KR101551753B1 - Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품 - Google Patents

Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품 Download PDF

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KR101551753B1
KR101551753B1 KR1020130014058A KR20130014058A KR101551753B1 KR 101551753 B1 KR101551753 B1 KR 101551753B1 KR 1020130014058 A KR1020130014058 A KR 1020130014058A KR 20130014058 A KR20130014058 A KR 20130014058A KR 101551753 B1 KR101551753 B1 KR 101551753B1
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wafer
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target
scanned
frame
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KR20130091287A (ko
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즈비 고렌
니르 벤-데이비드
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어플라이드 머티리얼즈 이스라엘 리미티드
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/32—Determination of transform parameters for the alignment of images, i.e. image registration using correlation-based methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/125—Digital circuitry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/127—Calibration; base line adjustment; drift compensation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
KR1020130014058A 2012-02-07 2013-02-07 Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품 Active KR101551753B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/368,306 US8855399B2 (en) 2012-02-07 2012-02-07 System, a method and a computer program product for CAD-based registration
US13/368,306 2012-02-07

Related Child Applications (1)

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KR1020150047604A Division KR101860506B1 (ko) 2012-02-07 2015-04-03 Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품

Publications (2)

Publication Number Publication Date
KR20130091287A KR20130091287A (ko) 2013-08-16
KR101551753B1 true KR101551753B1 (ko) 2015-09-10

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KR1020130014058A Active KR101551753B1 (ko) 2012-02-07 2013-02-07 Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품
KR1020150047604A Active KR101860506B1 (ko) 2012-02-07 2015-04-03 Cad­기반 레지스트레이션을 위한 시스템, 방법 및 컴퓨터 프로그램 제품

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Country Status (4)

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US (2) US8855399B2 (enExample)
JP (1) JP5864455B2 (enExample)
KR (2) KR101551753B1 (enExample)
TW (1) TWI519801B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768082B2 (en) * 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
JP6205757B2 (ja) * 2013-03-07 2017-10-04 オムロン株式会社 制御システム、制御装置、画像処理装置、および、制御方法
KR102330732B1 (ko) * 2014-04-02 2021-11-23 케이엘에이 코포레이션 마스크들을 위한 고밀도 레지스트레이션 맵들을 생성하기 위한 방법, 시스템 및 컴퓨터 프로그램 제품
GB2526359B (en) * 2014-05-23 2020-07-22 Advanced Risc Mach Ltd Graphics processing systems
US9715724B2 (en) * 2014-07-29 2017-07-25 Applied Materials Israel Ltd. Registration of CAD data with SEM images
US10012689B2 (en) 2015-03-25 2018-07-03 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10018571B2 (en) * 2015-05-28 2018-07-10 Kla-Tencor Corporation System and method for dynamic care area generation on an inspection tool
US10545490B2 (en) 2015-06-01 2020-01-28 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
US11010886B2 (en) * 2016-05-17 2021-05-18 Kla-Tencor Corporation Systems and methods for automatic correction of drift between inspection and design for massive pattern searching
US10161882B1 (en) * 2016-07-28 2018-12-25 Applied Materials Israel Ltd. Method of examining locations in a wafer with adjustable navigation accuracy and system thereof
KR101893823B1 (ko) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판의 왜곡 보상 방법
US10190991B2 (en) 2016-11-03 2019-01-29 Applied Materials Israel Ltd. Method for adaptive sampling in examining an object and system thereof
JP6805028B2 (ja) * 2017-03-07 2020-12-23 東京エレクトロン株式会社 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体
US10600177B2 (en) * 2017-08-09 2020-03-24 Kla-Tencor Corporation Nuisance reduction using location-based attributes
US11060981B2 (en) 2018-03-20 2021-07-13 Applied Materials Israel Ltd. Guided inspection of a semiconductor wafer based on spatial density analysis
KR102538785B1 (ko) * 2018-07-27 2023-05-31 삼성전자주식회사 컴퓨터 지원 설계(cad) 파일로부터 웨이퍼 이미지를 생성하는 방법 및 시스템
US10902620B1 (en) 2019-04-18 2021-01-26 Applied Materials Israel Ltd. Registration between an image of an object and a description
JP7404009B2 (ja) * 2019-09-19 2023-12-25 キオクシア株式会社 加工情報管理システム及び加工情報管理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060100730A1 (en) 2002-07-12 2006-05-11 Parkes Alan S Method for detection and relocation of wafer defects
US20080181484A1 (en) 2007-01-31 2008-07-31 Zeev Litichever Advanced cell-to-cell inspection

