CN102792464B - 用于紧凑的uv固化灯组件的uv led基灯 - Google Patents
用于紧凑的uv固化灯组件的uv led基灯 Download PDFInfo
- Publication number
- CN102792464B CN102792464B CN201080059024.4A CN201080059024A CN102792464B CN 102792464 B CN102792464 B CN 102792464B CN 201080059024 A CN201080059024 A CN 201080059024A CN 102792464 B CN102792464 B CN 102792464B
- Authority
- CN
- China
- Prior art keywords
- assembly
- platform
- led
- level
- optics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011261 inert gas Substances 0.000 claims abstract description 4
- 239000010453 quartz Substances 0.000 claims abstract description 4
- 230000000630 rising effect Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 28
- 238000005538 encapsulation Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28951809P | 2009-12-23 | 2009-12-23 | |
US61/289,518 | 2009-12-23 | ||
PCT/US2010/061480 WO2011079108A1 (en) | 2009-12-23 | 2010-12-21 | Uv led based lamp for compact uv curing lamp assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102792464A CN102792464A (zh) | 2012-11-21 |
CN102792464B true CN102792464B (zh) | 2015-08-26 |
Family
ID=44149626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080059024.4A Expired - Fee Related CN102792464B (zh) | 2009-12-23 | 2010-12-21 | 用于紧凑的uv固化灯组件的uv led基灯 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8357878B2 (zh) |
EP (1) | EP2517268B1 (zh) |
JP (1) | JP5955223B2 (zh) |
KR (1) | KR101819636B1 (zh) |
CN (1) | CN102792464B (zh) |
TW (1) | TWI453356B (zh) |
WO (1) | WO2011079108A1 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8872137B2 (en) | 2011-09-15 | 2014-10-28 | Phoseon Technology, Inc. | Dual elliptical reflector with a co-located foci for curing optical fibers |
JP6017573B2 (ja) | 2011-10-12 | 2016-11-02 | フォセオン テクノロジー, インコーポレイテッドPhoseon Technology, Inc. | 光ファイバーを硬化するための共同設置焦点を有する多重光収集とレンズの組合せ |
CN103900612B (zh) * | 2014-03-28 | 2016-05-18 | 中航捷锐(北京)光电技术有限公司 | 一种针对光纤陀螺敏感光纤环的冷光一体固化装置和方法 |
ES2806259T3 (es) * | 2014-05-30 | 2021-02-17 | Henkel Ag & Co Kgaa | Un procedimiento y un aparato para desmontar un módulo de visualización unido mediante un adhesivo líquido ópticamente transparente |
US9644831B2 (en) | 2015-01-15 | 2017-05-09 | Heraeus Noblelight America Llc | Intelligent manifold assemblies for a light source, light sources including intelligent manifold assemblies, and methods of operating the same |
US10520251B2 (en) | 2015-01-15 | 2019-12-31 | Heraeus Noblelight America Llc | UV light curing systems, and methods of designing and operating the same |
US9664371B2 (en) | 2015-01-15 | 2017-05-30 | Heraeus Noblelight America Llc | Lamp head assemblies and methods of assembling the same |
US9648705B2 (en) | 2015-01-15 | 2017-05-09 | Heraeus Noblelight America Llc | Intelligent lamp head assemblies, light sources including intelligent lamp head assemblies, and methods of operating the same |
DE102016102279A1 (de) * | 2015-07-15 | 2017-01-19 | Heraeus Noblelight Gmbh | Modulartig aufgebaute LED-Strahlereinheit und Verwendung derselben |
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
CN105276383B (zh) * | 2015-10-23 | 2021-04-20 | 清华大学 | 半导体照明装置 |
