JP5897387B2 - Method for manufacturing rotation detection device - Google Patents

Description

  The present invention relates to a method of manufacturing a rotation detection device that detects a rotation angle of a rotation side member.

  Conventionally, as a method of manufacturing a rotation detection device, a sensing unit that detects a change in magnetism associated with the rotation of a rotation-side member, and an operation based on an output signal of the sensing unit are performed to output a signal corresponding to the change in magnetism. A rotation detecting device using a magnetic detection member in which the sensing unit and the signal calculation unit are L-shaped, and the magnetic detection member is molded of resin. There is a method of forming a mold resin member that molds the magnetic detection member by placing the material in a mold and performing insert molding with a resin (see, for example, Patent Document 1).

JP 2011-102769 A

  According to the conventional method for manufacturing a rotation detection device, insert molding is performed without holding the surface corresponding to the detection body in the sensing part of the magnetic detection member by a mold. Therefore, when insert molding is performed, the sensing part moves due to the pressure and frictional forces caused by the flow of resin (molten resin) on both sides in the thickness direction of the sensing part. There was a problem that decreased. This is not preferable because it lowers the detection performance of the detection body of the sensing unit.

  The problem to be solved by the present invention is to provide a method of manufacturing a rotation detecting device capable of preventing a decrease in position accuracy of a sensing portion of a magnetic detection member due to a resin flow during insert molding.

A first aspect of the invention is a sensing unit that detects a change in magnetism associated with rotation of a rotation side member, a signal calculation unit that performs a calculation based on an output signal of the sensing unit and outputs a signal corresponding to the change in magnetism And a rotation detecting device using a magnetic detection member in which the sensing unit and the signal calculation unit are L-shaped, and the magnetic detection member is molded with resin. It is a method of manufacturing a rotation detection device that forms a mold resin member for molding a magnetic detection member by placing and insert molding with resin, and the mold corresponds to the detection body in the sensing part of the magnetic detection member A holding part that holds one side surface in the thickness direction is provided, and insert molding is performed in a state where one side surface of the sensing part of the magnetic detection member is partially held by the holding part of the mold. Cormorant is a method. According to this configuration, one side surface in the thickness direction of the sensing portion of the magnetic detection member is partially held by the holding portion of the mold during insert molding. Thereby, since the movement of the detection body in the thickness direction of the sensing part due to the flow of the resin at the time of insert molding is prevented, it is possible to prevent the position accuracy of the sensing part from being lowered. As a result, it is possible to prevent a decrease in detection performance of the detection body of the sensing unit.

  Moreover, resin can be filled in parts other than the part corresponding to the holding | maintenance part in one side of a sensing part. Thereby, a sensing part can be stably hold | maintained with a mold resin member. In addition, when the cavity formed in the mold resin member by the mold holding part is filled with resin (molten resin) in a later step, one side surface of the sensing part is partially formed into the cavity. It is only exposed. For this reason, unlike the case where one side surface of the sensing part is exposed entirely, the pressure receiving area (area exposed to the cavity) of the molding pressure at the time of resin molding in the subsequent process is small, so the stress applied to the sensing part is reduced. Can be reduced. At the same time, a portion other than the portion corresponding to the holding portion on one side surface of the sensing portion is held by the mold resin member. For this reason, it is possible to prevent the deformation of one side surface due to the stress applied to the sensing unit during resin molding in a subsequent process. Thereby, the fall of the detection performance of the detection body of a sensing part can be prevented.

According to a second aspect of the present invention, in the first aspect, the sensing unit of the magnetic detection member is partially held by a mold holding unit on one side surface of the sensing unit located on the signal calculation unit side, and the signal calculation of the sensing unit This is a method of injecting resin from an injection gate provided on a wall of a mold facing the other side located on the side opposite to the part side. Therefore, since the resin is injected from the injection gate in the vicinity of the sensing unit, for example, compared to the case where the resin is injected from the injection gate disposed on the side opposite to the sensing unit of the magnetic detection member, Molding shrinkage is reduced, and molding distortion of the sensing part can be prevented.

According to a third invention, in the first invention, two magnetic detection members are used, and the two magnetic detection members are arranged in the mold so that the two magnetic detection members face each other and the sensing units are overlapped with each other. Sensing part located in the thickness direction of the sensing part located on the signal computing part side is partially held by the holding part of the mold, and the sensing part located on the opposite side to the signal computing part side of both sensing parts This is a method of injecting resin from a plurality of injection gates provided on the wall of the mold facing the other side of the part and arranged at a predetermined interval from each other. Therefore, since the resin is injected by a plurality of injection gates, so-called multipoint gates, the gate cross-sectional area can be increased and the pressure loss can be reduced. Thereby, molding can be stabilized and molding distortion of the sensing part can be prevented. Further, by arranging a plurality of injection gates at a predetermined interval from each other, it is possible to fill both magnetic detection members with resin in a balanced manner.

According to a fourth invention, in any one of the first to third inventions, the connecting portions of the lead of the magnetic detection member and the terminal connected to the lead are overlapped with each other on a flat plate, and the welding electrode is brought into contact with the lead. In the state where the ground electrode is in contact with the terminal, resistance welding is performed by energizing between both electrodes, the tip surface of the ground electrode is formed in a plane that is in surface contact with the terminal, and the tip surface of the welding electrode is It is formed in the convex surface which has the inclined surface which carries out surface contact with this lead by the deformation | transformation by welding of a lead. Therefore, the welding interface is flat because resistance welding is performed by overlapping the connecting portions of the lead of the magnetic detection member and the terminal with each other between the flat plates. For this reason, unlike projection welding, the magnetic detection member is prevented from tilting due to welding, and the magnetic detection member is prevented from sinking due to penetration, and the magnetic detection member is connected to the terminal at a predetermined position with high accuracy. be able to. Further, in the case of projection welding, since the projection formed on the terminal can be abolished, a processing step (for example, press processing) related to the formation of the projection can be omitted, and the cost can be reduced. The tip surface of the ground electrode is a flat surface facing the terminal, and the tip surface of the welding electrode is formed as a convex surface having an inclined surface that comes into surface contact with the lead by deformation due to welding of the lead. Therefore, the lead and the terminal of the magnetic detection member can be reliably welded while being resistance welding.

1 is a cross-sectional view showing a throttle control device according to Embodiment 1. FIG. It is a perspective view which shows the cover of a throttle control apparatus. It is sectional drawing which shows the peripheral part of a rotation angle sensor. It is a perspective view which shows a rotation angle sensor. It is a front view which shows the sensor main body of a rotation angle sensor. It is a top view which shows the sensor main body of a rotation angle sensor. It is a bottom view which shows the sensor main body of a rotation angle sensor. It is a left view which shows the sensor main body of a rotation angle sensor. It is a front sectional view showing a sensor body of a rotation angle sensor. It is a front sectional view showing the peripheral part of the sensing part of the magnetoelectric conversion IC of the sensor body of the rotation angle sensor. It is a XI-XI line sectional view taken on the line of FIG. It is XII-XII sectional view taken on the line of FIG. It is a perspective view which shows a magnetoelectric conversion IC assembly. It is a perspective view which decomposes | disassembles and shows a magnetoelectric conversion IC assembly. It is a front view which shows a magnetoelectric conversion IC. It is a front sectional view showing a mold in a mold clamping state. It is a front sectional view showing a mold in a mold open state. It is a front view which shows the 1st holding | maintenance type | mold of a lower mold | type. It is a left view which shows the 1st holding | maintenance type | mold of a lower mold | type. It is a top view which shows the 1st holding | maintenance type | mold of a lower mold | type. FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 20. FIG. 21 is a cross-sectional view taken along line XXII-XXII in FIG. 20. It is a front sectional view showing a state where a magnetoelectric conversion IC assembly is set in a lower mold. It is a left view which shows the state which set the magnetoelectric conversion IC assembly to the lower mold | type. It is a top view which shows the state which set the magnetoelectric conversion IC assembly to the lower mold | type. It is a front sectional view showing a welding state of the lead of the magnetoelectric conversion IC and the sensor terminal. It is a top view which shows the relationship between the jig concerning welding and a sensing part. It is sectional drawing which shows the welding part of the lead | read | reed of a magnetoelectric conversion IC, and a sensor terminal. It is a perspective view which shows the front-end | tip part of a welding electrode. It is a front sectional view which shows the welding state of the lead | read | reed of the magnetoelectric conversion IC concerning a projection welding, and a sensor terminal. It is sectional drawing which shows the welding part of the lead | read | reed of the magnetoelectric conversion IC concerning a projection welding, and a sensor terminal. It is a front view which shows the magnetoelectric conversion IC after welding. 6 is a front view showing a first holding mold of a lower mold according to Embodiment 2. FIG. It is a left view which shows the 1st holding | maintenance type | mold of a lower mold | type. It is a top view which shows the 1st holding | maintenance type | mold of a lower mold | type. FIG. 36 is a cross-sectional view taken along line XXXVI-XXXVI in FIG. 35. FIG. 36 is a cross-sectional view taken along line XXXVII-XXXVII in FIG. 35.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[Embodiment 1]
Embodiment 1 will be described. This embodiment exemplifies a method of manufacturing a rotation angle sensor used as a non-contact type throttle position sensor for detecting the rotation angle, that is, the opening degree of a throttle valve in an electronically controlled throttle control device mounted on a vehicle such as an automobile. To do. For convenience of description, the throttle control device, the rotation angle sensor, and the rotation angle sensor manufacturing method will be described in this order.

The throttle control device will be described. FIG. 1 is a sectional view showing a throttle control device. The throttle control device will be described with reference to the vertical and horizontal directions in FIG.
As shown in FIG. 1, the throttle control device 10 includes a throttle body 12. The throttle body 12 is made of, for example, aluminum and has a bore wall portion 14. The bore wall portion 14 is formed in a hollow cylindrical shape extending in the front-rear direction (the front and back direction in FIG. 1). A bore 13 as an intake passage is formed in the bore wall portion 14. Further, a metal throttle shaft 16 that crosses the bore 13 in the radial direction, that is, the left-right direction is disposed on the bore wall portion 14. The throttle shaft 16 is rotatably held via bearings (reference numerals omitted) with respect to bearing portions 15 formed on both left and right side portions of the bore wall portion 14. Further, a butterfly valve type throttle valve 18 having a disk shape is fastened to the throttle shaft 16 by a screw 18s. The throttle valve 18 opens and closes the bore 13 by rotating integrally with the throttle shaft 16. Although not shown, an air cleaner is connected to the upstream side of the bore wall portion 14, and an intake manifold is connected to the downstream side of the bore wall portion 14.

  The right end portion of the throttle shaft 16 passes through the right bearing portion 15 of the throttle body 12. A throttle gear 22 is attached to the right end portion of the throttle shaft 16 protruding from the bearing portion 15 in a non-rotating state. For this reason, the throttle gear 22 rotates integrally with the throttle shaft 16 and the throttle valve 18. Further, the throttle gear 22 is made of, for example, resin, and has an inner cylinder part 22e and an outer cylinder part 22f that form a double cylinder. The inner cylinder portion 22e is concentric with the throttle shaft 16. A fan-shaped gear portion 22w is formed on the outer peripheral portion of the outer cylindrical portion 22f. Further, a back spring 26 made of a coil spring is interposed between the opposing surfaces of the throttle gear 22 and the throttle body 12. The back spring 26 always urges the throttle gear 22 in the closing direction.

  A motor housing portion 17 that is parallel to the throttle shaft 16 is formed integrally with the lower portion of the throttle body 12. The motor housing portion 17 is formed in a bottomed cylindrical shape having an opening on the right end surface. A drive motor 28 made of, for example, a DC motor is disposed in the motor housing portion 17. The drive motor 28 is driven and controlled by a signal output from an engine control unit so-called ECU (not shown) based on the depression amount of an accelerator pedal of an automobile or the like. A pinion gear 29 is attached to an output rotation shaft (not shown) protruding rightward from the drive motor 28 in a non-rotating state.

  On the right side surface of the throttle body 12, a counter shaft 23 that is parallel to the throttle shaft 16 is provided. A counter gear 24 is rotatably held on the counter shaft 23. The counter gear 24 has two large and small gear portions 24a and 24b having different gear diameters. The large diameter side gear portion 24 a is meshed with the pinion gear 29. The small-diameter side gear portion 24b is meshed with the throttle gear 22 (specifically, the gear portion 22w). Therefore, the rotational driving force of the drive motor 28 is transmitted to the throttle shaft 16 via the pinion gear 29, the counter gear 24, and the throttle gear 22. As the throttle shaft 16 rotates, the throttle valve 18 rotates, that is, is opened and closed, whereby the amount of intake air flowing through the bore 13 is adjusted. The pinion gear 29, the counter gear 24, and the throttle gear 22 constitute a reduction gear mechanism 21.

  A cylindrical yoke 33 and a pair of permanent magnets 35 disposed on the inner side of the yoke 33 are integrally provided on the inner peripheral portion of the inner cylinder portion 22e of the throttle gear 22 (see FIG. 3). . FIG. 3 is a cross-sectional view showing the periphery of the rotation angle sensor. The yoke 33 is made of a magnetic material. The pair of permanent magnets 35 is made of, for example, a ferrite magnet, and is magnetized in parallel so as to generate a magnetic field substantially parallel to each other, that is, to a hollow cylindrical space in the inner cylindrical portion 22e, that is, a magnetic field space. The permanent magnet 35 corresponds to a “field member” in the present specification.

  As shown in FIG. 1, a cover 30 that covers the reduction gear mechanism 21 is attached to the right side surface of the throttle body 12. The cover 30 is made of, for example, resin, and a rotation angle sensor 40 for detecting the rotation angle of the throttle gear 22, that is, the opening degree of the throttle valve 18, is integrated by insert molding. The throttle gear 22 corresponds to the “rotary member” in this specification. The rotation angle sensor 40 corresponds to a “rotation detection device” in this specification. The cover 30 corresponds to “fixed side member”, “component with rotation angle sensor”, and “component with rotation detection device” in this specification. The cover 30 will be described later.

Next, the rotation angle sensor 40 will be described. 4 is a perspective view showing a rotation angle sensor, FIG. 5 is a front view showing a sensor body of the rotation angle sensor, FIG. 6 is a plan view, FIG. 7 is a bottom view, FIG. 8 is a left side view, and FIG. Similarly, it is a front sectional view. For convenience of explanation, the rotation angle sensor 40 will be described with reference to the top, bottom, left, and right in FIG.
As shown in FIG. 9, the rotation angle sensor 40 includes two magnetoelectric conversion ICs 41, a plurality of (for example, four) sensor terminals 42 made of a metal plate, and a resin made by embedding or embedding both magnetoelectric conversion ICs 41. The mold resin member 46 is provided. The four sensor terminals 42 are collectively referred to as a “sensor terminal group 42”. In addition, the sensor main body 50 is configured by the two magnetoelectric conversion ICs 41, the group of sensor terminals 42, and the mold resin member 46. Hereinafter, it demonstrates in order.

The magnetoelectric conversion IC 41 will be described. FIG. 15 is a front view showing a magnetoelectric conversion IC. FIG. 15 shows the magnetoelectric conversion IC 41 before bending. The magnetoelectric conversion IC 41 will be described with reference to the top, bottom, left and right in FIG.
As shown in FIG. 15, the magnetoelectric conversion IC 41 includes a sensor IC using, for example, a ferromagnetic magnetoresistive element (MRE). The magnetoelectric conversion IC 41 has a horizontally long rectangular plate-shaped sensing unit 52, a vertically long rectangular plate-shaped signal calculation unit 54, and a plurality (for example, six) of electrically connecting the sensing unit 52 and the signal calculation unit 54 up and down. It has a strip plate-like connection terminal 56 and a plurality of (for example, three) strip plate-like leads 58 that are electrically drawn from the opposite side (ie, the lower side) of the signal calculation unit 54 to the connection terminal 56. ing.

