JP5887330B2 - はんだ組成物およびそれを用いたプリント配線基板 - Google Patents

はんだ組成物およびそれを用いたプリント配線基板 Download PDF

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Publication number
JP5887330B2
JP5887330B2 JP2013269732A JP2013269732A JP5887330B2 JP 5887330 B2 JP5887330 B2 JP 5887330B2 JP 2013269732 A JP2013269732 A JP 2013269732A JP 2013269732 A JP2013269732 A JP 2013269732A JP 5887330 B2 JP5887330 B2 JP 5887330B2
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Japan
Prior art keywords
mass
component
acid
flux
solder composition
Prior art date
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Active
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JP2013269732A
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English (en)
Japanese (ja)
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JP2015123472A (ja
Inventor
章一郎 成瀬
章一郎 成瀬
松村　光弘
光弘 松村
大悟 市川
大悟 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
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Tamura Corp
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Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP2013269732A priority Critical patent/JP5887330B2/ja
Priority to KR1020140187856A priority patent/KR102227645B1/ko
Publication of JP2015123472A publication Critical patent/JP2015123472A/ja
Application granted granted Critical
Publication of JP5887330B2 publication Critical patent/JP5887330B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013269732A 2013-12-26 2013-12-26 はんだ組成物およびそれを用いたプリント配線基板 Active JP5887330B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013269732A JP5887330B2 (ja) 2013-12-26 2013-12-26 はんだ組成物およびそれを用いたプリント配線基板
KR1020140187856A KR102227645B1 (ko) 2013-12-26 2014-12-24 땜납 조성물 및 그것을 사용한 프린트 배선기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013269732A JP5887330B2 (ja) 2013-12-26 2013-12-26 はんだ組成物およびそれを用いたプリント配線基板

Publications (2)

Publication Number Publication Date
JP2015123472A JP2015123472A (ja) 2015-07-06
JP5887330B2 true JP5887330B2 (ja) 2016-03-16

Family

ID=53534604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013269732A Active JP5887330B2 (ja) 2013-12-26 2013-12-26 はんだ組成物およびそれを用いたプリント配線基板

Country Status (2)

Country Link
JP (1) JP5887330B2 (ko)
KR (1) KR102227645B1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019175859A1 (en) * 2018-03-15 2019-09-19 Printcb Ltd. Two-component printable conductive composition
US10906137B2 (en) 2017-07-12 2021-02-02 Tamura Corporation Solder composition and electronic board
EP4144477A1 (en) 2021-09-02 2023-03-08 Tamura Corporation Solder composition and method for manufacturing electronic board
US11780035B2 (en) 2020-09-25 2023-10-10 Tamura Corporation Solder composition and electronic substrate
DE102023124887A1 (de) 2022-09-30 2024-04-04 Tamura Corporation Flussmittel-Zusammensetzung, Lötmittel-Zusammensetzung und elektronische Leiterplatte

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6310894B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6310893B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 フラックス組成物、はんだ組成物、および電子基板の製造方法
WO2018084072A1 (ja) * 2016-11-07 2018-05-11 株式会社弘輝 フラックス、はんだ組成物及び接合体の製造方法
JP6628821B2 (ja) * 2017-02-28 2020-01-15 株式会社タムラ製作所 フラックス組成物、はんだ組成物および電子基板
JP6903037B2 (ja) * 2018-07-20 2021-07-14 千住金属工業株式会社 ソルダペースト
JP6676242B1 (ja) * 2019-05-27 2020-04-08 千住金属工業株式会社 ソルダペースト
JP6849934B1 (ja) * 2020-03-18 2021-03-31 千住金属工業株式会社 フラックス及びソルダペースト
JP7220694B2 (ja) * 2020-10-30 2023-02-10 株式会社タムラ製作所 フラックス組成物、およびはんだ組成物、並びに、電子基板の製造方法
CN113001060A (zh) * 2021-03-10 2021-06-22 安徽禾炬电子材料有限公司 一种高效助焊剂配方

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124092A (ja) * 1989-10-06 1991-05-27 Hitachi Chem Co Ltd プリント配線板のプレフラックス
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
JP3735543B2 (ja) * 2001-06-05 2006-01-18 株式会社東芝 ソルダペースト
EP1660243A4 (en) * 2003-07-09 2011-11-16 Fry Metals Inc ÜBERZUGSMETALLTEILCHEN
JP6120139B2 (ja) * 2012-01-24 2017-04-26 荒川化学工業株式会社 鉛フリーはんだ用フラックス、鉛フリーソルダペーストおよび鉛フリー糸はんだ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10906137B2 (en) 2017-07-12 2021-02-02 Tamura Corporation Solder composition and electronic board
WO2019175859A1 (en) * 2018-03-15 2019-09-19 Printcb Ltd. Two-component printable conductive composition
US10982109B2 (en) 2018-03-15 2021-04-20 Printcb Ltd. Two-component printable conductive composition
US11780035B2 (en) 2020-09-25 2023-10-10 Tamura Corporation Solder composition and electronic substrate
EP4144477A1 (en) 2021-09-02 2023-03-08 Tamura Corporation Solder composition and method for manufacturing electronic board
DE102023124887A1 (de) 2022-09-30 2024-04-04 Tamura Corporation Flussmittel-Zusammensetzung, Lötmittel-Zusammensetzung und elektronische Leiterplatte

Also Published As

Publication number Publication date
JP2015123472A (ja) 2015-07-06
KR102227645B1 (ko) 2021-03-15
KR20150076106A (ko) 2015-07-06

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