JP5854360B2 - 熱硬化性組成物およびその熱硬化物 - Google Patents

熱硬化性組成物およびその熱硬化物 Download PDF

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Publication number
JP5854360B2
JP5854360B2 JP2013531603A JP2013531603A JP5854360B2 JP 5854360 B2 JP5854360 B2 JP 5854360B2 JP 2013531603 A JP2013531603 A JP 2013531603A JP 2013531603 A JP2013531603 A JP 2013531603A JP 5854360 B2 JP5854360 B2 JP 5854360B2
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epoxy resin
aliphatic
methyl
dimethanol
product
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Expired - Fee Related
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Japanese (ja)
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JP2013544905A (ja
JP2013544905A5 (OSRAM
Inventor
イー． ヘフナー，ロバート
イー． ヘフナー，ロバート
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ブルー キューブ アイピー エルエルシー
ブルー キューブ アイピー エルエルシー
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/025—Polycondensates containing more than one epoxy group per molecule characterised by the purification methods used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Compounds (AREA)
JP2013531603A 2010-09-30 2011-08-31 熱硬化性組成物およびその熱硬化物 Expired - Fee Related JP5854360B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38805910P 2010-09-30 2010-09-30
US61/388,059 2010-09-30
PCT/US2011/049840 WO2012047420A2 (en) 2010-09-30 2011-08-31 Thermosettable compositions and thermosets therefrom

Publications (3)

Publication Number Publication Date
JP2013544905A JP2013544905A (ja) 2013-12-19
JP2013544905A5 JP2013544905A5 (OSRAM) 2015-07-16
JP5854360B2 true JP5854360B2 (ja) 2016-02-09

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Family Applications (1)

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JP2013531603A Expired - Fee Related JP5854360B2 (ja) 2010-09-30 2011-08-31 熱硬化性組成物およびその熱硬化物

Country Status (8)

Country Link
US (1) US9068039B2 (OSRAM)
EP (1) EP2621990B1 (OSRAM)
JP (1) JP5854360B2 (OSRAM)
KR (1) KR20140009131A (OSRAM)
CN (1) CN103228694B (OSRAM)
BR (1) BR112013007037A2 (OSRAM)
ES (1) ES2569179T3 (OSRAM)
WO (1) WO2012047420A2 (OSRAM)

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US9371417B2 (en) * 2012-06-15 2016-06-21 Blue Cube Ip Llc Curable compositions
SE536610C2 (sv) * 2012-06-29 2014-03-25 Perstorp Ab Härdande pulverytbeläggningskomposition
KR20160137525A (ko) 2014-03-24 2016-11-30 블루 큐브 아이피 엘엘씨 에폭시 수지 조성물
WO2015148039A1 (en) 2014-03-24 2015-10-01 Dow Global Technologies Llc Partially hydrolyzed epoxy resin compositions
US10864543B2 (en) * 2015-05-15 2020-12-15 Dow Global Technologies Llc Material delivery system for laminator
KR102721907B1 (ko) 2018-04-04 2024-10-25 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 방향족 아민에 의한 에폭시 수지의 경화를 위한 가속화제 조성물
JP2020037649A (ja) * 2018-09-04 2020-03-12 Dic株式会社 ラミネート用硬化型接着剤、積層フィルム及び包装体
JP2022180227A (ja) * 2021-05-24 2022-12-06 日本特殊塗料株式会社 塗り床材用二液反応硬化型塗料組成物、塗膜、及び塗り床の形成方法

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Also Published As

Publication number Publication date
WO2012047420A2 (en) 2012-04-12
US20130237642A1 (en) 2013-09-12
EP2621990B1 (en) 2016-02-24
BR112013007037A2 (pt) 2019-09-24
JP2013544905A (ja) 2013-12-19
ES2569179T3 (es) 2016-05-09
CN103228694B (zh) 2016-04-27
CN103228694A (zh) 2013-07-31
KR20140009131A (ko) 2014-01-22
WO2012047420A3 (en) 2012-07-05
US9068039B2 (en) 2015-06-30
EP2621990A2 (en) 2013-08-07

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