  The sensing unit 52 is made of resin in a state in which a rectangular plate-shaped bridge channel portion 52a made of a ferromagnetic magnetoresistive element is disposed on the central portion in the longitudinal direction of a metal strip-shaped holding plate 52b. The rectangular plate-like outer shell member 52c is molded or embedded in the central portion. The holding plate 52b extends in a direction (left-right direction) orthogonal to the arrangement direction (up-down direction) of the sensing unit 52 and the signal calculation unit 54, and both end portions thereof protrude from both side surfaces of the outer shell member 52c. The bridge channel portion 52a corresponds to the “detector” in this specification. Further, the thickness direction of the sensing unit 52 (the front and back direction in FIG. 15) corresponds to the “thickness direction” in this specification.

  The signal calculation unit 54 is formed by embedding a semiconductor integrated circuit (not shown) in the center of a resin-made square plate-shaped outer shell member 54a. The outer shell members 52c and 54a of the sensing unit 52 and the signal calculation unit 54 are formed with the same outer shape in the arrangement direction (vertical direction). In addition, the outer shell member 54 a of the signal calculation unit 54 is formed longer in the arrangement direction (vertical direction) of the sensing unit 52 and the signal calculation unit 54 than the outer shell member 52 c of the sensing unit 52.

  The six connecting terminals 56 are orthogonal to the direction in which the sensing unit 52 and the signal calculation unit 54 are arranged on a single plane located at the center in the thickness direction (front-rear direction) of the sensing unit 52 and the signal calculation unit 54. They are arranged in parallel to each other at a predetermined interval in the (left-right direction). The three leads 58 are arranged in parallel on the one plane in a direction (left-right direction) orthogonal to the arrangement direction of the sensing unit 52 and the signal calculation unit 54 with a predetermined interval therebetween. The plate thickness direction of each connecting terminal 56 and lead 58 is directed in the same direction as the thickness direction of the sensing unit 52 and the signal calculation unit 54, that is, the front-rear direction (the front and back direction in FIG. 15). The six connection terminals 56 are collectively referred to as a “connection terminal 56 group”. The three leads 58 are collectively referred to as a “lead 58 group”.

The connecting terminal 56 group in the magnetoelectric conversion IC 41 (see FIG. 15) before the bending process is subjected to a bending process to be bent into an L shape. FIG. 14 shows the magnetoelectric conversion IC 41 that has been subjected to bending. FIG. 14 is an exploded perspective view showing the magnetoelectric conversion IC assembly.
As shown in FIG. 14, in the magnetoelectric conversion IC 41, the sensing unit 52 and the signal calculation unit 54 form a right angle, that is, an L shape, by bending the connecting terminal 56 group. Further, the lead 58 group is subjected to a bending process in which it is bent into an L shape in the direction opposite to the bending direction of the connecting terminal 56 group. The magnetoelectric conversion IC 41 thus subjected to the bending process corresponds to a “magnetic detection member” in the present specification.

  As shown in FIG. 14, two magnetoelectric conversion ICs 41 are prepared. The two magnetoelectric conversion ICs 41 are arranged facing each other in the left-right direction, with the sensing units 52 overlapped with each other, that is, vertically. In the present embodiment, the sensing unit 52 of the right magnetoelectric conversion IC 41 is overlaid on the sensing unit 52 of the left magnetoelectric conversion IC 41 (see FIG. 9). In the present embodiment, two magnetoelectric conversion ICs 41 are used in consideration of fail-safe. Even if one of the magnetoelectric conversion ICs 41 breaks down, the remaining magnetoelectric conversion ICs 41 can ensure the detection function. Has been. Further, as will be described later, the two magnetoelectric conversion ICs 41 are held in place by being molded with resin (mold resin member 46) in a state where the two magnetoelectric conversion ICs 41 are connected to the sensor terminal group 42 (FIG. 9). reference).

  Next, the sensor terminal group 42 will be described. As shown in FIG. 14, the sensor terminal group 42 is arranged on a horizontal plane. The plate thickness direction (thickness direction) of the sensor terminals 42 group is directed in the vertical direction. In the group of sensor terminals 42, the sensor terminal 42 (labeled with (a)) is a power terminal, the sensor terminal 42 (labeled with (b)) is a grounding terminal, and the sensor terminal 42 (marked (c)). 2) and the sensor terminal 42 (labeled with (d)) are set as signal output terminals, respectively. Each sensor terminal 42 corresponds to a “terminal” in this specification.

  The terminal portions 42a on the connector side of the group of sensor terminals 42 are arranged in parallel at a predetermined distance from each other in the left-right direction at the right rear portion. The terminal part on the IC connection side of the sensor terminal group 42 is referred to as a terminal part 42b.

  As shown in FIG. 7, the power sensor terminal 42 (a) has a terminal portion 42b on the IC connection side branched in a bifurcated shape, and both the terminal portions 42b are opposed to each other in the left-right direction. Is formed. The grounding sensor terminal 42 (b) has an IC connection-side terminal portion 42b branched in a bifurcated shape, and the tip end portion is formed in a reciprocal shape in the left-right direction. Both terminal portions 42b of the grounding sensor terminal 42 (b) are arranged in parallel at a predetermined interval on the front side (upper side in FIG. 7) of the both terminal portions 42b of the power supply sensor terminal 42 (a). The signal output sensor terminals 42 (c) and 42 (d) each have a terminal portion 42b on the IC connection side, and the both terminal portions 42b are formed to face each other in the left-right direction. Yes. Both terminal portions 42b of both signal output sensor terminals 42 (c) and 42 (d) are arranged in parallel at a predetermined interval on the front side (upper side in FIG. 7) of both terminal portions 42b of the grounding sensor terminal 42 (b). Arranged in a shape.

  As shown in FIG. 14, each terminal portion 42b on the IC connection side of the group of sensor terminals 42b is bent into a stepped so-called Z-shape so that the terminal portion on the connector side of the sensor terminal group 42 It is arranged at a position higher than that of the main body (including reference numeral 42c) including 42a (see FIG. 9). The portion extending in the vertical direction by the Z-shaped bending of the base end portion of each terminal portion 42b on the IC connection side of the sensor terminal 42 group is referred to as a rising portion (reference numeral 42d). Further, the three terminal portions 42b arranged in the front-rear direction (the front and back direction in FIG. 9) on the right side are arranged at higher positions than the three terminal portions 42b arranged in the front-rear direction on the left side. That is, the rising portion 42d of each terminal portion 42b on the right side has a height that is higher than the height of the rising portion 42d of each terminal portion 42b on the left side.

  Prior to the connection of the two magnetoelectric conversion ICs 41, the adjacent sensor terminals 42 are connected to each other via tie bars 45 (see FIG. 14). Then, after the molding resin member 46 is formed after the two magnetoelectric conversion ICs 41 are connected, each tie bar 45 is removed as an unnecessary portion, so that each sensor terminal 42 is separated to be an electrically independent terminal. (See FIGS. 4 and 7).

  Leads 58 of the two magnetoelectric conversion ICs 41 are respectively arranged on the terminal part 42b on the IC connection side of the group of sensor terminals 42 and fixedly connected by welding (see FIG. 13). FIG. 13 is a perspective view showing a magnetoelectric conversion IC assembly. An assembly of both the magnetoelectric conversion IC 41 and the sensor terminal group 42 is referred to as a magnetoelectric conversion IC assembly 59. A method of welding the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42b on the IC connection side of the sensor terminal 42 group will be described later.

