JP5878623B2 - 薄型ガラス基板にクラック開始傷を機械的に形成する方法 - Google Patents
薄型ガラス基板にクラック開始傷を機械的に形成する方法 Download PDFInfo
- Publication number
- JP5878623B2 JP5878623B2 JP2014505154A JP2014505154A JP5878623B2 JP 5878623 B2 JP5878623 B2 JP 5878623B2 JP 2014505154 A JP2014505154 A JP 2014505154A JP 2014505154 A JP2014505154 A JP 2014505154A JP 5878623 B2 JP5878623 B2 JP 5878623B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- polishing
- crack initiation
- flaw
- starting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 359
- 239000011521 glass Substances 0.000 title claims description 344
- 230000000977 initiatory effect Effects 0.000 title claims description 98
- 238000000034 method Methods 0.000 title claims description 72
- 238000005498 polishing Methods 0.000 claims description 148
- 239000000835 fiber Substances 0.000 claims description 80
- 239000003082 abrasive agent Substances 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 230000001902 propagating effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 206010052428 Wound Diseases 0.000 claims 3
- 208000027418 Wounds and injury Diseases 0.000 claims 3
- 238000000926 separation method Methods 0.000 description 18
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000006261 foam material Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 206010044038 Tooth erosion Diseases 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/10—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of brushes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
- B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Plasma & Fusion (AREA)
- Surface Treatment Of Glass (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Description
102 表面
109 支持体
110 ノズル
112 キャリア流体流
114 研磨材料
116 クラック開始傷
118 接触点
130 柔軟な表面
132 エアクッション
140 研磨装置
141 ドラム部材
142 研磨用繊維
143 回転中心軸
150 回転研磨ホイール
154 回転軸
180 レーザ光源
182 ビーム
184 冷却ノズル
186 冷却ジェット
190 ビームスポット
192 冷却スポット
196 分離ライン
Claims (10)
- ガラス基板に開始傷を形成して、前記ガラス基板を複数の基板に分離するのを助ける方法において、
前記ガラス基板を提供するステップ、
研磨材料をその中に取り込んで含んでいるキャリア流体流を前記ガラス基板の表面上に導いて、前記ガラス基板の前記表面に前記開始傷を形成するステップ、
前記開始傷を、レーザ光源を用いて加熱するステップ、および、
前記開始傷からクラックが始まるように前記開始傷を冷却流体で冷却するステップであって、該クラックが、前記ガラス基板の厚さを貫通して延在しかつ前記ガラス基板を横切って伝播して、前記ガラス基板が前記複数の基板に分離されるステップ、
を含むことを特徴とする方法。 - 前記キャリア流体流が圧縮空気を含み、かつ前記研磨材料のメッシュサイズが400から600であることを特徴とする請求項1記載の方法。
- 前記開始傷が複数の開始傷を含み、かつ、
該複数の開始傷が、前記ガラス基板の前記表面上における前記キャリア流体流の接触点の直径範囲内に位置していることを特徴とする請求項1または2記載の方法。 - ガラス基板に開始傷を形成して、前記ガラス基板を複数の基板に分離するのを助ける方法において、
前記ガラス基板を提供するステップ、
研磨材料を含んだ研磨用繊維で前記ガラス基板の表面に接触するステップ、および、
前記研磨用繊維を、該研磨用繊維の前記研磨材料が前記ガラス基板の前記表面に前記開始傷を形成するように、前記ガラス基板の前記表面上で移動させるステップ、
を含むことを特徴とする方法。 - 前記研磨用繊維と前記ガラス基板の前記表面との間の接触角度が、45°以下であることを特徴とする請求項4記載の方法。
- 前記研磨用繊維が前記ガラス基板の前記表面に接触しているときに前記ガラス基板を柔軟に支持するステップをさらに含むことを特徴とする請求項4または5記載の方法。
- ガラス基板に開始傷を形成して、前記ガラス基板を複数の基板に分離するのを助ける方法において、
