JP5864455B2 - Ｃａｄベースの位置合わせのためのシステム、方法、及びコンピュータプログラム製品 - Google Patents

Ｃａｄベースの位置合わせのためのシステム、方法、及びコンピュータプログラム製品 Download PDF

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JP5864455B2
JP5864455B2 JP2013036386A JP2013036386A JP5864455B2 JP 5864455 B2 JP5864455 B2 JP 5864455B2 JP 2013036386 A JP2013036386 A JP 2013036386A JP 2013036386 A JP2013036386 A JP 2013036386A JP 5864455 B2 JP5864455 B2 JP 5864455B2
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frame
displacement
wafer
runtime
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JP2013161485A (ja
JP2013161485A5 (enExample
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ゴレン ツヴィ
ゴレン ツヴィ
ベン−ダヴィデ ニア
ベン−ダヴィデ ニア
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アプライド マテリアルズ イスラエル リミテッド
アプライド マテリアルズ イスラエル リミテッド
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/32—Determination of transform parameters for the alignment of images, i.e. image registration using correlation-based methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/125—Digital circuitry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/127—Calibration; base line adjustment; drift compensation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP2013036386A 2012-02-07 2013-02-07 Ｃａｄベースの位置合わせのためのシステム、方法、及びコンピュータプログラム製品 Active JP5864455B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/368,306 US8855399B2 (en) 2012-02-07 2012-02-07 System, a method and a computer program product for CAD-based registration
US13/368,306 2012-02-07

Publications (3)

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JP2013161485A JP2013161485A (ja) 2013-08-19
JP2013161485A5 JP2013161485A5 (enExample) 2015-06-11
JP5864455B2 true JP5864455B2 (ja) 2016-02-17

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US (2) US8855399B2 (enExample)
JP (1) JP5864455B2 (enExample)
KR (2) KR101551753B1 (enExample)
TW (1) TWI519801B (enExample)

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KR102330732B1 (ko) * 2014-04-02 2021-11-23 케이엘에이 코포레이션 마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품
GB2526359B (en) * 2014-05-23 2020-07-22 Advanced Risc Mach Ltd Graphics processing systems
US9715724B2 (en) * 2014-07-29 2017-07-25 Applied Materials Israel Ltd. Registration of CAD data with SEM images
US10012689B2 (en) 2015-03-25 2018-07-03 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10018571B2 (en) * 2015-05-28 2018-07-10 Kla-Tencor Corporation System and method for dynamic care area generation on an inspection tool
US10545490B2 (en) 2015-06-01 2020-01-28 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
US11010886B2 (en) * 2016-05-17 2021-05-18 Kla-Tencor Corporation Systems and methods for automatic correction of drift between inspection and design for massive pattern searching
US10161882B1 (en) * 2016-07-28 2018-12-25 Applied Materials Israel Ltd. Method of examining locations in a wafer with adjustable navigation accuracy and system thereof
KR101893823B1 (ko) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판의 왜곡 보상 방법
US10190991B2 (en) 2016-11-03 2019-01-29 Applied Materials Israel Ltd. Method for adaptive sampling in examining an object and system thereof
JP6805028B2 (ja) * 2017-03-07 2020-12-23 東京エレクトロン株式会社 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体
US10600177B2 (en) * 2017-08-09 2020-03-24 Kla-Tencor Corporation Nuisance reduction using location-based attributes
US11060981B2 (en) 2018-03-20 2021-07-13 Applied Materials Israel Ltd. Guided inspection of a semiconductor wafer based on spatial density analysis
KR102538785B1 (ko) * 2018-07-27 2023-05-31 삼성전자주식회사 컴퓨터 지원 설계(cad) 파일로부터 웨이퍼 이미지를 생성하는 방법 및 시스템
US10902620B1 (en) 2019-04-18 2021-01-26 Applied Materials Israel Ltd. Registration between an image of an object and a description
JP7404009B2 (ja) * 2019-09-19 2023-12-25 キオクシア株式会社 加工情報管理システム及び加工情報管理方法

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Also Published As

Publication number Publication date
KR101551753B1 (ko) 2015-09-10
KR20130091287A (ko) 2013-08-16
JP2013161485A (ja) 2013-08-19
TWI519801B (zh) 2016-02-01
US8855399B2 (en) 2014-10-07
US9355443B2 (en) 2016-05-31
KR20150045413A (ko) 2015-04-28
KR101860506B1 (ko) 2018-05-23
US20130202187A1 (en) 2013-08-08
TW201346298A (zh) 2013-11-16
US20150093014A1 (en) 2015-04-02

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