  Next, the mold resin member 46 will be described. As shown in FIG. 9, the mold resin member 46 is a resin that molds or embeds both the magnetoelectric conversion ICs 41 of the magnetoelectric conversion IC assembly 59 (see FIG. 13). Both magnetoelectric conversion ICs 41 are held at predetermined positions by the molding resin member 46. 10 is a front sectional view showing a peripheral portion of the sensing part of the magnetoelectric conversion IC of the sensor body of the rotation angle sensor, FIG. 11 is a sectional view taken along line XI-XI in FIG. 10, and FIG. 12 is a line XII-XII in FIG. It is arrow sectional drawing.

  As shown in FIG. 10, the bridge channel part 52a of the sensing part 52 of both the magnetoelectric conversion ICs 41 is disposed concentrically (see the axis L in FIG. 10). Further, the holding plates 52b of both sensing parts 52 are arranged in parallel in the vertical direction. In addition, both signal calculation units 54 are arranged in parallel on the left and right sides at a predetermined interval. In the present embodiment, the bridge channel portion 52a of the lower sensing portion 52 is disposed on the upper side of the holding plate 52b and the bridge channel portion 52a of the upper sensing portion 52 is held. It arrange | positions under the board 52b. The bridge channel portion 52a of the lower sensing unit 52 may be disposed below the holding plate 52b, and the bridge channel portion 52a of the upper sensing unit 52 is disposed above the holding plate 52b. Also good.

  As shown in FIG. 9, the mold resin member 46 is formed in a cylindrical shape concentric with the bridge channel portion 52a of the sensing portion 52 of both magnetoelectric conversion ICs 41 (see axis L in FIG. 9). In addition, a frustoconical tip convex portion 60 having a small diameter at the upper end side (tip side) is formed at the upper end portion of the mold resin member 46 (see FIGS. 5 and 8). A pair of left and right pedestals 61 formed of a plane orthogonal to the axis L are formed symmetrically at the center in the vertical direction on the conical slope of the tip convex portion 60. The pedestal 61 is formed in an oval shape extending in the radial direction (left-right direction) of the tip convex portion 60 (see FIG. 6). Further, the pedestal 61 is formed across the conical slope of the tip convex portion 60 in the radial direction.

  A hollow first cavity 63 is formed at the center of the lower surface of the mold resin member 46. In the first cavity 63, the opposite side surfaces of the signal calculation unit 54 (specifically, the outer shell member 54a) of both the magnetoelectric conversion ICs 41 are exposed. In addition, a part of the lower surface of the sensing unit 52 located on the lower side of the sensing units 52 of both the magnetoelectric conversion ICs 41 is partially exposed in the first cavity 63. Specifically, as shown in FIGS. 10 to 12, the upper end of the first cavity 63 has a hollow cylindrical first hollow hole 63 a that exposes the center of the lower surface of the sensing unit 52, and the sensing unit 52. A hollow semi-cylindrical second hollow hole portion 63b that exposes both front and rear end portions of the lower surface of the sensor, and a hollow wide-angle cylindrical third hollow hole portion 63c that exposes both front and rear side portions of the sensing portion 52 are formed symmetrically in the front-rear direction. Has been. The periphery of these hollow hole portions 63a, 63b, and 63c is embedded with a mold resin member 46 (see hatching in FIGS. 10 to 12).

  As shown in FIG. 9, a hollow second cavity 65 is formed on the left side of the lower surface of the mold resin member 46. In the second cavity portion 65, the lower surface of the three terminal portions 42b arranged on the left side of the terminal portions 42b on the IC connection side of the group of sensor terminals 42, and the side surface of the rising portion 42d continuous with the lower surface are exposed. (See FIGS. 7 and 9). A hollow third cavity 67 is formed on the left side of the lower surface of the mold resin member 46. In the third cavity 67, the lower surface of the three terminal portions 42b arranged on the right side of the terminal portions 42b on the IC connection side of the group of sensor terminals 42, and the side surface of the rising portion 42d continuous with the lower surface are exposed. (See FIGS. 7 and 9). A method for molding the mold resin member 46 will be described later.

  Next, the cover 30 will be described. FIG. 2 is a perspective view showing a cover of the throttle control device. As shown in FIG. 2, the rotation angle sensor 40 (see FIG. 4) is integrated with a cover main body 31 that is a resin portion of the cover 30 by insert molding. A tip end portion (upper end portion in FIG. 4) of the mold resin member 46 of the sensor main body 50 is exposed in a protruding shape at the upper part inside the cover main body 31. A connector-side terminal portion 42a of the group of sensor terminals 42 is exposed in a cylindrical connector portion 31a formed in the lower right portion of the cover body 31 (upper right portion in FIG. 2). Further, the remaining part of the rotation angle sensor 40 is embedded in the cover body 31.

  Two motor terminals 44 (see FIG. 4) are integrated with the cover main body 31 by insert molding together with the rotation angle sensor 40. The two motor terminals 44 are collectively referred to as “motor terminal 44 group”. Further, the connector side terminal portions 44a of the two motor terminals 44 are exposed in the connector portion 31a. The terminal portions 44a are arranged in parallel with the connector-side terminal portions 42a of the group of sensor terminals 42 so as to form a line and at a predetermined interval from each other. Further, the motor-side terminal portions 44b of the motor terminals 44 group are exposed at the lower end portion on the inner side of the cover main body 31 in a state where they are arranged in the front-rear direction (see FIG. 2). Further, the remaining part of the motor terminal group 44 is embedded in the cover body 31. Since the motor terminal 44 does not constitute the rotation angle sensor 40, it is represented by a two-dot chain line 44 in FIG.

  As shown in FIG. 1, the cover 30 is attached to the throttle body 12 so as to cover the reduction gear mechanism 21. Thereby, the mold resin member 46 (specifically, the tip portion) of the sensor main body 50 of the rotation angle sensor 40 is loosely fitted and concentric with the space portion (magnetic field space) of the inner cylinder portion 22e of the throttle gear 22. (See FIG. 3). For this reason, the mold resin member 46 has a non-contact relationship with the inner cylinder portion 22e of the throttle gear 22 (including the permanent magnet 35 and the yoke 33). At the same time, the bridge channel portion 52a of the sensing portion 52 of both magnetoelectric conversion ICs 41 is concentric with the inner cylindrical portion 22e (including the permanent magnet 35 and the yoke 33) of the throttle gear 22 (in FIG. 3, (See axis L). Further, the motor side terminal portion 44b of the motor terminal 44 group in the cover 30 is electrically connected to both terminals 68 of the drive motor 28 (see FIG. 1).

  In the throttle control device 10 (see FIG. 1) described above, an external connector connected to an engine control unit (ECU) (not shown) is connected to the connector portion 31a (see FIG. 2) of the cover 30. When the throttle gear 22 is rotated by driving the drive motor 28, the magnetic change between the pair of permanent magnets 35 generated in the space portion (magnetic field space) of the throttle gear 22 (specifically, the inner cylinder portion 22e), that is, the magnetic flux. The direction of the magnetic flux changes, and the direction of the changed magnetic flux is detected by the sensing unit 52 (specifically, the bridge channel unit 52a) of the magnetoelectric conversion IC 41 of the sensor main body 50 of the rotation angle sensor 40 (see FIG. 3). Are input to both signal calculation sections 54 (specifically, semiconductor integrated circuits). Both signal calculation units 54 (specifically, semiconductor integrated circuits) process detection signals corresponding to the direction of magnetic flux input from both sensing units 52 to generate a linear rotation angle signal (voltage signal) corresponding to the rotation angle. Output to the control unit (ECU). The engine control unit (ECU) calculates the rotation angle of the throttle gear 22, that is, the opening degree of the throttle valve 18, based on the rotation angle signal.

  Next, a method for manufacturing the rotation angle sensor 40, that is, a method for forming the mold resin member 46 of the sensor body 50 will be described. First, a so-called mold that is used when insert-molding both magnetoelectric conversion ICs 41 with a resin (molten resin) that becomes the mold resin member 46 will be described. FIG. 16 is a front sectional view showing the mold in a clamped state, and FIG. 17 is a front sectional view showing the mold in an opened state. For convenience of explanation, the mold will be described with reference to the top, bottom, left and right in FIG. In addition, each direction of the mold corresponds to each direction of the magnetoelectric conversion IC assembly 59.

  As shown in FIG. 17, the mold 70 includes an upper mold 72 and a lower mold 76. In the present embodiment, the upper mold 72 is a fixed mold, and the lower mold 76 is a movable mold. The upper mold 72 is provided with a hollow cylindrical molding recess 73 for molding the remaining outer surface excluding the lower surface of the mold resin member 46 (see FIGS. 5 to 9). In addition, a pair of left and right injection gates 74 are provided on the upper wall portion 72a of the upper mold 72 at a predetermined interval. Specifically, both injection gates 74 are provided at a predetermined interval in the facing direction of both magnetoelectric conversion ICs 41, that is, in the left-right direction. Further, both injection gates 74 correspond to both pedestals 61 (specifically, the central portion) at the upper end portion of the mold resin member 46 (see FIG. 9). Further, both injection gates 74 are formed in a linear shape extending in the vertical direction so as to be orthogonal to both pedestals 61. The upper wall 72 a of the upper mold 72 corresponds to a wall that faces the upper surface of the upper sensing unit 52.

  The lower mold 76 can move back and forth in the vertical direction. That is, the lower mold 76 is clamped by the upward movement with respect to the upper mold 72 and is opened by the downward movement. On the upper surface (mold matching surface) 76a of the lower mold 76, a first holding mold 78 is provided in a protruding shape. 18 is a front view showing a lower first holding mold, FIG. 19 is a left side view, FIG. 20 is a plan view, FIG. 21 is a sectional view taken along line XXI-XXI in FIG. It is a sectional view taken along line XXII-XXII.

  As shown in FIGS. 21 and 22, the first holding die 78 holds both the magnetoelectric conversion ICs 41 of the magnetoelectric conversion IC assembly 59 and is formed in a rectangular column shape having a rectangular section with a long front and rear direction. Has been. A U-shaped groove 80 that opens in the left-right direction is formed at the tip (upper end) of the first holding die 78 (see FIGS. 19 and 20). The groove bottom surface 80 a of the concave groove 80 is formed by a plane orthogonal to the axis (center line) 78 </ b> L of the first holding mold 78. A cylindrical first holding convex portion 84 protrudes from the central portion of the groove bottom surface 80a. The first holding convex portion 84 is formed concentrically with the axis 78 </ b> L of the first holding mold 78. In addition, a semi-cylindrical second holding convex portion 85 is formed symmetrically in the front-rear direction at the corner portion formed by the groove bottom surface 80a of the groove 80 and both groove walls 81 with the plane side as the groove wall 81 side. . The first holding convex portion 84 and both the second holding convex portions 85 are formed at a predetermined interval from each other. Further, the upper surfaces of the first holding convex portion 84 and both the second holding convex portions 85 are formed by a plane orthogonal to the axis 78 </ b> L of the first holding mold 78. In addition, positioning grooves 82 extending in the vertical direction are formed on the opposing wall surfaces of both groove walls 81 (see FIGS. 20 and 22). The upper end surfaces of both positioning grooves 82 are open, and the lower end surfaces thereof are closed by the upper surfaces of both second holding projections 85 (see FIG. 19).

  As shown in FIG. 17, a second holding mold 87 located on the left side of the first holding mold 78 is provided in a protruding manner on the mold mating surface 76 a of the lower mold 76. The second holding mold 87 holds three terminal portions 42b arranged on the left side of the terminal portions 42b on the IC connection side of the sensor terminals 42 group of the magnetoelectric conversion IC assembly 59, and is arranged in the front-rear direction (in FIG. 17). It is formed in a rectangular parallelepiped shape extending in the direction of the paper surface. Further, a third holding die 89 located on the right side of the first holding die 78 is provided on the die matching surface 76a of the lower die 76 so as to protrude. The third holding mold 89 holds three terminal portions 42b arranged on the right side of the terminal portions 42b on the IC connection side of the sensor terminal 42 group of the magnetoelectric conversion IC assembly 59, and is arranged in the front-rear direction (in FIG. It is formed in a rectangular parallelepiped shape extending in the front and back direction. The third holding mold 89 is formed with a height higher than that of the second holding mold 87.

Next, a molding method for molding the mold resin member 46 using the mold 70 will be described. In the mold open state of the mold 70 (see FIG. 17), the magnetoelectric conversion IC assembly 59 is set on the mold mating surface 76a of the lower mold 76. 23 is a front sectional view showing a state where the magnetoelectric conversion IC assembly is set in the lower mold, FIG. 24 is a left side view, and FIG. 25 is a plan view.
That is, as shown in FIG. 23, the first holding mold 78 is relatively inserted between the signal calculation sections 54 of the both magnetoelectric conversion ICs 41, and both the sensing sections 52 are fitted in the concave grooves 80 of the first holding mold 78. (See FIGS. 24 and 25). Thereby, the lower surface of the lower sensing unit 52 is held in surface contact with the upper surfaces of the first holding convex portion 84 and the two second holding convex portions 85 of the first holding mold 78 (see FIG. 23). . Further, the corresponding portion is partially held by the bridge channel portion 52a on the lower surface of the lower sensing portion 52 (specifically, the outer shell member 52c) by the first holding convex portion 84 (see FIG. 21). The first holding convex portion 84 corresponds to a “holding portion” in this specification. Further, the lower surface of the outer shell member 52 c of the lower sensing unit 52 corresponds to one side surface of the sensing unit 52 in the thickness direction.

  Further, as shown in FIG. 25, the front and rear end portions of the holding plates 52b of both sensing portions 52 are engaged with the positioning grooves 82 of the both groove walls 81 of the first holding die 78 from above. Thereby, the holding plate 52b of both the sensing parts 52 is positioned in the front-back direction and the left-right direction. Further, the bridge channel portions 52a (see FIG. 21) of both the sensing portions 52 are positioned concentrically (see the axis L (78L) in FIG. 23). Further, both signal calculation sections 54 (specifically, the outer shell member 54a) are brought into contact with both side surfaces of the first holding mold 78 in a surface contact manner (see FIG. 23).

  As shown in FIG. 23, the second holding mold 87 holds the three terminal portions 42b arranged on the left side of the terminal portions 42b on the IC connection side of the group of sensor terminals 42. Among the terminal portions 42b, the rising portions 42d of the front and rear terminal portions 42b are brought into contact with the left side surface of the second holding mold 87 in a surface contact manner, and the rising portions 42d of the central terminal portion 42b are secondly held. It is brought into contact with the right side surface of the mold 87 in a surface contact manner (see FIG. 25). Further, the third holding mold 89 holds the three terminal portions 42b arranged on the right side of the terminal portions 42b on the IC connection side of the sensor terminals 42 group. Among the terminal portions 42b, the rising portions 42d of the front and rear terminal portions 42b are brought into surface contact with the right side surface of the third holding mold 89, and the rising portions 42d of the central terminal portion 42b are third-held. It is brought into contact with the left side surface of the mold 89 in a surface contact manner (see FIG. 25). Further, the main body portion 42c of the sensor terminal group 42 is brought into contact with the die-matching surface 76a of the lower die 76 in a surface contact manner (see FIGS. 23 and 24).

  As described above, after setting the magnetoelectric conversion IC assembly 59 on the lower mold 76, the mold 70 is clamped, that is, the lower mold 76 is closed to the upper mold 72 (see FIG. 16). Thereby, a cavity 91 corresponding to the mold resin member 46 is formed between the upper mold 72 and the lower mold 76. Further, between the upper mold 72 and the lower mold 76, the peripheral portion of the terminal portion 42b on the IC connection side of the sensor terminal group 42 is sandwiched. In this state, resin (molten resin) is injected into the cavity 91 from both injection gates 74 of the upper mold 72 and filled, whereby the mold resin member 46 is molded.

