JP5927682B2 - Ledグリッド装置、及びledグリッド装置を製造する方法 - Google Patents
Ledグリッド装置、及びledグリッド装置を製造する方法 Download PDFInfo
- Publication number
- JP5927682B2 JP5927682B2 JP2014560515A JP2014560515A JP5927682B2 JP 5927682 B2 JP5927682 B2 JP 5927682B2 JP 2014560515 A JP2014560515 A JP 2014560515A JP 2014560515 A JP2014560515 A JP 2014560515A JP 5927682 B2 JP5927682 B2 JP 5927682B2
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- Prior art keywords
- led
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- heat conducting
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 16
- 238000009966 trimming Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K99/00—Subject matter not provided for in other groups of this subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
- F21S4/15—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights the cables forming a grid, net or web structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
曲げられた端部224、226は、LEDモジュール208がプレート状部材204にちゃんと固定されるのを確実にし、接着剤を使用することを不要にする。しかしながら、プレート状部材204の材料に依存して、LEDモジュール208は、ホッチキスの針の形をした熱伝導素子によっても、しっかりと取り付けられ得る。
Claims (8)
- LEDグリッド装置を製造する方法であって、
複数の導電ワイヤを並べて配設し、それによって、第1の幅を持つワイヤのセットを形成するステップと、
各LEDパッケージが、前記ワイヤのセットのうちの少なくとも2本のワイヤに結合され、幾つかの平行な一連のLEDパッケージが形成されるように、前記ワイヤのセットに幾つかのLEDパッケージを結合するステップと、
各LEDパッケージに熱伝導素子を設け、それによって、LEDグリッドを形成するステップと、
前記LEDグリッドを、前記第1の幅より大きい第2の幅へ広げるステップと、
前記LEDグリッドをプレート状部材に取り付け、各熱伝導素子を前記プレート状部材に取り付けるステップとを有する方法。 - 前記各LEDパッケージに熱伝導素子を設けるステップが、
各一連のLEDパッケージに各々の熱伝導リボンを取り付けるステップと、
各LEDパッケージのための別々の熱伝導素子を形成するよう各リボンをトリムするステップとを有する請求項1に記載の方法。 - 前記各LEDパッケージのための別々の熱伝導素子を形成するよう各リボンをトリムするステップが、前記LEDパッケージを担持する中間部から反対方向に突出する第1及び第2突出部を残すステップを有する請求項2に記載の方法。
- 各熱伝導素子を所定の形状に成形するステップを更に有する請求項3に記載の方法。
- 前記各熱伝導素子を所定の形状に成形するステップが、前記第1及び第2突出部の各々の少なくとも第1部分を、前記中間部に対して或る角度に延在するよう曲げるステップを有する請求項4に記載の方法。
- 前記LEDグリッドをプレート状部材に取り付けるステップが、前記第1及び第2突出部の各々の前記第1部分を前記プレート状部材に差し込むステップを有する請求項5に記載の方法。
- 前記各熱伝導素子を所定の形状に成形するステップが、各突出部の端部が、前記プレート状部材の、前記中間部が配置される側に対して反対側において、前記プレート状部材から突出するように、前記第1及び第2突出部の各々の前記第1部分の、前記プレート状部材への差し込みを実施するステップを有する請求項6に記載の方法。
- 前記各熱伝導素子を所定の形状に成形するステップが、
前記第1及び第2突出部の各々の少なくとも第1部分を、前記中間部に対して或る角度で前記LEDパッケージを通り越して延在するよう、曲げるステップと、
各熱伝導素子の前記第1及び第2突出部の各々の端部を、前記中間部と平行に延在するよう曲げるステップとを有し、
前記各熱伝導素子を前記プレート状部材に取り付けるステップが、前記端部を前記プレート状部材の表面に取り付けるステップを有し、前記LEDパッケージの発光面が、前記プレート状部材の前記表面に面する請求項4に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261635418P | 2012-04-19 | 2012-04-19 | |
US61/635,418 | 2012-04-19 | ||
PCT/IB2013/052619 WO2013156883A2 (en) | 2012-04-19 | 2013-04-02 | A led grid device and a method of manufacturing a led grid device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015509667A JP2015509667A (ja) | 2015-03-30 |
JP5927682B2 true JP5927682B2 (ja) | 2016-06-01 |
Family
ID=48430883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014560515A Expired - Fee Related JP5927682B2 (ja) | 2012-04-19 | 2013-04-02 | Ledグリッド装置、及びledグリッド装置を製造する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9841170B2 (ja) |
EP (1) | EP2839726B1 (ja) |
JP (1) | JP5927682B2 (ja) |
CN (1) | CN104221484B (ja) |
RU (1) | RU2636055C2 (ja) |
WO (1) | WO2013156883A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015074923A1 (en) * | 2013-11-19 | 2015-05-28 | Koninklijke Philips N.V. | Lighting arrangement |
CN106369373A (zh) * | 2016-08-25 | 2017-02-01 | 江门市人和照明实业有限公司 | 一种led点光源的制作方法 |
RU2689301C1 (ru) * | 2018-03-13 | 2019-05-27 | Анатолий Павлович Бежко | Светодиодный модуль для формирования светильника |
CN110617414A (zh) * | 2019-09-06 | 2019-12-27 | 珠海博杰电子股份有限公司 | Led网灯及其生产方法 |
WO2021133369A1 (ru) * | 2019-12-24 | 2021-07-01 | Виктор Григорьевич ПЕТРЕНКО | Led-элемент решётчатого светоизлучающего массива |
RU2759139C1 (ru) * | 2020-11-17 | 2021-11-09 | Общество с ограниченной ответственностью «ЭМИКС | Система крепления светодиодных модулей, доступных для фронтального обслуживания |
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-
2013
- 2013-04-02 EP EP13722564.5A patent/EP2839726B1/en not_active Not-in-force
- 2013-04-02 US US14/395,099 patent/US9841170B2/en not_active Expired - Fee Related
- 2013-04-02 JP JP2014560515A patent/JP5927682B2/ja not_active Expired - Fee Related
- 2013-04-02 CN CN201380020537.8A patent/CN104221484B/zh not_active Expired - Fee Related
- 2013-04-02 WO PCT/IB2013/052619 patent/WO2013156883A2/en active Application Filing
- 2013-04-02 RU RU2014146311A patent/RU2636055C2/ru not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104221484B (zh) | 2017-07-14 |
CN104221484A (zh) | 2014-12-17 |
RU2636055C2 (ru) | 2017-11-20 |
WO2013156883A3 (en) | 2014-03-06 |
WO2013156883A2 (en) | 2013-10-24 |
US9841170B2 (en) | 2017-12-12 |
EP2839726A2 (en) | 2015-02-25 |
EP2839726B1 (en) | 2018-06-13 |
RU2014146311A (ru) | 2016-06-10 |
JP2015509667A (ja) | 2015-03-30 |
US20150070893A1 (en) | 2015-03-12 |
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