JP5925747B2 - 基板搬送装置及び基板処理装置 - Google Patents
基板搬送装置及び基板処理装置 Download PDFInfo
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- 238000002347 injection Methods 0.000 claims description 8
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
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Description
120:第2軸搬送台
130:ガイドレール
121:エアベアリング
122:吸入器
1221:吸入パッド
1222:吸入孔
1223:吸入通路管
1224:エア排出ポート
Claims (7)
- 第1軸方向に沿って置かれ且つ互いに離れた一対のガイドレールと、
前記一対のガイドレール同士を結ぶ第2軸方向に延びた胴体を有し、下面に設けられたエアベアリングによって前記ガイドレールに沿って第1軸方向に前後進スライドされる第1軸搬送台と、
前記第1軸搬送台を上部から凹形に囲むように、前記第1軸搬送台の上部に設けられ、下面に設けられたエアベアリングによって、前記第1軸搬送台に沿って第2軸方向に前後進スライドされる第2軸搬送台と、
前記第2軸搬送台の中央の内部に挿入される回転軸ガイドと、
前記回転軸ガイドの上部に設けられる基板支持台と、
前記エアベアリングの周縁を囲み、前記エアベアリングから噴射された後に反射されるエア圧を吸収する吸入器と、
を備え、
前記第1軸搬送台は、
前記胴体の両端に設けられ、前記一対のガイドレールに沿ってスライド移動する第1軸搬送台スライド体を備え、
前記第2軸搬送台は、
前記第1軸搬送台の上部に置かれる基板支持台受け体と、
前記第1軸搬送台の長手方向の側面をそこから距離をおいて囲むように、前記基板支持台受け体の両端からそれぞれ下側に突き出た第2軸搬送台支持体とを備え、
前記エアベアリングは、前記第1軸搬送台及び第2軸搬送台が単一の平面からなるチャンバーの底面上において滑走可能なように、前記第1軸搬送台スライド体の底面及び第2軸搬送台支持体の底面にそれぞれ複数設けられ、
前記吸入器は、
前記エアベアリングのエア噴射面の周縁を囲む吸入パッドと、
前記吸入パッドを周りの構造物に固定する固定バーと、
前記吸入パッドの下面に設けられた複数のエア吸入孔と、
前記吸入パッドの内部に形成された通路管であって、前記エア吸入孔と連結されたエア吸入通路管と、
前記エア吸入通路管の一方の端に設けられ、吸入されたエアを排出するエア排出ポートと、
を備える基板搬送装置。 - 前記第1軸搬送台の前記胴体には、溝条が刻まれている、請求項1に記載の基板搬送装置。
- 前記吸入パッドは、エアベアリングのエア噴射面の周縁を囲む単一のリング状に形成される、請求項1に記載の基板搬送装置。
- 前記吸入パッドは、エアベアリングのエア噴射面の周縁に沿って互いに離れて複数設けられ、エアベアリングのエア噴射面の周縁を囲む、請求項1に記載の基板搬送装置。
- 前記吸入パッドの底面は、フッ素樹脂であるテフロン(登録商標)によりコーティングされている、請求項1に記載の基板搬送装置。
- 前記吸入パッドとエアベアリングとの間の距離は50mm以内である、請求項1に記載の基板搬送装置。
- 内部空間を有するチャンバーと、
前記チャンバーの内部空間において、基板を第1軸方向及び第2軸方向に搬送する基板搬送装置と、
前記基板搬送装置に置かれた基板にレーザービームを照射するレーザー発生部と、
を備え、
前記基板搬送装置は、
第1軸方向に沿って置かれ且つ互いに離れた一対のガイドレールと、
前記一対のガイドレール同士を結ぶ第2軸方向に伸びた胴体を有し、下面に設けられたエアベアリングによって前記ガイドレールに沿って第1軸方向に前後進スライドされる第1軸搬送台と、
前記第1軸搬送台を上部から凹形に囲むように、前記第1軸搬送台の上部に設けられ、下面に設けられたエアベアリングによって、前記第1軸搬送台に沿って第2軸方向に前後進スライドされる第2軸搬送台と、
前記第2軸搬送台の中央の内部に挿入される回転軸ガイドと、
前記回転軸ガイドの上部に設けられる基板支持台と、
前記エアベアリングの周縁を囲み、前記エアベアリングから噴射された後に反射されるエア圧を吸収する吸入器と、
を備え、
前記第1軸搬送台は、
前記胴体の両端に設けられ、前記一対のガイドレールに沿ってスライド移動する第1軸搬送台スライド体を備え、
前記第2軸搬送台は、
前記第1軸搬送台の上部に置かれる基板支持台受け体と、
前記第1軸搬送台の長手方向の側面をそこから距離をおいて囲むように、前記基板支持台受け体の両端からそれぞれ下側に突き出た第2軸搬送台支持体とを備え、
前記エアベアリングは、前記第1軸搬送台及び第2軸搬送台が単一の平面からなるチャンバーの底面上において滑走可能なように、前記第1軸搬送台スライド体の底面及び第2軸搬送台支持体の底面にそれぞれ複数設けられ、
前記吸入器は、
前記エアベアリングの周縁を囲む吸入パッドと、
前記吸入パッドを周りの構造物に固定する固定バーと、
前記吸入パッドの下面に形成された複数のエア吸入孔と、
前記吸入パッドの内部に形成された通路管であって、前記エア吸入孔と連結されたエア吸入通路管と、
前記エア吸入通路管の一方の端に設けられ、吸入されたエアを排出するエア排出ポートと、
