JP5897862B2 - 半導体発光装置 - Google Patents

半導体発光装置 Download PDF

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Publication number
JP5897862B2
JP5897862B2 JP2011226142A JP2011226142A JP5897862B2 JP 5897862 B2 JP5897862 B2 JP 5897862B2 JP 2011226142 A JP2011226142 A JP 2011226142A JP 2011226142 A JP2011226142 A JP 2011226142A JP 5897862 B2 JP5897862 B2 JP 5897862B2
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Japan
Prior art keywords
emitting device
light emitting
light
led
refractive index
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JP2011226142A
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English (en)
Japanese (ja)
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JP2013089645A5 (enrdf_load_stackoverflow
JP2013089645A (ja
Inventor
篤 白石
篤 白石
浩 塚田
浩 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP2011226142A priority Critical patent/JP5897862B2/ja
Publication of JP2013089645A publication Critical patent/JP2013089645A/ja
Publication of JP2013089645A5 publication Critical patent/JP2013089645A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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JP2011226142A 2011-10-13 2011-10-13 半導体発光装置 Active JP5897862B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011226142A JP5897862B2 (ja) 2011-10-13 2011-10-13 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011226142A JP5897862B2 (ja) 2011-10-13 2011-10-13 半導体発光装置

Publications (3)

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JP2013089645A JP2013089645A (ja) 2013-05-13
JP2013089645A5 JP2013089645A5 (enrdf_load_stackoverflow) 2015-01-15
JP5897862B2 true JP5897862B2 (ja) 2016-04-06

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JP2011226142A Active JP5897862B2 (ja) 2011-10-13 2011-10-13 半導体発光装置

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JP (1) JP5897862B2 (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334142B2 (ja) * 2013-11-21 2018-05-30 スタンレー電気株式会社 発光装置
KR102200629B1 (ko) * 2013-12-30 2021-01-13 삼성디스플레이 주식회사 발광 유닛 및 이를 포함하는 표시 장치
KR102142718B1 (ko) * 2014-03-20 2020-08-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR102371290B1 (ko) * 2015-08-11 2022-03-08 엘지디스플레이 주식회사 광원 패키지 및 그를 포함하는 백라이트 유닛
JP6365592B2 (ja) * 2016-05-31 2018-08-01 日亜化学工業株式会社 発光装置
CN109997236B (zh) * 2016-10-25 2023-06-30 首尔半导体株式会社 发光二极管封装件以及具有该发光二极管封装件的显示装置
JP6734992B2 (ja) * 2017-04-26 2020-08-05 シチズン電子株式会社 バックライト
JP2019009429A (ja) * 2017-06-28 2019-01-17 日亜化学工業株式会社 発光装置
CN114464718B (zh) * 2017-10-26 2025-07-11 晶元光电股份有限公司 发光装置
JP7057493B2 (ja) * 2018-02-05 2022-04-20 日亜化学工業株式会社 発光装置とその製造方法
GB2589243B (en) 2018-07-12 2023-05-10 Seoul Semiconductor Co Ltd Light emitting device, light emitting diode package, backlight unit, and liquid crystal display
JP7193740B2 (ja) * 2020-04-17 2022-12-21 日亜化学工業株式会社 発光装置の製造方法及び発光モジュールの製造方法
CN112510138B (zh) * 2020-07-16 2025-08-12 江西省晶能半导体有限公司 发光装置及其制备方法、背光模组
JP7104350B2 (ja) * 2020-11-16 2022-07-21 日亜化学工業株式会社 発光装置
US12206052B2 (en) 2020-11-30 2025-01-21 Nichia Corporation Light-emitting device and planar light source that utilizes multiple wavelength conversion layers
JP7285439B2 (ja) * 2020-11-30 2023-06-02 日亜化学工業株式会社 面状光源
JP7508358B2 (ja) * 2020-12-10 2024-07-01 シチズン電子株式会社 発光装置
DE102021129972A1 (de) * 2021-11-17 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN114300603A (zh) * 2021-12-29 2022-04-08 惠州视维新技术有限公司 发光器件及其制备方法、灯板、背光模块以及显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298115A (ja) * 2002-04-05 2003-10-17 Citizen Electronics Co Ltd 発光ダイオード
JP2004304041A (ja) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd 発光ダイオード
JP4724618B2 (ja) * 2005-11-11 2011-07-13 株式会社 日立ディスプレイズ 照明装置及びそれを用いた液晶表示装置
JP4280283B2 (ja) * 2006-01-27 2009-06-17 株式会社オプトデザイン 面照明光源装置及びこれを用いた面照明装置
JP2009158639A (ja) * 2007-12-26 2009-07-16 Kyocera Corp サイドエミッタ型発光装置
JP2009245664A (ja) * 2008-03-28 2009-10-22 Sharp Corp 発光装置、バックライトおよび液晶表示装置
JP2010045248A (ja) * 2008-08-14 2010-02-25 Citizen Electronics Co Ltd 発光ダイオード
JP5321259B2 (ja) * 2009-06-10 2013-10-23 日本軽金属株式会社 照明装置付屋根構造体およびこれを用いたカーポート用屋根並びに待合スペース用屋根
JP2011150861A (ja) * 2010-01-20 2011-08-04 Opt Design:Kk Ｌｅｄ光源装置及びこの光源装置を用いた照明装置
US8556672B2 (en) * 2010-01-29 2013-10-15 Citizen Electronics Co., Ltd. Method of producing light-emitting device and light-emitting device
JP5519774B2 (ja) * 2010-03-23 2014-06-11 株式会社朝日ラバー シリコーン樹脂製反射基材、その製造方法、及びその反射基材に用いる原材料組成物

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Publication number Publication date
JP2013089645A (ja) 2013-05-13

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