JP5951206B2 - ダイシング・ダイボンディングシート - Google Patents

ダイシング・ダイボンディングシート Download PDF

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Publication number
JP5951206B2
JP5951206B2 JP2011201166A JP2011201166A JP5951206B2 JP 5951206 B2 JP5951206 B2 JP 5951206B2 JP 2011201166 A JP2011201166 A JP 2011201166A JP 2011201166 A JP2011201166 A JP 2011201166A JP 5951206 B2 JP5951206 B2 JP 5951206B2
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JP
Japan
Prior art keywords
mass
adhesive layer
parts
acrylic polymer
bonding sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011201166A
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English (en)
Japanese (ja)
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JP2013062445A5 (OSRAM
JP2013062445A (ja
Inventor
裕介 根津
裕介 根津
泰紀 柄澤
泰紀 柄澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2011201166A priority Critical patent/JP5951206B2/ja
Publication of JP2013062445A publication Critical patent/JP2013062445A/ja
Publication of JP2013062445A5 publication Critical patent/JP2013062445A5/ja
Application granted granted Critical
Publication of JP5951206B2 publication Critical patent/JP5951206B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2011201166A 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート Active JP5951206B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (3)

Publication Number Publication Date
JP2013062445A JP2013062445A (ja) 2013-04-04
JP2013062445A5 JP2013062445A5 (OSRAM) 2014-10-23
JP5951206B2 true JP5951206B2 (ja) 2016-07-13

Family

ID=48186842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011201166A Active JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Country Status (1)

Country Link
JP (1) JP5951206B2 (OSRAM)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
KR100804891B1 (ko) * 2006-02-14 2008-02-20 엘에스전선 주식회사 다이싱 다이 접착필름 및 이를 이용한 반도체 패키징 방법
JP4732472B2 (ja) * 2007-03-01 2011-07-27 日東電工株式会社 熱硬化型ダイボンドフィルム
JP2010189484A (ja) * 2009-02-16 2010-09-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
JP2013062445A (ja) 2013-04-04

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