JP5935163B2 - レジスト密着性向上剤及び銅配線製造方法 - Google Patents
レジスト密着性向上剤及び銅配線製造方法 Download PDFInfo
- Publication number
- JP5935163B2 JP5935163B2 JP2012079466A JP2012079466A JP5935163B2 JP 5935163 B2 JP5935163 B2 JP 5935163B2 JP 2012079466 A JP2012079466 A JP 2012079466A JP 2012079466 A JP2012079466 A JP 2012079466A JP 5935163 B2 JP5935163 B2 JP 5935163B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- acid
- copper
- adhesion improver
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- ing And Chemical Polishing (AREA)
- Materials For Photolithography (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012079466A JP5935163B2 (ja) | 2012-03-30 | 2012-03-30 | レジスト密着性向上剤及び銅配線製造方法 |
PCT/JP2013/055339 WO2013146060A1 (ja) | 2012-03-30 | 2013-02-28 | レジスト密着性向上剤及び銅配線製造方法 |
CN201380014226.0A CN104246017A (zh) | 2012-03-30 | 2013-02-28 | 抗蚀剂密合性提高剂和铜配线制造方法 |
KR1020147028201A KR20140143780A (ko) | 2012-03-30 | 2013-02-28 | 레지스트 밀착성 향상제 및 구리 배선 제조 방법 |
TW102107590A TW201348887A (zh) | 2012-03-30 | 2013-03-05 | 抗蝕劑密接性提升劑及銅配線製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012079466A JP5935163B2 (ja) | 2012-03-30 | 2012-03-30 | レジスト密着性向上剤及び銅配線製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013211346A JP2013211346A (ja) | 2013-10-10 |
JP5935163B2 true JP5935163B2 (ja) | 2016-06-15 |
Family
ID=49259335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012079466A Expired - Fee Related JP5935163B2 (ja) | 2012-03-30 | 2012-03-30 | レジスト密着性向上剤及び銅配線製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5935163B2 (zh) |
KR (1) | KR20140143780A (zh) |
CN (1) | CN104246017A (zh) |
TW (1) | TW201348887A (zh) |
WO (1) | WO2013146060A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6338232B1 (ja) * | 2017-09-22 | 2018-06-06 | メック株式会社 | 銅表面の粗化方法および配線基板の製造方法 |
WO2020079977A1 (ja) * | 2018-10-17 | 2020-04-23 | 株式会社Adeka | 表面処理液及びニッケル含有材料の表面処理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0634443B2 (ja) * | 1985-01-14 | 1994-05-02 | 株式会社日立製作所 | プリント配線板の製造方法 |
JP3387529B2 (ja) * | 1992-10-06 | 2003-03-17 | 朝日化学工業株式会社 | 銅および銅合金の化学溶解液 |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
JPH10209604A (ja) * | 1997-01-17 | 1998-08-07 | Hitachi Ltd | プリント配線基板の製造方法並びにそれに用いる粗化液及び粗化液の調製方法 |
CN1299546C (zh) * | 2000-10-26 | 2007-02-07 | 奥克一三井有限公司 | 在印刷电路板制造中利用对铜箔的金属化处理来产生细线条并替代氧化过程 |
EP1894230A2 (en) * | 2005-06-13 | 2008-03-05 | Advanced Technology Materials, Inc. | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
CN101457360B (zh) * | 2008-12-22 | 2010-11-10 | 深圳市板明科技有限公司 | 一种有机酸型粗化液 |
-
2012
- 2012-03-30 JP JP2012079466A patent/JP5935163B2/ja not_active Expired - Fee Related
-
2013
- 2013-02-28 CN CN201380014226.0A patent/CN104246017A/zh active Pending
- 2013-02-28 WO PCT/JP2013/055339 patent/WO2013146060A1/ja active Application Filing
- 2013-02-28 KR KR1020147028201A patent/KR20140143780A/ko not_active Application Discontinuation
- 2013-03-05 TW TW102107590A patent/TW201348887A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2013146060A1 (ja) | 2013-10-03 |
KR20140143780A (ko) | 2014-12-17 |
CN104246017A (zh) | 2014-12-24 |
TW201348887A (zh) | 2013-12-01 |
JP2013211346A (ja) | 2013-10-10 |
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