JP5893516B2 - 被処理体の処理装置及び被処理体の載置台 - Google Patents

被処理体の処理装置及び被処理体の載置台 Download PDF

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Publication number
JP5893516B2
JP5893516B2 JP2012140550A JP2012140550A JP5893516B2 JP 5893516 B2 JP5893516 B2 JP 5893516B2 JP 2012140550 A JP2012140550 A JP 2012140550A JP 2012140550 A JP2012140550 A JP 2012140550A JP 5893516 B2 JP5893516 B2 JP 5893516B2
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JP
Japan
Prior art keywords
focus ring
electrostatic chuck
pressing member
processing
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012140550A
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English (en)
Japanese (ja)
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JP2014007215A (ja
Inventor
陽平 内田
陽平 内田
淳 松浦
淳 松浦
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012140550A priority Critical patent/JP5893516B2/ja
Priority to KR1020130071639A priority patent/KR102069773B1/ko
Publication of JP2014007215A publication Critical patent/JP2014007215A/ja
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Publication of JP5893516B2 publication Critical patent/JP5893516B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012140550A 2012-06-22 2012-06-22 被処理体の処理装置及び被処理体の載置台 Expired - Fee Related JP5893516B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012140550A JP5893516B2 (ja) 2012-06-22 2012-06-22 被処理体の処理装置及び被処理体の載置台
KR1020130071639A KR102069773B1 (ko) 2012-06-22 2013-06-21 피처리체의 처리 장치 및 피처리체의 재치대

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012140550A JP5893516B2 (ja) 2012-06-22 2012-06-22 被処理体の処理装置及び被処理体の載置台

Publications (2)

Publication Number Publication Date
JP2014007215A JP2014007215A (ja) 2014-01-16
JP5893516B2 true JP5893516B2 (ja) 2016-03-23

Family

ID=50104706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012140550A Expired - Fee Related JP5893516B2 (ja) 2012-06-22 2012-06-22 被処理体の処理装置及び被処理体の載置台

Country Status (2)

Country Link
JP (1) JP5893516B2 (ko)
KR (1) KR102069773B1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6540022B2 (ja) * 2014-12-26 2019-07-10 東京エレクトロン株式会社 載置台及びプラズマ処理装置
CN105990085B (zh) * 2015-03-03 2018-03-30 中微半导体设备(上海)有限公司 等离子体刻蚀设备、聚焦环及其制作方法
JP6308165B2 (ja) * 2015-04-13 2018-04-11 トヨタ自動車株式会社 プラズマ処理装置
US10153520B2 (en) * 2016-06-01 2018-12-11 Toyota Jidosha Kabushiki Kaisha Manufacturing method for all-solid-state battery, manufacturing apparatus for all-solid-state battery, and all-solid-state battery
JP6146839B1 (ja) * 2016-08-04 2017-06-14 日本新工芯技株式会社 電極用リング
US11195704B2 (en) 2017-03-31 2021-12-07 Beijing E-town Semiconductor Technology Co., Ltd. Pedestal assembly for plasma processing apparatus
CN108735620B (zh) * 2017-04-19 2021-01-08 北京北方华创微电子装备有限公司 一种反应腔室
CN116884825A (zh) * 2017-12-15 2023-10-13 朗姆研究公司 等离子体室中使用的环形结构和系统
JP7055040B2 (ja) * 2018-03-07 2022-04-15 東京エレクトロン株式会社 被処理体の載置装置及び処理装置
JP7101055B2 (ja) * 2018-06-12 2022-07-14 東京エレクトロン株式会社 静電チャック、フォーカスリング、支持台、プラズマ処理装置、及びプラズマ処理方法
KR102096985B1 (ko) * 2018-08-23 2020-04-03 세메스 주식회사 기판 처리장치
JP6681522B1 (ja) * 2018-09-13 2020-04-15 日本碍子株式会社 ウエハ載置装置
JP7145041B2 (ja) * 2018-11-08 2022-09-30 東京エレクトロン株式会社 基板支持器、プラズマ処理装置、及びフォーカスリング
CN109767968B (zh) * 2018-12-17 2021-06-08 北京北方华创微电子装备有限公司 下电极结构及反应腔室
KR102562892B1 (ko) * 2022-12-29 2023-08-03 주식회사 기가레인 정전척 유닛 및 그를 구비한 플라즈마 식각 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4592916B2 (ja) * 2000-04-25 2010-12-08 東京エレクトロン株式会社 被処理体の載置装置
US7582186B2 (en) * 2002-12-20 2009-09-01 Tokyo Electron Limited Method and apparatus for an improved focus ring in a plasma processing system
JP4782733B2 (ja) * 2007-06-12 2011-09-28 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置

Also Published As

Publication number Publication date
KR20140000169A (ko) 2014-01-02
JP2014007215A (ja) 2014-01-16
KR102069773B1 (ko) 2020-01-23

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