  At this time, the flow pressure of the resin injected from both injection gates 74 (see arrow Y1 in FIG. 16) is applied in the direction of pressing both sensing units 52 downward, so that both sensing units 52 are in the lower mold 76. The first holding projection 78 is pressed onto the first holding projection 84 and both the second holding projections 85. Thereby, the position shift of both the sensing parts 52 can be prevented. Further, the flow pressure of the resin injected from both injection gates 74 (see arrow Y2 in FIG. 16) is applied in the direction in which both signal calculation units 54 are pressed in the opposite direction, so that both signal calculation units 54 are lower molds. It is pressed against both side surfaces of the first holding die 78 of 76. Thereby, the position shift of both the signal calculating parts 54 can be prevented.

  Further, the first holding convex portion 84 of the first holding die 78 partially holds the center portion of the lower surface of the sensing unit 52 corresponding to the bridge channel portion 52a in the lower sensing unit 52 (FIG. 21). reference). Further, both the front and rear end portions of the lower surface of the lower sensing unit 52 are partially held by both the second holding projections 85 of the first holding die 78 (see FIG. 22). Thereby, while being able to hold | maintain both the sensing parts 52 stably with the mold resin member 46, the part corresponding to the 1st holding | maintenance convex part 84 and the both 2nd holding | maintenance convex part 85 in the lower surface of the lower sensing part 52 Other portions can be filled with resin.

  Further, after the resin is solidified by cooling after the molding resin member 46 is molded, the mold 70 is opened, and the molded product, that is, the rotation angle sensor 40 (see FIGS. 4 to 9) is taken out from the mold 70. Accordingly, as shown in FIG. 9, the first cavity 63 is formed on the lower surface of the mold resin member 46 by the first holding die 78 of the lower die 76 (see FIG. 17). Thus, the second cavity 65 is formed, and the third cavity 67 is also formed by the third holding mold 89. Furthermore, as shown in FIGS. 10 to 12, the first hollow hole portion is formed at the upper end portion of the first cavity portion 63 by the first holding convex portion 84 of the first holding convex portion 84 (see FIGS. 19 and 20). 63a is formed, both second hollow holes 63b are formed by both front and rear second holding projections 85, and both third hollow holes 63c are formed by both front and rear groove walls 81.

  Further, the gate trace protrusions of both injection gates 74 are removed from the mold resin member 46. At this time, both gate trace protrusions are orthogonal to both pedestals 61 of the mold resin member 46, so that the mold resin member 46 is eaten away as compared with the case where the gate trace protrusions are inclined with respect to the pedestal 61. Note that “eating” refers to a phenomenon in which the peripheral portion of the mold resin member 46 is excessively removed together with the removal of the gate trace protrusion.

  Further, after the molding resin member 46 is molded, the tie bars 45 (see FIG. 13) connecting the terminals 42 are removed, so that the terminals 42 are electrically independent from each other. In this way, the rotation angle sensor 40 is completed.

Next, a method of welding the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42b on the IC connection side of the sensor terminal 42 will be described. FIG. 26 is a front sectional view showing a welding state between the lead of the magnetoelectric conversion IC and the sensor terminal, and FIG. 27 is a plan view showing the relationship between the jig for welding and the sensing part.
As shown in FIG. 26, a jig 93 is used for welding the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42 b of the sensor terminal 42. The jig 93 is formed in an L shape having a base part 95 and a column part 97 erected on the base part 95. A U-shaped groove-shaped groove 100 that opens in the left-right direction is formed at the upper end of the support column 97. As shown in FIG. 27, both front and rear positioning groove portions 102 extending in the vertical direction (the front and back direction in FIG. 27) are formed in the front and rear groove wall portions 101 of the concave groove portion 100.

  The sensor terminal 42 is placed on the base portion 95 of the jig 93 (see FIG. 26). In FIG. 26, one of the three terminal portions 42b arranged in the front direction of the drawing is shown on the left side of the terminal portions 42b on the IC connection side of the sensor terminals 42 group. Further, the sensing part 52 of the magnetoelectric conversion IC 41 is fitted into the recessed groove part 100 of the column part 97 of the jig 93. Further, both end portions of the holding plate 52b of the sensing unit 52 are engaged with the positioning groove portion 102 of the groove wall portion 101 of the concave groove portion 100 from above (see FIG. 27). Thereby, the holding plate 52b of the sensing unit 52 is positioned in the front-rear direction and the left-right direction. Further, the outer shell member 54a of the signal calculation unit 54 is brought into close contact with or in contact with the left side surface of the support column 97 (see FIG. 26).

  As shown in FIG. 26, the lead 58 of the magnetoelectric conversion IC 41 is brought into contact with the terminal portion 42 b of the sensor terminal 42 in a surface contact manner. That is, the lead 58 and the terminal portion 42b of the sensor terminal 42 are overlapped with each other on a flat plate. The overlapping portion of the lead 58 and the terminal portion 42b of the sensor terminal 42 corresponds to the “connecting portion” in this specification.

  In addition, the tip surface (upper end surface) of the round bar-shaped ground electrode 104 penetrating the base portion 95 in the vertical direction is brought into contact with the lower surface of the terminal portion 42 b of the sensor terminal 42. The tip surface of the ground electrode 104 is a plane orthogonal to the axis 104L. Further, a round bar-shaped welding electrode 106 disposed so as to face the ground electrode 104 is provided concentrically and movable in the vertical direction, and abuts on the upper surface of the lead 58 during welding. Is done. FIG. 28 is a cross-sectional view showing the welded portion between the lead of the magnetoelectric conversion IC and the sensor terminal, and FIG. 29 is a perspective view showing the tip of the welding electrode.

  As shown in FIG. 28, the front end surface (lower end surface) of the welding electrode 106 is formed on a convex surface 107 that faces the lead 58 and has an inverted mountain shape. Specifically, an inclined surface 108 that is inclined with respect to the axis 106L is formed on the lower end surface of the welding electrode 106, and a ridge line 109 (see FIG. 29) that extends in the front-rear direction is formed near the distal end side of the inclined surface 108. Thus, the tip is rounded into a chamfered shape. The remaining outer peripheral portion of the inclined surface 108 is also rounded into a chamfered shape.

  Then, as shown in FIG. 26, the terminal portion 42 b and the lead 58 are resistance-welded by energizing between the electrodes 104 and 106. That is, as shown in FIG. 28, both the terminals 42b and 58 are joined by the penetration of the welding interface F in the surface contact state between the terminal portion 42b and the lead 58 by resistance welding. Accordingly, a recess 110 corresponding to the convex surface 107 including the inclined surface 108 of the front end surface (lower end surface) of the welding electrode 106 is formed on the upper surface of the lead 58. In the same manner as described above, welding is performed between the lead 58 of the remaining magnetoelectric conversion IC 41 and the terminal portion 42b on the IC connection side of the sensor terminal 42 group.

  According to the manufacturing method of the rotation angle sensor 40 described above, the sensing part 52 (the lower side of the both magnetoelectric conversion ICs 41) is caused by the first holding convex part 84 of the first holding mold 78 of the lower mold 76 of the mold 70 during insert molding. Specifically, the central portion of the lower surface (one side surface in the thickness direction) of the outer shell member 52c is partially held (see FIGS. 21 to 23). As a result, the movement (in particular, the downward movement) of the bridge channel portions 52a in the thickness direction of the two sensing portions 52 due to the flow of the resin at the time of insert molding is prevented. can do. As a result, it is possible to prevent a decrease in detection performance of the bridge channel portion 52a of both sensing units.

  Further, at the time of insert molding, the second holding convex portion 85 of the first holding die 78 of the lower die 76 of the mold 70 is used to lower the lower surface (specifically, the outer shell member 52c) of the sensing portion 52 (specifically, the outer shell member 52c). The front and rear ends of one side surface in the thickness direction are partially held (see FIG. 22). Thereby, the movement (especially the downward movement) of the holding plates 52b in the thickness direction of both sensing parts 52 due to the flow of the resin at the time of insert molding is prevented. This is effective in preventing the movement (in particular, the downward movement) of the bridge channel part 52a in the thickness direction of both sensing parts 52 due to the flow of resin during insert molding. In addition, the 2nd holding | maintenance convex part 85 should just be provided as needed, and may be abbreviate | omitted.

