JP5955223B2 - 小型硬化用ランプ組立体用uvledを基礎としたランプ - Google Patents
小型硬化用ランプ組立体用uvledを基礎としたランプ Download PDFInfo
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- JP5955223B2 JP5955223B2 JP2012546136A JP2012546136A JP5955223B2 JP 5955223 B2 JP5955223 B2 JP 5955223B2 JP 2012546136 A JP2012546136 A JP 2012546136A JP 2012546136 A JP2012546136 A JP 2012546136A JP 5955223 B2 JP5955223 B2 JP 5955223B2
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- 230000003287 optical effect Effects 0.000 claims description 22
- 238000003491 array Methods 0.000 claims 1
- 238000001723 curing Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 230000005855 radiation Effects 0.000 description 10
- 238000000576 coating method Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 238000003848 UV Light-Curing Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
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- 230000002123 temporal effect Effects 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
- Led Device Packages (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Claims (7)
- 加工物製品を硬化する組立体において、
該加工物製品を受け取る形態とされている加工部材管、
該加工部材管に対して実質的に平行に配置されている少なくとも1個の光学部品、及び
少なくとも2個のレベルを具備する段付きプラットフォーム上に配設されている複数の発光ダイオード(LED)からなるアレイであって、第1LEDが該段付きプラットフォームの第1レベル上に位置されており且つ第2LEDが該段付きプラットフォームの第2レベル上に位置されているアレイ、
を有しており、該LEDのアレイから射出される光が該加工物製品を硬化させるために該少なくとも1個の光学部品によって該加工物製品上にフォーカスされ、該段付きプラットフォームの該第2レベルが該段付きプラットフォームの該第1レベルよりも該光学部品に一層近くに位置しており、該段付きプラットフォームの該第2レベルが該段付きプラットフォームの該第1レベルと少なくとも部分的にオーバーラップしている組立体。 - 請求項1において、該段付きプラットフォームの該第1レベルと該段付きプラットフォームの該第2レベルとを接続している該段付きプラットフォームの側壁が平坦である組立体。
- 請求項1において、該段付きプラットフォームの該第1レベルと該段付きプラットフォームの該第2レベルとを接続している該段付きプラットフォームの側壁が湾曲している組立体。
- 請求項1において、更に、該段付きプラットフォームに対して遠位であり且つ該加工部材管に対して実質的に平行に位置されている湾曲した反射器を包含しており、該湾曲した反射器は該加工部材管を逸れる該LEDアレイから射出された光を実質的に該加工物製品の反対側へフォーカスさせる形態とされている組立体。
- 請求項4において、長尺状の湾曲した反射器の曲率が該長尺の湾曲した反射器と該加工部材管との間の作業距離を決定する組立体。
- 請求項1において、該LEDアレイの各々がランバート型パターンで光を射出する組立体。
- 請求項1において、該光学部品が該加工部材管に近位の実質的に平坦な表面を具備している湾曲した半円柱を形成している組立体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28951809P | 2009-12-23 | 2009-12-23 | |
US61/289,518 | 2009-12-23 | ||
PCT/US2010/061480 WO2011079108A1 (en) | 2009-12-23 | 2010-12-21 | Uv led based lamp for compact uv curing lamp assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013527554A JP2013527554A (ja) | 2013-06-27 |
JP5955223B2 true JP5955223B2 (ja) | 2016-07-20 |
Family
ID=44149626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012546136A Expired - Fee Related JP5955223B2 (ja) | 2009-12-23 | 2010-12-21 | 小型硬化用ランプ組立体用uvledを基礎としたランプ |
Country Status (7)
Country | Link |
---|---|
US (1) | US8357878B2 (ja) |
EP (1) | EP2517268B1 (ja) |
JP (1) | JP5955223B2 (ja) |
KR (1) | KR101819636B1 (ja) |
CN (1) | CN102792464B (ja) |
TW (1) | TWI453356B (ja) |
WO (1) | WO2011079108A1 (ja) |
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US8872137B2 (en) | 2011-09-15 | 2014-10-28 | Phoseon Technology, Inc. | Dual elliptical reflector with a co-located foci for curing optical fibers |
WO2013055772A1 (en) * | 2011-10-12 | 2013-04-18 | Phoseon Technology, Inc. | Multiple light collection and lens combinations with co-located foci for curing optical fibers |
CN103900612B (zh) * | 2014-03-28 | 2016-05-18 | 中航捷锐(北京)光电技术有限公司 | 一种针对光纤陀螺敏感光纤环的冷光一体固化装置和方法 |
EP3149096B1 (en) * | 2014-05-30 | 2020-06-24 | Henkel AG & Co. KGaA | A process and apparatus for detaching a display module bonded by a liquid optically clear adhesive |
US9664371B2 (en) | 2015-01-15 | 2017-05-30 | Heraeus Noblelight America Llc | Lamp head assemblies and methods of assembling the same |
US10520251B2 (en) | 2015-01-15 | 2019-12-31 | Heraeus Noblelight America Llc | UV light curing systems, and methods of designing and operating the same |
US9644831B2 (en) | 2015-01-15 | 2017-05-09 | Heraeus Noblelight America Llc | Intelligent manifold assemblies for a light source, light sources including intelligent manifold assemblies, and methods of operating the same |
US9648705B2 (en) | 2015-01-15 | 2017-05-09 | Heraeus Noblelight America Llc | Intelligent lamp head assemblies, light sources including intelligent lamp head assemblies, and methods of operating the same |
DE102016102279A1 (de) * | 2015-07-15 | 2017-01-19 | Heraeus Noblelight Gmbh | Modulartig aufgebaute LED-Strahlereinheit und Verwendung derselben |
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
CN105276383B (zh) * | 2015-10-23 | 2021-04-20 | 清华大学 | 半导体照明装置 |
US10780656B2 (en) | 2015-10-30 | 2020-09-22 | Compagnie Generale Des Etablissments Michelin | Device for impregnation and curing of continuous fibers with resin |
DE102016100144A1 (de) | 2016-01-05 | 2017-07-06 | J-Fiber Gmbh | Vorrichtung zum Beschichten einer Faser sowie Verfahren zum Beschichten einer Faser und Faser |
JP6379118B2 (ja) | 2016-01-10 | 2018-08-22 | Hoya Candeo Optronics株式会社 | 光照射装置 |
WO2017180919A1 (en) * | 2016-04-15 | 2017-10-19 | Phoseon Technology, Inc. | Method and system for emission of and curing via narrow width radiation |
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JP6660317B2 (ja) * | 2017-01-31 | 2020-03-11 | Hoya Candeo Optronics株式会社 | 光照射装置 |
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CN107191794B (zh) * | 2017-06-01 | 2020-02-07 | 深圳市华星光电技术有限公司 | 一种灯具 |
JP6815942B2 (ja) * | 2017-06-16 | 2021-01-20 | ウシオ電機株式会社 | 光照射装置、光照射方法 |
EP3470231B1 (en) | 2017-10-10 | 2021-06-02 | HP Scitex Ltd | Printing fluid drying assembly, method and system |
US10486194B2 (en) * | 2017-12-11 | 2019-11-26 | Ofs Fitel, Llc | Post-draw tower optical fiber coating curing |
CN108131570A (zh) * | 2017-12-26 | 2018-06-08 | 武汉优炜星科技有限公司 | 长聚焦灯头及长聚焦光源系统 |
CN108943999B (zh) * | 2018-08-02 | 2021-01-22 | 中国人民银行印制科学技术研究所 | 预干燥固化机构、丝网印刷机及印刷方法 |
IT201800010863A1 (it) * | 2018-12-06 | 2020-06-06 | Ind Chimica Adriatica S P A In Sigla Ica S P A | Sistema meccanico di riflessione ed irraggiamento per la reticolazione di vernici polimerizzabili uv. |
CN110590187A (zh) * | 2019-09-27 | 2019-12-20 | 武汉优炜星科技有限公司 | 一种风冷式光纤拉丝固化装置 |
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-
2010
- 2010-12-21 US US12/974,335 patent/US8357878B2/en not_active Expired - Fee Related
- 2010-12-21 WO PCT/US2010/061480 patent/WO2011079108A1/en active Application Filing
- 2010-12-21 KR KR1020127019309A patent/KR101819636B1/ko active IP Right Grant
- 2010-12-21 EP EP10840056.5A patent/EP2517268B1/en not_active Not-in-force
- 2010-12-21 JP JP2012546136A patent/JP5955223B2/ja not_active Expired - Fee Related
- 2010-12-21 CN CN201080059024.4A patent/CN102792464B/zh not_active Expired - Fee Related
- 2010-12-23 TW TW099145644A patent/TWI453356B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101819636B1 (ko) | 2018-01-17 |
US8357878B2 (en) | 2013-01-22 |
TW201142183A (en) | 2011-12-01 |
EP2517268A1 (en) | 2012-10-31 |
EP2517268B1 (en) | 2018-07-04 |
US20110147356A1 (en) | 2011-06-23 |
TWI453356B (zh) | 2014-09-21 |
CN102792464A (zh) | 2012-11-21 |
JP2013527554A (ja) | 2013-06-27 |
KR20130007547A (ko) | 2013-01-18 |
WO2011079108A1 (en) | 2011-06-30 |
EP2517268A4 (en) | 2015-04-15 |
CN102792464B (zh) | 2015-08-26 |
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