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640200A (en) * 1994-08-31 1997-06-17 Cognex Corporation Golden template comparison using efficient image registration
US7034272B1 (en) * 1999-10-05 2006-04-25 Electro Scientific Industries, Inc. Method and apparatus for evaluating integrated circuit packages having three dimensional features
JP2002340810A (ja) * 2001-05-17 2002-11-27 Hitachi Ltd 検査点抽出方法およびその装置
US20030223639A1 (en) * 2002-03-05 2003-12-04 Vladimir Shlain Calibration and recognition of materials in technical images using specific and non-specific features
US7630560B2 (en) * 2002-04-10 2009-12-08 National Instruments Corporation Increasing accuracy of discrete curve transform estimates for curve matching in four or more dimensions
KR100474571B1 (ko) * 2002-09-23 2005-03-10 삼성전자주식회사 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치
US7539338B2 (en) * 2004-06-01 2009-05-26 Panasonic Corporation Bump inspection apparatus and method for IC component, bump forming method for IC component, and mounting method for IC component
JP4769025B2 (ja) * 2005-06-15 2011-09-07 株式会社日立ハイテクノロジーズ 走査型電子顕微鏡用撮像レシピ作成装置及びその方法並びに半導体パターンの形状評価装置
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US8103087B2 (en) * 2006-01-20 2012-01-24 Hitachi High-Technologies Corporation Fault inspection method
US7847929B2 (en) * 2006-08-23 2010-12-07 Applied Materials Israel, Ltd. Methods and apparatus for inspecting a plurality of dies
JP4988274B2 (ja) * 2006-08-31 2012-08-01 株式会社日立ハイテクノロジーズ パターンのずれ測定方法、及びパターン測定装置
JP2008128651A (ja) * 2006-11-16 2008-06-05 Olympus Corp パターン位置合わせ方法、パターン検査装置及びパターン検査システム
WO2008077100A2 (en) * 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
TWI374401B (en) * 2007-07-09 2012-10-11 Pixart Imaging Inc Detection method for displacements with sub-pixel accuracy and apparatus using the same
US8467595B2 (en) * 2008-08-01 2013-06-18 Hitachi High-Technologies Corporation Defect review system and method, and program
JP5568277B2 (ja) * 2009-10-22 2014-08-06 株式会社日立ハイテクノロジーズ パターンマッチング方法、及びパターンマッチング装置
WO2012016243A2 (en) * 2010-07-30 2012-02-02 Kla-Tencor Corporation Region based virtual fourier filter
US8699784B2 (en) * 2010-08-10 2014-04-15 Camtek Ltd. Inspection recipe generation and inspection based on an inspection recipe
US8331670B2 (en) * 2011-03-22 2012-12-11 Konica Minolta Laboratory U.S.A., Inc. Method of detection document alteration by comparing characters using shape features of characters

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060100730A1 (en) 2002-07-12 2006-05-11 Parkes Alan S Method for detection and relocation of wafer defects
US20080181484A1 (en) 2007-01-31 2008-07-31 Zeev Litichever Advanced cell-to-cell inspection

Also Published As

Publication number Publication date
KR20130091287A (ko) 2013-08-16
JP2013161485A (ja) 2013-08-19
TWI519801B (zh) 2016-02-01
US8855399B2 (en) 2014-10-07
US9355443B2 (en) 2016-05-31
JP5864455B2 (ja) 2016-02-17
KR20150045413A (ko) 2015-04-28
KR101860506B1 (ko) 2018-05-23
US20130202187A1 (en) 2013-08-08
TW201346298A (zh) 2013-11-16
US20150093014A1 (en) 2015-04-02

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