  Moreover, resin can be filled in the part other than the center part of the part corresponding to the bridge channel part 52a in the lower surface of the lower sensing part 52 and the front and rear ends (see FIGS. 10 to 12). Thereby, since the lower surface of the lower sensing part 52 is partially covered by the mold resin member 46, the sensing part 52 can be stably held by the mold resin member 46. For example, when the lower surface of the lower sensing unit 52 is entirely held by the first holding convex portion 84 of the first holding die 78 of the lower mold 76 of the mold 70, the lower surface of the lower sensing unit 52 is Since the resin part to be covered is not formed, it is difficult to stably hold the lower sensing part 52 by the mold resin member 46, but as described above, the bridge channel on the lower surface of the lower sensing part 52 The sensing portion 52 can be stably held by the mold resin member 46 by filling the portion corresponding to the portion 52a and the portions other than the central portions of the front and rear end portions.

  In addition, the cover 30 (see FIG. 2) of the first cavity 63 formed in the mold resin member 46 by the first holding projections 84 of the first holding mold 78 of the lower mold 76 of the mold 70 will be described later. In the case where the resin (molten resin) of the cover body 31 is filled, the lower surface of the lower sensing portion 52 passes through the first hollow hole portion 63a, the second hollow hole portion 63b, and the third hollow hole portion 63c. It is only partially exposed to the cavity (see FIG. 12). For this reason, unlike the case where the lower surface of the lower sensing portion 52 is entirely exposed, the pressure receiving area (the area exposed to the cavity) of the cover body 31 during resin molding is small, and therefore the lower side The stress applied to the sensing unit 52 can be reduced. At the same time, a portion other than the portion corresponding to the bridge channel portion 52 a on the lower surface of the lower sensing portion 52 is held by the mold resin member 46. For this reason, at the time of resin molding of the cover main body 31, it is possible to prevent the deformation of the lower surface due to the stress applied to the lower sensing portion 52. Thereby, the fall of the detection performance of the bridge channel part 52a of a sensing part can be prevented.

  In addition, the sensing unit 52 of the both magnetoelectric conversion ICs 41 has a first holding projection of the first holding mold 78 of the lower mold 76 of the lower mold 76 on one side, that is, the lower surface, located on the signal calculation unit 54 side of the lower sensing unit 52. The injection gate 74 provided on the upper wall 72a of the upper mold 72 of the mold 70 that is partially held by the section 84 and is opposed to the other side surface, that is, the upper surface of the sensing section 52 opposite to the signal calculation section 54 side. This is a method of injecting resin from (see FIG. 16). Accordingly, since the resin is injected from the injection gate 74 in the vicinity of the upper sensing unit 52, for example, an injection gate disposed on the opposite side of the sensing unit 52 of the magnetoelectric conversion IC 41 (for example, an injection gate provided in the lower mold 76). Compared with the case of injecting the resin from the resin, variation in resin flow and molding shrinkage are reduced, and molding distortion of both sensing parts 52 can be prevented.

  Further, two magnetoelectric conversion ICs 41 are used, and in the mold 70, both the magnetoelectric conversion ICs 41 face each other and the sensing unit 52 is arranged so as to overlap each other, and the thickness direction of the sensing unit located on the lower side One side or bottom surface of the mold 70 is partially held by the first holding convex portion 84 of the first holding die 78 of the lower die 76 of the mold 70, and the other side of the upper sensing unit 52 is opposed to the other side or top surface of the mold 70. This is a method of injecting resin from a pair of left and right injection gates 74 provided on the upper wall portion 72a of the upper mold 72 and arranged at a predetermined interval from each other (see FIG. 16). Therefore, since the resin is injected by a plurality of injection gates 74, so-called multipoint gates, the gate cross-sectional area can be increased and the pressure loss can be reduced. Thereby, molding can be stabilized and molding distortion of both sensing parts 52 can be prevented. In addition, by arranging the pair of left and right injection gates 74 at a predetermined interval from each other, the two magnetoelectric conversion ICs 41 can be filled with resin in a balanced manner.

  Further, the connecting portion of the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42b on the IC connection side of the group of sensor terminals 42 are superposed on each other, the welding electrode 106 is brought into contact with the lead 58, and the terminal portion of the sensor terminal 42 Resistance welding is performed by energizing both electrodes 104 and 106 with the ground electrode 104 in contact with 42b (see FIG. 26). The front end surface of the ground electrode 104 is formed in a plane that is in surface contact with the terminal portion 42 b of the sensor terminal 42, and the front end surface of the welding electrode 106 is an inclined surface 108 that is in surface contact with the lead 58 due to deformation due to welding of the lead 58. (See FIG. 28). Accordingly, the welding interface F (see FIG. 28) becomes flat because resistance welding is performed by overlapping the connecting portions of the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42b of the sensor terminal 42 with each other. For this reason, unlike projection welding, the magnetoelectric conversion IC 41 is prevented from tilting due to welding, and the magnetoelectric conversion IC 41 is prevented from sinking due to penetration, so that the magnetoelectric conversion IC 41 is accurately placed in a predetermined position on the sensor terminal 42 in a predetermined position. Can be connected.

This point will be supplemented. When the terminal portion 42b of the sensor terminal 42 is connected to the lead 58 of the magnetoelectric conversion IC 41, it is generally performed by projection welding. FIG. 30 is a front sectional view showing a welded state between the lead of the magnetoelectric conversion IC and the sensor terminal for projection welding, and FIG. 31 is a sectional view showing the welded portion.
As shown in FIG. 30, in the case of projection welding, a hemispherical projection, so-called projection 111 (see FIG. 31) is formed on the terminal portion 42b of the sensor terminal 42 by press molding. The sensor terminal 42 and the magnetoelectric conversion IC 41 are set on the jig 93 in the same manner as described above. Further, the lead 58 of the magnetoelectric conversion IC 41 is brought into contact with the projection 111 of the terminal portion 42 b of the sensor terminal 42. Further, the front end surface (upper end surface) of the ground electrode 104 is a plane orthogonal to the axis 104L and is in contact with the lower surface of the terminal portion 42b, as described above. In addition, the front end surface (lower end surface) of the welding electrode 106 is a plane orthogonal to the axis 106 </ b> L and is in contact with the upper surface of the lead 58. And by supplying with electricity between both electrodes 104 and 106, the terminal part 42b of the sensor terminal 42 and the lead 58 of the magnetoelectric conversion IC 41 are resistance-welded. That is, as shown in FIG. 31, both the terminals 42 b and 58 are joined by melting of the point contact welding interface Fa between the terminal portion 42 b and the lead 58 by resistance welding.

  FIG. 32 is a front view showing the magnetoelectric conversion IC after welding. In FIG. 32, a solid line 41 indicates a magnetoelectric conversion IC by resistance welding, and a two-dot chain line 41 indicates a magnetoelectric conversion IC by projection welding. Further, in FIG. 32, symbol H indicates the height of the sensing unit 52, that is, the height of the lower surface of the sensing unit 52 of the magnetoelectric conversion IC 41 with reference to the lower surface of the main body 42 c of the sensor terminal 42. Θ represents the tilt angle of the magnetoelectric conversion IC, that is, the tilt angle of the signal calculation unit 54 that is orthogonal to the lower surface of the main body 42c and that is based on one side in the thickness direction of the signal calculation unit 54 of the magnetoelectric conversion IC 41. ing. Moreover, in the magnetoelectric conversion IC 41 after welding, it is desirable that the inclination angle θ is 0 (zero) ° or substantially 0 (zero) ° without the height H of the sensing unit 52 varying. The lower surface of the sensing unit 52 is preferably parallel or substantially parallel to the lower surface of the main body 42c of the sensor terminal 42.

