JP5935932B2 - フッ化物蛍光体及びそれを用いた発光装置 - Google Patents

フッ化物蛍光体及びそれを用いた発光装置 Download PDF

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Publication number
JP5935932B2
JP5935932B2 JP2015142053A JP2015142053A JP5935932B2 JP 5935932 B2 JP5935932 B2 JP 5935932B2 JP 2015142053 A JP2015142053 A JP 2015142053A JP 2015142053 A JP2015142053 A JP 2015142053A JP 5935932 B2 JP5935932 B2 JP 5935932B2
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Japan
Prior art keywords
phosphor
fluoride
light
tetravalent
fluoride phosphor
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JP2015142053A
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English (en)
Japanese (ja)
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JP2015221905A (ja
Inventor
吉田　智一
智一 吉田
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Nichia Corp
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Nichia Corp
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Publication of JP2015221905A publication Critical patent/JP2015221905A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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JP2015142053A 2013-07-03 2015-07-16 フッ化物蛍光体及びそれを用いた発光装置 Active JP5935932B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015142053A JP5935932B2 (ja) 2013-07-03 2015-07-16 フッ化物蛍光体及びそれを用いた発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013140212 2013-07-03
JP2013140212 2013-07-03
JP2015142053A JP5935932B2 (ja) 2013-07-03 2015-07-16 フッ化物蛍光体及びそれを用いた発光装置

Related Parent Applications (1)

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JP2014122887A Division JP5783302B2 (ja) 2013-07-03 2014-06-13 フッ化物蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法

Related Child Applications (1)

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JP2016037847A Division JP6304287B2 (ja) 2013-07-03 2016-02-29 フッ化物蛍光体粒子及びそれを用いた発光装置

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JP2015221905A JP2015221905A (ja) 2015-12-10
JP5935932B2 true JP5935932B2 (ja) 2016-06-15

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JP2015142053A Active JP5935932B2 (ja) 2013-07-03 2015-07-16 フッ化物蛍光体及びそれを用いた発光装置
JP2015142052A Active JP5854166B2 (ja) 2013-07-03 2015-07-16 フッ化物蛍光体の製造方法
JP2016037847A Active JP6304287B2 (ja) 2013-07-03 2016-02-29 フッ化物蛍光体粒子及びそれを用いた発光装置

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JP2015142052A Active JP5854166B2 (ja) 2013-07-03 2015-07-16 フッ化物蛍光体の製造方法
JP2016037847A Active JP6304287B2 (ja) 2013-07-03 2016-02-29 フッ化物蛍光体粒子及びそれを用いた発光装置

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6149606B2 (ja) * 2013-08-26 2017-06-21 日亜化学工業株式会社 フッ化物蛍光体の製造方法
KR20170077679A (ko) 2015-12-28 2017-07-06 서울반도체 주식회사 광색역 발광소자
US11702348B2 (en) * 2016-08-19 2023-07-18 Current Lighting Solutions, Llc Purified potassium hexafluoromanganate and methods for purifying potassium hexafluoromanganate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5332673B2 (ja) * 2008-02-07 2013-11-06 三菱化学株式会社 半導体発光装置、バックライトおよびカラー画像表示装置
KR101592836B1 (ko) * 2008-02-07 2016-02-05 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치, 백라이트, 컬러 화상 표시 장치, 및 그들에 사용하는 형광체
JP2009280763A (ja) * 2008-05-26 2009-12-03 Sharp Corp 蛍光体調製物およびそれを用いた発光装置
JP5446511B2 (ja) * 2009-06-30 2014-03-19 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
US8057706B1 (en) * 2010-07-27 2011-11-15 General Electric Company Moisture-resistant phosphor and associated method
US8252613B1 (en) * 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors
MY167700A (en) * 2011-04-08 2018-09-21 Shinetsu Chemical Co Preparation of complex fluoride and complex fluoride phosphor
JP5418548B2 (ja) * 2011-07-06 2014-02-19 日亜化学工業株式会社 フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置
JP2013053503A (ja) * 2011-09-05 2013-03-21 Hiroaki Yamashiro 潮位差海水流発電装置
JP2014177586A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置

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JP2015221905A (ja) 2015-12-10
JP2015212398A (ja) 2015-11-26
JP6304287B2 (ja) 2018-04-04
JP2016135881A (ja) 2016-07-28
JP5854166B2 (ja) 2016-02-09

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