前記ガラス基板を提供するステップ、
前記ガラス基板を回転研磨ホイールに近接させて柔軟に支持するステップ、および、
前記回転研磨ホイールを前記ガラス基板の表面に接触させるステップであって、このとき前記ガラス基板の歪みを最小限に抑えるよう、前記回転研磨ホイールから前記ガラス基板に加えられる力の主成分が前記ガラス基板の前記表面に平行になるようにし、ここで前記研磨ホイールが、前記ガラス基板の前記表面に前記開始傷を研磨して生成するステップ、
を含むことを特徴とする方法。 - 前記開始傷の深さが0.1×Tであり、ここでTは前記ガラス基板の厚さであることを特徴とする請求項7記載の方法。
- 前記回転研磨ホイールによって前記ガラス基板に加えられる前記力が、1N以上かつ24N以下であり、さらに前記回転研磨ホイールが、400メッシュ以上かつ600メッシュ以下の材料で被覆されていることを特徴とする請求項7または8記載の方法。
- 前記回転研磨ホイールが揺れるように作られていることを特徴とする請求項7から9いずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161475409P | 2011-04-14 | 2011-04-14 | |
US61/475,409 | 2011-04-14 | ||
PCT/US2012/030498 WO2012141874A1 (en) | 2011-04-14 | 2012-03-26 | Methods for mechanically forming crack initiation defects in thin glass substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014511821A JP2014511821A (ja) | 2014-05-19 |
JP5878623B2 true JP5878623B2 (ja) | 2016-03-08 |
Family
ID=47009638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014505154A Expired - Fee Related JP5878623B2 (ja) | 2011-04-14 | 2012-03-26 | 薄型ガラス基板にクラック開始傷を機械的に形成する方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5878623B2 (ja) |
KR (1) | KR20140016928A (ja) |
CN (1) | CN103476719A (ja) |
TW (1) | TWI539506B (ja) |
WO (1) | WO2012141874A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11780760B2 (en) | 2017-09-15 | 2023-10-10 | Corning Incorporated | Systems and methods for processing a glass ribbon |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI586612B (zh) * | 2011-11-18 | 2017-06-11 | 康寧公司 | 用於修整移動玻璃帶之設備及方法 |
CN104684856B (zh) * | 2012-11-09 | 2017-07-07 | 日本电气硝子株式会社 | 初始裂纹形成装置以及形成方法 |
JP2017538650A (ja) * | 2014-11-07 | 2017-12-28 | コーニング インコーポレイテッド | 研磨面を用いた薄型ガラス基板におけるクラック開始欠陥の機械的形成 |
DE102015104815A1 (de) | 2015-03-27 | 2016-09-29 | Schott Ag | Verfahren und Vorrichtung zum kontinuierlichen Trennen von Glas |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4702042A (en) * | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
JPH0796452B2 (ja) * | 1993-11-19 | 1995-10-18 | 坂東機工株式会社 | ガラス板の加工機械 |
US5622540A (en) * | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
JP3370314B2 (ja) * | 2000-08-04 | 2003-01-27 | 三星ダイヤモンド工業株式会社 | 脆性基板用カッターホイール |
JP2003200336A (ja) * | 2001-12-27 | 2003-07-15 | Optrex Corp | 液晶表示パネルの面取り方法 |
KR100657196B1 (ko) * | 2002-11-06 | 2006-12-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 스크라이브 라인 형성장치 및 스크라이브 라인 형성방법 |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
JP2004292278A (ja) * | 2003-03-28 | 2004-10-21 | Kawaguchiko Seimitsu Co Ltd | ガラスカッターホイール、及びその製造方法と、それを備えた自動ガラススクライバー、並びにガラス切り、及びそれを用いて切断したガラス、及びそのガラスを用いた電子機器装置 |
JP4163552B2 (ja) * | 2003-05-20 | 2008-10-08 | 株式会社ホンダロック | 板ガラスの切断方法および装置 |
EP1690835B1 (en) * | 2003-12-05 | 2011-08-17 | Asahi Glass Company Ltd. | Method for cutting glass plates |
KR20060017058A (ko) * | 2004-08-19 | 2006-02-23 | 엠.제이.테크(주) | 스크라이빙 휠 커터 |
JP2009242184A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Electric Glass Co Ltd | 脆性板状物の切断方法及び切断装置 |
US20100294746A1 (en) * | 2008-11-19 | 2010-11-25 | Applied Materials, Inc. | Laser scribing platform with moving gantry |
CZ302636B6 (cs) * | 2010-09-10 | 2011-08-10 | Capka@Vlastimil | Zpusob úpravy povrchu plochého skla a zarízení k provádení tohoto zpusobu |
-
2012
- 2012-03-26 KR KR1020137026504A patent/KR20140016928A/ko not_active Application Discontinuation
- 2012-03-26 CN CN2012800163987A patent/CN103476719A/zh active Pending
- 2012-03-26 JP JP2014505154A patent/JP5878623B2/ja not_active Expired - Fee Related
- 2012-03-26 WO PCT/US2012/030498 patent/WO2012141874A1/en active Application Filing
- 2012-04-11 TW TW101112830A patent/TWI539506B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11780760B2 (en) | 2017-09-15 | 2023-10-10 | Corning Incorporated | Systems and methods for processing a glass ribbon |
Also Published As
Publication number | Publication date |
---|---|
WO2012141874A1 (en) | 2012-10-18 |
CN103476719A (zh) | 2013-12-25 |
JP2014511821A (ja) | 2014-05-19 |
KR20140016928A (ko) | 2014-02-10 |
TW201250811A (en) | 2012-12-16 |
TWI539506B (zh) | 2016-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5878623B2 (ja) | 薄型ガラス基板にクラック開始傷を機械的に形成する方法 | |
JP5132863B2 (ja) | 平板ガラスから任意の輪郭のガラス板を製造する方法 | |
JP6071024B2 (ja) | 薄いガラス板を製造する方法 | |
TWI457188B (zh) | 利用線鋸切削工件的方法 | |
JP2006240948A (ja) | ガラス板製品を切り抜きにより製造する方法 | |
EP2314548A2 (en) | Breaking apparatus and breaking method | |
JP6412538B2 (ja) | ダイシング装置 | |
CN1581443A (zh) | 晶片加工方法 | |
JP2013514259A (ja) | レーザ罫書きされた湾曲ガラスリボンからのガラスシートの分離 | |
KR20150084655A (ko) | 초기 크랙 형성 장치, 및 형성 방법 | |
WO2010052827A1 (ja) | インゴット切断装置及び切断方法 | |
KR20090103205A (ko) | 화학기계적연마 장비 | |
TW201438833A (zh) | 線鋸及線鋸之製造方法 | |
JP2010525559A (ja) | 半導体本体から薄ディスク又はフィルムを製造するための方法及び装置 | |
KR101303552B1 (ko) | 반도체 웨이퍼의 양면을 화학적으로 그라인딩하는 방법 | |
KR101621455B1 (ko) | 회전형 와이어 소우 장치 | |
CN102574266A (zh) | 半导体晶片的研磨方法 | |
JP5370913B2 (ja) | ガラス基板の端面研磨装置およびその端面研磨方法 | |
JP2006229057A (ja) | 基板処理装置及び基板処理方法 | |
CN105705446A (zh) | 卷制造方法和制造装置 | |
TWI656103B (zh) | 使用磨料表面之薄玻璃基材中的機械式形成裂隙起始缺陷 | |
WO2011046052A1 (ja) | 電極板の通気孔形成方法 | |
JP7255890B2 (ja) | 脆性材料基板の加工方法及び分断方法 | |
JP4798441B2 (ja) | ウェーハ搬送方法及びウェーハ搬送ユニット | |
JP2004235251A (ja) | 貼り合わせ基板およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150303 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151217 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160105 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160128 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5878623 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |