JP5940887B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
- Publication number
- JP5940887B2 JP5940887B2 JP2012114331A JP2012114331A JP5940887B2 JP 5940887 B2 JP5940887 B2 JP 5940887B2 JP 2012114331 A JP2012114331 A JP 2012114331A JP 2012114331 A JP2012114331 A JP 2012114331A JP 5940887 B2 JP5940887 B2 JP 5940887B2
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- photodetecting element
- semiconductor
- semiconductor photodetecting
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003384 imaging method Methods 0.000 title claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 131
- 239000000835 fiber Substances 0.000 claims description 64
- 230000003287 optical effect Effects 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 44
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
- Y10S977/752—Multi-walled
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Description
Claims (5)
- 互いに対向する第一主面と第二主面とを有し、前記第一主面側に光感応領域が設けられると共に、前記光感応領域に対応する部分が該部分の周辺部分を残して前記第二主面側から薄化されている裏面入射型の半導体光検出素子と、
互いに対向する第三主面と第四主面とを有し、前記第三主面と前記第四主面とに開口し且つ前記半導体光検出素子を収容する収容空間が形成されたパッケージと、
光入射端面と光出射端面とを有し、前記光出射端面が前記第二主面と対向するように配置されたファイバ光学プレートと、
前記第一主面側から前記半導体光検出素子に固定され、前記半導体光検出素子の薄化されている部分を保護する保護部材と、を備え、
前記ファイバ光学プレートの前記光入射端面側の部分は、前記第三主面より前記パッケージの外側に突出し、
前記ファイバ光学プレートの前記光出射端面側の部分は、前記半導体光検出素子の前記周辺部分に対応する第一部分と、前記半導体光検出素子の薄化されている部分に対応し且つ前記第一部分よりも前記半導体光検出素子に向けて突出する第二部分と、を含み、
前記ファイバ光学プレートの前記第一部分と前記第二部分とで構成される段差の高さは、前記半導体光検出素子の薄化されている前記部分と前記周辺部分とで構成される段差の高さよりも低く、
前記半導体光検出素子と前記ファイバ光学プレートとは、前記光出射端面と薄化されている前記部分との間に充填された被検出光に対して光学的に透明な樹脂により、前記第一部分と前記周辺部分とが当接し且つ前記第二部分と薄化されている前記部分とが離れている状態で固定されており、
前記第二部分と薄化されている前記部分とは、前記樹脂を介して光学的に結合されていることを特徴とする固体撮像装置。 - 前記ファイバ光学プレートの前記第二部分の、前記半導体光検出素子の薄化されている前記部分に対向する面には、波長選択フィルタが配置されており、
前記半導体光検出素子と前記ファイバ光学プレートとは、前記波長選択フィルタと薄化されている前記部分とが離れている状態で固定されていることを特徴とする請求項1に記載の固体撮像装置。 - 前記半導体光検出素子が、台座を介して前記パッケージに固定されていることを特徴とする請求項1又は2に記載の固体撮像装置。
- 前記収容空間を前記第四主面側から閉塞し、前記保護部材に固定される蓋部材を更に備え、
前記保護部材と蓋部材とが、熱的に結合されていることを特徴とする請求項1〜3のいずれか一項に記載の固体撮像装置。 - 前記保護部材と蓋部材とが、樹脂と該樹脂よりも熱伝導率が高い材料からなるフィラーとを含む接着剤により固定されていることを特徴とする請求項4に記載の固体撮像装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012114331A JP5940887B2 (ja) | 2012-05-18 | 2012-05-18 | 固体撮像装置 |
KR1020147028037A KR102004016B1 (ko) | 2012-05-18 | 2013-03-13 | 고체 촬상 장치 |
EP13790820.8A EP2851953B1 (en) | 2012-05-18 | 2013-03-13 | Solid-state image pickup device |
CN201380026040.7A CN104303303B (zh) | 2012-05-18 | 2013-03-13 | 固体摄像装置 |
PCT/JP2013/057003 WO2013172081A1 (ja) | 2012-05-18 | 2013-03-13 | 固体撮像装置 |
US14/401,224 US9401381B2 (en) | 2012-05-18 | 2013-03-13 | Solid-state image pickup device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012114331A JP5940887B2 (ja) | 2012-05-18 | 2012-05-18 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013243197A JP2013243197A (ja) | 2013-12-05 |
JP5940887B2 true JP5940887B2 (ja) | 2016-06-29 |
Family
ID=49583503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012114331A Active JP5940887B2 (ja) | 2012-05-18 | 2012-05-18 | 固体撮像装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9401381B2 (ja) |
EP (1) | EP2851953B1 (ja) |
JP (1) | JP5940887B2 (ja) |
KR (1) | KR102004016B1 (ja) |
CN (1) | CN104303303B (ja) |
WO (1) | WO2013172081A1 (ja) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6138207Y2 (ja) * | 1980-12-20 | 1986-11-05 | ||
US4814847A (en) * | 1986-11-21 | 1989-03-21 | Bell Communications Research, Inc. | Ingaas semiconductor structures |
JPH05303058A (ja) * | 1992-04-24 | 1993-11-16 | Matsushita Electric Ind Co Ltd | 光ファイバアレイ基板および光ファイバアレイ基板を用いた完全密着型イメージセンサ |
JP4005704B2 (ja) * | 1998-07-14 | 2007-11-14 | 浜松ホトニクス株式会社 | X線パネルセンサ |
JP3717685B2 (ja) | 1998-09-22 | 2005-11-16 | 日本原子力研究所 | イメージングプレートの放射線画像読み出し装置及びその読み出し方法 |
JP4562875B2 (ja) * | 2000-07-17 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体装置 |
US6667528B2 (en) | 2002-01-03 | 2003-12-23 | International Business Machines Corporation | Semiconductor-on-insulator lateral p-i-n photodetector with a reflecting mirror and backside contact and method for forming the same |
JP4227389B2 (ja) * | 2002-10-09 | 2009-02-18 | 浜松ホトニクス株式会社 | 撮像装置及びその製造方法 |
JP4494745B2 (ja) * | 2003-09-25 | 2010-06-30 | 浜松ホトニクス株式会社 | 半導体装置 |
FR2888043B1 (fr) * | 2005-07-01 | 2007-11-30 | Atmel Grenoble Soc Par Actions | Capteur d'image a galette de fibres optiques |
JP4490406B2 (ja) * | 2006-10-11 | 2010-06-23 | 浜松ホトニクス株式会社 | 固体撮像装置 |
US8106363B2 (en) * | 2008-04-17 | 2012-01-31 | Carestream Health, Inc. | Digital radiography panel with pressure-sensitive adhesive for optical coupling between scintillator screen and detector and method of manufacture |
JP5922519B2 (ja) * | 2012-07-20 | 2016-05-24 | 浜松ホトニクス株式会社 | シンチレータパネル及び放射線検出器 |
EP3132463A2 (en) * | 2014-04-17 | 2017-02-22 | Gatan, Inc. | Hybrid energy conversion and processing detector |
-
2012
- 2012-05-18 JP JP2012114331A patent/JP5940887B2/ja active Active
-
2013
- 2013-03-13 KR KR1020147028037A patent/KR102004016B1/ko active IP Right Grant
- 2013-03-13 WO PCT/JP2013/057003 patent/WO2013172081A1/ja active Application Filing
- 2013-03-13 CN CN201380026040.7A patent/CN104303303B/zh active Active
- 2013-03-13 EP EP13790820.8A patent/EP2851953B1/en active Active
- 2013-03-13 US US14/401,224 patent/US9401381B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013243197A (ja) | 2013-12-05 |
EP2851953A1 (en) | 2015-03-25 |
WO2013172081A1 (ja) | 2013-11-21 |
US20150130004A1 (en) | 2015-05-14 |
EP2851953A4 (en) | 2016-01-20 |
KR20150022749A (ko) | 2015-03-04 |
EP2851953B1 (en) | 2016-11-16 |
US9401381B2 (en) | 2016-07-26 |
KR102004016B1 (ko) | 2019-07-25 |
CN104303303B (zh) | 2017-04-12 |
CN104303303A (zh) | 2015-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107532941B (zh) | 光检测装置 | |
TWI747887B (zh) | 光檢測裝置 | |
JP6467346B2 (ja) | 光検出装置 | |
JP6290594B2 (ja) | 光検出装置 | |
JP6862216B2 (ja) | 光検出装置 | |
JP4227389B2 (ja) | 撮像装置及びその製造方法 | |
JP2019071414A (ja) | 光検出装置 | |
JP2008098309A (ja) | 光検出装置 | |
JP2024086931A (ja) | 光検出装置 | |
KR100769587B1 (ko) | 비접촉식 적외선 온도 센서 | |
JP5940887B2 (ja) | 固体撮像装置 | |
JP2004152875A (ja) | 半導体レーザモジュール | |
CN113167995A (zh) | 光学滤光器装置及光学滤光器装置的控制方法 | |
JP2015015631A (ja) | 撮像チップ、撮像ユニット及び撮像装置 | |
JP6713589B1 (ja) | 光検出装置 | |
JP7015285B2 (ja) | 光検出装置 | |
JP7139401B2 (ja) | 光検出装置 | |
JP7049296B2 (ja) | 光検出装置 | |
JP2002365045A (ja) | 測距センサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150915 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160517 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160519 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5940887 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |