JP5907819B2 - レンズユニットおよびレーザ加工装置 - Google Patents

レンズユニットおよびレーザ加工装置 Download PDF

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Publication number
JP5907819B2
JP5907819B2 JP2012139293A JP2012139293A JP5907819B2 JP 5907819 B2 JP5907819 B2 JP 5907819B2 JP 2012139293 A JP2012139293 A JP 2012139293A JP 2012139293 A JP2012139293 A JP 2012139293A JP 5907819 B2 JP5907819 B2 JP 5907819B2
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Japan
Prior art keywords
temperature
optical lens
laser beam
lens
galvano
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JP2012139293A
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Japanese (ja)
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JP2013130856A (ja
JP2013130856A5 (enExample
Inventor
智彦 石塚
智彦 石塚
伊藤　健治
健治 伊藤
正史 成瀬
正史 成瀬
悌史 ▲高▼橋
悌史 ▲高▼橋
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012139293A priority Critical patent/JP5907819B2/ja
Priority to TW101141523A priority patent/TWI510810B/zh
Priority to CN201210452192.0A priority patent/CN103128439B/zh
Priority to KR1020120132882A priority patent/KR101422932B1/ko
Publication of JP2013130856A publication Critical patent/JP2013130856A/ja
Publication of JP2013130856A5 publication Critical patent/JP2013130856A5/ja
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  • Laser Beam Processing (AREA)
  • Lenses (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2012139293A 2011-11-24 2012-06-21 レンズユニットおよびレーザ加工装置 Active JP5907819B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012139293A JP5907819B2 (ja) 2011-11-24 2012-06-21 レンズユニットおよびレーザ加工装置
TW101141523A TWI510810B (zh) 2011-11-24 2012-11-08 透鏡單元及雷射加工裝置
CN201210452192.0A CN103128439B (zh) 2011-11-24 2012-11-13 透镜单元以及激光加工装置
KR1020120132882A KR101422932B1 (ko) 2011-11-24 2012-11-22 렌즈 유닛 및 레이저 가공 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011255676 2011-11-24
JP2011255676 2011-11-24
JP2012139293A JP5907819B2 (ja) 2011-11-24 2012-06-21 レンズユニットおよびレーザ加工装置

Publications (3)

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JP2013130856A JP2013130856A (ja) 2013-07-04
JP2013130856A5 JP2013130856A5 (enExample) 2014-11-20
JP5907819B2 true JP5907819B2 (ja) 2016-04-26

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JP2012139293A Active JP5907819B2 (ja) 2011-11-24 2012-06-21 レンズユニットおよびレーザ加工装置

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JP (1) JP5907819B2 (enExample)
TW (1) TWI510810B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT517185B1 (de) * 2015-05-13 2017-06-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes () mit einem
JP6292410B2 (ja) * 2015-05-26 2018-03-14 京セラドキュメントソリューションズ株式会社 光走査装置及び画像形成装置
JP2018146615A (ja) * 2017-03-01 2018-09-20 コニカミノルタ株式会社 画像書込装置及び画像形成装置
CN111093884B (zh) * 2017-09-21 2022-05-24 松下知识产权经营株式会社 激光加工头及使用该激光加工头的激光加工系统
DE102017009472B4 (de) * 2017-10-12 2025-09-18 Precitec Gmbh & Co. Kg Vorrichtung für ein Laserbearbeitungssystem, Laserbearbeitungssystem mit derselben und Verfahren zum Einstellen einer Fokuslage eines optischen Elements
WO2020153046A1 (ja) * 2019-01-22 2020-07-30 三菱電機株式会社 光学部品およびレーザ加工機
JP7203479B2 (ja) * 2019-08-29 2023-01-13 ビアメカニクス株式会社 レーザ加工装置
JP6861918B1 (ja) * 2020-07-03 2021-04-21 三菱電機株式会社 レーザ加工装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316889A (ja) * 1986-07-07 1988-01-23 Mitsubishi Electric Corp レ−ザ光異常監視装置
JPS63212080A (ja) * 1987-02-27 1988-09-05 Matsushita Electric Ind Co Ltd レ−ザ加工装置
JPS63264289A (ja) * 1987-04-21 1988-11-01 Mitsubishi Heavy Ind Ltd レ−ザ溶接方法
DE19782307T1 (de) * 1997-12-26 2001-02-01 Mitsubishi Electric Corp Laserbearbeitungsgerät
JP2001051214A (ja) * 1999-08-16 2001-02-23 Ricoh Co Ltd 光ビーム走査装置および画像形成装置
JP4393227B2 (ja) * 2004-02-27 2010-01-06 キヤノン株式会社 露光装置、デバイスの製造方法、露光装置の製造方法
WO2009066370A1 (ja) * 2007-11-20 2009-05-28 Mitsubishi Electric Corporation レーザ発振器内出射ミラーの劣化状態測定方法およびレーザ加工装置
CN102123654B (zh) * 2008-11-11 2012-07-18 奥林巴斯医疗株式会社 摄像装置及内窥镜
WO2010098299A1 (ja) * 2009-02-24 2010-09-02 株式会社ニコン 光学素子の保持装置、光学系、及び露光装置
JP5279949B2 (ja) * 2010-04-12 2013-09-04 三菱電機株式会社 レーザ加工機、レーザ加工方法およびレーザ加工制御装置

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Publication number Publication date
TW201326893A (zh) 2013-07-01
JP2013130856A (ja) 2013-07-04
TWI510810B (zh) 2015-12-01

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