を備える基板処理装置。
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KR10-2012-0128136 | 2012-11-13 | ||
KR1020120128136A KR101403458B1 (ko) | 2012-11-13 | 2012-11-13 | 기판 이송 장치 및 기판 처리 장치 |
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JP5925747B2 true JP5925747B2 (ja) | 2016-05-25 |
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JP (1) | JP5925747B2 (ja) |
KR (1) | KR101403458B1 (ja) |
CN (1) | CN103811386B (ja) |
TW (1) | TWI525742B (ja) |
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KR101983327B1 (ko) | 2016-07-26 | 2019-05-29 | 에이피시스템 주식회사 | 레이저 처리장치 |
CN112828485B (zh) * | 2020-12-31 | 2023-03-24 | 南昌航空大学 | 一种用于止推顶箔微激光点焊的装置 |
CN114724999B (zh) * | 2022-03-31 | 2023-01-03 | 先之科半导体科技(东莞)有限公司 | 一种二极管入料座 |
CN117276160B (zh) * | 2023-11-21 | 2024-02-13 | 上海隐冠半导体技术有限公司 | 一种气浮刹车装置、运动装置及气浮刹车装置的控制方法 |
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JPS58141536A (ja) * | 1982-02-17 | 1983-08-22 | Sanyo Electric Co Ltd | 半導体ウエハ−の吸着ヘツド |
KR0131754Y1 (ko) * | 1995-12-27 | 1999-02-01 | 문정환 | 스테이지 구동장치 |
JP2000264411A (ja) * | 1999-03-17 | 2000-09-26 | Mitsubishi Heavy Ind Ltd | 浮上移動台車 |
JP2002217082A (ja) * | 2001-01-12 | 2002-08-02 | Nikon Corp | ステージ装置及び露光装置 |
US7313926B2 (en) * | 2005-01-18 | 2008-01-01 | Rexorce Thermionics, Inc. | High efficiency absorption heat pump and methods of use |
TWI457193B (zh) * | 2006-03-02 | 2014-10-21 | Sumitomo Heavy Industries | Stage device |
JP4782710B2 (ja) * | 2006-03-02 | 2011-09-28 | 住友重機械工業株式会社 | ステージ装置 |
JP2009210295A (ja) * | 2008-02-29 | 2009-09-17 | Canon Inc | 位置決め装置、露光装置及びデバイス製造方法 |
KR100982345B1 (ko) * | 2008-05-14 | 2010-09-15 | 주식회사 쎄믹스 | 레이저 리페어 시스템을 위한 척 플레이트 이송장치 |
JP2010286784A (ja) * | 2009-06-15 | 2010-12-24 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法 |
KR101089626B1 (ko) * | 2009-07-24 | 2011-12-06 | 에이피시스템 주식회사 | 기판 이송이 에어 베어링을 통해 이루어지는 레이저 열처리 장치 |
JP2011133724A (ja) * | 2009-12-25 | 2011-07-07 | Nikon Corp | 流体静圧軸受、移動体装置、露光装置、デバイス製造方法、及び清掃装置 |
KR20110131011A (ko) * | 2010-05-28 | 2011-12-06 | (유)에스엔티 | 스크린 프린터의 클리닝 장치 및 이를 구비하는 스크린 프린터 |
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CN103811386A (zh) | 2014-05-21 |
JP2014099607A (ja) | 2014-05-29 |
TWI525742B (zh) | 2016-03-11 |
KR101403458B1 (ko) | 2014-06-30 |
KR20140061614A (ko) | 2014-05-22 |
CN103811386B (zh) | 2017-04-12 |
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