US10780656B2 (en) | 2015-10-30 | 2020-09-22 | Compagnie Generale Des Etablissments Michelin | Device for impregnation and curing of continuous fibers with resin |
DE102016100144A1 (de) | 2016-01-05 | 2017-07-06 | J-Fiber Gmbh | Vorrichtung zum Beschichten einer Faser sowie Verfahren zum Beschichten einer Faser und Faser |
JP6379118B2 (ja) * | 2016-01-10 | 2018-08-22 | Hoya Candeo Optronics株式会社 | 光照射装置 |
KR102331470B1 (ko) * | 2016-04-15 | 2021-11-26 | 포세온 테크날러지 인코퍼레이티드 | 좁은 폭 방사를 통한 방출 및 경화를 위한 방법 및 시스템 |
US10408423B2 (en) | 2016-06-21 | 2019-09-10 | The Boeing Company | Ultraviolet curing system and method |
JP6660317B2 (ja) | 2017-01-31 | 2020-03-11 | Hoya Candeo Optronics株式会社 | 光照射装置 |
CN108686907A (zh) * | 2017-04-10 | 2018-10-23 | 上海臻辉光电技术有限公司 | 用于固化光纤上的涂料的系统和方法 |
US11370231B2 (en) | 2017-04-07 | 2022-06-28 | Phoseon Technology, Inc. | Pivoted elliptical reflector for large distance reflection of ultraviolet rays |
CN107191794B (zh) * | 2017-06-01 | 2020-02-07 | 深圳市华星光电技术有限公司 | 一种灯具 |
JP6815942B2 (ja) * | 2017-06-16 | 2021-01-20 | ウシオ電機株式会社 | 光照射装置、光照射方法 |
EP3470231B1 (en) | 2017-10-10 | 2021-06-02 | HP Scitex Ltd | Printing fluid drying assembly, method and system |
US10486194B2 (en) * | 2017-12-11 | 2019-11-26 | Ofs Fitel, Llc | Post-draw tower optical fiber coating curing |
CN108131570A (zh) * | 2017-12-26 | 2018-06-08 | 武汉优炜星科技有限公司 | 长聚焦灯头及长聚焦光源系统 |
CN108943999B (zh) * | 2018-08-02 | 2021-01-22 | 中国人民银行印制科学技术研究所 | 预干燥固化机构、丝网印刷机及印刷方法 |
IT201800010863A1 (it) * | 2018-12-06 | 2020-06-06 | Ind Chimica Adriatica S P A In Sigla Ica S P A | Sistema meccanico di riflessione ed irraggiamento per la reticolazione di vernici polimerizzabili uv. |
CN110590187A (zh) * | 2019-09-27 | 2019-12-20 | 武汉优炜星科技有限公司 | 一种风冷式光纤拉丝固化装置 |
US20220047731A1 (en) * | 2020-07-10 | 2022-02-17 | Emoled S.R.L. | Method for inactivation of a pathogen colony in spaces, surfaces and objects using electromagnetic radiation |
KR102569173B1 (ko) | 2021-10-27 | 2023-08-21 | 주식회사 지엠지 | Uv 경화공정용 컴팩트한 구조를 갖는 고출력 spot형 uv 경화광학장치 및 경화방법 |
CN114133148A (zh) * | 2021-12-08 | 2022-03-04 | 苏州市职业大学 | 光纤着色油墨固化腔 |
Citations (2)
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CN201033467Y (zh) * | 2007-06-06 | 2008-03-12 | 中国科学院广州电子技术研究所 | 紫外光固化快速成型设备 |
CN101467020A (zh) * | 2006-02-27 | 2009-06-24 | 照明管理解决方案公司 | 一种改进的产生宽光束的led装置 |
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US4010374A (en) * | 1975-06-02 | 1977-03-01 | Ppg Industries, Inc. | Ultraviolet light processor and method of exposing surfaces to ultraviolet light |
US6386865B1 (en) * | 1997-02-14 | 2002-05-14 | Bisco Inc. | System for fabrication of indirect dental restoratives |
EP0924500B1 (de) * | 1997-12-08 | 2006-10-18 | STEAG RTP Systems GmbH | Verfahren zum Messen elektromagnetischer Strahlung |
JPH11176389A (ja) * | 1997-12-12 | 1999-07-02 | Ushio Inc | ウエハ加熱用フィラメントランプおよび加熱用光源 |
TW398154B (en) * | 1998-02-12 | 2000-07-11 | Minolta Co Ltd | Electron beam profile measurement device for CRT |
JP3438658B2 (ja) * | 1999-07-22 | 2003-08-18 | ウシオ電機株式会社 | ランプユニット及び光照射式加熱装置 |
JP2002118071A (ja) | 2000-10-10 | 2002-04-19 | Ushio Inc | 光照射式加熱処理装置及び方法 |
