least one road that control device 21 has in the 1st feedway 30
In the case of being made a mistake on footpath 31, control device 21 only stops using the path 31 made a mistake of the 1st feedway 30.And
And, control device 21 is continuing with normal route 31, until being made a mistake in the All Paths 31 that the 1st feedway 30 has
Untill.
In the control, to there is the path 31 made a mistake in control device 21 identical with progress in the 1st feedway 30
In the case of the path 31 that the electronic unit 9 of species is supplied, the path 31 that the path 31 can be used to carry out with making a mistake is supplied
The supply of the electronic unit for the identical type of electronic unit 9 given.Thus, it is possible to reduce stop the 1st feedway 30 number of times and
The number of times of the 1st feedway 30 is dismantled from electronic component mounting apparatus 10.In the example shown in Fig. 3, with 3 paths 31
The 1st feedway 30A in, in the case of being electronic unit A in 2 paths 31 or 3 paths 31 are electronic unit C feelings
Under condition, the 2nd control for error handle can be used.
In being controlled for the 2nd of error handle, in the case of the electronic unit of supply identical type, in the institute of path 31
After the electronic unit supply having terminates, i.e. after the part in path 31 is finished, can also be supplied and part by other paths 31
The electronic unit for the electronic unit identical type that the path 31 being finished is supplied.Thus, it is possible to the electronics that 1 path 31 is had
Part 9 has been used, and therefore, it can suppress the waste of electronic unit.Below, for the 1st feedway 30 and the 2nd feedway 32
Determination relative to the configuration of electronic component mounting apparatus 10 is illustrated.
Managing device 23 shown in Fig. 1, imagination in the 1st feedway 30 setting electronic unit state, according to
The combination of the electronic unit set on multiple paths 31, in units of the 1st feedway 30, determines the configuration in path 31.Pass through
Managing device 23 etc. optimize after the 1st feedway 30 configuration, in units of the 1st feedway 30, therefore can press down
Make the replacing of the electronic unit in each path 31.Therefore, it is adaptable to change the more situation of production adjustment.
Managing device 23 can not also consider the arrangement of the electronic unit in the 1st feedway 30, and configuration path 31 and
1st feedway 30.It is most initial in the case of not being set with electronic unit in the 1st feedway 30, it is not necessary to consider the 1st
Path 31 in feedway 30, therefore in this case, determine to match somebody with somebody in units of each path 31 of the 1st feedway 30
Put.Due to considering to the configuration in path 31, therefore it can efficiently configure the 1st feedway 30.In addition, in the 1st feedway
Set in 30 after electronic unit, the configuration in path 31 is determined in units of the 1st feedway 30.
Managing device 23 it is determined that feedway configuration when, the 1st feedway the 30 and the 2nd of identical size is supplied and filled
The distribution for putting 32 is managed.In the quantity for the feedway that can be set in the 1st resettlement section 13F and the 2nd resettlement section 13R,
In the case of being mixed the 1st feedway 30 and the 2nd feedway 32, managing device 23, which is distributed, causes whole multiple 1
Feedway 30 is reached behind the path 31 for the maximum quantity having, and the 2nd feedway 32 is allocated.In addition, can root
According in the controlling of each path of situation automatic decision, the control of each feedway which it is suitable in the case of, automatically
It is controlled, is set as condition, the control for carrying out each path can be preset or each feedway is carried out
Control.
The 1st feedway 30 in the combination identical path 31 with electronic unit, is configured in the 1st resettlement section 13F
In the case of and configuration in the 2nd resettlement section 13R in the case of, conveying direction of the path 31 relative to substrate（From L to T in Fig. 3
Direction）Order it is different.If for example, the 1st supply in the path 31 in path 31 and electronic unit B with electronic unit A
Device 30, is configured in the 1st resettlement section 13F, then the order in path 31 is to be followed successively by electronics from the conveying direction upstream side of substrate
Components A, B.If the 1st feedway 30 is with the state alignment in the 2nd resettlement section 13R, the order in path 31 is from defeated
Direction upstream side is sent to be followed successively by electronic unit B, A, it is opposite with situation of the configuration in the 1st resettlement section 13F.
Therefore, the 1st feedway 30 in path 31 with electronic unit A, B of the configuration in the 2nd resettlement section 13R,
The order in path 31 can be set to be followed successively by electronic unit A, B from the conveying direction upstream side of substrate.But, if with above-mentioned
Mode is set, even the 1st feedway 30 in the path then with electronic unit A, B, it is also necessary to correspond respectively to the 1st collecting
Portion 13F and the 2nd resettlement section 13R carries out the order switching in path 31, lacks versatility.Therefore, control device 21, which is directed to, has electricity
1st feedway 30 in the combination identical path 31 of subassembly, is identified as in the 1st resettlement section 13F and the 2nd resettlement section 13R,
Putting in order for path 31 is opposite.Thus, the 1st feedway 30 in the combination identical path 31 with electronic unit, without
Carry out path 31 between the 1st resettlement section 13F and the 2nd resettlement section 13R to switch, thus versatility is improved.
As described above, according to present embodiment, in the case where using the feedway with multiple paths, can obtain
Following effects.First, by being carried out for each device or each path at the mistake of the feedway with multiple paths
Reason, can select the timing of error handle, thus can reduce error handle change production adjustment time.Furthermore it is possible to safely
Dismantle feedway.Moreover, by having the feedway in multiple paths for each device or the configuration of each path, so as to
With direct using the part band being provided with, therefore, easily carry out changing production adjustment, it is possible to reduce change production adjustment time.In addition, can
So that in the feedway with multiple paths, the supply for setting electronic unit for each path is limited, therefore control is not
The residue given up halfway can be caused to have the part band of electronic unit, so as to which multiple paths are efficiently used.Present embodiment
Structure, can also suitably be used following.In addition, the construction of the structure with present embodiment, is realized and present embodiment
Identical effect, effect.
（Embodiment 2）
The electronic component mounting method that embodiment 2 is related to there is provided being adapted for use with the feedway with multiple paths,
The method during circuit substrate of multiple species of the electronic unit of multiple species is carried in production.Present embodiment can pass through Fig. 1
Shown electronic component mounting apparatus 10 and electronic component mounting system 100 is realized.
In the presence of multiple production schedules are performed successively, the electronic unit supplied from feedway is arranged on to the predetermined bits of substrate
The installation method for the electronic unit put.In the installation method of this electronic unit, 1 production schedule is referred to as group.In group
Contain the set of circuits substrate produced in this group, the substrate and electronic unit used in the production etc. as packet.
There is handing-over function when performing multiple groups successively, i.e., will be common when there is common feeder between continuous 2 groups
Feeder configures the identical installation site in electronic component mounting apparatus 10, and the configuration to remaining feeder is optimized.
By joining function, it can shorten and change production adjustment time when producing multiple circuit substrates.But, handing-over function not with
1st feedway 30 in multiple paths 31（Reference picture 2）Corresponding algorithm, and just for each path 31 or each 1st
Feedway 30 is optimized.
In the present embodiment, the managing device 23 of electronic component mounting system 100, by the electricity being used in conjunction between group
Subassembly, divides into the electronic unit joined between multiple groups and the electronic unit not joined, and is grouped, also, excellent
First distributed to the path 31 of the 1st feedway 30.By the above-mentioned means, between group the 1st feedway 30 can be reduced by as far as possible
Movement or only 1 the 1st feedway 30 in the replacing of part band in a part of path 31 etc..Furthermore it is possible to reduce as far as possible
By without using electronic unit situation about constraining in path 31.Below, this implementation is performed for electronic component mounting system 100
The processing sequence during electronic component mounting method that mode is related to is illustrated.
Fig. 4 is the flow chart for the electronic component mounting method that the electronic component mounting system that embodiment 2 is related to is performed.Portion
The managing device 23 that part installation system 100 has, is used to perform electronic unit installation of the present embodiment by reading
The computer program of method, performs the order described in above computer program, so as to realize electricity of the present embodiment
Subassembly installation method.