  By the way, according to the magnetoelectric conversion IC 41 that is projection welded to the terminal portion 42b of the sensor terminal 42 (see the two-dot chain line 41 in FIG. 32), the magnetoelectric conversion IC 41 that is resistance welded to the terminal portion 42b of the sensor terminal 42 (in FIG. 32). , The inclination angle θ is large, and the height H of the sensing unit 52 varies. This is because, according to projection welding (see FIG. 31), the lead 58 is tilted or submerged due to the penetration of the point contact welding interface Fa.

  However, according to the magnetoelectric conversion IC 41 (see solid line 41 in FIG. 32) resistance-welded to the terminal portion 42b of the sensor terminal 42, the welding interface F ( 28) is a flat surface, it is possible to prevent the lead 58 from tilting or sinking. For this reason, variation in the height H of the sensing unit 52 can be prevented, and the tilt angle θ can be set to 0 (zero) ° or substantially 0 (zero) °. Therefore, the magnetoelectric conversion IC 41 can be accurately connected to the sensor terminal 42 at a predetermined position in a predetermined posture.

  Moreover, in the case of projection welding, the projection 111 (refer FIG. 31) formed in the terminal part 42b of the sensor terminal 42 can be abolished. For this reason, the process (for example, press work) concerning formation of projection 111 can be omitted, and cost can be reduced.

  The tip surface of the ground electrode 104 is a flat surface facing the terminal portion 42 b of the sensor terminal 42, and the tip surface of the welding electrode 106 has an inclined surface 108 that comes into surface contact with the lead 58 due to deformation of the lead 58 due to welding. It is formed on the convex surface 107. Therefore, the lead 58 of the magnetoelectric conversion IC 41 and the terminal portion 42b of the sensor terminal 42 can be reliably welded while being resistance welding.

[Embodiment 2]
A second embodiment will be described. Since the present embodiment is a modification of the first holding mold 78 in the lower mold 76 of the mold 70 of the first embodiment, the modified portion will be described and redundant description will be omitted. 33 is a front view showing a lower first holding mold, FIG. 34 is a left side view, FIG. 35 is a plan view, FIG. 36 is a sectional view taken along the line XXXVI-XXXVI in FIG. 35, and FIG. It is XXXVII-XXXVII sectional view taken on the line.
As shown in FIGS. 33 to 37, in the present embodiment, the first holding convex portion 84 and the second holding convex portions 85 of the first holding mold 78 (see FIGS. 18 to 22) in the first embodiment are This is a change to the holding convex portion 112. The holding convex portion 112 is formed in a cross shape in plan view on the groove bottom surface 80a of the concave groove 80 (see FIG. 35). The upper surface of the holding convex portion 112 is formed by a plane orthogonal to the axis (center line) of the first holding die 78. As shown in FIG. 35, the holding convex portion 112 includes a first convex portion 113 extending in the front-rear direction and having both end portions connected to both groove walls 81 of the concave groove 80, and a first convex portion extending in the left-right direction. And a second ridge 114 that intersects at the center of the portion 113. The intersecting portion (reference numeral 115) of the two ridge portions 113 and 114 corresponds to the bridge channel portion 52a in the sensing portion 52 of the magnetoelectric conversion IC 41, so that the sensing portion 52 (specifically, the outer shell member 52c). The lower surface is partially retained (see FIGS . 36 and 37 ). Moreover, the 1st protruding item | line part 113 hold | maintains partially the lower surface of the sensing part 52 (specifically outer shell member 52c) by respond | corresponding to the holding plate 52b in the sensing part 52 of the magnetoelectric conversion IC41. The holding convex portion 112 corresponds to a “holding portion” in this specification .

  The present invention is not limited to the above-described embodiment, and modifications can be made without departing from the gist of the present invention. For example, in the embodiment, two magnetoelectric conversion ICs 41 are used, but one magnetoelectric conversion IC 41 may be used. Moreover, the shape of the holding part (the 1st holding convex part 84, the holding convex part 112) of the 1st holding type | mold 78 of the lower mold | type 76 is not limited to the said embodiment, It can change suitably. In the present embodiment, one injection gate 74 is provided on each of the left and right sides, but a plurality of injection gates 74 may be provided on each of the left and right sides. Further, the injection gate 74 may be plural if necessary, and may be one. Even in the case of one injection gate, the flow pressure of the resin is arranged so as to act in the direction in which the sensing unit 52 and the signal calculation unit 54 of the magnetoelectric conversion 1C41 are pressed against the first holding mold 78 of the lower mold 76, respectively. Good. Further, the shape of the convex surface 107 of the ground electrode 104 is not limited to the above embodiment, and can be changed as appropriate.

10 ... Throttle control device 22 ... Throttle gear (rotary member)
30 ... Cover (fixed side member, component with rotation angle sensor, component with rotation detector)
40 ... Rotation angle sensor (rotation detection device)
41. Magnetoelectric conversion IC (magnetic detection member)
42 ... Sensor terminal (terminal)
46 ... Mold resin member 52 ... Sensing part 52a ... Bridge channel part (detector)
54 ... Signal operation unit 58 ... Lead 59 ... Magnetic-electric conversion IC assembly 70 ... Mold 72 ... Upper die 72a ... Upper wall (wall)
74 ... Injection gate 76 ... Lower mold 78 ... First holding mold 84 ... First holding convex part (holding part)
DESCRIPTION OF SYMBOLS 104 ... Earth electrode 106 ... Welding electrode 108 ... Inclined surface 107 ... Convex surface 112 ... Holding convex part (holding part)

Claims (4)

A sensing unit in which a detection body for detecting a change in magnetism associated with the rotation of the rotation side member is embedded, and a signal for performing a calculation based on an output signal of the detection body of the sensing unit and outputting a signal corresponding to the change in magnetism In a rotation detection device comprising a calculation unit, wherein the sensing unit and the signal calculation unit use an L-shaped magnetic detection member, and the magnetic detection member is molded with resin, the magnetic detection unit A method of manufacturing a rotation detection device for forming a mold resin member for molding the magnetic detection member by arranging a detection member in a mold and performing insert molding with a resin,
The mold is provided with a holding portion that partially holds a portion corresponding to the detection body of one side surface in the thickness direction of the sensing portion of the magnetic detection member,
The method of manufacturing a rotation detecting device, wherein the insert molding is performed in a state where a portion corresponding to the detection body on one side surface of the sensing unit of the magnetic detection member is partially held by the holding unit of the mold. . A method for manufacturing the rotation detecting device according to claim 1,
The sensing portion of the magnetic detecting member, the portion corresponding to the detection of the one side is located in the signal operation unit side of the sensing portion is partly held by the holding portion of the mold,
Injecting resin from an injection gate provided on the wall of the mold facing the other side located on the opposite side of the sensing unit from the signal calculation unit and disposed at a position corresponding to the signal calculation unit A method for manufacturing a rotation detecting device. A method for manufacturing the rotation detecting device according to claim 1,
Two magnetic detection members are used,
Placed in the mold in a state where the two magnetic detection members face each other and the sensing units overlap each other,
Wherein the portion corresponding to the detection of the one side is located in the signal operation unit side, of the two sensing portions is partially held by the holding portion of the mold,
The two sensing units are provided on the wall of the mold facing the other side located on the opposite side to the signal computation unit side, and are located at positions corresponding to the two signal computation units with a predetermined distance from each other. Resin is injected from a pair of injection gates arranged. A method of manufacturing a rotation detecting device. It is a manufacturing method of the rotation detecting device according to any one of claims 1 to 3,
The connecting portions of the magnetic detection member lead and the terminal connected to the lead are overlapped with each other on a flat plate, the welding electrode is in contact with the lead, and the ground electrode is in contact with the terminal. Resistance welding is performed by energizing in between,
The tip surface of the ground electrode is formed in a plane that is in surface contact with the terminal,
The method of manufacturing a rotation detecting device, wherein the front end surface of the welding electrode is formed into a convex surface having an inclined surface that comes into surface contact with the lead by deformation due to welding of the lead.

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