US7234862B2 (en) * | 2000-10-13 | 2007-06-26 | Tokyo Electron Limited | Apparatus for measuring temperatures of a wafer using specular reflection spectroscopy |
US20030012925A1 (en) * | 2001-07-16 | 2003-01-16 | Motorola, Inc. | Process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same and including an etch stop layer used for back side processing |
US20030235800A1 (en) * | 2002-06-24 | 2003-12-25 | Qadar Steven Abdel | LED curing light |
US7399982B2 (en) * | 2003-01-09 | 2008-07-15 | Con-Trol-Cure, Inc | UV curing system and process with increased light intensity |
CN1802744A (zh) * | 2003-04-09 | 2006-07-12 | 库利克-索法投资公司 | 集成电路的电交互连接结构及其制造方法 |
EP1754259B1 (en) * | 2004-03-18 | 2019-07-17 | Phoseon Technology, Inc. | Direct and indirect cooling of leds |
JP4868331B2 (ja) * | 2005-02-18 | 2012-02-01 | ミネベア株式会社 | 面状照明装置 |
TWI274654B (en) * | 2006-01-26 | 2007-03-01 | Apticon Inc | Tape-to-roll forming method for surface microstructure of light sensitive resin layer and optical film manufactured according to the method |
WO2007100837A2 (en) * | 2006-02-27 | 2007-09-07 | Illumination Management Solutions, Inc. | An improved led device for wide beam generation |
US7860379B2 (en) | 2007-01-15 | 2010-12-28 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
JP5279309B2 (ja) * | 2008-03-19 | 2013-09-04 | トッパン・フォームズ株式会社 | 紫外線照射装置 |
-
2010
- 2010-12-21 JP JP2012546136A patent/JP5955223B2/ja not_active Expired - Fee Related
- 2010-12-21 EP EP10840056.5A patent/EP2517268B1/en not_active Not-in-force
- 2010-12-21 KR KR1020127019309A patent/KR101819636B1/ko active IP Right Grant
- 2010-12-21 WO PCT/US2010/061480 patent/WO2011079108A1/en active Application Filing
- 2010-12-21 US US12/974,335 patent/US8357878B2/en not_active Expired - Fee Related
- 2010-12-21 CN CN201080059024.4A patent/CN102792464B/zh not_active Expired - Fee Related
- 2010-12-23 TW TW099145644A patent/TWI453356B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101467020A (zh) * | 2006-02-27 | 2009-06-24 | 照明管理解决方案公司 | 一种改进的产生宽光束的led装置 |
CN201033467Y (zh) * | 2007-06-06 | 2008-03-12 | 中国科学院广州电子技术研究所 | 紫外光固化快速成型设备 |
Also Published As
Publication number | Publication date |
---|---|
US20110147356A1 (en) | 2011-06-23 |
KR20130007547A (ko) | 2013-01-18 |
JP5955223B2 (ja) | 2016-07-20 |
JP2013527554A (ja) | 2013-06-27 |
US8357878B2 (en) | 2013-01-22 |
TW201142183A (en) | 2011-12-01 |
EP2517268A1 (en) | 2012-10-31 |
EP2517268A4 (en) | 2015-04-15 |
EP2517268B1 (en) | 2018-07-04 |
WO2011079108A1 (en) | 2011-06-30 |
TWI453356B (zh) | 2014-09-21 |
CN102792464A (zh) | 2012-11-21 |
KR101819636B1 (ko) | 2018-01-17 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Maryland USA Patentee after: HERAEUS NOBLELIGHT AMERICA LLC Address before: Maryland USA Patentee before: Heraeus Noblelight Fusion UV Inc. Address after: Maryland USA Patentee after: Heraeus Noblelight Fusion UV Inc. Address before: Maryland USA Patentee before: FUSION UV SYSTEMS, Inc. |
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CP01 | Change in the name or title of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20201221 |
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CF01 | Termination of patent right due to non-payment of annual fee |