First, managing device 23 to group when optimizing, and the circuit substrate of the predetermined production of estimation can be used as several groups
Produced（Step S101）, store the result into the storage part that managing device 23 has., can be in life by the processing
When producing electricity base board, estimation can realize that production, and group include the circuit substrate of interior predetermined production by how many group, enter
And the part that is used in each group can be estimated.
Then, managing device 23 is directed to each group, from storage part be extracted in step S101 in the portion that uses in the group that estimates
Part, i.e. the substrate before electronic unit and carrying electronic unit（Step S102）, result is stored in storage part.Then, manage
Device 23 distinguishes the part joined between multiple groups and the part not joined, and the part extracted in step s 102 is divided
Group（Step S103）.Each part is included in the part, only used in the part used in whole groups, multiple groups in whole groups
The part used in 1 group.For example, in the case where group is 3, carrying out the packet shown in table 1.English alphabet in table 1
It is the identifier of group.In 1 group, the electronic unit produced for circuit substrate is at least recorded.In the example shown in table 1,
Group A is used in conjunction with group 1 to 3, and group B is used in conjunction with group 1,2, and group C is used in conjunction with group 1,3.Group E, F, G exist respectively
Used in group 1,2,3.
Table 1
Electronic unit is distributed in the path 31 having a case that to multiple 1st feedways 30, the 2nd feedway 32
Under, managing device 23 is preferential to the path 31 of the 1st feedway 30 by the electronic unit being used in conjunction between multiple above-mentioned groups
Distribution（Step S 104）.Then, managing device 23 confirms the remainder of each group（Step S 105）.Remainder is in conduct
The quantity for the electronic unit that group is concentrated is produced in the case of not divided exactly by the number of path of the 1st feedway 30 with multiple paths 31
Raw.Remainder combines with other and and distributes or supplied to the 2nd with single path 31 to the 1st feedway
Device 32 is distributed.
In the case of no remainder（Step S106 is yes）, electronic unit of the end of managing device 23 for group 1
Distribution, for group 2, performs the processing since step S 101 and carries out electronic unit distribution.In the electronics for whole groups
After part distribution terminates, electronic component mounting apparatus 10 is distributed according to the electronic unit in each group, and electronics is installed on substrate
Part, produces circuit substrate.In the case where there is remainder（Step S106 is no）, managing device 23 for each group obtain with
The combination of 1st feedway 30 and the corresponding electronic unit of the 2nd feedway 32 and remainder（Hereinafter referred to as combine）（Step
Rapid S107）.Then, managing device 23 obtains replacing number of times and the portion of the part band always occupied in width, path in each group
Part constrains number of times（Step S108）, the combination that Utilization assessment function pair is obtained in step s 107 evaluated, and obtains evaluation of estimate
（Step S109）.In the case that the evaluation of estimate obtained in step S109 is optimal（Step S110 is yes）, will be in step S107
In obtained combination be stored in as optimum combination in storage part, and be updated.The evaluation of estimate obtained in step S109 is not
In the case of being optimal（Step S110 is no）, 23 pairs of combinations of managing device change（Step S112）, then repeat step
S108 to step S110.
After optimum combination is obtained by above-mentioned treatment process, managing device 23 terminates the electronic unit point for group 1
Match somebody with somebody, for group 2, perform the processing since step S101 and carry out electronic unit distribution.In the ministry of electronics industry for whole groups
After part distribution terminates, electronic component mounting apparatus 10 installs electronics according to the distribution of the electronic unit in each group on substrate
Part, produces circuit substrate.Below, the combination and its evaluation for electronic unit are illustrated.
Fig. 5 to Figure 12 is the combination example for representing the electronic unit in the electronic component mounting system that embodiment 2 is related to
Illustrate figure.In each path 31 of the 1st feedway 30 and the 2nd feedway 32 carry out electronic unit combination when, it is necessary to ginseng
Number has following 3.Each parameter is the smaller the better.
（1）Comprising always occupying width in each group including the dead circuit footpath that can not newly distribute electronic unit（x）
（2）The replacing number of times in path（y）
（3）Enter the number of times of row constraint to the electronic unit for not making a reservation for use for the part band being changed without in path（About
Beam number of times：z）
In the case where asking for always occupying width, respectively occupy width, had been configured with the path 31 of the 1st feedway 30
In the case of electronic unit, even if there is path 31 temporarily for sky, also as 1 calculating.I.e., in this case,
Even if there is the path 31 temporarily for sky, also calculated as the width that occupies of 1 the 1st feedway 30.Behind
In the group of execution, in the case of there is not yet the 1st feedway 30 in the path that determination is assigned electronic unit, increase is removed 1
With the value of number of path（1/ number of path）.The replacing number of times in path 31 is the replacing number of times for the part band installed in path 31.More
Change number of times and do not include dismounting number of times, but calculated by the number of times of installing component band.Constraint component refers to, even in being changed without
In the case of part band itself in path 31, it is mixed in the multiple paths 31 still having as the 1st feedway 30
The electronic unit that uses and without using electronic unit state when without using electronic unit.Constrain number of times（z）Refer to constraint
The number of times that part is produced.
Evaluation method considers following methods.
（1）It is always to occupy width x first according to the principle optimized to group, next to that changing number of times y, finally examines
Consider the z of the effect of constraint value of part.
（2）Priority can be determined by user（For example, determining priority etc. with y, x, z order）.
（3）As evaluation of estimate, such as evaluation of estimate=x × a+y × b+z × c, for example, user's setting is multiplied by weight to x, y, z
Coefficient a, b, c bounds evaluation, select the combination of value minimum obtained by bounds evaluation.
In the present embodiment, pass through（1）Evaluation method combination is evaluated, but be not limited to this.
As the example of combination, as shown in figure 5, using the 1st feedway 30 with 2 paths 31, being set in group 1
The electronic unit that the electronic unit that the electronic unit that group A electronic unit is 5 kinds, organize B is 4 kinds, organize C is 5 kinds, organize E is 2 kinds.
Now, group A electronic unit is remaining a kind, it is remaining a kind to organize C electronic unit.In this case, by the remaining group of A ministry of electronics industry
Part and group C electronic unit are incorporated into the feedway 30 of identical the 1st.The feelings of remaining electronic unit are produced in group A and group B
Condition, group B and group C in produce remaining electronic unit situation, group B and group E in produce remaining electronic unit situation,
The situation of remaining electronic unit is produced in group C and group E, it is also all identical.Table 2 represents to merge group A and group C remainder
Situation in 1 the 1st feedway 30 and it is distributed to the 2nd feedway 32 with single path 31 respectively
In the case of always occupy width, change number of times and constraint number of times.Represent according to the situation that combination is different and changes.As described above,
If at first evaluate always occupy width x, this example it is this with group 1 be object in the case of, by group A and organize C remainder
Merge in 1 the 1st feedway 30.
Table 2
As next combination example, as shown in fig. 6, using the 1st feedway 30 with 2 paths 31, in group 1,
The electronic unit that the electronic unit that the electronic unit that group A electronic unit is 5 kinds, organize B is 4 kinds, organize C is 5 kinds, organize E is 3 kinds.
Now, group A electronic unit is remaining a kind, and the electronic unit for organizing C is remaining a kind, and the electronic unit for organizing E is remaining a kind.In the situation
Under, it is contemplated that 3 kinds of following forms.
（1）It will be merged using the more group A of part number of times and group C, distributed in 1 the 1st feedway 30, by group E's
Supremum distribution is in the 2nd feedway 32.
（2）It will be merged using the less group C of part number of times and group E, distributed in 1 the 1st feedway 30, by group A's
Supremum distribution is in the 2nd feedway 32.
（3）Group A and group B is merged, distributes in 1 the 1st feedway 30, group C supremum distribution is filled in the 2nd supply
Put in 32.
In this case, due to mode（3）It is the space that dummy status is continuously generated in 2 groups, mode（2）It is to set again
The production adjustment of changing of operation when organizing C surely is reduced, and group A is separately configured to be easily caused insufficient space.Therefore selection mode
（1）.Similarly selected in the case of group A, B, E are remaining.Mode is shown in table 3（1）、（2）、（3）When always occupy width,
Change number of times and constraint number of times.As described above, if evaluation of priorities always occupies width x, by this example it is this with group 1 be object
In the case of, selection mode（2）.
Table 3
As next combination example, as shown in Figure 7, Figure 8, using the 1st feedway 30 with 2 paths 31, in group 1
In, group A electronic unit is 5 kinds, the electronic unit of organizing B is 4 kinds, the electronic unit of organizing C is 4 kinds, the electronic unit of organizing E is 3
Kind.Now, group A electronic unit is remaining a kind, and the electronic unit for organizing C is remaining a kind, and the electronic unit for organizing E is remaining a kind.In the feelings
Under condition, it is considered to following 3 kinds of forms.
（1）As shown in fig. 7, group A and group E is merged, distribute in 1 the 1st feedway 30.
（2）As shown in figure 8, borrowing without remaining group of C, group A and group C are merged, distributed in 1 the 1st feedway 30
In, also, group C and group E is merged, distribute in 1 the 1st feedway 30.In this case, in next group（Group 2）In
Change path, i.e. change part band, will without remaining group of C as a group G processing so that organize C and organize E combination in group 3 quilt
Redistribute.
（3）Group A and group E are distributed in the 2nd feedway 32 respectively.
In combination example, select in group below（Group 2 and group 3）In occupy the mode that width leaves surplus（2）.Table 4
In mode is shown（1）、（2）、（3）Always occupy width, change number of times and constraint number of times.If as described above, evaluation of priorities is total
Occupy width x, then this example it is this with group 1 be object in the case of, selection mode（2）.
Table 4
As next combination example, as shown in Figure 9, Figure 10, using the 1st feedway 30 with 2 paths 31, in group
The electronic unit that the electronic unit that the electronic unit that in 1, group A electronic unit is 4 kinds, organize B is 3 kinds, organize C is 3 kinds, organize E is 3
Kind.Now, group B electronic unit is remaining a kind, and the electronic unit for organizing C is remaining a kind, and the electronic unit for organizing E is remaining a kind.In the feelings
Under condition, it is considered to following 3 kinds of forms.
（1）As shown in figure 9, group B and group C is merged, distribute in 1 the 1st feedway 30, remaining group of E is distributed
In the 2nd feedway 32.Thus, reduce and change number of times.
（2）As shown in Figure 10, group C and group E are merged, distributed in 1 the 1st feedway 30.Thus, space is improved
Service efficiency.
（3）Group B and group E are distributed in the 2nd feedway 32 respectively, by remaining set C distribution in the 2nd feedway 32
In.
In combination example, it is considered to change number of times as preferentially selection mode to reduce（1）Situation and selection below
Group（Group 2 and group 3）The abundant mode in space（2）Situation both.Mode is shown in table 5（1）、（2）、（3）When always account for
There is width, change number of times and constraint number of times.If this with group 1 in this example as described above, evaluation of priorities always occupies width x
In the case of object, selection mode（1）.
Table 5
As next combination example, as shown in Figure 11, Figure 12, using the 1st feedway 30 with 2 paths 31,
The electronic unit that the electronic unit that in group 1, group A electronic unit is 3 kinds, organize B is 3 kinds, organize C is 3 kinds, organizes E electronic unit
For 3 kinds.Now, group A electronic unit is remaining a kind, and the electronic unit for organizing B is remaining a kind, and the electronic unit for organizing C is remaining a kind, organizes E
Remaining a kind of electronic unit.In this case, it is considered to following 3 kinds of forms.
（1）As shown in figure 11, group A and group B are merged, distributed in 1 the 1st feedway 30, also, will group C and group E
Merge, distribute in 1 the 1st feedway 30.
（2）As shown in figure 12, group A and group C are merged, distributed in 1 the 1st feedway 30, also, will group B and group E
Merge, distribute in 1 the 1st feedway 30.
（3）Group A and group E is merged, distributed in 1 the 1st feedway 30, also, group B and group C is merged, distribution exists
In 1 the 1st feedway 30.Mode is shown in table 6（1）、（2）、（3）Always occupy width, change number of times and constraint number of times.Such as
It is upper described, if evaluation of priorities will always occupy width x, this example it is this with group 1 for object in the case of, selection mode（1）.
Table 6
As described previously for group 1, for each group uniformly to the path of the 1st feedway 30 or the 2nd feedway 32
After 31 are allocated, in group 2, similarly for each group of path 31 to the 1st feedway 30 or the 2nd feedway 32
It is allocated.But, for the electronic unit configured, excluded from distribution object.This in original state
The electronic unit distributed in the path 31 of the 1st feedway 30 or the 2nd feedway 32 is also identical.For whole groups point
After end, managing device 23 terminates electronic component mounting method of the present embodiment.Then, electronic component mounting apparatus
10 electronic units carried out according to managing device 23 are distributed, and electronic unit is installed on substrate, circuit substrate is produced.
According to present embodiment, in the case of using with the feedway for being more than or equal to 2 paths, for many
When the replacing of the part band corresponding with path is reduced between individual group, it is impossible to easily carry out the part band replacing in each path
Feedway, it is possible to achieve following effects.It is possible, firstly, to be set to the part without each path in whole feedways
The replacing of band, production adjustment time is changed so as to shorten.In addition, by the benchmark when being grouped to electronic unit, making
With always occupying width, changing number of times and constraining number of times as condition, increased change of adjoint group number can be reduced respectively and produces adjustment work
Industry increase, increased change of adjoint replacing number of times produce adjustment operation increase and increase caused part stock control due to constraining number of times
The increase in man-hour, above-mentioned group's number increase is caused by always occupying width increase.Moreover, by always occupying width, changing number of times
And constraint number of times sets priority or weight and changes evaluation method, so as to group's quantity, replacing number of times and part library
Deposit the optimization that management meet the form that user uses.
Claims (10)
1. a kind of electronic component mounting apparatus, it installs electronic unit on substrate,
Characterized in that, having：
Feedway, it has multiple paths, and the path is to maintaining the electronic unit holding members of multiple electronic units
Supplied；And
Control device, it selects to drive path in the multiple path of the feedway, by the electronics supplied
Part is carried on the substrate by boarded head,
In the case that the control device makes a mistake at least one path in the multiple path, the supply is changed
Device to the selection mode in the driving path,
In the case that the control device makes a mistake at least one path, the All Paths of the feedway are stopped using.
2. electronic component mounting apparatus according to claim 1, wherein,
In the case that the control device makes a mistake at least one path, only stop using and mistake occurs in the feedway
Path by mistake.
3. electronic component mounting apparatus according to claim 1, wherein,
In the case that the control device makes a mistake at least one path that the feedway has, it is continuing with
Normal path, untill being made a mistake on the All Paths that the feedway has.
4. electronic component mounting apparatus according to claim 2, wherein,
There is a pair electronics for the electronic unit identical type supplied with the path by making a mistake in the feedway
In the case of other paths that part is supplied, the control device, which is used, to be supplied the electronic unit of the identical type
Other paths given, the electronic unit of pair electronic unit identical type supplied with the path by making a mistake enters
Row supply.
5. electronic component mounting apparatus according to claim 2, wherein,
In the case of the path for the electronic unit that there are multiple supply identical types in the feedway, the control device
After the electronic unit of 1 path supply is finished, the electronics that above-mentioned 1 path being finished using other paths pair and part is supplied
The electronic unit of part identical type is supplied.
6. a kind of electronic component mounting method, it installs electronic unit by electronic component mounting apparatus on substrate,
The electronic component mounting method is characterised by,
With feedway, the feedway has multiple paths, and the path is to maintaining the electronics of multiple electronic units
Member retainer section part is supplied, by the control device of electronic component mounting apparatus, in the multiple of the feedway
Selection driving path in path, the electronic unit supplied is carried on the substrate by boarded head,
At this moment, in the case of being made a mistake at least one path in the multiple path, the control device change supply
Device to the selection mode in the driving path,
In the case that the control device makes a mistake at least one path, the All Paths of the feedway are stopped using.
7. electronic component mounting method according to claim 6, wherein,
In the case that the control device makes a mistake at least one path, only stop using and mistake occurs in the feedway
Path by mistake.
8. electronic component mounting method according to claim 6, wherein,
In the case that the control device makes a mistake at least one path that the feedway has, it is continuing with
Normal path, untill the All Paths that the feedway has make a mistake.
9. electronic component mounting method according to claim 8, wherein,
There is a pair electronics for the electronic unit identical type supplied with the path by making a mistake in the feedway
In the case of other paths that part is supplied, the control device, which is used, to be supplied the electronic unit of the identical type
Other paths given, the electronic unit of pair electronic unit identical type supplied with the path by making a mistake enters
Row supply.
10. electronic component mounting method according to claim 8, wherein,
In the case of the path for the electronic unit that there are multiple supply identical types in the feedway, the control device
After the electronic unit of 1 path supply is finished, using other paths, pair above-mentioned 1 path being finished with part supply
The electronic unit of electronic unit identical type is supplied.
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| JP2011-225314 | 2011-10-12 | ||
| JP2011225314A JP2013084862A (en) | 2011-10-12 | 2011-10-12 | Electronic component mounting apparatus |
| JP2011-233293 | 2011-10-24 | ||
| JP2011233293A JP5792586B2 (en) | 2011-10-24 | 2011-10-24 | Electronic component mounting system, electronic component mounting method, and electronic component mounting computer program |
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| KR101970794B1 (en) * | 2014-04-07 | 2019-04-22 | 한화정밀기계 주식회사 | Method for controlling operation of component mounter |
| JP6524416B2 (en) * | 2015-12-03 | 2019-06-05 | パナソニックＩｐマネジメント株式会社 | Component supply method and component mounting system |
| US11076521B2 (en) * | 2016-07-08 | 2021-07-27 | Fuji Corporation | Production plan creation system and production plan creation method |
| JP6500245B2 (en) * | 2016-09-12 | 2019-04-17 | パナソニックＩｐマネジメント株式会社 | Component mounting system, component sorting method and component mounting apparatus |
| US10824137B2 (en) * | 2017-06-19 | 2020-11-03 | Panasonic Intellectual Property Management Co., Ltd. | Mounting board manufacturing system |
| CN109581995B (en) * | 2017-09-28 | 2021-09-17 | 上海微电子装备（集团）股份有限公司 | Intelligent diagnosis system and method |
| JP6986148B2 (en) * | 2018-05-25 | 2021-12-22 | 株式会社Fuji | Component mounting system |
| JP7050929B2 (en) * | 2018-07-19 | 2022-04-08 | 株式会社Fuji | Component mounting system |
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| JP2003318597A (en) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Method for placing component and method for mounting component |
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| JPH08148884A (en) * | 1994-11-19 | 1996-06-07 | Nitto Kogyo Co Ltd | Chip mounting device |
| JP3978910B2 (en) * | 1998-12-07 | 2007-09-19 | 松下電器産業株式会社 | Electronic component mounting equipment |
| JP3955210B2 (en) * | 2001-12-19 | 2007-08-08 | 松下電器産業株式会社 | Component mounting method and component mounting apparatus |
| JP3934002B2 (en) * | 2002-07-23 | 2007-06-20 | 松下電器産業株式会社 | Component mounting order optimization method, component mounting order optimization program, and component mounting apparatus |
| JP4589164B2 (en) * | 2005-04-04 | 2010-12-01 | Ｊｕｋｉ株式会社 | PCB mounting optimization method for component mounters |
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| JP2003318597A (en) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Method for placing component and method for mounting component |
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